CN101615446B - 内含导电性粒子的树脂膜片及由其电连接的电子部件 - Google Patents

内含导电性粒子的树脂膜片及由其电连接的电子部件 Download PDF

Info

Publication number
CN101615446B
CN101615446B CN2009101503914A CN200910150391A CN101615446B CN 101615446 B CN101615446 B CN 101615446B CN 2009101503914 A CN2009101503914 A CN 2009101503914A CN 200910150391 A CN200910150391 A CN 200910150391A CN 101615446 B CN101615446 B CN 101615446B
Authority
CN
China
Prior art keywords
particle
resin
layer
resin film
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2009101503914A
Other languages
English (en)
Chinese (zh)
Other versions
CN101615446A (zh
Inventor
河野务
小林宏治
小岛和良
美野真行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Resonac Corp
Original Assignee
Hitachi Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Chemical Co Ltd filed Critical Hitachi Chemical Co Ltd
Priority to CN201110251065.XA priority Critical patent/CN102298988B/zh
Publication of CN101615446A publication Critical patent/CN101615446A/zh
Application granted granted Critical
Publication of CN101615446B publication Critical patent/CN101615446B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B5/00—Non-insulated conductors or conductive bodies characterised by their form
    • H01B5/16—Non-insulated conductors or conductive bodies characterised by their form comprising conductive material in insulating or poorly conductive material, e.g. conductive rubber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B13/00—Apparatus or processes specially adapted for manufacturing conductors or cables
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R11/00—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts
    • H01R11/01—Individual connecting elements providing two or more spaced connecting locations for conductive members which are, or may be, thereby interconnected, e.g. end pieces for wires or cables supported by the wire or cable and having means for facilitating electrical connection to some other wire, terminal, or conductive member, blocks of binding posts characterised by the form or arrangement of the conductive interconnection between the connecting locations
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29199—Material of the matrix
    • H01L2224/2929—Material of the matrix with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73201—Location after the connecting process on the same surface
    • H01L2224/73203—Bump and layer connectors
    • H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Non-Insulated Conductors (AREA)
  • Laminated Bodies (AREA)
  • Conductive Materials (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Wire Bonding (AREA)
  • Combinations Of Printed Boards (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
CN2009101503914A 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件 Expired - Fee Related CN101615446B (zh)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201110251065.XA CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Applications Claiming Priority (6)

Application Number Priority Date Filing Date Title
JP2008167454 2008-06-26
JP2008167454 2008-06-26
JP2008-167454 2008-06-26
JP2009-148551 2009-06-23
JP2009148551A JP4623224B2 (ja) 2008-06-26 2009-06-23 樹脂フィルムシート及び電子部品
JP2009148551 2009-06-23

Related Child Applications (3)

Application Number Title Priority Date Filing Date
CN2011102510630A Division CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途
CN201110251065.XA Division CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102511046A Division CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件

Publications (2)

Publication Number Publication Date
CN101615446A CN101615446A (zh) 2009-12-30
CN101615446B true CN101615446B (zh) 2013-07-17

Family

ID=41495036

Family Applications (4)

Application Number Title Priority Date Filing Date
CN2009101503914A Expired - Fee Related CN101615446B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102511046A Pending CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2011102511046A Pending CN102298989A (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN201110251065.XA Expired - Fee Related CN102298988B (zh) 2008-06-26 2009-06-25 内含导电性粒子的树脂膜片及由其电连接的电子部件
CN2011102510630A Pending CN102298987A (zh) 2008-06-26 2009-06-25 树脂膜片的用途

Country Status (4)

Country Link
JP (9) JP4623224B2 (enExample)
KR (8) KR101038614B1 (enExample)
CN (4) CN101615446B (enExample)
TW (3) TWI415144B (enExample)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品
CN106424711B (zh) * 2012-03-06 2019-02-15 东洋油墨Sc控股株式会社 导电性微粒及其制造方法、导电性树脂组成物、导电性薄片、以及电磁波屏蔽薄片
JP6221285B2 (ja) * 2013-03-21 2017-11-01 日立化成株式会社 回路部材の接続方法
JP6069153B2 (ja) * 2013-09-27 2017-02-01 デクセリアルズ株式会社 アンダーフィル材、及びこれを用いた半導体装置の製造方法
JP6645730B2 (ja) * 2014-01-28 2020-02-14 デクセリアルズ株式会社 接続体及び接続体の製造方法
JP6307308B2 (ja) * 2014-03-06 2018-04-04 デクセリアルズ株式会社 接続構造体の製造方法、及び回路接続材料
KR102430609B1 (ko) * 2014-03-31 2022-08-08 데쿠세리아루즈 가부시키가이샤 이방성 도전 필름 및 그 제조 방법
KR101737173B1 (ko) 2014-07-24 2017-05-17 삼성에스디아이 주식회사 이방 도전성 필름, 이의 제조 방법, 및 이를 포함하는 반도체 장치
TWI715542B (zh) * 2014-11-12 2021-01-11 日商迪睿合股份有限公司 光硬化系異向性導電接著劑、連接體之製造方法及電子零件之連接方法
JP6661886B2 (ja) * 2015-03-11 2020-03-11 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR101684144B1 (ko) 2015-07-08 2016-12-07 울산대학교 산학협력단 무단변속기를 이용한 고효율 파력발전기 및 그 제어방법
JP6327630B1 (ja) * 2017-04-28 2018-05-23 リンテック株式会社 フィルム状焼成材料、支持シート付フィルム状焼成材料、フィルム状焼成材料の製造方法、及び支持シート付フィルム状焼成材料の製造方法
KR102569980B1 (ko) * 2017-09-11 2023-08-24 가부시끼가이샤 레조낙 회로 접속용 접착제 필름 및 그의 제조 방법, 회로 접속 구조체의 제조 방법, 그리고 접착제 필름 수용 세트
WO2019050006A1 (ja) * 2017-09-11 2019-03-14 日立化成株式会社 回路接続用接着剤フィルム及びその製造方法、回路接続構造体の製造方法、並びに、接着剤フィルム収容セット
TWI846756B (zh) * 2018-11-21 2024-07-01 日商信越化學工業股份有限公司 異向性薄膜、及異向性薄膜的製造方法
JP2020024937A (ja) * 2019-10-28 2020-02-13 日立化成株式会社 フィルム状回路接続材料及び回路部材の接続構造体の製造方法
KR20210154293A (ko) 2020-06-11 2021-12-21 현대자동차주식회사 리튬이온 이차전지 및 그 제조방법
KR20220019470A (ko) 2020-08-10 2022-02-17 현대자동차주식회사 리튬이온 이차전지 제조 시스템 및 그 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1210614A (zh) * 1996-02-08 1999-03-10 旭化成工业株式会社 各向异性导电组合物

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63102110A (ja) * 1986-10-17 1988-05-07 富士ゼロックス株式会社 異方導電体及びその製法
JPH03107888A (ja) * 1989-09-21 1991-05-08 Sharp Corp 回路基板の接続構造
JPH0645204A (ja) * 1992-07-21 1994-02-18 Nippon Chemicon Corp 固体電解コンデンサ
JPH0645024A (ja) * 1992-07-22 1994-02-18 Hitachi Chem Co Ltd 異方導電性接着フィルム
JPH08148213A (ja) * 1994-11-25 1996-06-07 Hitachi Chem Co Ltd 接続部材、該接続部材を用いた電極の接続構造及び接続方法
GB2296845A (en) * 1995-01-04 1996-07-10 Plessey Semiconductors Ltd Frequency shift keyed radio receivers
JP4032439B2 (ja) * 1996-05-23 2008-01-16 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JP3656768B2 (ja) * 1995-02-07 2005-06-08 日立化成工業株式会社 接続部材および該接続部材を用いた電極の接続構造並びに接続方法
JPH10200243A (ja) * 1997-01-13 1998-07-31 Toshiba Chem Corp 異方性導電ペーストによる電気接続方法
JP2000182691A (ja) * 1998-12-17 2000-06-30 Hitachi Chem Co Ltd 回路の接続部材及びこれを用いた接続方法
TW492215B (en) * 2000-03-23 2002-06-21 Sony Corp Electric connection material and electric connection method
JP2004006417A (ja) 2003-08-22 2004-01-08 Hitachi Chem Co Ltd 接続部材及びこれを用いた電極の接続構造
JP2005146044A (ja) * 2003-11-12 2005-06-09 Sumitomo Electric Ind Ltd 異方導電性接着剤
JP4728665B2 (ja) * 2004-07-15 2011-07-20 積水化学工業株式会社 導電性微粒子、導電性微粒子の製造方法、及び異方性導電材料
JP2006233202A (ja) * 2005-01-31 2006-09-07 Asahi Kasei Electronics Co Ltd 回路接続用異方導電性接着フィルム
JP4877230B2 (ja) * 2005-11-18 2012-02-15 日立化成工業株式会社 接着剤組成物、回路接続材料、接続構造及び回路部材の接続方法
JP4967482B2 (ja) * 2006-02-27 2012-07-04 日立化成工業株式会社 導電粒子、接着剤組成物及び回路接続材料
CN101449426B (zh) * 2006-04-11 2012-05-16 Jsr株式会社 各向异性导电连接器及各向异性导电连接器装置
CN101432931B (zh) * 2006-04-27 2013-04-24 旭化成电子材料株式会社 导电颗粒配置薄片及各向异性导电膜
JP2008112732A (ja) * 2007-11-19 2008-05-15 Hitachi Chem Co Ltd 電極の接続方法
JP4623224B2 (ja) * 2008-06-26 2011-02-02 日立化成工業株式会社 樹脂フィルムシート及び電子部品

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1210614A (zh) * 1996-02-08 1999-03-10 旭化成工业株式会社 各向异性导电组合物

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
JP昭63－102110A 1988.05.07
JP特开平10－200243A 1998.07.31
JP特开平9－312176A 1997.12.02

Also Published As

Publication number Publication date
JP4661985B2 (ja) 2011-03-30
CN102298988A (zh) 2011-12-28
KR101120277B1 (ko) 2012-03-07
CN102298988B (zh) 2016-09-07
TWI396626B (zh) 2013-05-21
KR101120253B1 (ko) 2012-03-16
JP4661986B2 (ja) 2011-03-30
JP2011233528A (ja) 2011-11-17
KR101200148B1 (ko) 2012-11-12
JP2011233530A (ja) 2011-11-17
CN102298987A (zh) 2011-12-28
JP4970574B2 (ja) 2012-07-11
JP2011233529A (ja) 2011-11-17
KR20110084488A (ko) 2011-07-25
JP2010278013A (ja) 2010-12-09
TWI415144B (zh) 2013-11-11
CN101615446A (zh) 2009-12-30
KR20100102571A (ko) 2010-09-24
JP4623224B2 (ja) 2011-02-02
KR20110084490A (ko) 2011-07-25
TW201215504A (en) 2012-04-16
JP2011003544A (ja) 2011-01-06
KR20110084491A (ko) 2011-07-25
CN102298989A (zh) 2011-12-28
JP2011198767A (ja) 2011-10-06
JP2010034037A (ja) 2010-02-12
KR20110084489A (ko) 2011-07-25
JP4766185B2 (ja) 2011-09-07
TW201101343A (en) 2011-01-01
KR20110084492A (ko) 2011-07-25
JP2010267627A (ja) 2010-11-25
JP2010284973A (ja) 2010-12-24
KR20110130376A (ko) 2011-12-05
KR20100002196A (ko) 2010-01-06
TW201013710A (en) 2010-04-01
KR101038614B1 (ko) 2011-06-03

Similar Documents

Publication Publication Date Title
CN101615446B (zh) 内含导电性粒子的树脂膜片及由其电连接的电子部件
TWI455151B (zh) 電路連接材料、使用其之薄膜狀電路連接材料、電路構件之連接構造及其製造方法
KR101376002B1 (ko) 접착제 조성물 및 이것을 이용한 회로 접속 재료, 및 회로 부재의 접속 방법 및 회로 접속체
TWI443686B (zh) Conductive materials and connecting structures
TW201218883A (en) Circuit connection structure
CN107254264B (zh) 电路连接材料、电路部件的连接结构及其制造方法
CN204651307U (zh) 连接结构体
TWI540195B (zh) A circuit connecting material and a connecting method using the same, and a connecting structure
JP2013149467A (ja) 異方性導電フィルム、接続構造体及び接続構造体の製造方法
KR20190081985A (ko) 이방 도전성 필름, 이를 포함하는 디스플레이 장치 및／또는 이를 포함하는 반도체 장치
CN204927244U (zh) 连接结构体
JP2018082166A (ja) 硬化性材料及び積層体

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20130717

Termination date: 20140625

EXPY Termination of patent right or utility model