200843927 九、發明說明： 【發明所屬之技術領域】 本發明係關於一種於硬化性樹脂成形材料之成形時，能 夠去除模具表面之污物且使模具表面具有脫模性而兼具= 潔性及脫模性之壓縮型模具清潔用及脫模回復用樹脂:: 物、以及使用該樹脂組合物之模具清潔及模具脫模回復方 法。 【先前技術】 先前，於利用環氧樹脂等熱硬化性樹脂而形成積體電路 等密封成形物時，若成形時間持續較長，則模具内部表面 將有π物附著，若照舊接連繼續成形，則常常會導致密封 成形物表面有污物附著，或密封成形物附著於模具上而使 知成形操作無法繼續。因此，必須定期對模具進行清潔， 故而提出有如下方法：每次進行成形材料數百次射出成形 (shot molding)時’以數次之射出比例使模具清潔用樹脂成 形，進行模具清潔。 例如，於日本專利特公昭52_788號公報中，提出有「硬 化性樹脂成形材料（胺系樹脂成形材料除外）成形時藉由以 胺系樹脂為主體之材料成形來清潔模具表面污物之方 法」，其中揭示有由胺系樹脂、有機質基材及/或無機質 基材、脫模劑構成之模具清潔用樹脂組合物。 近年來，隨著積體電路等（縮寫為IC(Integrated circuit， 積體電路）、LSI(Large Scale Integrati〇n，大規模積體電 路））之高積體化、薄型化、表面安裝化，成形品之形狀、 125940.doc 200843927 構造之多樣化得到發展’因此’期望半導體密封材料實現 高流動化。 因此，若利用高流動化型之環氧密封材料，則於通氣孔 部分易產生樹脂堵塞，當產生該等堵塞時，放氣 bleeding)會變得困難，導致樹脂無法流動，從而產生模穴 部產生未填充而形成不良，故而難以連續成形。因此，為 了避免產生該等狀況，必須進行清潔，但❹轉移型清潔 材料日守由於上述理由，樹脂無法正常流動，因此，難以去 除堵塞於通氣孔之樹脂。 另方面，使用模具清潔用樹脂組合物進行清潔後，模 具表面可變得乾淨，但反之，亦存在如下問題··由於模具 表面之脫模劑亦被去除，因此清潔後立即進行成形之模具 的脫模性會變得極差。因此，使用模具清潔用樹脂組合物 之後’必須使模具脫模回復樹脂組合物成形，以將模具脫 模回復樹脂組合物中之脫模劑轉移至模具表面，使脫模性 回復。 該模具脫模回復樹脂組合物，係使脫模劑轉移至模具表 面而使脫模性迅速回復者。先前，作為模具脫模回復樹脂 組合物’例如係使用含有環氧樹脂、苯酚樹脂、硬化加速 劑、巴西棕櫊蠟及矽石（siUca)等成分者。 該等模具脫模回復樹脂組合物亦與上述相同，由於在通 氣孔α卩分產生樹脂堵塞，無法使樹脂流入至整個通氣孔， 故而難以使通氣孔部分之脫模回復。 專利文獻1 :日本專利特公昭52_788號公報 125940.doc 200843927 【發明内容】 [發明所欲解決之問題] 如上所述，本發明係用以解決如下問題：隨著半導體密 封材料之高流動化而於通氣孔部分產生樹脂堵塞、因樹脂 堵塞而難以利用模具清潔用樹脂組合物進行清潔、以及難 以利用模具脫核回復樹脂組合物來使脫模回復。又，本發 明提供一種兼具清潔性及脫模回復性之壓縮型模具清潔用 及脫模回復用樹脂組合物，其可容易地進行通氣孔部分之 清潔或脫模回復’且可於一個步驟内完成模具之清潔及脫 模回復’而並非必須於清潔模具表面污物後再使用模具脫 模回復樹脂組合物來補給與污物一併去除之脫模成分該等 煩雜的兩個步驟操作之先前之技術方法。 [解決問題之技術手段] 本务明係為解決上述問題而開發者，提供一種模具清潔 用及模具脫模回復用樹脂組合物，其特徵在於，其係於硬 化性樹脂成形材料之成形時去除模具表面之污物且使模具 表面具有脫模性之樹脂組合物，且含有三聚氰胺樹脂，且 含有至少一種金屬皂系脫模劑。 本發明之模具清潔用及模具脫模回復用樹脂組合物，較 好的是進一步含有甘露糖醇或/及金屬皂以外之脫模劑。 [發明之效果] 、本發明之模具清潔用及模具脫模回復用樹脂組合物，係 兼具模具清潔效果與模具脫模回復效果之雙重效果，不僅 可去除杈八、流道及澆口之污物，且亦可去除通氣孔部分 125940.doc 200843927 及模具之分模區（parting area)之污物，尤I， 、系Μ 具可容易地谁尸 孔部分之清潔與脫模回復之壓縮型樹脂組合丁 須進行先前之包括利用模具清潔用樹脂組合物：，二無 :潔操作與利用模具脫模回復用樹脂組合物實施：：：具 模回復操作該等煩雜的兩個步驟操作，而—、脫 完成模具之清潔與脫模回復。 …個步驟内 【實施方式】200843927 IX. OBJECTS OF THE INVENTION: TECHNICAL FIELD The present invention relates to a method for removing a stain on a surface of a mold and having a mold release property on the surface of the mold when forming the curable resin molding material, and having both cleanliness and Desinable compression mold cleaning and mold release resin:: and mold cleaning and mold release recovery method using the resin composition. [Previously] When a sealing molded product such as an integrated circuit is formed by using a thermosetting resin such as an epoxy resin, if the molding time continues to be long, π objects adhere to the inner surface of the mold, and if the molding continues, the molding continues. This often results in the adhesion of dirt on the surface of the sealed molded article, or the sealing of the molded article to the mold, so that the forming operation cannot be continued. Therefore, it is necessary to clean the mold on a regular basis. Therefore, there is a method of forming a resin for mold cleaning at a plurality of injection ratios each time the molding material is subjected to shot molding for several times, and the mold is cleaned. For example, Japanese Patent Publication No. Sho 52-788 discloses a method of cleaning a surface of a mold by forming a material mainly composed of an amine resin during molding of a curable resin molding material (excluding an amine resin molding material). There is disclosed a resin composition for mold cleaning comprising an amine resin, an organic substrate, an inorganic substrate, and a release agent. In recent years, with the integration, thinning, and surface mounting of integrated circuits (abbreviated as IC (Integrated Circuit) and LSI (Large Scale Integrator)), The shape of the molded article, the diversification of the structure of 125940.doc 200843927 has been developed. Therefore, it is desired to achieve high fluidization of the semiconductor sealing material. Therefore, when a highly fluidized epoxy sealing material is used, resin clogging is likely to occur in the vent portion, and when such clogging occurs, bleeding becomes difficult, and the resin cannot flow, thereby generating a cavity portion. It is unfilled and poorly formed, so that it is difficult to form continuously. Therefore, in order to avoid such a situation, it is necessary to perform cleaning. However, since the resin cannot flow normally due to the above reasons, it is difficult to remove the resin which is clogged in the vent hole. On the other hand, after cleaning with the resin composition for mold cleaning, the surface of the mold can be cleaned, but conversely, the following problems also occur: • Since the release agent on the surface of the mold is also removed, the mold is formed immediately after cleaning. The release property will become extremely poor. Therefore, after the resin composition for mold cleaning is used, it is necessary to mold the mold release-recovery resin composition to transfer the release agent in the mold release-recovery resin composition to the surface of the mold to restore the mold release property. The mold is released from the resin composition, and the release agent is transferred to the surface of the mold to promptly recover the release property. Heretofore, as the mold release-recovery resin composition, for example, a component containing an epoxy resin, a phenol resin, a hardening accelerator, a Brazilian palm wax and a sillimanite (siUca) is used. Similarly to the above, the mold release-recovery resin composition has a resin clogging in the vent hole α, and the resin cannot flow into the entire vent hole, so that it is difficult to restore the vent hole portion. Patent Document 1: Japanese Patent Publication No. Sho 52-788 No. 125940.doc 200843927 SUMMARY OF INVENTION [Problems to be Solved by the Invention] As described above, the present invention is to solve the problem that the semiconductor sealing material is highly fluidized. Resin clogging occurs in the vent portion, it is difficult to clean by the resin composition for mold cleaning due to clogging of the resin, and it is difficult to recover the mold release by re-nucleating the resin composition with a mold. Moreover, the present invention provides a resin composition for cleaning and mold release of a compression type mold which has both cleanability and mold release recovery, which can easily perform cleaning or demolding of the vent portion and can be performed in one step. In the process of cleaning the mold and releasing the mold, it is not necessary to clean the surface of the mold and then use the mold to release the resin composition to replenish the mold release component together with the dirt. Previous technical methods. [Means for Solving the Problem] In order to solve the above problems, the present invention provides a resin composition for mold cleaning and mold release recovery, which is characterized in that it is removed during molding of a curable resin molding material. A resin composition having a mold surface and having a mold release property, and containing a melamine resin and containing at least one metal soap release agent. The resin composition for mold cleaning and mold release recovery of the present invention preferably further contains a release agent other than mannitol or/metal soap. [Effect of the Invention] The resin composition for mold cleaning and mold release recovery of the present invention has the dual effects of the mold cleaning effect and the mold release recovery effect, and can remove not only the dam, the runner and the gate. Contaminant, and can also remove the vent hole part 125940.doc 200843927 and the mold parting area of the dirt, especially I, the system can easily be the corpse part of the cleaning and release compression compression The resin composition of the type of resin is previously required to include a resin composition for cleaning with a mold: a second: clean operation and a resin composition for mold release using a mold::: a mold return operation, such a troublesome two-step operation, And - remove the mold to clean and release the mold. ...in one step [Embodiment]
::’對本發明之模具清潔用及模具脫模回復用樹脂組 合物進行詳細說明。 本發明中所使用《三聚氰胺樹脂可採用眾人所周知 而製備。 凌 例如，使甲醛與三聚氰胺結晶以莫耳比i ·· i〜4 :丨，較 L的是1,5 : 1〜3 : 1於水溶液中發生反應，來製備初始 口物水溶液。可使其等在三聚氰胺結晶濃度2g〜6〇%、反 =溫度70〜1Gn：以及⑽性之條件下進行反應，經ι〇〜⑽ 刀鐘反應結束。上述甲酸之一部分，可由三聚甲駿、甲駿 以外之醛類成分例如乙醛類等脂肪族醛類來取代。 一本發明之模具清潔用及模具脫模回復用樹脂組合物，除 二聚氰胺樹脂以外，亦含有金屬皂系脫模劑。 乍為i屬皂系脫模劑之例，例如可列舉硬脂酸鈣、硬脂 酸鋅:肉豆Μ酸鋅等。作為金屬皂系、脫模劑之添加量，較 勺疋，相對於100重量份之三聚氰胺樹脂，添加〇.2〜1〇 重里伤，更好的是添加0·4〜0.8重量份。若金屬皂系脫模劑 之外、加里不足，則脫模性與清潔性會降低，而若金屬皂系 125940.doc 200843927 脫模劑之添加詈·^夕 ， 』加里過多’則脫模性較好 本發明之模具清_ M β硪性降低。 β，糸用及杈具脫模回禮 好的是，其令除含 用树月“且合物’較 外，進一步含有甘露_。藉μ Ε ^脫模劑以 模具脫模性之同時降低加熱褪色。路糖醇，可於維持 作為甘露糖醇，較好的是D·甘露糖醇。 當含有甘露糖醇時，鮫 3 播h X 士 & 疋使金屬皂系脫模劑盥甘靈The resin composition for mold cleaning and mold release recovery of the present invention will be described in detail. The melamine resin used in the present invention can be prepared by a well-known method. Ling For example, an initial aqueous solution of an oral solution is prepared by crystallizing formaldehyde and melamine in a molar ratio of i·· i 4 : 丨, which is 1, 5: 1 to 3 : 1 in an aqueous solution. The reaction can be carried out under the conditions of a melamine crystal concentration of 2 g to 6 〇%, a reverse temperature of 70 to 1 Gn: and (10), and the reaction is completed by ι〇~(10) knives. A part of the above formic acid may be substituted by an aliphatic aldehyde such as an aldehyde component other than the saponin or a carbaryl. A resin composition for mold cleaning and mold release recovery according to the present invention contains a metal soap-based release agent in addition to the melamine resin. Examples of the i-based soap-based release agent include calcium stearate and zinc stearate: zinc myristate. The addition amount of the metal soap system and the mold release agent is 5% to 1 part by weight, more preferably 0. 4 to 0.8 parts by weight, based on 100 parts by weight of the melamine resin. If the metal soap is not used in the mold release agent, the mold release property and the cleanability are lowered, and if the metal soap system is 125940.doc 200843927, the mold release agent is added, and the "excessive Gary" is released. Preferably, the mold of the present invention has a reduced 硪Mβ硪 property. It is good to release the β, 糸 and 杈 脱 , 回 其 其 其 其 其 好的 好的 好的 好的 好的 好的 好的 好的 好的 好的 令 令 含 含 含 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 。 Fading, road sugar alcohol, can be maintained as mannitol, preferably D. mannitol. When containing mannitol, 鲛3 broadcast h X Shi &; 金属 metal soap release agent 盥甘灵
糖醇之含有比例以#旦 供U路 妁以重里比汁為90 ·· 10〜3〇 ·· 7〇， 是80 : 20〜40 ·· 60。若甘靈 尤/、好的 變差。 #路搪醇之比例過大’則清潔性會 作為甘露糖醇之添加量，較好的是，相對於ι〇〇重量份 =氛胺樹脂’添加。.…重量份，更好的是添加 〇·3〜0.8重量份。若甘露 吁 < 添加里不足，則無添加效 果’而若甘露糖醇之添加量過多，則脫The content of sugar alcohol is #旦. For U road, the weight of the juice is 90 ·· 10~3〇 ·· 7〇, is 80: 20~40 ·· 60. If Gan Ling is especially good, it will be worse. If the ratio of #路搪醇 is too large, the cleanability is added as the amount of mannitol, and it is preferably added to the ι〇〇 part by weight = amine resin. .... by weight, more preferably 〇·3~0.8 parts by weight. If the nectar appeals < insufficient in the addition, there is no added effect. If the amount of mannitol added is too large, then take off
性降低。 H 本么明之杈具清潔用及模具脫模回復用樹脂組合 物’較好的亦有’ 除含有三聚氰胺樹脂及金屬息系脫 杈別以外，進一步含有金屬皂以外之脫模劑。藉由含有金 j皂以外之脫模劑，可不受環氧密封材料中之脫模成分之 影響而發揮模具脫模性。 作為金屬皂以外之脫模劑，可列舉褐煤酸部分皂化_或 =刀子複合酯等酯系脫模劑、改性烴系蠟或礦物油系合成 壤等合成壤。具體而言，可適當使用Lic〇wax 〇p(日本科 莱恩（Clariant Japan)股份有限公司製褐煤酸部分皂化 125940.doc -10- 200843927 酯）、Loxiol G78(日本科寧（Cognis Japan)股份有限公司製 高分子複合酯）、Licolub H-4(日本科萊恩股份有限公司製 改性烴）及L〇xiol VPN881(日本科寧股份有限公司製礦物 油系合成蠟）等市售品。作為金屬皂以外之脫模劑，較好 * 的是此處列舉之酯系脫模劑及合成蠟，若使用此處列舉以 , 外之脫模劑，則清潔性有時會變差。 當含有該等金屬皂以外之脫模劑時，較好的是使金屬皂 (') 系脫模劑與金屬皂以外之脫模劑之含有比例以重量比計為 90: 10〜30·· 70,尤其好的是8〇: 2〇〜4〇 : 6〇。若金屬皂以 外之脫模劑之比例過大，則清潔性會變差。 作為金屬皂以外之脫模劑之添加量，較好的是，相對於 100重里伤之二聚氰胺樹脂，添加〇 〜重量份，更好的 疋"j、、加0.1〜0.5重^份。若金屬皂以外之脫模劑之添加量不 足，則無添加效果，而若金屬皂以外之脫模劑之添加量過 多’則脫模性較好，但清潔性降低。 G f發明之模具清潔用及模具脫模回復用樹脂組合物，為 了提高清潔效果’較好的是其中含有紙襞。作為該紙聚， 彳使用草紙漿、竹紙漿、木材紙漿(針葉樹紙漿、闊葉樹 紙漿）等，亦可使用化學紙聚、機械紙漿中之任一者。 . 〃較好的是’於使料本發明之模具清㈣及模具脫模回 復用樹脂組合物之必要成分的三聚氛胺樹脂浸潰於該紙藥 =形態（樹脂浸潰紙漿）下’該紙漿存在於本發明之模具 清，用及模具脫模回復用樹脂組合物中。該樹脂含浸紙衆 可猎由將紙漿浸潰於三聚氰胺_甲醛樹脂水溶液中後加以 125940.doc -11 - 200843927 乾燥而製備。又，亦可將上述紙褒之一部分或全部替換成 粉末紙漿，藉此，可進一步提高流動性。 對上述紙漿之大小並無特別限定，通常為5〜1〇〇〇_， 較好的是10〜20”m左右。又，相對於爾量份之三聚氰 Mm n紙漿u量ϋ常為5~7G重量份，較好的是 20〜60重量份。若紙漿之含量未滿5重量份，則無添加效 果；若超過70重量份，則流動性變差，而無法填充至模具 之各個角落，使模具上殘留有汚物，故而不好。 較好的是’本發明之模具清潔用及模具脫模回復用樹脂 組合物中進一步含有硬化觸媒。作為硬化觸媒，可列舉鄰 苯二甲酸酐、草酸、磺胺酸、對甲苯磺酸等有機酸、鹽 酸4酸等無機酸，該等酸類與三乙胺、三乙醇胺、β-二 ^乙知、2-甲基_2_胺基小丙醇等之鹽類。作為硬化觸 娣之添加量，相對於i 〇〇重署 4 t c士曰 更里知之二聚氰胺樹脂，通常添 σ · ϊ份以下0.05重量份以上，較好的 〇·ι重量份以上。 w卜 較好的是’本發明之模呈音 組合物中含有、登白,、+、 模具脫模回復用樹脂 ^上述紙漿及硬化觸媒中之一種以上。 物力之模具清潔用及模具脫模回復用樹脂組合 料、低硬度小粒徑之填充材料;丨/…之纖維狀填充 製備本發明之模具清潔用及模具脫模 時’可採用將三聚氰胺榭 是用树月曰組合物 醇、金屬皂以外之脫模二二糸脫模劑 '與甘露糖 、角、、’氏漿等其他添加劑類均勻混合 125940.doc 200843927 而製得之任意方法。 例如可列舉混煉機、帶型攪拌機、亨舍爾混合機、球磨 機、滾筒攪拌機、石磨機、滾打機等。 作為可使用本發明之模具清潔用及模具脫模回復用樹脂 ::ά物來進行模具之清潔及脫模回復的硬化性樹脂成形材 • 肖例如可列舉％氧樹脂成形材料、苯盼樹脂成形材料 等較好的疋裱氧樹脂成形材料，尤其好的是半導體封裝 (:: ㈣氧樹脂成形材料。又，本發明之模具清潔用及模具脫 模回復用树月曰組合物可用於欲使該硬化性樹脂成形材料自 動成幵/時所使用之任意模具中，但通常用於由鐵、絡等構 成之模具時效果較佳。 用模a來使本發明之模具清潔用及模具脫模回復用樹 月a、’且σ物成形’藉此，可去除該模具表面之污物且可使模 ” ^面’、有脫模性。本發明之模具清潔用及模具脫模回復 用樹脂組合物之成形條件較好的是模具溫度16〇〜19〇t， C 成形壓力10〜20 MPa，硬化時間2~3分鐘。 實施例 以下’舉出實施例等’進—步對本發明進行詳細說明， 但本發明並不被該等實施例等所限定。 - (製造例1) 旦利用眾所周知之方法，使彻重量份之三聚氰胺與520重 量份之福馬林（37%水溶液）以及350重量份之水進行加熱反 應二製作三聚氰胺_甲醛樹脂’於所獲得之三聚氰胺樹脂 水溶液中添加257重量份之紙漿並加以混煉，其後，經減 125940.doc -13- 200843927 壓乾燥，獲得樹脂含量約為72%之現合有紙聚之三聚氰胺_ 甲酸樹脂粉末（三聚氰胺樹脂浸潰紙聚）。 (製造例2) 利用喷霧乾燥機，於約200。〇之溫度對製造例1中所獲得 之三聚氰胺樹脂水溶液(固體含量約為6〇重量％)進行乾燥 處理，藉此獲得粉末狀三聚氰胺樹脂。 [實施例1 ]Reduced sex. H. The resin composition for cleaning and mold release is preferably a 'release agent other than metal soap except for the melamine resin and the metal-based release. By releasing the release agent other than the gold soap, the mold release property can be exhibited without being affected by the release component in the epoxy sealing material. Examples of the release agent other than the metal soap include an ester-based release agent such as a montanic acid partial saponification_or = knife complex ester, a modified hydrocarbon wax or a mineral oil-based synthetic soil. Specifically, Lic〇wax 〇p (partially saponified montanic acid produced by Clariant Japan Co., Ltd. 125940.doc -10- 200843927 ester), and Loxiol G78 (limited by Cognis Japan) can be suitably used. Commercially available products such as polymer polyester esters, Licolub H-4 (modified hydrocarbons manufactured by Clariant Co., Ltd., Japan), and L〇xiol VPN881 (mineral oil synthetic waxes manufactured by Nippon Corning Co., Ltd.). The release agent other than the metal soap is preferably an ester-based release agent and a synthetic wax as exemplified above. When the release agent is used as described above, the cleanability may be deteriorated. When a mold release agent other than the metal soap is contained, it is preferred that the ratio of the metal soap (') release agent to the release agent other than the metal soap is 90: 10 to 30% by weight. 70, especially good is 8〇: 2〇~4〇: 6〇. If the proportion of the release agent other than the metal soap is too large, the cleanability will be deteriorated. As the amount of the mold release agent other than the metal soap, it is preferred to add 〇 to the weight of the melamine resin which is 100% by weight, and more preferably 疋"j, plus 0.1 to 0.5 weight ^ Share. If the amount of the release agent other than the metal soap is insufficient, there is no additive effect, and if the amount of the release agent other than the metal soap is excessively increased, the mold release property is good, but the cleanability is lowered. The resin composition for mold cleaning and mold release recovery of the invention of G f is for improving the cleaning effect. It is preferable to contain paper pulp. As the paper, turf pulp, bamboo pulp, wood pulp (conifer pulp, hardwood pulp), or the like may be used, and either chemical paper or mechanical pulp may be used. Preferably, the trimeric amine resin which is an essential component of the resin composition of the present invention and the mold composition for mold release is impregnated in the paper product = form (resin impregnated pulp) This pulp is present in the resin composition for mold cleaning, mold release and mold recovery of the present invention. The resin impregnated paper can be prepared by dipping the pulp in an aqueous solution of melamine-formaldehyde resin and drying it in 125940.doc -11 - 200843927. Further, part or all of the above-mentioned paper sheets may be replaced with powdered pulp, whereby the fluidity can be further improved. The size of the above pulp is not particularly limited, and is usually 5 to 1 Å, preferably 10 to 20" m. Further, the amount of melamine Mm n pulp relative to the amount is often 5 to 7 parts by weight, preferably 20 to 60 parts by weight. If the content of the pulp is less than 5 parts by weight, there is no additive effect; if it exceeds 70 parts by weight, the fluidity is deteriorated, and it is impossible to fill each of the molds. In the corner, it is not preferable to leave a stain on the mold. It is preferable that the resin composition for mold cleaning and mold release recovery of the present invention further contains a curing catalyst. As the curing catalyst, phthalic acid can be cited. An inorganic acid such as acetic anhydride, oxalic acid, sulfamic acid or p-toluenesulfonic acid, or an inorganic acid such as hydrochloric acid, such as triethylamine, triethanolamine, β-diethylamine or 2-methyl-2-amino group. a salt such as a small propanol. As a kind of hardening contact, it is better to add σ · ϊ or less to 0.05 parts by weight or more, relative to i 〇〇 4 4 c 曰 曰 里 里 0.05 0.05 The weight of the 〇·ι is more than or equal to w. Preferably, the mold composition of the present invention contains White, +, mold release recovery resin ^ one of the above pulp and hardening catalyst. Material mold cleaning and mold release recovery resin composition, low hardness and small particle size filling material; 丨 /... Fibrous filling preparation of the mold cleaning and mold release of the present invention can be carried out by using melamine hydrazine as a sulphate composition alcohol, a metal mold soap other than a mold release bismuth release agent' with mannose, horn, Any method prepared by uniformly mixing 125940.doc 200843927 with other additives such as 'slurry. For example, a mixer, a belt mixer, a Henschel mixer, a ball mill, a roller mixer, a stone mill, and a roller machine can be cited. For example, the curable resin molding material which can be used for the cleaning of the mold and the release of the mold for the mold cleaning and mold release recovery of the present invention can be used. A preferred epoxy resin molding material such as a resin molding material is particularly preferably a semiconductor package (:: (4) an oxygen resin molding material. Further, the mold cleaning and mold release recovery of the present invention The eucalyptus composition can be used in any mold to be used for automatically forming the curable resin molding material, but it is generally used for a mold composed of iron, cord, etc., and is preferably used by the mold a. In the mold cleaning and mold release of the invention, the tree month a, 'and the σ object forming' can remove the dirt on the surface of the mold and can make the mold "face" and have mold release property. The molding conditions for the cleaning and mold release-recovering resin composition are preferably a mold temperature of 16 Torr to 19 Torr, a C molding pressure of 10 to 20 MPa, and a curing time of 2 to 3 minutes. The present invention will be described in detail, but the present invention is not limited by the examples and the like. - (Manufacturing Example 1) A well-known method is used to make a gram of melamine and 520 parts by weight of formalin. (37% aqueous solution) and 350 parts by weight of water were subjected to a heating reaction to prepare a melamine-formaldehyde resin, and 257 parts by weight of pulp was added to the obtained aqueous melamine resin solution and kneaded, and thereafter, 125940.doc -13 was subtracted. - 20084 3927 Press-dried to obtain a paper-poly melamine-formic acid resin powder (melamine resin impregnated paper) having a resin content of about 72%. (Production Example 2) A spray dryer was used at about 200. The temperature of the crucible was dried by the aqueous solution of the melamine resin obtained in Production Example 1 (solid content of about 6% by weight), whereby a powdery melamine resin was obtained. [Example 1]
利用球磨機，將1000重量份之製造m中所獲得之樹脂 3里約72%之此合有紙漿之三聚氰胺-甲醛樹脂粉末、ο」 重量份之鄰苯二甲酸酐與6〇重量份之硬脂酸鋅加以混 合，藉此獲得模具清潔用及模具脫模回復㈣脂組合物 A °利用下述K方法’評估所獲得之樹脂組合物a之模 具清潔性及模具脫模性。其結果示於表丨中。如表丨所示， 樹脂組合物A發揮出優良之模具清潔性。X，於利用樹脂 組合物A進行模具清隸未使_具脫模回制樹脂組合 物之情況下使環氧密封材料成形時，此時呈現出之模具脫 模性並不遜於先前之使用右*替目始 j 用有杈具脫模回復用樹脂組合物時 之模具脫模性。 [實施例2 ] 利用球磨機，將1〇〇〇重量份之製造例丨中所獲得之樹脂 含量約為72%之混合有紙聚之三聚氰胺_甲醛樹脂粉末、3〇 重置份之製造例2中所獲得之粉末狀三聚氰胺樹脂、3〇重 罝份之粉末紙漿、0.5重量份之鄰苯二曱酸酐、2 5重量份 之硬脂酸鋅及3.5重量份之硬脂_加以混合，藉此獲得 125940.doc -14- 200843927 例!同樣之方：復用樹赌組合物B。利用與實施 及模且7估所獲得之樹脂組合物B的模具清潔性 其結果揭示於表+如表ι所示 合物B發揮出優良之模具清 、、、 R、隹—#日 丨生。又，於利用樹脂組合物 B進作具清潔後未使用模具脫模回復㈣餘 況下使環氧密封材料成形時，卜μ卩主q 之障 不、孫W "十成形時，此時呈現出之模具脫模性並 、之使用有模具脫模回復用樹脂組合 脫模性。 了心镆具 [測試方法] 清潔性測試 使用市售之聯苯系環氧樹脂成形材料（住友電木 (Sumitomo Bakelite)股份有限公司製 eme_735it)，利用 TQFP(Thin Quad Flat Pack ’薄四方扁平封裝）之模具，藉 由500次射出成形，而形成模具之污物。藉由下述方式進 行評估：使用該已有污物附著之模具，反覆使模具清潔用 及模具脫模回復用樹脂組合物成形，直至將模具表面、、主★ 乾淨為止。 、…Μ 脫模回復測試 清潔性測試結束後，使用市售之聯苯系環氧樹脂成形材 料（住友電木股份有限公司製ΕΜΕ-735 1Τ)進行連續成带、、則 試，藉此，確認模具脫模性。再者，對模具清潔性較差而 未完成洗淨之模具清潔用及模具脫模回復用樹脂組合物， 未進行脫模回復測試。 125940.doc -15- 200843927 [表1] 樹脂組合物 模具清潔性 模具脫模性 清潔完成射出次數 上模/下模 實施例1 5次/4次 良好 實施例2 Β 6次/4次 良好 [實施例3] T用球磨機，將1000重量份之製造例1中所獲得之樹脂 》1約為72%之混合有、紙漿之三聚氰胺-甲醛樹脂粉末、 〇·5重量份之鄰苯二甲、3()重量份之硬脂酸鋅以及 重讀之D·甘露糖醇加以混合，藉此獲得模具清潔用及模 具脫模回復用樹脂組合物c。利用與實施，同樣之方式， 評估所獲得之樹脂組合物c的模具清潔性及模具脫模性。 其結果揭示於表2中。如表2所示，樹脂組合物c發揮出優 良之模/、/月/糸f生又，於利用樹脂組合物c進行模具清潔 後未使用模具脫模回復用樹脂組合物之情況下使環氧密封 U ㈣成形時，此時呈現出之模具脫模性並不遜於先前之使 用有模具脫模回復用樹脂組合物時之模具脫模性。 [實施例4] ' 利用球磨機，將1000重量份之製造例1中所獲得之樹脂 . 纟量約為72%之混合有紙漿之三聚氰胺_甲醛樹脂粉末、 〇:重量份之鄰苯二甲酸酐、15重量份之硬脂酸鋅及3〇重 量份之D-甘露糖醇加以混合，藉此獲得模具清潔用及模具 脫模回復用樹脂組合物D。利用與實施例丨同樣之方式，評 估所獲得之樹脂組合❹的模具清潔性及模具脫模性。其 125940.doc • 16 - 200843927 結果揭示於表2中。如表2所示，樹脂組合物D發揮出優良 之模具清潔性。又，於利用樹脂組合物D進行模具清潔後 未使用模具脫模回復用樹脂組合物之情況下使環氧密封材 料成形時，此時呈現出之模具脫模性並不遜於先前之使用 有模具脫模回復用樹脂組合物時之模具脫模性。 [表2] 樹脂組合物 模具清潔性 模具脫模性 清潔完成射出次數 上模/下模 實施例3 C 5次/4次 良好 實施例4 D 6次/4次 良好 [實施例5] 利用球磨機，將1 000重量份之製造例i中所獲得之樹脂 含量約為72%之混合有紙漿之三聚氰胺_甲醛樹脂粉末、 〇·5重S份之鄰苯二甲酸酐、2·5重量份之硬脂酸鋅及重 量份之Licowax ΟΡ(日本科萊恩股份有限公司製褐煤酸部 分皂化酯）加以混合，藉此獲得模具清潔用及模具脫模回 復用樹脂組合物E。利用與實施例丨同樣之方式，評估所獲 得之樹脂組合物E之模具清潔性及模具脫模性。其結果^ 示於表3中。如表3所示’樹脂組合物E發揮出優良之模且 清潔性。X’於利用樹脂組合物_行模具清潔後未使用 模具脫模回復用樹脂組合物之情況下使環氧㈣材料成形 時，此時呈現出之模具脫模性並不遜於先前之使用有模具 脫模回復用樹脂組合物時之模具脫模性。 [實施例6] 125940.doc -17- 200843927 =用球磨機，將1〇〇〇重量份之製造例1中所獲得之樹脂 3里、、、勺為72%之混合有紙漿之三聚氰胺-甲醛樹脂粉末、 重里&之鄰苯一甲酸肝、2·5重量份之硬脂酸辞及u重 量份之L〇xiol G78(日本科寧股份有限公司製高分子複合 g曰）加以混合，藉此獲得模具清潔用及模具脫模回復用樹 脂組合物F。制與實施例丨同樣之方式，評估所獲得之樹 脂組合W的模具清潔性及模具脫模性。其結果揭示於表3 t。如表3所示，樹脂組合物F發揮出優良之模具清潔性。 又，於利用樹脂組合物F進行模具清潔後未使用模具脫模 回復用樹脂組合物之情況下使環氧密封材料成形時，此時 呈現出之模具脫模性並不遜於先前之使用有模具脫模回復 用樹脂組合物時之模具脫模性。 [實施例7] 7用球磨機，將1000重量份之製造例丨中所獲得之樹脂 含量約為72%之混合有紙漿之三聚氰胺_甲醛樹脂粉末、3〇 重罝份之製造例2中所獲得之粉末狀三聚氰胺樹脂、3〇重 量份之粉末紙漿、〇·5重量份之鄰苯二甲酸酐、2.5重量份 之硬脂酸鋅及3.5重量份之Uc〇lub Η·4(曰本科萊恩股份有 限公司製改性烴）加以混合，藉此獲得模具清潔用及模具 脫模回復用樹脂組合物G。利用與實施例丨同樣之方式，評 估所獲得之樹脂組合物G的模具清潔性及模具脫模性。其 、、果揭示於表3中。如表3所示，樹脂組合物〇發揮出優良 之模具π漂性。又，於利用樹脂組合物G進行模具清潔後 未使用模具脫模回復用樹脂組合物之情況下使環氧密封材 125940.doc -18- 200843927 料成形時，此時呈現出之模 有模具脫模回復用樹脂組合物 月】便 σ物時之模具脫模性。 [實施例8] 利用球磨機，將1000重量份之製造们中 含量约為72%之混合有紙裝 * 又 ，曰 7 一鬈氰胺-甲醛樹脂粉末、3〇 重篁伤之製造例2中所獲得之粉 末狀二聚鼠胺樹脂、30重 篁伤之粉末紙漿、〇·5重量份 刀 < 磾本一罗酸酐、2.5重量份 之硬脂酸鋅及3.0重量份夕匕·，Tr xio VPN881(日本科寧股份有 =製礦物油系合成修以混合，藉此獲得模具清潔 用及模具㈣回制樹脂組合物H。利用與實施例丨同樣之 方式’評估所獲得之樹脂組合物H的模具清潔性及模具脫 核性。其結果揭示於表3中。如表3所示，樹脂組合物⑽ 揮=良之模具清潔性。又’於利用樹脂組合物Η進行模 具^潔後未使用模具脫模回復用樹脂組合物之情況下使環 ^密封材料成形時’此時呈現出之模具脫模性並不遜於先 、’ 用有模具脫模回復用樹脂組合物時之模JL脫模性。 [表3] 〆、、 樹脂組合物 模具清潔性 模具脫模性 清潔完成射出次數 上模/下模 Ε 5次/5次 F 5次/5次 PC -^T 7 G 4次/4次 8 Η 6次/6次 Pv 良好 產業上之可利用性 — 用本發明之模具清潔用及模具脫模回復用樹脂組 125940.doc •19- 200843927 合物’可去除因近年來環氡密 模 模具具有脫H因此，可減少 吊^、之—系列模具清潔操作及模具脫模回復操作，從 而可縮短知作時間。並且，無須使用轉移成形時所必需之 引線框架或虛設框架（dummy frame)等構件，因此亦可減 少一系列模具清潔操作及模具脫模回復操作之相關成本。 125940.doc -20-Using a ball mill, about 72% of the melamine-formaldehyde resin powder of the pulp obtained in the resin 3 obtained in the production of m, ο" parts by weight of phthalic anhydride and 6 parts by weight of stearin Zinc acid was mixed to obtain mold cleaning and mold release recovery. (IV) Grease composition A ° The mold cleanability and mold release property of the obtained resin composition a were evaluated by the following K method. The results are shown in the table. As shown in Table 树脂, the resin composition A exerts excellent mold cleanability. X, when the epoxy resin sealing material is formed by using the resin composition A, and the epoxy resin sealing material is formed without demolding the resin composition, the mold release property exhibited at this time is not inferior to the previous use right. * The mold release property when the resin composition for mold release is used for the mold is used. [Example 2] Production Example 2 in which a resin content of a resin obtained in a production example of about 1% by weight was mixed with a paper-polymerized melamine-formaldehyde resin powder and a 3-inch replacement portion by using a ball mill Mixing the powdered melamine resin, the 3 liters of the pulverized pulp, 0.5 parts by weight of phthalic anhydride, 25 parts by weight of zinc stearate, and 3.5 parts by weight of the hard fat obtained by mixing Obtained 125940.doc -14- 200843927 Example! The same side: reuse tree bet composition B. The mold cleanability of the resin composition B obtained by the evaluation and the simulation was evaluated. The results are shown in Table +, as shown in Table 1, the compound B exhibits excellent mold cleaning,, R, 隹-#日丨生. In addition, after the resin composition B is used for cleaning, the mold is not used for mold release. (4) When the epoxy sealing material is formed, the obstacle is not formed, and the sun is W " The mold release property is exhibited, and the mold release property of the mold release recovery is used. Heartware [Test Method] The cleaning test uses a commercially available biphenyl-based epoxy resin molding material (eme_735it manufactured by Sumitomo Bakelite Co., Ltd.) using TQFP (Thin Quad Flat Pack 'thin quad flat package) The mold is formed by 500 injection molding to form a mold stain. The evaluation was carried out by using the mold to which the existing dirt adhered, and the resin composition for mold cleaning and mold release recovery was repeatedly formed until the surface of the mold was cleaned. Μ 脱 脱 回复 回复 回复 回复 脱 脱 脱 脱 脱 脱 脱 脱 脱 脱 脱 脱 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 735 Confirm the mold release property. Further, the resin composition for mold cleaning and mold release recovery which was inferior in mold cleanability and which was not cleaned was not subjected to the mold release recovery test. 125940.doc -15- 200843927 [Table 1] Resin composition mold cleaning mold release cleaning completion number of shots upper mold / lower mold Example 1 5 times / 4 times good example 2 Β 6 times / 4 times good [ Example 3] T was used in a ball mill to mix 1000 parts by weight of the resin obtained in Production Example 1 with about 72%, melamine-formaldehyde resin powder of pulp, 重量·5 parts by weight of phthalic acid, 3 parts by weight of zinc stearate and re-read D·mannitol are mixed, whereby a resin composition c for mold cleaning and mold release recovery is obtained. The mold cleanability and mold release property of the obtained resin composition c were evaluated in the same manner as in the practice. The results are disclosed in Table 2. As shown in Table 2, the resin composition c exhibits excellent mold/,/month/foil, and the ring is removed after the mold is cleaned by the resin composition c, and the resin composition for mold release is not used. When the oxygen seal U (4) is formed, the mold release property exhibited at this time is not inferior to the mold release property of the conventional resin composition for mold release recovery. [Example 4] 'A 1000 parts by weight of a resin obtained in Production Example 1 using a ball mill. A smelting amount of melamine-formaldehyde resin powder mixed with pulp of about 72%, 〇: parts by weight of phthalic anhydride 15 parts by weight of zinc stearate and 3 parts by weight of D-mannitol were mixed, whereby a resin composition D for mold cleaning and mold release recovery was obtained. The mold cleanability and mold release property of the obtained resin composite crucible were evaluated in the same manner as in the example. Its 125940.doc • 16 - 200843927 results are shown in Table 2. As shown in Table 2, the resin composition D exhibited excellent mold cleanability. Further, when the epoxy resin sealing material is molded without using the resin composition for mold release recovery after the mold cleaning by the resin composition D, the mold release property exhibited at this time is not inferior to that of the previous mold. The mold release property when the resin composition for mold release is released. [Table 2] Resin composition mold cleaning mold release cleaning completion ejection times upper mold / lower mold Example 3 C 5 times / 4 times good example 4 D 6 times / 4 times good [Example 5] Using a ball mill And 1 000 parts by weight of the melamine-formaldehyde resin powder mixed with pulp having a resin content of about 72% obtained in the production example i, 〇·5 weight S parts of phthalic anhydride, 2.5 parts by weight Zinc stearate and a part by weight of Licowax® (partially saponified ester of montanic acid produced by Clariant Co., Ltd., Japan) were mixed to obtain a resin composition E for mold cleaning and mold release. The mold cleanability and mold release property of the obtained resin composition E were evaluated in the same manner as in the example. The results are shown in Table 3. As shown in Table 3, the resin composition E exhibited excellent mold and cleanability. When the epoxy (tetra) material is formed by using the resin composition after the cleaning of the resin composition without using the mold release-recovering resin composition, the mold release property exhibited at this time is not inferior to that of the previous mold. The mold release property when the resin composition for mold release is released. [Example 6] 125940.doc -17- 200843927 = 1 part by weight of the melamine-formaldehyde resin mixed with pulp in the resin 3 obtained in Production Example 1 and 72% in a ball mill Mixing powder, oligo & o-benzoic acid liver, 2.5 parts by weight of stearic acid and u parts by weight of L〇xiol G78 (polymer composite g) manufactured by Nippon Corning Co., Ltd. A resin composition F for mold cleaning and mold release recovery was obtained. The mold cleanability and mold release property of the obtained resin combination W were evaluated in the same manner as in the Example. The results are disclosed in Table 3 t. As shown in Table 3, the resin composition F exhibited excellent mold cleanability. Further, when the epoxy resin sealing material is formed without using the resin composition for mold release recovery after the mold cleaning by the resin composition F, the mold release property exhibited at this time is not inferior to that of the previous mold. The mold release property when the resin composition for mold release is released. [Example 7] 7 obtained by using a ball mill, 1000 parts by weight of a melamine-formaldehyde resin powder obtained by mixing a resin having a resin content of about 72%, and a ruthenium-formaldehyde resin powder mixed with 3 parts by weight. Powdered melamine resin, 3 parts by weight of powdered pulp, 〇 5 parts by weight of phthalic anhydride, 2.5 parts by weight of zinc stearate, and 3.5 parts by weight of Uc〇lub Η·4 (曰本科莱恩股份The modified hydrocarbon produced by the company was mixed, whereby a resin composition G for mold cleaning and mold release recovery was obtained. The mold cleanability and mold release property of the obtained resin composition G were evaluated in the same manner as in the Example. The results are shown in Table 3. As shown in Table 3, the resin composition 〇 exhibited excellent mold π floatability. Further, when the resin composition G is cleaned by the resin composition G, and the epoxy resin sealing material 125940.doc -18-200843927 is formed without using the resin composition for mold release recovery, the mold is formed at this time. Resin composition for mold recovery month] mold release property when σ is used. [Example 8] Using a ball mill, 1000 parts by weight of a manufacturer having a content of about 72% mixed with paper loaded *, 曰7-cyanamide-formaldehyde resin powder, and 3 〇 heavy wounded in Production Example 2 The obtained powdery dimeric murine amine resin, 30 weight-damaged powder pulp, 〇·5 parts by weight of knife < 磾本一罗酸酸, 2.5 parts by weight of zinc stearate and 3.0 parts by weight of 匕 匕, Tr Xio VPN881 (Japan Corning Co., Ltd. has a mineral oil system synthetically mixed to obtain mold cleaning and mold (4) to return resin composition H. The resin composition obtained was evaluated in the same manner as in Example ' The mold cleanability and mold denuclearity of H. The results are disclosed in Table 3. As shown in Table 3, the resin composition (10) was good in mold cleanability, and the mold was cleaned by using the resin composition. When the resin composition is used for mold release recovery, when the ring sealing material is formed, the mold release property exhibited at this time is not inferior to that of the mold JL when the resin composition for mold release is recovered. Moulding. [Table 3] 〆,, resin composition mold cleaning Mould release mold cleaning complete shot times upper mold / lower mold Ε 5 times / 5 times F 5 times / 5 times PC - ^ T 7 G 4 times / 4 times 8 Η 6 times / 6 times Pv Good industry can Utilizing - Resin group for mold cleaning and mold release recovery according to the present invention 125940.doc •19- 200843927 The compound can be removed. In recent years, the mold of the ring mold has a de-H, so that the hanging can be reduced. A series of mold cleaning operations and mold release recovery operations can shorten the time of knowledge. Moreover, it is not necessary to use components such as lead frames or dummy frames necessary for transfer molding, thereby reducing a series of mold cleaning operations and The cost associated with the mold release recovery operation. 125940.doc -20-