KR102274604B1 - Melamine Resin Composition for Cleaning Semiconductor Mold - Google Patents

Abstract

The present invention relates to a melamine resin composition for cleaning a semiconductor mold, characterized in that it comprises a melamine resin, a detergent grafted inorganic filler, pulp, a curing catalyst and a lubricant. The melamine resin composition for cleaning a semiconductor mold according to the present invention has an effect of having an improved cleaning power than the conventional melamine resin composition for cleaning a semiconductor mold.

Description

Melamine Resin Composition for Cleaning Semiconductor Mold

The present invention relates to a melamine resin composition for cleaning semiconductor molds with improved cleaning power for semiconductor molds.

Melamine mold cleaning compound, which is a cleaning material for semiconductor encapsulation molds, is the cause of surface staining that occurs in the process of encapsulating semiconductor devices with a semiconductor encapsulant (EMC). It refers to a material made of a thermosetting polymer compound that removes contaminants from the mold.

The melamine mold cleaning compound is used in the manufacturing process of semiconductor chips, integrated circuits (IC), BGA (Ball Grid Array), transistors and diodes, as well as in the molding process of various plastic products. used for cleaning molds.

In the case of encapsulation molding using the encapsulation molding material containing the curable resin composition, contaminants derived from the encapsulation molding material are likely to occur if the encapsulation molding operation of an integrated circuit or LED element is continued for a long time. There is a defect that the inside of the molding die is contaminated due to the generation of such dirt. When such dirt is left in the mold, a defect in which the dirt adheres to the surface of an encapsulation molded article such as an integrated circuit or an LED element occurs. Therefore, in the sealing molding process, it is required to remove the dirt in the molding die.

In general, cleaning of the mold for semiconductor encapsulation molding is performed by molding the resin composition for cleaning the mold instead of the encapsulation material at a ratio of several shots every hundreds of shots in the encapsulation molding process, and the mold cleaning resin composition is molded. By doing so, it is possible to remove dirt on the inner surface of the molding die.

When cleaning a metal mold|die, if the resin composition for metal mold|die cleaning which reduced the filler into particle size is used, clogging of the narrow gate part of the metal mold|die cavity refined|miniaturized can be suppressed. However, when the filler material is made into small particles, the physical polishing effect of the filler material is reduced, and in particular, there is a defect that the dirt removal performance of the corner portion is reduced. Moreover, the flow of the resin composition for metal mold|die cleaning becomes excess at the time of cleaning, and the resin composition for metal mold|die cleaning which reduced a filler into particle size has a defect which cannot fully remove dirt because the resin composition for metal mold|die cleaning does not accumulate|stack properly in a metal mold|die. For this reason, a melamine bath composition is often used to clean the semiconductor mold, and when the melamine resin composition is used, it is possible to reduce the semiconductor element sealing time and reduce the wear of the mold, and the process of encapsulating with a semiconductor encapsulant (EMC compound) is reduced. Productivity can be improved by reducing defective products and improving work efficiency.

However, as the materials and processes of semiconductor molds are diversified day by day, there is a continuous demand for technology development for a mold cleaning composition exhibiting high cleaning efficiency. In particular, in order to cope with the high performance of the equipment used in recent years, the shape and structure of encapsulation molding such as integrated circuits and LED elements are also diversified and refined, and the shape and structure of molding molds used in the encapsulation molding process are also diversified and refined It is required, and the cleaning of the molding mold includes complex and various corners where dirt is easily left, and there is a limit to completely removing dirt to every corner of the mold cavity with the existing melamine resin composition.

The present invention derived to solve the above problems is to provide a melamine resin composition for cleaning a semiconductor mold, which has improved cleaning power than the conventional melamine resin composition for cleaning a semiconductor mold used as a cleaning material for a mold for semiconductor encapsulation. do it with

The problem to be solved by the present invention is not limited to the technical problems mentioned above, and other technical problems not mentioned can be clearly understood by those of ordinary skill in the art to which the present invention belongs from the following description. will be.

The present invention for solving the above problems relates to a melamine resin composition for cleaning a semiconductor mold, characterized in that it comprises a melamine resin, a detergent grafted inorganic filler, pulp, a curing catalyst and a lubricant.

In the present invention, the inorganic filler may preferably be a nano-ceramic powder having an average particle diameter of 50 to 300 nm.

In the present invention, the detergent may be liquid at room temperature and preferably have a boiling point of 160 °C to 220 °C, and the content of the inorganic filler grafted with the detergent is preferably 5 to 30 parts by weight based on 100 parts by weight of the melamine resin. can do.

In the present invention, the pulp may preferably be a powdery pulp having a particle size of #30 to #300, and the content of the pulp may be preferably 5 to 30 parts by weight based on 100 parts by weight of the melamine resin.

In the present invention, the content of the curing catalyst may be preferably 0.5 to 3 parts by weight based on 100 parts by weight of the melamine resin.

In the present invention, the amount of the lubricant may be 0.1 to 5 parts by weight based on 100 parts by weight of the melamine resin.

When the melamine resin composition for cleaning a semiconductor mold of the present invention is measured as a function of time using an ODR (Oscillating Disk Rheometer) at a curing temperature in the range of 170 to 180° C., the maximum torque value (maximum torque, MH value) ) may be preferably 20 to 40 Lb-inch.

The melamine resin composition for cleaning a semiconductor mold according to the present invention has an effect of having an improved cleaning power than the conventional melamine resin composition for cleaning a semiconductor mold.

Since the present invention can apply various transformations and can have various embodiments, specific embodiments are illustrated in the drawings and described in detail in the detailed description. However, this is not intended to limit the present invention to specific embodiments, and it should be understood to include all modifications, equivalents, and substitutes included in the spirit and scope of the present invention. In describing the present invention, if it is determined that a detailed description of a related known technology may obscure the gist of the present invention, the detailed description thereof will be omitted.

The terms used in the present application are only used to describe specific embodiments, and are not intended to limit the present invention. The singular expression includes the plural expression unless the context clearly dictates otherwise. In the present application, terms such as “comprise” or “have” are intended to designate that a feature, number, step, operation, component, part, or combination thereof described in the specification exists, but one or more other features It should be understood that this does not preclude the existence or addition of numbers, steps, operations, components, parts, or combinations thereof.

Terms such as first, second, etc. may be used to describe various elements, but the elements should not be limited by the terms. The above terms are used only for the purpose of distinguishing one component from another.

The present invention relates to a melamine resin composition for cleaning a semiconductor mold, and more particularly, it is characterized in that it comprises a melamine resin, a cleaning agent grafted inorganic filler, pulp, a curing catalyst, and a lubricant.

In the present invention, a semiconductor mold means a mold for molding a semiconductor encapsulant, and the melamine resin composition for cleaning a semiconductor mold of the present invention is used to remove contaminants formed on the surface of a mold for molding a semiconductor encapsulant. It means a melamine resin composition.

In the present invention, the melamine resin is a material having high thermal stability and excellent flame retardancy, and the melamine resin may be at least one selected from the group consisting of a melamine-phenol cocondensate and a melamine-urea cocondensate. The melamine-phenol co-condensate may be a co-condensation of melamine, phenols and aldehydes (eg, formhalaldehyde), and the melamine-urea co-condensate may be a co-condensation of melamine, urea and aldehydes. have.

In the present invention, the melamine resin may be prepared by a known method. For example, an aqueous solution of an initial condensate is prepared by reacting formaldehyde (37% aqueous solution) and melamine in an aqueous solution at a molar ratio of 1 to 2.5. React for 100 to 180 minutes at a reaction temperature of 85 to 95 ℃, slightly alkaline (pH 7.5). Thereafter, the gelled product is crushed and dried in a hot air dryer at 80° C. for 2 hours to remove moisture, and then a white melamine resin can be prepared.

In addition, in the melamine resin composition for cleaning a semiconductor mold according to the present invention, in addition to the melamine resin, other resins that can be blended with the melamine resin may be blended in an amount that does not adversely affect the effects of the present invention, and the blend with the melamine resin Other possible resins may be alkyd resins, polyester resins, acrylic resins, epoxy resins, rubbers, and the like.

In the present invention, the inorganic filler serves to enhance the cleaning power by strengthening the strength of the melamine resin composition for cleaning semiconductor molds, and the inorganic filler is silicon oxide, silicon carbide, titanium carbide, titanium oxide, boron carbide, and boron oxide. , may be any one or more selected from the group consisting of aluminum oxide, magnesium oxide, calcium oxide and nano ceramic powder, In order to further strengthen the strength of the melamine resin composition for cleaning semiconductor molds to increase cleaning power, it is most preferable to use a nano-ceramic powder having an average particle diameter of 50 to 300 nm.

The cleaning agent grafted with the inorganic filler serves to release contaminants in the mold from the mold, and the cleaning agent is coupled to the inorganic filler using a coupling agent. The melamine resin composition for cleaning a semiconductor mold of the present invention is characterized in that the cleaning agent includes a grafted inorganic filler, thereby enhancing cleaning performance and improving mold release property. Considering that the mold temperature range of the semiconductor mold is around 160 ~ 200 ℃, the cleaning agent is vaporized at the mold temperature zone to maximize the cleaning effect, it is liquid at room temperature and preferably has a boiling point of 160 ~ 220 ℃, e.g. For example, it may be a glycol ether-based cleaning compound, an imidazoline-based cleaning compound, an amine-based cleaning compound, or an amino alcohol-based cleaning compound, and may be used in combination of one or more thereof. The coupling agent used when grafting the cleaning agent to the inorganic filler is a surface-modifying material that is coated on the surface of the inorganic filler to increase adhesion and uniformity, and to increase the surface-active properties. At least one selected from aliphatic, alicyclic and aromatic alkoxy including alkoxysilane, methyltrialkoxysilane, and ethyltrialkoxysilane may be used, and the reactive silanes include alkoxysilane having an epoxy group, a thiol group, an amine group, and an acid anhydride group. One or more selected from may be used.

The melamine resin composition for cleaning semiconductor molds measures torque as a function of time using an ODR (Oscillating Disk Rheometer) at a curing temperature in the range of 170 to 180°C. In evaluating the properties of melamine through the above ODR equipment, when the melamine resin composition is cured, the curing progress state can be confirmed. As the melamine resin composition sample is warmed to the curing temperature, the melamine resin composition sample becomes softer and the torque decreases. The melamine resin composition sample then begins to harden, which can be confirmed by the increase in torque. The melamine resin composition sample may be defined as a minimum torque (ML value) at the time when curing starts, and this minimum torque value means deformation characteristics and minimum viscosity in an uncured state. In addition, as the curing of the melamine resin composition proceeds, the torque continues to increase until it reaches a maximum value, and the maximum value may be defined as a maximum torque value (MH value), and this maximum torque value is It refers to the strength or shear modulus of a fully cured state of the melamine resin composition. That is, the smaller the minimum torque value, which means the deformation characteristics and the minimum viscosity of the melamine resin composition in an uncured state, the better the spreadability and the sufficient filling inside the mold is possible, but when the minimum torque value is too small, There is a problem in that the filling is defective when filling in the mold due to excessive spreadability. Therefore, when the minimum torque value exceeds the appropriate range, since curing proceeds in a state in which the melamine resin composition is not sufficiently filled in the mold, effective cleaning ability cannot be exhibited, which is not preferable. On the other hand, the maximum torque (MH value) of the melamine resin composition for cleaning a semiconductor mold of the present invention was most appropriate when 20 to 40 Lb-inch. When the maximum torque value is less than 20 Lb-inch, the strength of the melamine resin composition is weak and sticking phenomenon may occur when contaminants inside the mold are included, which is a problem, and the maximum torque value is 40 Lb If it is larger than -inch, the strength of the composition after curing is too high, which is a problem because the melamine resin composition may crumble.

The content of the inorganic filler grafted with the detergent in the present invention is not particularly limited, but is preferably 5 to 30 parts by weight based on 100 parts by weight of the melamine resin, more preferably 5 to 25 parts by weight, most preferably may be 10 to 20 parts by weight. This is because when the content of the inorganic filler grafted with the detergent is less than 5 parts by weight relative to 100 parts by weight of the melamine resin, the strength of the melamine resin composition is excessively lowered, and the cleaning power for contaminants attached to the inside of the mold is not good, and it exceeds 30 parts by weight. This is because the fluidity of the melamine resin composition is deteriorated and the mold is not filled to every corner, so there is a problem in that contaminants remain in every corner of the mold.

In the present invention, the pulp serves to enhance the strength of the melamine resin composition for cleaning semiconductor molds and improve the fluidity to supplement the cleaning power, and the content of the pulp is not particularly limited, but 100 parts by weight of the melamine resin It is preferably 5 to 30 parts by weight, more preferably 5 to 25 parts by weight, and most preferably 10 to 20 parts by weight. This is because when the content of the pulp is less than 5 parts by weight relative to 100 parts by weight of the melamine resin, the strength of the melamine resin composition is lowered and the cleaning power is lowered, and when it exceeds 30 parts by weight, the fluidity of the melamine resin composition deteriorates and is not filled to every corner of the mold. This is because there is a problem that contaminants remain in every corner of the mold.

The form of the pulp may be pulp impregnated with melamine resin or pulp in powder form, and in the case of the pulp in powder form, it is possible to improve the fluidity of the melamine resin composition for cleaning semiconductor molds, thereby further removing contaminants to every corner of the mold. can be removed more efficiently. The powdered pulp may preferably have a particle size of #30 to #300, more preferably #50 to #280, and most preferably #50 to #250. This is because if the particle size of the powdered pulp is less than #30, the fluidity of the melamine resin composition for cleaning the mold may be reduced, and if it exceeds #300, there is a problem in that the moldability is significantly reduced. When the pulp is a pulp impregnated with a melamine resin, it may be prepared by impregnating the pulp in an aqueous melamine solution. The aqueous melamine solution may be, for example, an aqueous melamine-formaldehyde resin aqueous solution or a melamine-phenol-formaldehyde resin aqueous solution, but is not limited thereto as long as it is an aqueous solution containing melamine.

In the present invention, the curing catalyst may be any one or more selected from the group consisting of maleic anhydride, myristic acid, palmitic acid, stearic acid, citric acid monohydrate, benzoic acid and phthalic anhydride, and the content of the curing catalyst is not particularly limited, but the present invention In order to prevent a decrease in the cleaning power of the melamine resin composition for cleaning a semiconductor mold of the present invention, it is preferably 0.5 to 3 parts by weight, more preferably 0.5 to 2% by weight, based on 100 parts by weight of the melamine resin.

In the present invention, the lubricant serves to enhance fluidity so that the semiconductor mold can be cleaned without missing any corners, and the lubricant includes zinc stearate, calcium stearate, and zinc myristate. myristate) selected from metallic soaps; fatty acids selected from stearic acid and oleic acid; glycerol selected from glycerol, glycerol monooleate and glycerol monohydroxystearate; and fatty acid amides selected from lauric acid amide, myristic acid amide, uric acid amide, oleic amide, stear amide, methylenebisstearic acid amide, ethylenebisstearic acid amide, and ethylenebisoleic acid amide; It may be one or more, but preferably zinc stearate.

In addition, the content of the lubricant is preferably 0.1 to 5 parts by weight based on 100 parts by weight of the melamine resin, more preferably 0.1 to 3 parts by weight, and most preferably 0.1 to 1 parts by weight. This is because when the content of the lubricant is less than 0.1 parts by weight relative to 100 parts by weight of the melamine resin, the fluidity of the melamine resin composition is not sufficient to fill every corner of the semiconductor mold, so there is a problem that contaminants may remain in the mold, 5 When it exceeds a weight part, this is because the strength of the melamine resin composition for cleaning a semiconductor mold of the present invention is too low, and there is a problem that the cleaning power is lowered.

The melamine resin composition for cleaning a semiconductor mold according to the present invention has the advantage of having an improved cleaning power than the conventional melamine resin composition for cleaning a semiconductor mold, so that it is possible to minimize the encapsulation time of the semiconductor small intestine, and it is possible to reduce the wear of the semiconductor mold, When the semiconductor encapsulant molding process is performed, the product defect rate can be reduced and the encapsulation work efficiency can be improved, thereby improving the productivity of the semiconductor package.

Furthermore, the melamine resin composition for cleaning a semiconductor mold according to the present invention is a semiconductor chip, integrated circuit (IC), BGA (Ball Grid Array), transistor (Transistor), diode (Diode), etc. in the manufacturing process of course, as well as various It can also be used extensively for cleaning molds in the molding process of plastic products.

Hereinafter, the present invention will be described by way of examples. The following examples are merely examples for explaining the present invention, and the scope of the present invention is not limited thereby.

<Example>

Example 1

Melamine resin, 20 parts by weight of inorganic filler grafted with detergent based on 100 parts by weight of the melamine resin, 15 parts by weight of pulp having a particle size of #40 based on 100 parts by weight of the melamine resin, 0.5 parts by weight of maleic anhydride having a melting point of 52.6° C. as a curing catalyst A melamine resin composition for cleaning semiconductor molds according to the present invention was prepared by mixing parts by weight and 0.5 parts by weight of benzoic acid having a melting point of 124° C. and 0.4 parts by weight of zinc stearate as a lubricant.

In the case of the inorganic filler to which the cleaning agent was grafted, nano ceramic powder having an average particle diameter of 210 nm was used as the inorganic filler, and dipropylene glycol methyl ether having a boiling point of 190°C was used as the cleaning agent, and the cleaning agent was used as an inorganic filler. The coupling agent used when bonding to the methyltrialkoxysilane (methyltrialkoxysilane) was used.

Example 2

A melamine resin composition for cleaning a semiconductor mold according to the present invention was prepared in the same manner as in Example 1, except that ethylene glycol monobutyl ether having a boiling point of 188° C. was used as the cleaning agent.

comparative example

A melamine resin composition for cleaning a semiconductor mold was prepared in the same manner as in Example 1, but without using a cleaning agent.

Experimental example

The cleaning power of the melamine resin compositions for cleaning semiconductor molds prepared in Examples 1, 2 and Comparative Example 1, respectively, were evaluated by the following test method.

[Test Methods]

A commercial biphenyl type epoxy resin mold material (CEL-9200XU available from Hitachi Chemical Co., Ltd) was used and molded for 500 shots in a mold for a TQFP (thin quad flat pack) to have mold filth. The evaluation is made by repeatedly molding the melamine resin composition for cleaning semiconductor molds of Examples 1 and 2 and Comparative Example 1 using a contaminated mold until the mold surface is cleaned. The smaller the number of repeated molding, the better the cleaning power, and the test results are as shown in Table 1 below.

Example 1 Example 2 Comparative Example 1 cleaning complete
number of shots 5 5 7 Great Great Good

As shown in Table 1, it can be seen that the melamine resin composition of Examples 1 and 2 using the inorganic filler grafted with the detergent has superior cleaning power compared to the melamine resin composition of Comparative Example 1 which does not.

As described above, those skilled in the art to which the present invention pertains will be able to understand that the present invention may be embodied in other specific forms without changing the technical spirit or essential characteristics thereof. The scope of the present invention is indicated by the claims to be described later rather than the above detailed description, and all changes or modifications derived from the meaning and scope of the claims and their equivalent concepts are interpreted as being included in the scope of the present invention. should be

Claims (9)

A melamine resin, a detergent comprising a grafted inorganic filler, a pulp, a curing catalyst and a lubricant,
The inorganic filler is a nano-ceramic powder having an average particle diameter of 50 to 300 nm,
The content of the inorganic filler grafted with the detergent is 5 to 30 parts by weight based on 100 parts by weight of the melamine resin,
When the torque as a function of time is measured using an ODR (Oscillating Disk Rheometer) at a curing temperature in the range of 170 to 180° C., a semiconductor mold having a maximum torque (MH value) of 20 to 40 Lb-inch A melamine resin composition for cleaning.
delete The method of claim 1,
The cleaning agent is a liquid at room temperature and a melamine resin composition for cleaning a semiconductor mold, characterized in that the boiling point is 160 ~ 220 ℃.
delete The method of claim 1,
The pulp is a melamine resin composition for cleaning a semiconductor mold, characterized in that the pulp is in the form of a powder having a particle size of #30 to #300.
The method of claim 1,
The content of the pulp is a melamine resin composition for cleaning a semiconductor mold, characterized in that 5 to 30 parts by weight based on 100 parts by weight of the melamine resin.
The method of claim 1,
The content of the curing catalyst is a melamine resin composition for cleaning a semiconductor mold, characterized in that 0.5 to 3 parts by weight based on 100 parts by weight of the melamine resin.
The method of claim 1,
The content of the lubricant is a melamine resin composition for cleaning a semiconductor mold, characterized in that 0.1 to 5 parts by weight based on 100 parts by weight of the melamine resin.
delete