CN101506975B - 堆叠管芯封装 - Google Patents

堆叠管芯封装 Download PDF

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Publication number
CN101506975B
CN101506975B CN2007800304876A CN200780030487A CN101506975B CN 101506975 B CN101506975 B CN 101506975B CN 2007800304876 A CN2007800304876 A CN 2007800304876A CN 200780030487 A CN200780030487 A CN 200780030487A CN 101506975 B CN101506975 B CN 101506975B
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CN
China
Prior art keywords
integrated circuit
circuit die
wire
electrical contacts
bonded
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Active
Application number
CN2007800304876A
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English (en)
Chinese (zh)
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CN101506975A (zh
Inventor
艾尔博·吴
高文生
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaiwei International Co
Marvell International Ltd
Marvell Asia Pte Ltd
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Marvell World Trade Ltd
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Publication of CN101506975A publication Critical patent/CN101506975A/zh
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Publication of CN101506975B publication Critical patent/CN101506975B/zh
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/60—Insulating or insulated package substrates; Interposers; Redistribution layers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/551—Materials of bond wires
    • H10W72/552—Materials of bond wires comprising metals or metalloids, e.g. silver
    • H10W72/5522—Materials of bond wires comprising metals or metalloids, e.g. silver comprising gold [Au]
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/853—On the same surface
    • H10W72/859—Bump connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/884—Die-attach connectors and bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/722—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/732—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/752—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between stacked chips
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/754—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked insulating package substrate, interposer or RDL

Landscapes

  • Semiconductor Integrated Circuits (AREA)
  • Wire Bonding (AREA)
CN2007800304876A 2006-06-15 2007-06-13 堆叠管芯封装 Active CN101506975B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US81377806P 2006-06-15 2006-06-15
US60/813,778 2006-06-15
US11/801,317 2007-05-09
US11/801,317 US7535110B2 (en) 2006-06-15 2007-05-09 Stack die packages
PCT/US2007/013821 WO2007146307A2 (en) 2006-06-15 2007-06-13 Stack die packages

Publications (2)

Publication Number Publication Date
CN101506975A CN101506975A (zh) 2009-08-12
CN101506975B true CN101506975B (zh) 2011-04-06

Family

ID=38666964

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2007800304876A Active CN101506975B (zh) 2006-06-15 2007-06-13 堆叠管芯封装

Country Status (6)

Country Link
US (2) US7535110B2 (https=)
EP (1) EP2033220B1 (https=)
JP (1) JP5320611B2 (https=)
CN (1) CN101506975B (https=)
TW (1) TWI429050B (https=)
WO (1) WO2007146307A2 (https=)

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US9009393B1 (en) 2008-09-23 2015-04-14 Marvell International Ltd. Hybrid solid-state disk (SSD)/hard disk drive (HDD) architectures
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US8525327B2 (en) 2011-10-03 2013-09-03 Invensas Corporation Stub minimization for assemblies without wirebonds to package substrate
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US8659141B2 (en) 2011-10-03 2014-02-25 Invensas Corporation Stub minimization using duplicate sets of terminals for wirebond assemblies without windows
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CN102446882B (zh) 2011-12-30 2013-12-04 北京工业大学 一种半导体封装中封装系统结构及制造方法
US8787034B2 (en) 2012-08-27 2014-07-22 Invensas Corporation Co-support system and microelectronic assembly
US9368477B2 (en) 2012-08-27 2016-06-14 Invensas Corporation Co-support circuit panel and microelectronic packages
US8848392B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support module and microelectronic assembly
US8848391B2 (en) 2012-08-27 2014-09-30 Invensas Corporation Co-support component and microelectronic assembly
US9070423B2 (en) 2013-06-11 2015-06-30 Invensas Corporation Single package dual channel memory with co-support
CN103426871B (zh) * 2013-07-25 2017-05-31 上海航天测控通信研究所 一种高密度混合叠层封装结构及其制作方法
US9123555B2 (en) 2013-10-25 2015-09-01 Invensas Corporation Co-support for XFD packaging
CN103558903A (zh) * 2013-11-12 2014-02-05 上海航天测控通信研究所 一种具有抗辐性能的PowerPC计算机模块
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JP2016192447A (ja) * 2015-03-30 2016-11-10 株式会社東芝 半導体装置
CN108140632B (zh) * 2015-04-14 2020-08-25 华为技术有限公司 一种芯片
US9871019B2 (en) 2015-07-17 2018-01-16 Invensas Corporation Flipped die stack assemblies with leadframe interconnects
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CN108336030A (zh) * 2018-01-16 2018-07-27 奥肯思（北京）科技有限公司 一种多层堆叠系统级封装
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CN110943077A (zh) * 2019-11-08 2020-03-31 关键禾芯科技股份有限公司 毫米波应用的多颗晶片封装结构
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Also Published As

Publication number Publication date
WO2007146307A3 (en) 2008-03-06
WO2007146307B1 (en) 2008-05-22
US7825521B2 (en) 2010-11-02
TWI429050B (zh) 2014-03-01
US7535110B2 (en) 2009-05-19
US20090212410A1 (en) 2009-08-27
CN101506975A (zh) 2009-08-12
EP2033220B1 (en) 2019-10-16
EP2033220A2 (en) 2009-03-11
JP5320611B2 (ja) 2013-10-23
TW200807670A (en) 2008-02-01
US20080006948A1 (en) 2008-01-10
WO2007146307A2 (en) 2007-12-21
JP2009540606A (ja) 2009-11-19

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Effective date of registration: 20200426

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Patentee after: Marvell Asia Pte. Ltd.

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Effective date of registration: 20200426

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Patentee before: Marvell International Ltd.

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