WO2008120597A1 - 金型離型回復用樹脂組成物及び金型離型回復方法 - Google Patents

金型離型回復用樹脂組成物及び金型離型回復方法 Download PDF

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Publication number
WO2008120597A1
WO2008120597A1 PCT/JP2008/055413 JP2008055413W WO2008120597A1 WO 2008120597 A1 WO2008120597 A1 WO 2008120597A1 JP 2008055413 W JP2008055413 W JP 2008055413W WO 2008120597 A1 WO2008120597 A1 WO 2008120597A1
Authority
WO
WIPO (PCT)
Prior art keywords
mold
mold releasability
resin composition
recovering
releasability
Prior art date
Application number
PCT/JP2008/055413
Other languages
English (en)
French (fr)
Japanese (ja)
Inventor
Kiyohito Hiromitsu
Hiroaki Nomura
Kenichi Hamaura
Original Assignee
Nippon Carbide Kogyo Kabushiki Kaisha
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Carbide Kogyo Kabushiki Kaisha filed Critical Nippon Carbide Kogyo Kabushiki Kaisha
Priority to JP2009507467A priority Critical patent/JP5242555B2/ja
Priority to CN2008800069300A priority patent/CN101626878B/zh
Priority to KR1020097016236A priority patent/KR101436809B1/ko
Publication of WO2008120597A1 publication Critical patent/WO2008120597A1/ja
Priority to HK10106730.0A priority patent/HK1139898A1/xx

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/60—Releasing, lubricating or separating agents
    • B29C33/62—Releasing, lubricating or separating agents based on polymers or oligomers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C33/00—Moulds or cores; Details thereof or accessories therefor
    • B29C33/56—Coatings, e.g. enameled or galvanised; Releasing, lubricating or separating agents
    • B29C33/58—Applying the releasing agents

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
PCT/JP2008/055413 2007-03-30 2008-03-24 金型離型回復用樹脂組成物及び金型離型回復方法 WO2008120597A1 (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2009507467A JP5242555B2 (ja) 2007-03-30 2008-03-24 金型離型回復用樹脂組成物及び金型離型回復方法
CN2008800069300A CN101626878B (zh) 2007-03-30 2008-03-24 模具脱模恢复用树脂组合物及模具脱模恢复方法
KR1020097016236A KR101436809B1 (ko) 2007-03-30 2008-03-24 금형 이형회복용 수지 조성물 및 금형 이형회복방법
HK10106730.0A HK1139898A1 (en) 2007-03-30 2010-07-12 Resin composition for recovering mold releasability amd method for recovering mold releasability

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
JP2007090384 2007-03-30
JP2007-090384 2007-03-30
JP2007-090385 2007-03-30
JP2007090385 2007-03-30

Publications (1)

Publication Number Publication Date
WO2008120597A1 true WO2008120597A1 (ja) 2008-10-09

Family

ID=39808179

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2008/055413 WO2008120597A1 (ja) 2007-03-30 2008-03-24 金型離型回復用樹脂組成物及び金型離型回復方法

Country Status (7)

Country Link
JP (1) JP5242555B2 (ko)
KR (1) KR101436809B1 (ko)
CN (1) CN101626878B (ko)
HK (1) HK1139898A1 (ko)
MY (1) MY154931A (ko)
TW (1) TWI406750B (ko)
WO (1) WO2008120597A1 (ko)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101691472B (zh) * 2009-09-22 2011-10-12 东莞光群雷射科技有限公司 镭射烫金用三聚氰胺离型剂
CN103555127A (zh) * 2013-10-28 2014-02-05 武汉天诚防伪技术有限公司 镭射烫金电化铝改性离型材料
JP2017035881A (ja) * 2015-08-07 2017-02-16 日本カーバイド工業株式会社 金型清掃用樹脂組成物

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105590534A (zh) * 2016-02-14 2016-05-18 余启佳 一种仿真白萝卜模具制作方法

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879849A (ko) * 1972-01-27 1973-10-26
JPS62132964A (ja) * 1985-12-04 1987-06-16 Matsushita Electric Works Ltd 成形材料の製造方法
JPH0381111A (ja) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd 金型清掃用成形材料および金型清掃方法
JPH07309998A (ja) * 1994-05-18 1995-11-28 Hitachi Chem Co Ltd 金型表面離型処理用樹脂組成物及び該組成物を用いた金型表面の離型処理法並びに該組成物で離型処理した金型を用いた熱硬化性樹脂成形品の成形方法
JPH0957762A (ja) * 1995-08-23 1997-03-04 Nippon Carbide Ind Co Inc 金型清掃用樹脂組成物
JPH09290424A (ja) * 1996-04-26 1997-11-11 Hoechst Ind Kk 離型剤組成物
JP2000143995A (ja) * 1998-11-13 2000-05-26 Mitsui Chemicals Inc 樹脂組成物
JP2001247755A (ja) * 2000-03-08 2001-09-11 Teijin Ltd コネクター用樹脂ペレット混合物

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS57178814A (en) * 1981-04-30 1982-11-04 Kuraray Co Ltd Manufacture of molded resin molding and mold therefor

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4879849A (ko) * 1972-01-27 1973-10-26
JPS62132964A (ja) * 1985-12-04 1987-06-16 Matsushita Electric Works Ltd 成形材料の製造方法
JPH0381111A (ja) * 1989-08-24 1991-04-05 Matsushita Electric Works Ltd 金型清掃用成形材料および金型清掃方法
JPH07309998A (ja) * 1994-05-18 1995-11-28 Hitachi Chem Co Ltd 金型表面離型処理用樹脂組成物及び該組成物を用いた金型表面の離型処理法並びに該組成物で離型処理した金型を用いた熱硬化性樹脂成形品の成形方法
JPH0957762A (ja) * 1995-08-23 1997-03-04 Nippon Carbide Ind Co Inc 金型清掃用樹脂組成物
JPH09290424A (ja) * 1996-04-26 1997-11-11 Hoechst Ind Kk 離型剤組成物
JP2000143995A (ja) * 1998-11-13 2000-05-26 Mitsui Chemicals Inc 樹脂組成物
JP2001247755A (ja) * 2000-03-08 2001-09-11 Teijin Ltd コネクター用樹脂ペレット混合物

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101691472B (zh) * 2009-09-22 2011-10-12 东莞光群雷射科技有限公司 镭射烫金用三聚氰胺离型剂
CN103555127A (zh) * 2013-10-28 2014-02-05 武汉天诚防伪技术有限公司 镭射烫金电化铝改性离型材料
JP2017035881A (ja) * 2015-08-07 2017-02-16 日本カーバイド工業株式会社 金型清掃用樹脂組成物

Also Published As

Publication number Publication date
JP5242555B2 (ja) 2013-07-24
HK1139898A1 (en) 2010-09-30
TW200902274A (en) 2009-01-16
MY154931A (en) 2015-08-28
JPWO2008120597A1 (ja) 2010-07-15
CN101626878A (zh) 2010-01-13
KR101436809B1 (ko) 2014-09-03
TWI406750B (zh) 2013-09-01
CN101626878B (zh) 2012-12-26
KR20100014372A (ko) 2010-02-10

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