TW200902274A - Resin composition for recovering mold releasability amd method for recovering mold releasability - Google Patents

Abstract

Disclosed is a resin composition for recovering mold releasability, which provides the surface of a mold with releasability after removing dirt on the mold surface during molding of a curable resin molding material. This resin composition contains a melamine resin, while further containing at least one metallic soap-based mold release agent and an organic fatty acid ester-based mold release agent or/and a synthetic wax. This resin composition for recovering mold releasability enables to recover excellent mold releasability which lasts for a long time, and thus enables to continuously mold a sealing article for a long time.

Description

200902274 IX. Description of the Invention: [Technical Fields of the Invention] The resin composition for mold release recovery of the tying system is used in the hardening table = forming (four) forming, after removing the dirt on the surface of the mold, in the mold \ denuclearity '' and the use of the mold release compounding resin composition ★ 2 release recovery method. According to the present invention, the mold release response can be made to have a good mold release property, and the subsequent molding of the molded material can be carried out for a long period of time. [Prior Art] A thermosetting resin molding material such as an epoxy resin molding material is used to form a sealed molded article such as a bulk circuit, and is oozing out through the release agent contained in the thermosetting tree material. The interface between the molded product and the mold serves to release the mold from the scraping waste portion, the cavity portion, and the flow channel agglomerate portion. When the molding is continued for several times, the mold release property of the molded article is remarkably deteriorated, the molded article has a rough surface, the appearance of the molded article is poor, and defects such as defects occur in the printing step after molding. The cause of the ruthenium is that the release agent contained in the above-mentioned molding material is repeatedly formed at two temperatures, and is sequentially laminated on the surface of the above-mentioned mold to form an oxidative degradation layer of a hard release agent due to gradual deterioration of the emulsification. Therefore, it has been implemented to avoid the cleaning of the molds in these conditions. However, the surface of the mold has been cleaned after the cleaning is completed. However, since the release agent on the surface of the mold is also removed, if it is directly formed after the cleaning is completed, there will be extreme The problem of the mold stripping property is damaged. H. It is necessary to mold the material (4), mold the mold release and use the resin composition to form the mold release, and use the resin combination I30093.doc 200902274 to transfer the surface to the mold surface. And return the mold release. Patent Document 1 describes a method for rapidly recovering mold release property, which is to restore the mold release property to (4) 'by using a metal containing 10 parts by weight or more, 5 parts by weight or more of wax, 〇 5 weight The molding material of at least one of the above-mentioned types of release agents is heat-formed to transfer the release agent to the surface of the mold. Thus, it is possible to eliminate the troublesome work such as spraying a release agent on the surface of the mold. However, this method makes the number of continuous forming of the sealed molded article extremely small after the release property is recovered. In addition, with the integration, thinning, and surface mounting of integrated circuits (ic.lsi) in recent years, the shape and structure of molded products are diversified = continuous improvement, ϋ 'seeking semiconductor sealing materials High fluidity. On the other hand, in order to achieve fluidization, the sealing resin is inferior in mold release property, and the mold is easily stained with dirt, which causes new problems such as a decrease in productivity. Therefore, in order not only the cleaning operation of the mold can be frequently performed, but also the mold release operation can be performed frequently, and the mold release property after the mold release is restored is required, the mold is continued for a long time, and the number of continuous molding of the sealed molded article is large. A resin composition for mold release. [Patent Document 1] Japanese Laid-Open Patent Publication No. Hei. No. 48-79849. The present invention relates to a resin composition for providing mold release, and a resin composition for mold release recovery, corresponding to a semiconductor. The high fluidization of the sealing material, „the cleaning operation of the money mold recovery operation” means that the mold release property after the mold release recovery can be continued for a long time, and the continuous molding of the sealed molded product can be performed for a long time after the nuclear recovery. 130093. Doc 200902274 In order to solve the above-mentioned problems, the present invention provides a composition for removing a ruthenium and removing a resin from a resinous resin molding material. After the mold is coated with n* ”..., the dirt on the surface, the surface of the chess board is imparted with a deodorizing resin composition containing melamine resin and containing the glutamine group and the organic fatty acid vinegar. The molding agent or/and the class I4 release agent are sufficient to allow the seal molded article length I to be subjected to the multiplexed resin composition after the mold release is recovered. The mold composition of the mold is returned to the mold of the present invention, and the resin composition type of the mold is recovered, and the finger Γΐ m is used as the shrinkage = release: the recovery of the tree wax conjugate is formed during the curing of the curable resin, and the mold is removed. After the dirt on the surface and the dirt in the mold sub-division (4), the mold surface is imparted with mold release property and fruit property. Therefore, the mold release-recovering enamel composition can also be used to obtain the empty shirt. The tree moon 曰 排 排 U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U U匕 脱 脱 【 实施 实施 实施 实施 实施 实施 实施 【 【 【 【 【 【 【 【 【 【 【 【 【 【 【 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉 藉Or / ^ soiling' to visualize the mold release recovery effect, thereby making it possible to continuously form the stretched molded article after the mold release. Further, the compression type is a shape, and the release effect of the air venting portion and the long-term continuous molding of the sealed molded article after the mold release is restored. Embodiments H 纟 quot 说明 说明 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 093 ι~4:ι, ^利为丨·5:1~3:1, reacted in an aqueous solution to produce an initial condensate V-containing liquid. The reaction can be carried out under the conditions of a melamine crystal concentration of 20 to 60%, a reaction temperature of 70 to MMTC, and a weak basicity, and the reaction is carried out at 1 () to (10) minutes. The above-mentioned part of the formic acid may be replaced with a poly-A@Hu Bu brewing component such as an aliphatic aldehyde such as acetaldehyde. The resin composition for mold release recovery of the present invention contains a metal-based release agent, an organic fatty acid ester release agent, and/or a synthetic wax, in addition to melamine (4). Examples of the metal type 4 release agent include stearic acid dance, zinc stearate, and zinc myristate. The organic fatty acid ester-based release agent may, for example, be a saponified succinic acid saponified vinegar or a polymer composite s. For example, a modified tobacco wax or a mineral oil synthetic wax may be used. Specifically, commercially available products include RICOWAX 〇P (partially saponified ester of octadecanoic acid manufactured by CLARIANT JAPAN Co., Ltd.), LOXIOL G78 (polymer vinegar made by COGNIS JAPAN Co., Ltd.), and UCOLB H-4 ( CLARIANT JAPAN Co., Ltd., a denatured hydrocarbon wax), and LOXIOL VPN 881 (a mineral oil-based synthetic wax manufactured by COGNIS JAPAN Co., Ltd.). The ratio of the metal soap release agent to other mold release agents (organic fatty acid ester release agent and synthetic wax) is preferably in the weight ratio of the former: the latter 90.10 to 30:70 'especially at 80: 20~40:60. If the ratio of the other release agent is excessive, the continuous formability will be weak, which is not preferable. 130093.doc 200902274 Metal soaps (4) Drums Other (four) total content, melamine resin _ parts, preferably 〇 2~5 〇 weight #份 〇 5~(10) parts by weight. When the total content of the release agents is insufficient, the dehusking property of the mold will be weakened. When the excess is excessive, the mold release property of the mold and the butadiene is good, but the refining of the resin composition for mold release recovery is rich. The singularity of the 叙 地 地 々 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显 显The resin composition for mold release recovery of the present invention preferably contains paper pulp in addition to the melamine resin and the above-mentioned release agent, which improves the workability when the molded article is removed from the article. As the pulp, grass, bamboo pulp, wood pulp (conifer pulp, broad-leaved pulp), or the like may be used, and either chemical pulp or mechanical pulp may be used. Further, the melamine resin which is an essential component of the resin composition for mold release recovery of the present invention may be impregnated into the pulp, and used in the impregnated form (resin impregnated paper crucible). The resin is impregnated with paper, Example #, and the paper is immersed in an aqueous solution of melamine-furaldehyde resin and dried to prepare. And the paper can be partially or completely replaced with powdered pulp, whereby the fluidity can be adjusted as needed. The size of the above pulp is not particularly limited, and is generally 5 to 1 μm μm, preferably about 10 to 200 μmη. Further, the content of the above pulp is usually 5 to 7 parts by weight, preferably 20 to 60 parts by weight, based on 100 parts by weight of the melamine resin. When the content of the pulp is less than 5 parts by weight, there is no additive effect; when it exceeds 70 parts by weight, the fluidity during use is deteriorated, and the resin composition for mold release recovery cannot be filled in each corner of the mold, so 130093 .doc -10- 200902274 It is not possible to give the mold a full release property, which is not good. Hardly, the resin composition for mold release recovery of the present invention contains a hardening catalyst, and examples thereof include o-benzene L-sodium sulfonate, amino sulfonic acid, and p-methyl sulphate. , hydrochloric acid; such acid and triethylamine A specific inorganic mercapto-2-aminopropanol; etc.; .% amine methylaminoethanol, 2-relative Bu 4 salt. As the amount of the hardening catalyst added, f is less than 1 part by weight of the amine resin, generally is part by weight. Rereading the above, preferably i weight (four), Q1 is better than the present invention. the above. The above-mentioned "Four" (4) fat composition contains one kind of the above-mentioned pulp and the component of the hardening catalyst. The resin composition for demolding recovery of the mold of the present invention is colored with a coloring material such as a pigment, paper, and added. Inorganic filler materials, etc. Buzhi's quasi-filled, low-hardness granules The above-mentioned coloring materials can be exemplified by inorganic pigments such as oxidized chin and carbon-iron, and zinc-reducing, oxidizing and oxazoles, laughing = Λ ^, Organic pigments such as diazo, stupid, non-, diazole, kemaline (17-7 U), total sorghum, onion, blue, azo, #fluorescent : wood powder, cotton, wide: #木科4'The above fibrous fibrous fiber, vinylon fiber, Μ, ^ fiber and other natural fibers, linalylamine * ^ fiber ^ 3 fiber and other chemical fiber, etc. μ, ten And & μ filling materials can be exemplified by:, the above-mentioned inorganic filling mother, talc "W glass fiber, Shi Xi stone powder, no treatment carbon mold release mold of the invention _ two: chemical = acid (four). The resin composition for mold release recovery is a type I mold. 'It can also be used for the release mold of the transfer mold. ・3O093.doc 200902274 In the case of the 匕 type, it is better to use melamine tree saponin, metal soap release agent, organic fatty acid vinegar release agent in addition to the essential ingredients. Or / and synthetic bismuth, also combined with pulp, hard (four) medium, sputum (four) 丨 之一 composition of the following examples show i (four) mold detachment complex (four) fat composition of the better fit 1 〇〇 weight parts 0·3~ 1 〇 parts by weight of 0.5 to 1.5 parts by weight [compressed type of formulation] melamine resin metal soap release agent organic fatty acid ester release agent or / and synthetic ant pulp 20 to 40 parts by weight of hardening catalyst 0.02 ~ 0 · 50 parts by weight - 4 metal type 4 release agent and organic fatty acid ester release agent or / and synthetic wax group. 丄 ' 卜 & 权 硬 硬 硬 硬 硬 硬 硬 硬 硬 部分 部分 部分 部分 部分Ester, combination of mouth, calcium sulphate and denatured hydrocarbon wax, combination of hard fat _ and polymer vinegar. In addition to the amine resin, the metal soap, the bismuth 丨 忐 忐 之 二 二 虱 虱 虱 虱 虱 虱 虱 虱 除 除 除 除 除 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺 胺Agent or / and stone powder and other I machine fillers: such as fibrous fillers, hardening catalyst 1 ' '., machine filler 枓, coloring materials, antioxidants, showing a transfer mode I off such as 'to (four) jade chess An example of a resin composition for mold release. σ milk < better combination [transfer type formulation example] 100 parts by weight of melamine resin 130093.doc 12 200902274 metal soap release agent 0.3-1.0 parts by weight of organic fatty acid ester release agent 0.5~1.5 parts by weight or / And synthetic ant paper Yi 5~20 parts by weight of hardening catalyst 0.02~0.1 parts by weight Shi Xishi powder 10~40 parts by weight

In the case of a transfer type, a combination of the above metal soap release agent and an organic fatty acid ester release agent or/and a synthetic wax is preferably a combination of zinc stearate and a partially saponified ester of octadecanoic acid. , a combination of zinc stearate and denatured hydrocarbon wax, a combination of stearic acid and mineral oil synthetic hydrazine. When the resin composition for mold release recovery of the present invention is prepared, a melamine resin, a metal soap release agent, an organic fatty acid vinegar release agent or/and a synthetic wax, and other additives such as paper can be used. Any organization that is homogeneous in class. The port can be exemplified by a kneader, a ribbon mixer, a Hanschel mixer, a ball mill, a roller trainer, a crusher, a drum, and the like. The curable resin molding material which can be released from the mold by using the mold release-recovery (four) fat composition of the present invention, for example, an epoxy resin molding material, a secret resin molding material, etc., is preferably an epoxy resin molding material, particularly The epoxy resin molding material for semiconductor sealing, the resin composition for mold release recovery of the present invention can be used for the mold type used in the automatic molding of the curable resin molding material, but is also applicable. Yu Yi is a mold made of iron, chrome, etc. The release property of the mold of the present invention by demolding the resin composition to the mold was 130093.doc 200902274. In the mold release of the present invention, the molding conditions are as follows: the mold temperature is .me, the molding pressure is 10 to 20 MPa, and the hardening time is 2 to 3 minutes. EXAMPLES Hereinafter, the present invention will be described in more detail with reference to examples, but the present invention is not limited to the examples. (Manufacturing Example 1)

480 parts by weight of polytrimethylene cyanamide is reacted with 52 parts by weight of formaldehyde (37% aqueous solution) and 350 parts by weight of water. A melamine-formaldehyde resin is prepared by a known method, and π parts by weight of paper is added to the obtained aqueous solution of melamine resin. After the kneading, the mixture was dried under reduced pressure to obtain a pulp having a resin content of about 73% mixed with melamine-formaldehyde resin powder (melamine resin impregnated pulp). (Production Example 2) A melamine resin aqueous solution (solid content of about 60% by weight) obtained by a spray drying apparatus was dried at about 5% to obtain a powdery melamine resin. [Example 1] The pulp containing the resin content of about 73% obtained in Production Example 1 was mixed with 3 parts by weight of the melamine-formaldehyde resin powder, and 50 parts by weight of the powdery melamine resin obtained in Production Example 2, and the crushed stone powder of size #200. Parts by weight, benzoquinone from nine parts by weight, zinc stearate 0.3 parts by weight, ethyl bis-stearate guanamine oxime. 3 parts by weight, and RICOWAX 〇P (part of the 18-acid acid produced by CLARIANT JAPAN Co., Ltd.) Saponified ester) 0.35 parts by weight mixed in a ball mill' to obtain a mold release-recovering resin composition A. The obtained mold was released 130093.doc 14 200902274 Resin resin composition A' exhibited a good mold release as shown in Table 1. Further, after the mold release recovery using the mold release-recovering resin composition A, the epoxy sealing material was molded to exhibit good continuous formability. [Example 2] In place of the RICOWAXOP (instead of Example 1) CLARIANTJ Molding mold was obtained in the same manner as in Example 1 except that LOXIOL G78 (polymer complex ester manufactured by COGNIS JAPAN Co., Ltd.) was used in an amount of 0. 35 parts by weight. Resin-recovering resin composition B. The obtained mold release-recovering resin composition B exhibited good mold release property as shown in Table 1. Further, mold release-recovery resin composition B was used for mold release. After the recovery, when the epoxy sealing material was molded, good continuous formability was exhibited. [Example 3] Instead of the rule 1 in the first embodiment (: 0\^^0? ((: 1^111八1^) In the same manner as in Example 1, except that a part of the saponified ester of octadecanoic acid (manufactured by Sigma) was used in an amount of 0.35 parts by weight, using 0.35 parts by weight of LICOLB H-4 (CLARIANT JAPAN # ^ ^ ). Resin composition C for mold release recovery. The obtained resin composition C for mold release recovery exhibited good mold release property as shown in Table 1. Further, the resin composition C was removed by mold release. After the mold is recovered, when the epoxy sealing material is formed, it shows a good continuous formation. [Example 4] In place of 0.35 parts by weight of RICO WAX OP (partially alkalized ester of octadecanoic acid manufactured by CLARI ANT JAPAN Co., Ltd.) in Example 1, 130093.doc -15-200902274 LICOLB VPN881 was used. A resin composition D for mold release recovery was obtained in the same manner as in Example 1 except that 0.30 parts by weight of a mineral oil-based synthetic wax of COGNIS JAPAN Co., Ltd. was used. The obtained resin composition D for mold release recovery exhibited good mold release properties as shown in Table 1. Further, after the mold composition D was released from the mold by the mold, and the mold release was recovered, the epoxy seal material was molded to exhibit good continuous formability. [Test Example 1] Initialization of the mold When the mold release test for the resin composition A to D for mold release is performed, it is necessary to stabilize the surface state of the mold before the test, so that the mold is cleaned and used in the market. The melamine-based mold cleaning material (NIKALET ECR-CL, manufactured by CAR本CARBIDE Industries Co., Ltd.) is cleaned by transfer molding, and the blast-cleaning material is sold by melamine-based molds (manufactured by CAR本CARBIDE Industries Co., Ltd.) NIKALET ECR-SW7320) performs 2 bead cleaning by compression molding. <forming conditions>

Mold: QFP Mold temperature: 175 ° C / 175 ° C Hardening time: ECR-CL 300 seconds SW7320 180 seconds Release test After the initial cleaning of the mold, the mold is released by the transfer molding to return the resin composition A ~D was formed by a bead shot with a hardening time of 180 seconds. Then, it was molded by a commercially available biphenyl-based epoxy resin molding material (Sumitomo 130093.doc -16-200902274 BakeLITE Co., Ltd. EME-7351T), and the mold release property and continuous moldability were confirmed. <forming conditions>

Mold: QFP Mold temperature: 175 ° C / 175 ° C Hardening time: 100 seconds [Table 1] Example 1 2 3 4 Resin composition for mold release recovery ABCD Evaluation item S Mold release property 〇〇〇〇 Continuous forming Sex > 1000 Beads > 1000 Beads > 1000 Beads > 1000 Beads: The mold cavity, the gate, and the air vent are not clogged, and the molded product after hardening can be easily released from the mold. [Example 5] The pulp having a resin content of about 73% obtained in Production Example 1 was mixed into three

(I (1000 parts by weight of melamine-formaldehyde resin powder, 0.5 parts by weight with phthalic anhydride, 2.5 parts by weight of zinc stearate, and RICOWAX OP (partially saponified ester of octadecanoic acid manufactured by CLARIANT 'JAPAN Co., Ltd.) 3.5 parts by weight was mixed in a ball mill to obtain a resin composition E for mold release recovery. The obtained resin composition E for mold release recovery exhibited good mold release property as shown in Table 2. Further, the mold was used. After the release of the resin composition E for mold release recovery, the epoxy sealing material was molded to exhibit good continuous formability. 130093.doc 200902274 [Example 6] In addition to the RICOWAX OP (CLARIANT) in the alternative example 5 In the same manner as in Example 5 except that 1.0 part by weight of LICOLB G78 (polymer complex ester manufactured by COGNIS JAPAN Co., Ltd.) was used in an amount of 3.5 parts by weight, a part of the saponified ester of octadecanoic acid produced by JAPAN Co., Ltd. was used. Resin composition F. The obtained mold release-recovering resin composition f exhibited good mold release property as shown in Table 2. Further, after the mold release-recovery resin composition F was used for mold release recovery, When the epoxy sealing material is formed, it exhibits good continuous formability. [Embodiment 7] In place of 111 in the embodiment 5 (: 0\\^^0?((:[八十一八八]^丁1八? Mold release mold was obtained in the same manner as in Example 5 except that 3.5 parts by weight of LICOLB H-4 (denatured hydrocarbon manufactured by CLARIANT JAPAN Co., Ltd.) was used in an amount of 3.5 parts by weight. The resin composition G for recovery was obtained, and the obtained resin composition G for mold release recovery exhibited good mold release property as shown in Table 2. Further, after the mold release was resumed by using the resin composition G for mold release recovery When the epoxy sealing material is formed, it exhibits good continuous formability. [Embodiment 8] In addition to the actual & Example 5, 111 (: 0\¥入又0?((:1^八111八) In addition, 3.0 parts by weight of LICOLB VPN 881 (mineral oil synthetic wax manufactured by COGINS JAPAN Co., Ltd.) was used in an amount of 3.5 parts by weight. In the same manner as in 5, the resin composition for mold release recovery is obtained. The obtained mold release-recovering resin composition η, such as 130093.doc •18- 200902274 Table 2 shows good mold release properties. In addition, after the mold release is recovered by using the mold release, the epoxy sealing material is formed to have a good appearance. [Test Example 2] Initialization of the mold was carried out in the same manner as in Test Example 1. The mold was cleaned after the initial cleaning of the mold release test was completed, and the resin composition was released from the mold by compression molding. The crucibles were formed by a bead shot with a hardening time of 180 seconds. Then, it was molded by a commercially available biphenyl-based epoxy resin molding material (manufactured by Sumitomo BAKELITE Co., Ltd., ΕΜΕ-735 1Τ), and the mold release property and continuous moldability were confirmed. <forming conditions>

Mold: QFP

Mold temperature: 175 ° C / 175 ° C Hardening time: 100 seconds [Table 2] Example 5 6 7 8 Resin composition for mold release recovery EFG Η Evaluation item g Mold release property 〇〇〇〇 Continuous formability gt ;1000 Beads > 1000 Beads > 1000 Beads > 1000 The evaluation criteria of the bead mold release property are the same as in Table 1. 130093.doc -19- 200902274 Industrial Applicability It is possible to prevent/obtain high functionalization and semiconductor elements (4) Resin 藉 by using the mold release recovery property of the resin composition of the present invention. The machine is smashed, and the clogging occurs in the exhaust portion of the cavity. Further, since the eye-catching and the work holes are maintained for a long time due to the release property of the weathers, excellent continuous formability is exhibited and productivity is improved. 130093.doc 20·

Claims (1)

200902274 X. Patent application scope: 1. A resin composition for mold release and recovery, which is characterized in that when the curable resin molding material is formed, after removing the dirt on the surface of the mold, the surface of the plate is removed. A resin composition having a modulus; the resin composition contains 2. melamine (tetra) grease and contains at least (five) metal soap release agent, and an organic fatty acid ester release agent or/and a synthetic wax. The resin composition for mold release recovery according to claim 1, wherein the organic fatty acid vinegar release agent is a partially specialized vinegar or a high molecular complex ester of the 28th acid. 3. The resin composition for mold release recovery according to claim 1, wherein the synthetic lanthanide-denatured hydrocarbon-like soil or the oil-based synthetic butterfly. (4) The resin composition for mold release recovery according to the item 1, wherein the ratio of the content of the gold and the mold release agent to the total content of the organic fatty acid ester release agent and the synthetic synthesis is Based on the weight ratio, the former. The latter = 90: 1〇~3〇: 7(). 5. The resin composition for mold release recovery of the second aspect, wherein the ratio of the content of the gold, the mold release, the total amount of the organic fatty acid ester release agent, and the wax to the wax is Based on the weight ratio, the former. The latter = 9〇: 10~30: 7〇. 6. The resin composition for mold release recovery of claim 3, wherein a ratio of a content of the gold release agent to a total amount of the organic fatty acid S-type release agent and the second wax is a weight ratio Prevail, the former. The latter = 90: 10~30: 7〇. 7. Resin composition for mold release recovery according to claim 1 to 6, 130093.doc 200902274 *Content of the metal soap release agent, the above organic fatty acid ester: release agent The total amount of the content and the content of the synthetic wax is 〇2 to 5 parts by weight based on 1 part by weight of the melamine resin. 8. The resin composition for mold release recovery according to any one of claims 1 to 3, wherein the resin composition is a compression type. The resin composition for mold release of the moon length item 7 is a compression type. The resin composition for mold release recovery according to any one of the above items, wherein the resin composition is a transfer type. 11. The resin composition for mold release recovery according to claim 7, wherein the soybean fat composition is a transfer type. The resin composition for mold release of any one of the items of the item 丨6 to 6, wherein at least one of the paper has a paper and a curing catalyst. In the resin composition for mold release of the mold of the seventh aspect, at least one of the eight pulps and the hardening catalyst is further used. 3 Yes 14. For example, the mold release of the mold for the release of the mold is used to replace the resin with the paper t and the hardening catalyst. " 15. Resin composition for the mold release of the mold of claim 9 is at least one of the paper and the hardening catalyst. 〃Including the resin composition for mold release of the month of the 10th, which is - pulp and At least one type of hardening catalyst. The resin composition for mold release recovery of the month 11 is at least one of a lining, a crepe pulp, and a curing catalyst. Request for the resin composition for mold release from the 丨~17. 壬一130093.doc 200902274 VII. Designated representative drawings: (1) The representative representative of the case is: (none) (2) The components of the representative figure Brief description of the symbol: VIII. If there is a chemical formula in this case, please disclose the chemical formula that best shows the characteristics of the invention: (none) L 130093.doc