KR102019456B1 - Resin composition for cleaning die - Google Patents

Abstract

The present invention provides a mold cleaning resin comprising a melamine resin, a spherical inorganic filler having a maximum particle diameter of 1 to 70 µm, a curing catalyst selected from myristic acid and stearic acid, and zinc myristic acid salts of saturated fatty acids and metals. To provide a composition.

Description

Resin composition for cleaning dies

The present invention relates to a resin composition for mold cleaning. In more detail, this invention relates to the resin composition for metal mold | die cleaning of the transfer type which removes the dirt of the molding die internal surface derived from a thermosetting resin composition.

In the case of sealing molding using the sealing molding material containing a thermosetting resin composition, the dirt derived from the sealing molding material is likely to occur when the sealing molding operation such as an integrated circuit or an LED element is continued for a long time. Due to such dirt generation, there is a defect that the inside of the molding die becomes dirty. If such dirt is left in the mold, a defect occurs in which dirt adheres to the surface of an encapsulation molded product such as an integrated circuit or an LED element. Therefore, when encapsulating, it is required to remove the dirt in the molding die. It is preferable to shape | mold the resin composition for metal mold | die cleaning instead of the sealing molding material by the ratio of several shots every time when several hundred shots of sealing molding is carried out in the case of sealing molding. By molding the resin composition for metal mold | die cleaning, it is possible to remove the dirt of the molding die inner surface.

Such a resin composition for metal mold | die cleaning is conventionally proposed. For example, the resin composition for metal mold | die cleaning of patent document 1 contains 10-70 mass% of epoxy-modified melamine resin with respect to the whole amount of amino-type resin, and the thermal-temperature toughness of the molded article obtained by shape | molding at the time of metal mold cleaning is carried out. ) And the workability of mold cleaning is improved.

In order to cope with the high performance of devices to be used in recent years, encapsulation shapes and structures of integrated circuits and LED devices have been diversified and refined. Therefore, diversification and precision of the shape and structure of the molding die used for the sealing molding process are calculated | required. The cleaning of the molding die is required to remove the dirt to every corner of the mold cavity, including the corners where dirt is likely to remain.

Patent document 1 describes the resin composition for metal mold | die cleaning which made the thing of 1 mass% with respect to mineral powder whole quantity with a maximum particle diameter of 180 micrometers or less and a particle diameter of 100 micrometers or more as mineral powder. The resin composition for metal mold | die cleaning of patent document 1 discloses the effect which improves the cleaning workability by clogging in the narrow gate part by spreading the resin composition for metal mold | die spreading to every corner of an inside of a space | gap. However, the effect is not enough and there is room for improvement. Furthermore, the resin composition for metal mold | die cleaning of patent document 1 has room for improvement also in the dirt removal performance in a metal mold | die.

When cleaning the metal mold | die, when the resin composition for metal mold | die cleaning which granulated the filler was used, clogging of the narrow gate part of the refined metal mold | die cavity can be suppressed. However, when the filler is made small, the physical polishing effect of the filler is reduced, and in particular, there is a defect that the dirt removal performance of the corner portion is reduced. Moreover, in the resin composition for metal mold | die cleaning which granulated the filler, the flow of the resin composition for metal mold | die cleaning becomes excessive at the time of cleaning. Therefore, the resin composition for metal mold | die cleaning does not accumulate suitably in a metal mold | die, and there exists a defect which cannot remove dirt sufficiently.

Patent Document 1: Japanese Patent Application Laid-Open No. 2003-62835

This invention is made | formed in view of the said situation. That is, under the above circumstances, for example, a resin cleaning composition for mold cleaning in which dirt removal performance is improved while a good cleaning effect is obtained to a corner portion of a finely molded mold cavity and the like is required.

The resin composition for metal mold | die cleaning of this invention is a resin composition for metal mold | die cleaning containing a melamine type resin, an inorganic filler, a hardening catalyst, and a salt of a saturated fatty acid and a metal, Comprising: The said inorganic filler is spherical, The maximum particle diameter of the said inorganic filler The curing catalyst is at least one selected from myristic acid and stearic acid, and the salt of the saturated fatty acid and the metal is zinc myristic acid.

Moreover, in the resin composition for metal mold | die cleaning of this invention, the said inorganic filler has an average particle diameter of 4 micrometers-10 micrometers, the standard deviation of a particle diameter is 7 micrometers or less, the average aspect ratio of particle | grains is 1-1.2, and the aspect ratio standard The aspect whose deviation is 0.3 or less is preferable.

Moreover, the aspect which is the resin composition for metal mold | die cleaning of the transfer type used for the metal mold | die cleaning machine of a metal mold | die cleaning machine of this invention is preferable. That is, the resin composition for metal mold | die cleaning of this invention is used suitably for transfer molding.

According to the present invention, by specifying the range of the shape and particle size of the inorganic filler and using a specific curing catalyst and a specific salt of a saturated fatty acid and a metal, it is possible to remove dirt while obtaining a good cleaning effect to the corner of the refined mold cavity. Provided is a resin composition for cleaning a mold having improved performance.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of the resin composition for metal mold | die cleaning of this invention is described.

The resin composition for metal mold | die cleaning of this invention is at least melamine type resin, the spherical inorganic filler of 1 micrometer-70 micrometers of maximum particle diameters, the hardening catalyst selected from myristic acid and stearic acid, and myristic acid which is a salt of saturated fatty acid and a metal. It is composed of zinc. The resin composition for metal mold | die cleaning of this invention may be comprised using another component as needed.

Melamine-based resin

The resin composition for metal mold | die cleaning of this invention contains at least 1 sort of melamine type resin.

Melamine-based resin refers to melamine resin, melamine-phenol cocondensate or melamine-urea cocondensate.

The melamine resin is a condensate of triazines and aldehydes. Examples of triazines include melamine, benzoguanamine, acetguanamine, and the like. Examples of aldehydes include formaldehyde, paraformaldehyde and acetaldehyde.

The melamine-phenol cocondensate is a co-condensate of triazines, phenols and aldehydes. Phenolics include, for example, phenol, cresol, xylenol, ethylphenol and butylphenol.

The melamine-urea co-condensate is a co-condensate of triazines, urea and aldehydes.

The resin composition for metal mold | die cleaning of this invention may contain other resin compositions, such as an alkyd resin, a polyester resin, an acrylic resin, an epoxy resin, and rubbers in the range which does not impair the effect of this invention other than a melamine resin.

Since the resin composition for metal mold | die cleaning of this invention contains a melamine type resin, it shows the outstanding cleaning property with respect to the dirt of the inside surface of a molding die. The reason for this is not always clear, but the methirol group of the melamine-based resin has a high polarity, so that the dirt derived from the encapsulation molding material that occurs during molding and adheres to the inner surface of the molding die (that is, a bag containing a thermosetting resin composition) Since the dirt derived from a molding material) and the resin composition for metal mold | die cleaning of this invention can act, it is thought that the resin composition for metal mold | die cleaning containing melamine type resin shows the outstanding performance. Moreover, since melamine type resin is thermally stable, it is thought that the outstanding cleaning property is exhibited stably even in the vicinity of 160-190 degreeC which is the temperature at the time of metal mold cleaning.

Inorganic filler

The resin composition for metal mold | die cleaning of this invention contains at least 1 sort (s) of the spherical inorganic filler whose maximum particle diameter is 1 micrometer-70 micrometers.

The inorganic filler used for this invention has a spherical form. A spherical shape means that the average aspect ratio of the particle | grains of the inorganic filler mentioned later is 1-1.5, and also includes a substantially spherical shape similar to the spherical shape similar to a spherical shape such as an ellipse with a cross section whose diameter is not the same in addition to a complete spherical shape.

The average aspect ratio of the particles of the inorganic filler is preferably 1 to 1.2. Therefore, the resin composition for metal mold | die cleaning of this invention can maintain the fluidity | liquidity of the resin composition for metal mold | die cleaning at the time of cleaning. Moreover, the resin composition for metal mold | die cleaning of this invention can expect favorable cleaning effect to the corner part of the refined metal mold | die cavity, and can also suppress the abrasion and damage of the molding die inner surface and gate part.

When the resin composition for metal mold | die cleaning has an average aspect ratio of the particle | grains of an inorganic filler 1.5 or less, the fluidity | liquidity of the resin composition for metal mold | die cleaning can be kept favorable at the time of cleaning, and good cleaning property can be ensured to the corner part of the refined metal mold cavity. In addition, wear and damage to the molding die inner surface and the gate portion are also suppressed.

In this invention, the aspect ratio of the particle | grains of an inorganic filler is calculated | required as follows.

That is, the aspect ratio of the particle | grains of an inorganic filler is calculated | required using an electron microscope like the method of obtaining the particle diameter mentioned later. Here, the long diameter X and the short diameter Y orthogonal to the long diameter X of one inorganic filler are measured 5 times, respectively. From the measured value obtained, the aspect ratio of the particle | grains of one inorganic filler is calculated | required by the following formula. However, long diameter (X) ≥ short diameter (Y).

Aspect ratio of particle = (average of five measurement values of X) / (average value of five measurement values of Y)

And the said aspect ratio was measured about each of 150 inorganic fillers, the average of the obtained measured value was calculated | required, and it was set as the aspect ratio of the particle | grains of an inorganic filler.

According to the definition in the present invention, when the long diameter X and the short diameter Y are the same, the aspect ratio of the particles is one. In the definition in the present invention, the aspect ratio of the particles does not take a value less than one. The shape of the inorganic filler is spherical, but the closer to the spherical the closer the aspect ratio of the particles to 1. Even when the image of the inorganic filler in the electron microscope is square, the aspect ratio of the particles is 1, but the shape of the inorganic filler used in the present invention is all spherical (including approximately spherical), and in the present invention, the aspect of the particles A ratio near 1 indicates a sphere close to a sphere.

In this invention, the average aspect ratio of the particle | grains of an inorganic filler is an average value of the aspect ratio of 150 inorganic fillers measured by the said method. In addition, the standard deviation of the aspect ratio of the inorganic filler mentioned later is a standard deviation of the aspect ratio of the particle | grains of 150 inorganic fillers measured by the said method.

The inorganic filler is at least one selected from the group consisting of silicon carbide, silicon oxide (silica), titanium carbide, titanium oxide, boron carbide, boron oxide, aluminum oxide, magnesium oxide and calcium oxide, for example. These inorganic fillers may be used alone or in combination of two or more.

The inorganic filler in the present invention is preferably silicon oxide (silica) and titanium oxide, particularly preferably silicon oxide. Although it depends on the material and state of a metal mold | die, silicon oxide (silica) and titanium oxide as an inorganic filler used for this invention are preferable at the point that hardness is moderate, and can suppress abrasion and damage to the inner surface of a metal mold | die and a gate part. The inventors of the present invention believe that the inorganic filler removes the dirt from the surface of the mold by physically polishing the cleaned mold cavity. In addition, silicon oxide (silica) and titanium oxide are preferable because they are thermally stabilized in the vicinity of 160 to 190 占 폚, which is the time of cleaning the mold.

In the resin composition for metal mold | die cleaning of this invention, it is preferable that the standard deviation of the aspect ratio of the said inorganic filler is 0.3 or less. If the resin composition for metal mold | die cleaning of this invention is easy to maintain the fluidity | liquidity of the resin composition for metal mold | die cleaning at the time of cleaning, when the standard deviation of the aspect ratio of the particle | grains of the said inorganic filler is easy to be obtained, the cleaning property to the corner part of a metal mold cavity will be acquired. The wear and damage of the mold die inner surface and the gate portion can be further suppressed.

Especially, as a standard deviation of the aspect ratio of an inorganic filler, 0.15-0.3 are more preferable.

In the above, the "miniaturized mold cavity" means that the cavity is compactly optimally arranged on the entire surface of the molding die by miniaturizing the cavity. The finer mold cavity has a smaller gate portion than the conventional one due to the miniaturization of the cavity, and the narrowest one is 100 µm.

The maximum particle diameter of the inorganic filler used for this invention is 1 micrometer-70 micrometers. In the resin composition for metal mold | die cleaning of this invention, since the largest particle diameter of the inorganic filler contained is in the range of 1 micrometer-70 micrometers, the favorable cleaning effect can be acquired to the corner part of the refined metal mold cavity. Here, having a maximum particle diameter of 1 µm or more means that the inorganic filler has a shape that only physically acts on the dirt on the mold surface. Moreover, when the maximum particle diameter exceeds 70 micrometers, particle | grains of an inorganic filler will become clogged easily in a cavity part, fluidity | liquidity will fall, and a cleaning effect will fall as a result.

Among them, the maximum particle size of the inorganic filler is more preferably 10 µm to 50 µm, particularly preferably 20 µm to 45 µm, and most preferably 45 µm.

It is preferable that the average particle diameter of the inorganic filler used for this invention is 4 micrometers-10 micrometers. The inventor of the present invention considers that the inorganic filler having a significantly small average particle diameter has a low mass and surface area, thus making it difficult to exert the cleaning performance of the mold cavity. In the resin composition for metal mold | die cleaning of this invention, when the average particle diameter of the said inorganic filler is 4 micrometers or more, the cleaning property of the whole molding metal mold | die can be obtained more. Moreover, when the average particle diameter of the said inorganic filler is 10 micrometers or less, the cleaning property to the corner part of the refined metal mold | die cavity can be obtained more. Furthermore, when the average particle diameter of the inorganic filler in this invention is 10 micrometers or less, abrasion and damage of a molding die inner surface and a gate part can be suppressed more.

Especially, as an average particle diameter of an inorganic filler, 5 micrometers-8 micrometers are more preferable.

It is preferable that the standard deviation of the particle diameter of the inorganic filler used for this invention is 7 micrometers or less. In the resin composition for metal mold | die cleaning of this invention, when the standard deviation of the particle diameter of an inorganic filler is 7 micrometers or less, since the fluidity | liquidity of the resin composition for metal mold | die cleaning can be maintained at the time of cleaning, the cleaning property to the corner part of a metal mold cavity can be obtained more. have.

Especially, as a standard deviation of the particle diameter of an inorganic filler, 1 micrometer-7 micrometers are more preferable.

In this invention, the particle diameter of the said inorganic filler is calculated | required as follows.

That is, by using an electron microscope (product name: JSM-5510, product of Nihon Electronics Co., Ltd.), the inorganic filler is taken 1500 times so that approximately 30 inorganic fillers are included in one field of view, and the diameters of the inorganic fillers of each of the other 5 fields are respectively measured. Measured. Next, the short diameter (Y) orthogonal to the long diameter (X) and the long diameter (X) of the inorganic filler was measured, and the average value of the measured values was calculated five times, respectively. X and Y were measured about 150 inorganic fillers in total, and the particle diameter of one inorganic filler was calculated | required by the following formula, and the particle size of an inorganic filler was calculated | required by averaging the particle diameter (calculated value) of 150 inorganic fillers.

Particle diameter = ((average of five measured values of X) + (average of five measured values of Y)) / 2

In this invention, an average particle diameter is the average value of the particle diameter of 150 inorganic fillers measured by the said method. In addition, the standard deviation of the particle size is the standard deviation of the particle size of 150 inorganic fillers measured by the above method.

The inorganic filler which can be used suitably for this invention is amorphous spherical silica, For example, the product name "S440-4" of Shinnitetsu Sumikin Materials Micron Co., Ltd. (Shinnitetsu Materials Micron Co., Ltd.), " HS-202 "," HS-204 "," UF-320 ", etc. are mentioned.

Curing catalyst

The resin composition for metal mold | die cleaning of this invention contains at least one selected from myristic acid and stearic acid as a hardening catalyst.

When the resin composition for mold cleaning is spherical (including approximately spherical) and the inorganic filler having a maximum particle size of 1 µm to 70 µm is used for the resin composition for mold cleaning, the flow of the resin composition for mold cleaning is reduced when the fine mold cavity is cleaned. It may become excess, and since the resin composition for metal mold | die cleaning does not stay suitably in a metal mold | die, it may not be able to fully remove dirt. The inventors of the present invention have found that by using myristic acid and / or stearic acid as the curing catalyst, excessive flow of the resin composition for mold cleaning is prevented when the fine mold cavity is cleaned.

Therefore, in the resin composition for metal mold | die cleaning of this invention, since the resin composition for metal mold | die cleaning stays in a metal mold | die properly, the corner part of the refined metal mold cavity can be cleaned, and the dirt removal performance is also improved.

0.1 mass part-3.0 mass parts are preferable with respect to 100 mass parts of said melamine resin, As for content in the composition of myristic acid and stearic acid used for this invention, 0.5 mass part-2.0 mass parts are more preferable, Especially preferably, It is 1.0 mass part-2.0 mass parts. When content of the said myristic acid is 0.1 mass part or more, the resin composition for metal mold | die cleaning of this invention is easy to harden at the time of cleaning, and the dirt of the refined metal mold cavity is removed more favorably. Moreover, when the myristic acid is 3.0 mass parts or less, the storage stability of the resin composition for metal mold | die cleaning of this invention is more excellent.

Salts of Saturated Fatty Acids and Metals

The resin composition for metal mold | die cleaning of this invention contains zinc myristic acid salt as a salt of a saturated fatty acid and a metal. The inventors of the present invention believe that, when cleaning the fine mold cavity, the salts of saturated fatty acids and metals act on the dirt, and thus, for example, the dirt is swollen to easily peel off from the surface of the molding die. That is, the inventor of the present invention finds that by selectively using zinc myristicate as a salt of a saturated fatty acid and a metal, it prevents the flow of the resin composition for metal mold | die cleaning of this invention from becoming excessive at the time of cleaning a refined metal mold cavity. It was.

The melting point of myristic acid zinc is 123 ° C to 130 ° C. In addition, the temperature at the time of cleaning of the metal mold | die cavity which uses the sealing molding material containing a thermosetting resin composition is 160 degreeC-190 degreeC.

The inventor of the present invention cleans the flow of the resin composition for mold cleaning of the present invention because the myristic acid zinc contained in the resin composition for metal mold cleaning of the present invention exhibits proper fluidity in a range of 160 ° C to 190 ° C, which is a cleaning working environment temperature. We think that it becomes range suitable for.

Therefore, in the resin composition for metal mold | die cleaning of this invention, the resin composition for metal mold | die cleaning is piled up appropriately in a metal mold | die, it can clean the corner part of the refined metal mold cavity, and the dirt removal performance improves.

As content of the zinc myristic acid used as a salt of a saturated fatty acid and a metal, 0.1 mass part-3.0 mass parts are preferable with respect to 100 mass parts of said melamine type resins, 0.5 mass part-2.0 mass parts are more preferable, Especially preferably, It is 1.0 mass part-2.0 mass parts. When content of zinc myristicate is 0.1 mass part or more, the resin composition for metal mold | die cleaning of this invention becomes easy to harden at the time of cleaning, and the dirt of the refined metal mold cavity is removed favorably. Moreover, since content of the zinc myristic acid content is 3.0 mass parts or less, since the flow of the resin composition for metal mold | die cleaning of this invention does not become excess, it is preferable.

Other additives

The resin composition for metal mold | die cleaning of this invention may contain the other additive further. As another additive, a coloring agent, antioxidant, a lubricating agent, etc. are mentioned, for example.

As the lubricant, for example, fatty acid amide lubricants, specifically lauric acid amide, myristic acid amide, erucic acid amide, oleic acid amide, saturated or unsaturated monoamide type lubricants such as stearic acid amide, methylenebis stearic acid amide, ethylenebis stearic acid Saturated or unsaturated bisamide type lubricants, such as an amide and ethylenebis oleic acid amide, etc. are mentioned.

The resin composition for metal mold | die cleaning of this invention is suitable for removing the dirt from the molding die internal surface from the sealing molding material containing the thermosetting resin composition represented by an epoxy resin, a silicone resin, a phenol resin, and a polyimide resin.

The resin composition for metal mold | die cleaning of this invention can be prepared by mixing a melamine type resin, an inorganic filler, a curing catalyst, a salt of saturated fatty acid and a metal, and other additives substantially uniformly as needed. As a method for mixing substantially uniformly, a method using a kneader, a ribbon blender, a Henschel mixer, a ball mill, a roll mill, a brain trajectory, a tumbler, etc. is mentioned, for example.

The resin composition for metal mold | die cleaning of this invention is suitable for the resin composition for metal mold | die cleaning of the transfer type used for a transfer type molding machine.

The resin composition for metal mold | die cleaning of this invention is processed into a tablet shape normally, and is used for the cleaning operation in a molding die normally. In detail, after arranging a lead frame on a metal mold | die, the resin composition for metal mold | die cleaning of a tablet shape is inserted into a port part, and it clamps and flows to a plunger. At this time, resin flows into the mold cavity from the gate portion via the runner portion from the port portion. A cleaning operation | work is performed by removing a molded object containing the resin composition for metal mold | die cleaning which was integrated with a lead frame, and a dirt after predetermined | prescribed molding time passed.

The resin composition for metal mold | die cleaning of this invention is used suitably for removing the dirt in the molding metal mold | die in the bag molding operation | work of an integrated circuit. The material of the said molding die is iron, chromium, etc., for example. The molding die is usually plated. By repeating the bag forming operation and the cleaning operation of the inner surface of the molding die, micron-sized wounds are generated in the molding die, and the mold is worn out. Due to the occurrence of such scratches and abrasions, peeling of the plated surface of the molding die and roughening of the surface state occur. Molding dies are formed by the occurrence of internal scratches, peeling off the plated surface of the molding die inner surface, and roughness of the surface state, resulting in deterioration of moldability and mold release property and poor surface appearance during encapsulation. Thereby, the defect which loses the cleaning workability in a molding die further arises. In the resin composition for metal mold | die cleaning of this invention, damage in the molding die at the time of cleaning can also be suppressed by appropriately selecting the largest particle diameter of the spherical (approximately spherical) inorganic filler.

Example

Hereinafter, an Example and a comparative example are given and this invention is demonstrated in detail. In addition, this invention is not limited to these Examples.

(Example 1)

21.3 parts by weight of melamine-phenol cocondensate, 50 parts by weight of melamine resin, and amorphous spherical silica as an inorganic filler (product name: S440-4) 20 parts by mass of inorganic fillers manufactured by Shinnitetsu Sumikin Materials, Inc. (Micron, Inc.), 7.8 parts by mass of hardwood pulp as organic fillers, and myristic acid as salts of saturated fatty acids and metals. 0.5 mass part of zinc and 0.05 mass part of myristic acid as a hardening catalyst were added to the ball mill, and it grind | pulverized. Thereafter, 0.35 parts by mass of stearic acid amide was added as a lubricant by a Nauta mixer. In this way, the resin composition for metal mold | die cleaning was produced.

The inorganic filler was observed under an electron microscope, and the average aspect ratio of the particles of S440-4 was 1.16 (spherical). Moreover, the average aspect ratio of some particle | grains of the other inorganic filler mentioned later used for the Example was spherical in the range of 1-1.5.

Table 1 below shows the composition and the amount (mass part) of the resin composition for metal mold | die cleaning produced in Example 1, the average particle diameter, the maximum particle diameter, and the average aspect ratio of an inorganic filler together.

Moreover, the standard deviation of the particle diameter of an inorganic filler was 7 micrometers, and the standard deviation of the aspect ratio of an inorganic filler was 0.23.

Moreover, cleaning property was evaluated by the test method shown below about the produced resin composition for metal mold | die cleaning. Moreover, the produced resin composition for metal mold | die cleaning is a transfer type.

Cleanability

An automatic molding machine using a QFP (Quad Flat Package) mold is prepared, and 400 shots are formed at a mold temperature of 175 ° C using EME-G700L (product of Sumitomo Bakelite Co., Ltd.), a commercial epoxy resin molding material, to form an inner surface of a molding die. Dirt was expressed. The cleaning operation was performed by repeatedly molding the resin composition for metal mold | die cleaning produced above until the internal surface dirt could be removed using this metal mold | die. Repetitive molding of the resin composition for metal mold | die cleaning was performed by making mold temperature 175 degreeC similarly to the case of shaping | molding of an epoxy resin molding material.

Moreover, the gate part of the metal mold | die cavity used for evaluation was 800 micrometers in width, and 300 micrometers in height. Furthermore, the gate part of this mold cavity was 100 micrometers in the narrowest part.

The cleaning property evaluation was carried out by determining whether the dirt is removed from the corner portion of the mold cavity and the number of shots required for cleaning the gate portion and the corner portion of the mold cavity, especially paying attention to whether the gate portion or the corner portion of the mold cavity is cleaned. The lower the number of shots, the better the cleaning property. Table 1 puts together the evaluation result of each Example and a comparative example.

The dirt removal property of the corner part confirmed visually and evaluated the presence or absence of the dirt in the corner part of a mold cavity. Evaluation judged that the resin composition for metal mold | die cleaning passed the gate part of a metal mold | die well, and there was no dirt or there was little dirt, and set it as "A", and it was determined that "B" had dirt remaining and causing defect in molding.

In addition, the evaluation of the number of shots required for cleaning to the gate portion or the corner portion of the mold cavity records the number of shots when the number of completed shots is 10 or less, and the case where dirt cannot be removed after 10 cleanings is `` NG ''. Was determined.

(Example 2)

The resin composition for metal mold | die cleaning was produced like Example 1 except having changed the myristic acid used as the hardening catalyst in Example 1 into stearic acid, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

(Examples 3-5)

Except having changed the inorganic filler as shown in Table 1 in Example 1, the resin composition for metal mold | die cleaning was produced like Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 1)

Except having used benzoic acid as a curing catalyst in Example 1, the resin composition for metal mold | die cleaning was produced like Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 2)

The resin composition for metal mold | die cleaning was produced like Example 1 except having used zinc stearate as a salt of saturated fatty acid and a metal in Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

(Comparative Example 3)

The resin composition for metal mold | die cleaning was produced like Example 1 except having used crystalline silica (product name: R-1) of the Yamamori civil engineering Co., Ltd. product as an inorganic filler in Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

In addition, the inorganic filler used by the comparative example 3 has the particle diameter and aspect ratio shown in Table 1, and the shape of this inorganic filler was confirmed using the electron microscope, and it was indefinite.

(Comparative Example 4)

The resin composition for metal mold | die cleaning was produced like Example 1 except having used the crystalline silica (product name: pure quartz powder) of the Seto ceramics raw material company as an inorganic filler in Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

Moreover, the inorganic filler used by the comparative example 4 has the particle diameter and aspect ratio shown in Table 1.

(Comparative Example 5)

Except having changed the inorganic filler as shown in Table 1 in Example 1, the resin composition for metal mold | die cleaning was produced like Example 1, and the cleaning property was evaluated. The evaluation results are shown in Table 1.

The detail of the inorganic filler in Table 1 is as follows.

S440-4: Amorphous spherical silica from Shinnitetsu Sumikin Materials Micron, Inc. (Shin-Nitetsu Materials Micron, Inc.)

HS-202: Amorphous spherical silica from Shinnitetsu Sumikin Materials Micron, Inc. (Shin-Nitetsu Materials Micron, Inc.)

R-1: Crystalline silica from Yamamori Civil Engineering Co., Ltd.

HS-302: Amorphous spherical silica from Shinnitetsu Sumikin Materials Micron, Inc. (Shin-Nitetsu Materials Micron, Inc.)

UF-320: amorphous spherical silica manufactured by Tokuyama Corporation

HS-204: Amorphous spherical silica from Shinnitetsu Sumikin Materials Micron, Inc. (Shin-Nitetsu Materials Micron, Inc.)

Pure stone powder: Crystalline silica from Seto Ceramics

As shown in the said Table 1, the resin composition for metal mold | die cleaning of this invention was able to clean well to the corner part of the refined metal mold | die cavity, and was able to improve the dirt removal performance.

In addition, as shown in Table 1, the resin composition for metal mold | die cleaning of Examples 1-5 is melamine type resin, the inorganic filler of spherical shape and the largest particle diameter of 1 micrometer-70 micrometers, myristic acid or stearic acid as a hardening catalyst, Since it contains zinc myristic acid salt as a salt of a saturated fatty acid and a metal, it can clean well to a corner part with respect to the metal mold | die which the narrowest part is 100 micrometers in a gate part, and the outstanding dirt removal performance which also finishes four times of cleaning completion shorts Indicated. Furthermore, when the surface of the metal mold | die after cleaning was observed, the resin composition for metal mold | die cleaning of Examples 1-5 did not damage the metal mold | die surface.

On the other hand, since the resin composition for metal mold | die cleaning of the comparative example 1 contained benzoic acid as a hardening catalyst, the flow of the resin composition for metal mold | die cleaning was excessive, and the number of cleaning completed shorts increased. Therefore, dirt removal performance was inferior to Example 1.

In the resin composition for metal mold | die cleaning of the comparative example 2, since zinc stearate is contained as a salt of a saturated fatty acid and a metal, the flow of the resin composition for metal mold | die cleaning was excessive, and the number of cleaning completed shorts increased. Therefore, dirt removal performance was inferior to Example 1.

In the resin composition for metal mold | die cleaning of the comparative example 3, since the maximum particle diameter of an inorganic filler is 352 micrometers, and an amorphous form, the corner part of a metal mold cavity was impossible to clean, and also the dirt removal performance of a metal mold | die was also inferior.

In the resin composition for metal mold | die cleaning of the comparative example 4, since the maximum particle diameter of an inorganic filler is 100 micrometers, it was difficult to clean the corner part of a metal mold cavity, even if the flow of the metal composition for metal mold | die cleaning was appropriate. Moreover, the dirt removal performance of the metal mold | die also fell.

In the resin composition for metal mold | die cleaning of the comparative example 5, the maximum particle diameter of an inorganic filler was 75 micrometers, and particle | grains tended to be clogged easily in a cavity part, and favorable fluidity | liquidity could not be secured and the corner part of a metal mold | die cavity could not be cleaned satisfactorily. Therefore, the dirt removal performance of the metal mold | die also fell.

As shown in the above Examples and Comparative Examples, when the maximum particle diameter of the inorganic filler is 1 µm to 70 µm, the flow during cleaning by the resin composition for mold cleaning is controlled by appropriately selecting a curing catalyst and a salt of a saturated fatty acid and a metal. It was possible to achieve a satisfactory cleaning effect up to the corner portion of the finely molded mold cavity. Moreover, the resin composition for metal mold | die cleaning stayed in the metal mold | die suitably, and the dirt removal performance in a metal mold was also improved.

The resin composition for metal mold | die cleaning of this invention is a resin composition for metal mold | die cleaning which removes the dirt of the mold surface derived from a thermosetting resin composition, and is used suitably for the transfer molding in a transfer type | mold machine.

As for the indication of the Japanese application 2012-011544, the whole is taken in into this specification by reference.

All documents, patent applications, and technical specifications described herein are incorporated by reference to the same extent as if the individual documents, patent applications, and technical specifications were specifically incorporated by reference.

Claims (3)

The resin composition for metal mold | die cleaning which contains a melamine resin, the spherical inorganic filler of 1 micrometer-70 micrometers of maximum particle diameters, the hardening catalyst selected from myristic acid and a stearic acid, and zinc myristic acid which is a salt of a saturated fatty acid and a metal. The method according to claim 1,
The said inorganic filler has an average particle diameter of 4 micrometers-10 micrometers, the standard deviation of particle diameters is 7 micrometers or less, the average aspect ratio of particle | grains is 1-1.2, and the standard deviation of aspect ratios is 0.3 or less resin composition for metal mold | die cleaning. The method according to claim 1 or 2,
Resin composition for metal mold | die cleaning used for a transfer molding machine.