CN101479665B

CN101479665B - Optical imaging device with thermal attenuation

Info

Publication number: CN101479665B
Application number: CN200780023553.7A
Authority: CN
Inventors: B·格尔里希; J·库格勒尔; T·伊特纳; S·赫姆巴歇尔; K-H·席米茨埃克; P·泰埃巴蒂; H·霍尔德雷
Original assignee: Carl Zeiss SMT GmbH
Current assignee: Carl Zeiss SMT GmbH
Priority date: 2006-05-09
Filing date: 2007-05-09
Publication date: 2012-07-11
Anticipated expiration: 2027-05-09
Also published as: KR20090018939A; WO2007128835A1; JP2014168095A; TWI432909B; JP6240247B2; JP5543201B2; US8363206B2; TW200813641A; US20090135385A1; US20130114057A1; JP2018055111A; KR101411764B1; DE102006021797A1; EP2016465A1; JP2012256921A; JP5908940B2; US20180181007A1; JP2016177289A; JP5543549B2; CN101479665A

Abstract

An optical imaging device, in particular for use in microlithography, includes a mask device for receiving a mask having a projection pattern, a projection device with an optical element group, a substrate device for receiving a substrate and an immersion zone. The optical element group is adapted to project the projection pattern onto the substrate and includes a plurality of optical elements with an immersion element to which the substrate is at least temporarily located adjacent to during operation. During operation, the immersion zone is located between the immersion element and the substrate and is at least temporarily filled with an immersion medium. A thermal attenuation device is provided, the thermal attenuation device being adapted to reduce fluctuations within the temperature distribution of the immersion element induced by the immersion medium.

Description

The optical imaging device of band heat fade device

Technical field

The present invention relates to a kind of optical imaging device.The present invention can be used on and makes in the employed microlithography technology of microelectronic circuit.The invention still further relates to a kind of optical imaging method, this method is particularly implemented by optical imaging device according to the present invention.

Background technology

Particularly in the micro-lithography field; Except use has high-precision parts; Must be during operation; The position and the physical dimension that on big as far as possible degree, are held in the picture device feature are constant, and to realize corresponding high image quality, the imaging device parts for example are the optical element such as lens, catoptron and grating.Be in the order of magnitude and be the result that high-precision requirement in the small scope of several nanometers remains following needs: be reduced in make the employed optical system of microelectronic circuit resolution to promote the microminiaturization of microelectronic circuit to be produced.

For the resolution that realizes increasing, can reduce employed light wavelength, be in extreme ultraviolet (EUV) scope as this, with the scope situation of system of the operation wavelength work of 13nm, perhaps can increase the numerical aperture of employed optical projection system.Significantly increase numerical aperture to surpass 1 a kind of possibly scheme be in so-called immersion system, to realize, wherein, have immersing medium greater than 1 refractive index and be placed between the submergence element and substrate to be made public of optical projection system.The optical element that utilization has extra high refractive index can further increase numerical aperture.

Should be appreciated that in so-called single immersion system submergence element (promptly part contacts, is in the optical element of submerged state with immersing medium at least) is normally near last optical element of substrate to be made public.Here, immersing medium contacts with substrate with this last optical element usually.In so-called pair of immersion system, the submergence element not necessarily must be last optical element, promptly near the optical element of substrate.In so two immersion systems or many immersion systems, the submergence element also can separate through one or more other optical elements and substrate.In this case, the submergence element at least the immersing medium that is immersed in wherein of part can for example be placed between two optical elements of optical system.

Along with the increase with numerical aperture that reduces of operation wavelength, it is harsh more that the bearing accuracy of used optical element and dimension precision requirement become in whole work.Certainly, the image error of whole optical devices minimizes requirement and has also improved.

Certainly, here, the distortion of Temperature Distribution in used optical element and the respective optical element that possibly finally cause thus, and the final variations in refractive index relevant with temperature of respective optical element is particular importance.

Known from EP 1 477 853 A2 (authorizing Sakamoto); For the EUV system; Offset on one's own initiative heating that catoptron (only in such system, can use) causes by incident light and initiatively will the given position in catoptron on the temperature of catching remain in the given scope, whole disclosures of the document are incorporated this paper by reference into.This is to carry out through temperature control equipment, this temperature control equipment be arranged on the middle position of mirror back surface and comprise Peltier's element or like so that the target cooling to be provided.This solution has such shortcoming on the one hand, promptly is not suitable for refraction optical element, as them especially in the immersion system above-mentioned, because central temperature control equipment can cover the zone that optics uses.On the other hand, only the temperature of the single position in catoptron is controlled under the state of almost stable under the condition of considering the luminous energy that is absorbed by catoptron reliably.Other heat affectings of environment; Particularly the heat affecting of instability and/or localized variation all still is not considered respectively, the heat affecting of instability and/or localized variation be as possibly introduce by immersing medium with the Temperature Distribution that possibly cause in catoptron in dynamically and those influences of localised waving.

Summary of the invention

Therefore; The object of the present invention is to provide a kind of optical imaging device and a kind of optical imaging method; These apparatus and method do not demonstrate these shortcomings or on littler degree, demonstrate these shortcomings at least; More particularly, except the absorption effect of considering projected light, allow to realize compensation to the localized heat environmental impact that acts on optical element with simple mode.

The present invention is based on such discovery; It is such thermal environment influence; The influence that particularly derives from immersing medium possibly cause the localised waving in the Temperature Distribution of respective optical element in immersion system; These localised wavings are very important with respect to the absorption effect of projected light, or even appreciable.According to the present invention; Show; On the one hand; If be provided with corresponding heat fade device, its except with absorb relevant fluctuation also reduce in the Temperature Distribution of respective optical element the fluctuation that the environment by the respective optical element causes, the expectation compensation of such thermal environment influence for dioptric system and refraction optical element also respectively as employed in the immersion system, being feasible.For this purpose, according to the present invention, in a kind of deformation program that comprises immersion system, for the submergence element provides the heat fade device, said heat fade device is suitable for providing reducing of the fluctuation that particularly in the Temperature Distribution of submergence element, caused by immersing medium.In this way, except considering absorption effect, it is also conceivable that the localised waving that in the Temperature Distribution of submergence element, especially causes by immersing medium.

In addition, the present invention promptly particularly for refracting element, can set up the relevant temperature characteristic model of considering instability and/or local environment influence especially, and it is used in the ACTIVE CONTROL to Temperature Distribution also based on such discovery.Utilize such temperature characterisitic model can predict or estimate under imaging process not being had the condition of disturbing, to be difficult in really optics and use the Temperature Distribution that records in the zone, and in Temperature Distribution control, consider the Temperature Distribution of this prediction or estimation.

Therefore; It is a kind of especially for the optical imaging device in the microlithography technology that one object of the present invention is to provide, and it comprises mask set, the projection arrangement with optical elements sets that is used to receive the mask that comprises projection pattern, substrate devices and the submergence district that is used to receive substrate.This optical elements sets is suitable for projection pattern is projected on the substrate, and comprises a plurality of optical elements, comprising the submergence element, substrate during operation at least temporarily with this submergence element adjacency.During operation, this submergence district is arranged between submergence element and the substrate, and at least temporarily is filled with immersing medium.According to the present invention, be provided with the heat fade device, said heat fade device is suitable for reducing the interior fluctuation that is caused by immersing medium of Temperature Distribution TE of submergence element.

It is a kind of especially for the optical imaging method in the microlithography technology that another object of the present invention is to provide; Wherein, Optical element through optical elements sets; Projection pattern is projected on the substrate, and the submergence element of optical elements sets part at least is immersed in the scope in submergence district in the immersing medium with the substrate adjacency.According to the present invention,, reduce the fluctuation that in the Temperature Distribution TE of submergence element, causes by immersing medium through the heat fade device.

Another object of the present invention provides a kind of especially for the optical imaging device in the microlithography technology; It comprises mask set, the projection arrangement with optical elements sets that is used to receive the mask that comprises projection pattern, substrate devices and the submergence district that is used to receive substrate; Wherein, optical elements sets is suitable for projection pattern is projected on the substrate.Optical elements sets comprises a plurality of optical elements, and comprising at least one submergence element, this submergence element at least temporarily is immersed in the immersing medium of the scope that is arranged in the submergence district during operation.Be provided with the heat fade device; Said heat fade device is suitable for reducing the fluctuation that in the Temperature Distribution TE of submergence element, caused by immersing medium; Wherein, this heat fade device comprises at least one hot decoupling, is used for making the submergence element from least a portion of its environment portion of hot decoupling at least.

It is a kind of especially for the optical imaging method in the microlithography technology that another purpose of the present invention is to provide; Wherein, Optical element through optical elements sets; Projection pattern is projected on the substrate, and the submergence element of optical elements sets part at least is immersed in the immersing medium in the scope in submergence district.According to the present invention, through the heat fade device, reduce the fluctuation that in the Temperature Distribution TE of submergence element, causes by immersing medium, wherein, at least portion of hot decoupling of submergence element from least a portion of its environment is provided through this heat fade device.

It is a kind of especially for the optical imaging device in the microlithography technology that another object of the present invention is to provide, and it comprises mask set, the projection arrangement with optical elements sets that is used to receive the mask that comprises projection pattern, the substrate devices that is used to receive substrate.Optical elements sets is suitable for projection pattern is projected on the substrate, and comprises a plurality of optical elements, comprising at least one heat control optical element.According to the present invention; Be provided with the heat fade device; It is associated with the heat control optical element, and said heat fade device is suitable for reducing the fluctuation in the Temperature Distribution TE of heat control optical element, wherein; In order to reduce the temperature fluctuation in the heat control optical element, the temperature characterisitic model of this heat fade device visit heat control optical element.

It is a kind of especially for the optical imaging method in the microlithography technology that another purpose of the present invention is to provide, and wherein, through the optical element of optical elements sets, projection pattern projected on the substrate, and these optical elements comprise the heat control optical element.According to the present invention, through the heat fade device, reduce the fluctuation in the Temperature Distribution TE of heat control optical element, wherein, in order to reduce the temperature fluctuation in the heat control optical element, the temperature characterisitic model of visit heat control optical element.

By dependent claims and can find out other preferred implementations of the present invention respectively in the description related to the preferred embodiment with reference to the accompanying drawings.All combinations of disclosed characteristic no matter whether in claims, clearly narrate, all fall into protection scope of the present invention.

Description of drawings

Fig. 1 is the synoptic diagram according to a kind of preferred implementation of optical imaging device of the present invention, utilizes this optical imaging device can implement a kind of preferred implementation according to optical imaging method of the present invention;

Fig. 2 is the show in schematic partial sections of a part of the imaging device of Fig. 1;

Fig. 3 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 4 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 5 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 6 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 7 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 8 is the show in schematic partial sections that illustrates according to Fig. 2 detail D of the another kind of preferred implementation of optical imaging device of the present invention;

Fig. 9 is the block diagram according to a kind of preferred implementation of optical imaging method of the present invention that can utilize that the optical imaging device of Fig. 1 implements;

Figure 10 is the show in schematic partial sections according to the another kind of preferred implementation of optical imaging device of the present invention.

Embodiment

1 to 9 describe below with reference to accompanying drawings according to of the present invention and be used for the preferred implementation of the optical imaging device of microlithography processes.

Fig. 1 shows the synoptic diagram according to a kind of preferred implementation of optical imaging device of the present invention, and the form of optical imaging device is that to be utilized in wavelength in the UV scope be that the light of 193nm comes the micro-lithography device 101 of work.

Micro-lithography device 101 comprises that illuminator 102, form are that mask set, the form of mask platform 103 is that optical projection system and the form with object lens 104 of optical axis 104.1 is the substrate devices of wafer station 105.The irradiation of illuminator 102 usefulness projected light beams (not being shown specifically) is arranged on the mask 103.1 on the mask platform 103, and the wavelength of this projected light beam is 193nm.On mask 104.3, form projection pattern, this projection pattern is to use projected light beam, is to be arranged on the substrate of the wafer 105.1 on the wafer station 105 through the optical element form of projecting to that is arranged in the object lens 104.

Object lens 104 comprise the optical elements sets 106 that is formed by one group of optical element 107 to 109.Optical element 107 to 109 remains in the object lens housing 104.2.Because operation wavelength is 193nm, optical element 107 to 109 is the refraction optical elements such as lens or like.Here, be so-called final element or last lens element near last optical element 109 of wafer 105.1 during operation.

Micro-lithography device 101 is immersion systems.In submergence district 110, liquid-immersed medium 110.1 (for example being highly purified water or analog) is set between wafer 105.1 and last lens element 109.In submergence district 110, be provided with the soaking pit of immersing medium 110.1, on the one hand, the part that in fact this soaking pit need be made public wafer 105.1 downwards at least limits.The lateral boundaries of this soaking pit part at least is to be provided by submergence frame 110.2 (being also referred to as immersion hood usually).The part that the part that optics uses between exposure period at least and last lens element 109 of last lens element 109 is arranged in object lens 104 outsides immerses soaking pit, makes that last lens element 109 is the submergence element on meaning of the present invention.Therefore, only be positioned at immersing medium 110 from last lens element 109 ejaculation and the light path between last lens element 109 and wafer.

Because the refractive index of immersing medium is higher than 1, has realized numerical aperture NA greater than 1, and with respect to the legacy system of using gases atmosphere between lens element and the wafer in the end, resolution has improved.

In order to realize the NA value greater than 1.4 numerical aperture, last lens element 109 preferred refractive index ratio that adopt is generally used for the quartz (SiO) of such lens element or the higher material of refractive index of calcium fluoride (CaF).In this embodiment, the material of last lens element 109 is spinels.But, in other embodiments, can use other to have the corresponding high refractive index and the other lenses material of suitable respective wavelength.The example of such lens material is LuAG (Luetcium aluminum garnet, for example Lu ₃Al ₅O ₁₂).In addition, should be appreciated that the present invention also can be used for the situation of traditional quartz or calcium fluoride lens.In addition, should be appreciated that and to select another numerical aperture.Yet about high resolving power, the value of numerical aperture preferably is at least 1.3.

The spinel refractive index that last lens element 109 uses has than traditional quartz or the obvious higher temperature control of calcium fluoride lens.Therefore; Be necessary to make during operation the actual temperature distribution TE of last lens element to remain in the narrow variation range; This is in order to keep given theoretical temperatures distribution TSE; With the image error that the respective change that reduces at least by the refractive index of last lens element 109 causes, preferred even make this error reach minimum.

But; Should be appreciated that particularly in the micro-lithography field, in system with optical element of processing by quartzy (SiO) or calcium fluoride (CaF); The Temperature Distribution of submergence element possibly change or fluctuate; These variations or fluctuation cannot be ignored, so that for such system, use the present invention also to have very big benefit.

In order to satisfy these the narrow variation ranges around given theoretical temperatures distribution TSE, be provided with heat fade device 111 according to the present invention.Mainly this heat fade device 111 is described in further detail below with reference to Fig. 2 to 9.Fig. 2 (local mode with high simplified) shows the semisectional view that object lens 104 are positioned at an end of wafer side.

In the present embodiment, because heat fade device 110, remain Δ TE=1mK in the maximum deviation of the given theoretical temperatures distribution TSE of the duration of work of micro-lithography device 101 and last lens element 109.In this way, the image error and the image error variation that are caused by thermal-induced deformation and thermoinduction variations in refractive index respectively can keep enough lowly, to realize high imaging quality.But, should be appreciated that in other embodiments of the present invention other possibly higher maximum deviation be feasible, particularly according to the thermal deformation characteristic and the thermoinduction variations in refractive index of institute's materials used.Preferably, these maximum deviations are no more than 10mK, because can realize extra high image quality whereby.

In this, should be appreciated that given theoretical temperatures distribution TSE can select arbitrarily.Can select like this, make last lens element 109 in this given theoretical temperatures distribution TSE, have minimum image error for a kind of image error type at least.But; Also can select like this; Make last lens element 109 in this given theoretical temperatures distribution TSE, have an image error for a kind of image error type at least, this image error have that enough amounts reduce or or even the corresponding image error of other optical elements of full remuneration optical elements sets 106; Thereby at least for a kind of image error, the assembly of object lens 104 reaches minimum as error.As error minimize, whole disclosures of the document are incorporated this paper by reference into from the known such assembly of EP 0 956 871 A1 (Rupp).

Heat fade device 111 comprises a plurality of active heat fade control circuits and passive heat fade parts.Especially, it comprises and is used for controlling the control circuit that immersing medium 110.1 is supplied with the supplying temperature in submergence district specially, as the first heat fade control circuit.

For this reason, this first heat fade control circuit 112 comprises feedway 112.1, first temperature control equipment 112.1, first temperature sensor 112.3 and control device 111.1.Feedway 112.1 is supplied with immersing medium 110.1 with enough amounts and enough flow velocitys to submergence district 110 through at least one supply line.First temperature control equipment 112.2 that is connected with control device 111.1 is arranged on before the inlet point that immersing medium 110.1 gets into submergence districts 110 nearby, and with the supplying temperature TIF of adjustment to the expectation of immersing medium 110.1.First temperature sensor 112.3 through wireless and/or at least the wired coupling arrangement (for more clear and not shown) of part be connected with controller 111.1.

The supplying temperature TIF of expectation is confirmed with the mode that describes below by control device 111.1.First temperature sensor 112.3 is evenly distributed in the periphery in submergence zone 110 and as first definite device on meaning of the present invention, through these first temperature sensors, detects the temperature of immersing medium 110.1 in the perimeter in submergence district 110.These first temperature sensors 112.3 provide corresponding first temperature data to the relevant input end 111.2 of control device 111.1.

But, should be appreciated that except first temperature sensor 112.3 of the perimeter through being evenly distributed on submergence district 110 and directly measure, can be at the diverse location place to temperature or at least another parameter measure or confirm.Can go out the temperature of immersing medium at estimation unit from this temperature or parameter estimation through corresponding enough accurate estimation (being determined parameter and immersing medium 110.1 enough accurate known relationship between the temperature of the perimeter in submergence district 110 based on this) in the perimeter in submergence district 110.

From these first temperature datas, control device 111.1 is confirmed the actual temperature distribution TI in the submergence district 110 through the first temperature characterisitic model of the immersing medium 110.1 of storage.Here; As other parameters, the first temperature characterisitic model is also considered: the actual light power of the effective supply temperature T IF of (offering control device 111.1 through first temperature control equipment 112.2) immersing medium, (offering control device 111.1 through feedway 112.1) flow velocity of immersing medium 110.1, the actual temperature distribution TE of last lens element 109 (confirming with the following mode that will describe in detail) and (offering control device through lighting device 102).

From actual temperature distribution TI, according to the given theoretical temperatures distribution TSI in immersing medium 110.1, control device 111.1 confirms to be used for the first controlling value C of temperature control equipment 112.2 and/or feedway 112.1.Through this first controlling value C, temperature control equipment is regulated supplying temperature TIF and/or 112.1 pairs of flow velocitys of feedway are regulated, and makes actual temperature distribution TI near the theoretical temperatures distribution TSI in immersing medium 110.

Supplying temperature TIF confirms and can carry out according to the variation delta TIE that actual temperature distributes in the TI, this variable quantity be from before catch or definite temperature and parameter in expect and obtain.In other words, the serviceability temperature characteristic model, such variation delta TIE can be predicted and was cancelled before its (fully) occur.

On meaning of the present invention; Actual temperature distribution TI in immersing medium 110.1 representes to influence the parameter P of the temperature of last lens element 110.1; Because because the thermograde between immersing medium 110.1 and last lens element 109 causes the heat transmission of the temperature variation of last lens element between immersing medium 110.1 and last lens element 109.In addition; Supplying temperature TIF and/or tachograph are shown in the controlled variable on the meaning of the present invention, because they can be used to influence respectively in thermograde between immersing medium 110.1 and last lens element 109 and the heat transmission between immersing medium 110.1 and last lens element 109.Therefore, temperature control equipment 112.2 and/or feedway 112.1 are illustrated respectively in the device that influences on the meaning of the present invention.

In this, should be appreciated that the given theoretical temperatures distribution TSI in immersing medium 110.1 can select by any-mode.It can be specified to by static mode; Under the situation of lens element 109 internal memories under the situation of immersing medium 110.1 internal memories at theoretical Temperature Distribution TSI and in the end at theoretical Temperature Distribution TSE; In the end there is not thermograde between lens element 109 and the immersing medium 110, thereby do not have heat transmission.

In other words, if last lens element 109 is in its theory state in this case, the immersing medium 110 of control can not disturb considerable heat and introduce last lens element 109 by this way.But; If last lens element 109 is in the state that departs from its theory state in this case; In the end produce thermograde between lens element 109 and the immersing medium 110.1; Offset the actual temperature distribution TE of last lens element 109 and the actual deviation between the theoretical temperatures distribution TSE, thereby realized attenuating through the immersing medium 110.1 of control by this way.

Theoretical temperatures distribution TSI in immersing medium 110.1 also can select according to the actual temperature distribution TE of last lens element 109; Make under the situation of immersing medium 110.1 internal memories at theoretical Temperature Distribution TSI; In the end offer the fixed temperature gradient between lens element 109 and the immersing medium 110.1, thereby provide given heat to transmit.Preferably; Be chosen in the thermograde between last lens element 109 and the immersing medium 110.1; Make its offset the deviation of theoretical temperatures distribution TSE of actual temperature distribution TE and last lens element 109 of last lens element 109; Thereby also realized the heat fade effect through the immersing medium 110.1 of control by this way here.

In this case; The lens element 109 in the end and the preferred selection like this of the thermograde between the immersing medium 110.1 that are provided with through immersing medium 110.1; Make that the deviation of actual temperature distribution TE and theoretical temperatures distribution TSE of last lens element 109 is big more, this thermograde is also big more.In other words, can realize the actual temperature distribution TE of last lens element 109 and the dynamic heat fade of the deviation between the theoretical temperatures distribution TSE by this way.

If in this case, last lens element 109 is in its theory state, and the immersing medium 110.1 of control can not disturb considerable heat and introduce last lens element 109 by this way.If not like this, the deviation between the actual temperature distribution TE of last lens element 109 and the theoretical temperatures distribution TSE is big more, and is just big more through the cancellation level of the immersing medium 110.1 of control by this way.

Heat fade device 111 also comprises and is used for controlling the temperature T A of the gas atmosphere 113.1 that contacts with the Free Surface 110.3 of immersing medium 110.1 and/or the control circuit 113 of humidity HA and/or flow velocity VA specially, as the second heat fade control circuit.

For this reason, the second heat fade control circuit 113 comprises second feedway 113.2 and control device 111.1 that is used for gas atmosphere 113.1.Second feedway 113.2 is through at least one supply line, with at the relevant temperature at Free Surface 110.3 places of immersing medium 110.1 and the gas that flow velocity provides q.s.Second feedway 113.2 with the temperature of gas atmosphere 113.1 and/or humidity and/or flow rate regulation to the expectation value of confirming with the mode that describes below by control device 111.1.

Control device 111.1 is confirmed the actual temperature distribution TI in the immersing medium 110.1 in submergence district 110 in the above described manner.Actual temperature distribution TI in the immersing medium 110.1, control device 111.1 confirms to be used for the second controlling value C of second feedway 113.2 according to the given theoretical temperatures distribution TSI in the immersing medium.Through this second controlling value C, the temperature of 113.2 pairs of gas atmospheres 113.1 of second feedway and/or humidity and/or flow velocity are regulated.

In each case, adjusting can be provided, make the evaporation capacity of immersing medium reach minimum at Free Surface 110.3 places of immersing medium 110.1.Preferably; This is to carry out through following mode: the temperature of adjustments of gas atmosphere 113.1; Make it be equivalent to immersing medium 110.1, preferably be adjusted to saturated fully in the temperature at Free Surface 110.3 places with humidity regulation to the sufficiently high value of gas atmosphere 113.1; Avoiding the evaporation of immersing medium 110.1, thereby avoid heat transmission from immersing medium 110.1.

In other words, in this flexible program, avoided introducing immersing medium, thereby also avoided hot interference to get into last lens element 109 because immersing medium 110.1 disturbs in the evaporation at Free Surface place 110.3 and with heat.

Control through the second heat fade control circuit 113 is subordinated to the control through the first heat fade control circuit 112.But; Be to be understood that; In other embodiments of the present invention; Can be provided with the heat transmission of initiatively using through causing where necessary, offsetting in the end the actual temperature distribution TE of a lens element 109 and the deviation between the theoretical temperatures distribution TSE, thereby realize the heat fade effect from immersing medium 110.1 by evaporation.

For example; In the end under the theory state of a lens element 109; Can have certain rate of evaporation, according to the actual temperature distribution TE of last lens element 109 and the direction of the deviation to be decayed between the theoretical temperatures distribution TSE, this rate of evaporation can increase or reduce; So that the actual temperature distribution TI of immersing medium 110.1 is near the theoretical temperatures distribution TSI of the respective change of immersing medium; Just, raise respectively or the reduction temperature, thereby offset the actual temperature distribution TE of last lens element 109 and the deviation between the theoretical temperatures distribution TSE through the thermograde between immersing medium 110.1 and last lens element 109.

Here; The temperature of gas atmosphere 113.1 and/or humidity and/or flow velocity are also illustrated in the controlled variable CP on the meaning of the present invention; Because through these parameters, can influence thermograde and the heat transmission between immersing medium 110.1 and last lens element 109 between immersing medium 110.1 and last lens element 109 respectively.Therefore, second feedway is also illustrated in the device that influences on the meaning of the present invention.

In this, should be appreciated that here that the given theoretical temperatures distribution TSI in the immersing medium also can select arbitrarily according to the top mode of having described.In addition, should be appreciated that Free Surface 110.3 can be all or part of of Free Surface of immersing medium 110.1.

Heat fade device 111 also comprises the temperature controlling circuit 114 that is used for directly influencing specially last lens element 109, as the 3rd heat fade control circuit.

For this reason, the 3rd heat fade control circuit 114 comprises that a plurality of forms are second temperature control equipment, second temperature sensor 114.2 and the control device 111.1 that is evenly distributed in the Peltier's element 114.1 of last lens element 109 periphery.Will describe in detail as following; The Peltier's element 114.1 that is connected with control device 111.1 (as following will the detailed description in detail) cools off or heats last lens element 109; Make the actual temperature distribution TE of last lens element 109 and the deviation between the theoretical temperatures distribution TSE be cancelled, thereby realized the heat fade effect equally.

Through being evenly distributed on last lens element 109 and being illustrated in second temperature sensor 114.2 and 114.3 of the definite device on the meaning of the present invention, confirm last lens element 109 temperature of the corresponding position of a lens element 109 in the end.Second temperature sensor 114.2 provides corresponding first temperature data with the 114.3 relevant input ends 111.2 to control device 111.1.

Should be appreciated that here, the measurement of temperature or at least one other parameter or confirm also can to provide at the diverse location place, rather than provide through the direct measurement that is evenly distributed on second temperature sensor 114.2,114.3 on last lens element 109.At estimation unit, can go out the temperature of last lens element 109 from this temperature or parameter estimation through correspondingly estimating (being determined the enough accurate known relationship between the temperature of parameter and last lens element 109) enough accurately based on this.

From these first temperature datas, control device 111.1 is confirmed the actual temperature distribution TE in last lens element 109 through the first temperature characterisitic model of last lens element 109 of storage.Here, as other parameters, actual temperature distribution TI that the first temperature characterisitic model is also considered immersing medium 110.1 and (offering control device 111.1) actual light power through lighting device 102.

Actual temperature distribution TE in last lens element 109, control device 111.1 confirm to be used for the 3rd controlling value C of Peltier's element 114.1 according to the given theoretical temperatures distribution TSE in lens element 109 in the end.Regulate the temperature on the surface of the surface with last lens element 109 of Peltier's element 114.1 facing mutually through the 3rd controlling value C.Therefore, Peltier's element 114.1 heating or the surface of cooling off last lens element 109 make the actual temperature distribution TE of last lens element 109 near the theoretical temperatures distribution TSE in last lens element 109.

On meaning of the present invention; The temperature on the surface that the surface with last lens element 109 of Peltier's element 114.1 is faced mutually thereby expression controlled variable PC are because can influence the heat transmission between Peltier's element 114.1 and last lens element 109 through this temperature.Therefore, Peltier's element 114.1 is illustrated in the device that influences on the meaning of the present invention.

As shown in Figure 3; In other flexible programs of micro-lithography device 101; Adding or substituting as Peltier's element 114.1; In the zone that on the optics of lens element 109, does not have to use, the 3rd heat fade control circuit 114 can comprise (another) second temperature control equipment of the resistive heating device 114.4 that form is.To specify as following; These resistive heating device 114.4 last lens elements 109 of heating that are connected with control device 111.1; Make the actual temperature distribution TE of last lens element 109 and the deviation between the theoretical temperatures distribution TSE be cancelled, thereby realized the heat fade effect equally.

Fig. 3 has illustrated the resistive heating device 114.4 according to the another kind of embodiment of micro-lithography device 101 of the present invention with the synoptic diagram corresponding to the detail D of Fig. 2.As can be as can be seen from Figure 3, this resistive heating device 114.4 comprises a plurality of conducting elements 114.5, they are fit to interconnect and are fit to be connected with control device 111.1.Conducting element 114.5 is embedded in the surface of last lens element 109.

For example, can make conducting element 114.5 through the shape of metal powder (forming conducting element 114.5 later on) with expectation is placed on the surface of last lens element 109.Then, for example use iraser, this metal powder is heated to such degree, make fusion of metal powder and be connected to form conducting element.In addition, because its higher density, the motlten metal powder sinks in the matrix of last lens element 109 local melting.

Conducting element 114.5 can fully be embedded in the matrix of last lens element 109, and is as shown in Figure 3.But, should be appreciated that in other embodiments of the present invention conducting element 114.5 can be just surrounded by the body portion ground of last lens element 109.In this case, protective seam (as among Fig. 3 shown in the with dashed lines profile 114.6) can be set.This protective seam 114.6 can be protected the influence of the immersing medium 110.1 of conducting element 114.5 protect it from corrosion property.This protective seam 114.6 can for example be to have passed through sputtering technology, quartz (SiO) layer that CVD (chemical vapor deposition) technology or similar technology apply.In addition, should be appreciated that protective seam 114.6 can comprise arrangements of electric connection between the conducting element 114.5 and the arrangements of electric connection that is connected with control device 111.1 where necessary.

As explained that through second temperature sensor 114.2 and 114.3 (see figure 2)s, in the end the corresponding position of a lens element 109 records the temperature of last lens element 109.Second temperature sensor 114.2 provides corresponding first temperature data with the 114.3 relevant input ends 111.2 to control device 111.1.

Should be appreciated that here, temperature or at least another parameter measurement or confirm also can to provide at the diverse location place, rather than provide through the direct measurement that is evenly distributed on the temperature sensor 114.2,114.3 on last lens element 109.At estimation unit, estimate that (based on the enough accurate known relationship between the temperature of this parameter/temperature that is determined and last lens element 109) can be from the temperature that this records or definite temperature or parameter estimation go out last lens element 109 enough accurately through corresponding.

Actual temperature distribution TE in last lens element 109, according to the given theoretical temperatures distribution TSE in lens element 109 in the end, control device 111.1 confirms to be used for the 3rd controlling value C of resistive heating device 114.4.By the 3rd controlling value C, the temperature of regulating resistive heating device 114.4 through the corresponding electric currents in the conducting element 114.5.Therefore, resistive heating device 114.4 last lens element 109 of heating make actual temperature distribution TE near the theoretical temperatures distribution TSE in last lens element 109.

Should be appreciated that resistive heating device 114.4 can meticulous arbitrarily mode cut apart, what for example be divided into any amount can be by the section of control device 111.1 selective control.In this way, can realize any desired Temperature Distribution in the resistive heating device 114.4.

Thereby the thermometer of conducting element 114.5 is shown in the controlled variable CP on the meaning of the present invention, because can influence the heat transmission between conducting element 114.5 and last lens element 109 through this temperature.Therefore, conducting element 114.5 is illustrated respectively in the device that influences on the meaning of the present invention.

Fig. 4 has illustrated the resistive heating device 214.4 according to the another kind of embodiment of micro-lithography device 101 of the present invention with the synoptic diagram corresponding to the detail D of Fig. 2.Can use this resistive heating device 214.4 to replace the resistive heating device 114.4 of Fig. 3.As visible from Fig. 4, resistive heating device 214.4 comprises a plurality of conducting elements 214.5, and they are fit to interconnect and are fit to be connected with control device 111.1.Conducting element 214.5 is arranged on the surface of last lens element 109 and is embedded in the protective seam 214.6.

Conducting element 214.5 can adopt thin layer technology and/or thick-layer technology, is applied on the surface of last lens element 109 with the shape of expecting.Subsequently, they can be coated with protective seam 214.6.

Especially this protective seam 214.5 of protecting the influence of conducting element 214.5 protect it from corrosion property immersing mediums 110.1 can be a protective seam arbitrarily.For example, this protective seam 214.6 can be quartz (SiO) layer that applies through sputtering technology, CVD (chemical vapor deposition) technology or similar technology.

This protective seam 214.6 also can comprise polymeric material.Polyimide; (PI) material; (material that for example name with

is sold by

) is specially suitable.Should be appreciated that for example protective seam 214.6 can be formed by the polyimide support film, conducting element 214.5 is applied on this carrier film with the shape of expectation.Then, this carrier film can be applied on last lens element 109, for example bonds on last lens element 109.

As visible from Fig. 4, protective seam 214.6 comprises a plurality of other temperature sensors 214.2 that are connected with control device 111.1.These temperature sensors 214.2 (adding or substituting as temperature sensor 114.2,114.3) are caught the temperature of last lens element 109 in the corresponding position.Temperature sensor 214.2 provides corresponding first temperature data to the relevant input end 111.2 of control device 111.1.

The function of resistive heating device 214.4 with as the function of the top resistive heating device of having described 114.4 identical.Therefore, here can be fully referring to top explanation.Especially, resistive heating device 214.4 also can meticulous arbitrarily mode be cut apart.

Fig. 5 has illustrated the radiant heating device 214.4 according to the another kind of embodiment of micro-lithography device 101 of the present invention with the synoptic diagram corresponding to the detail D of Fig. 2.Can use this radiant heating device 314.4 to come the resistive heating device 114.4 of alternate figures 3.As visible from Fig. 5, radiant heating device 314.4 comprises a plurality of heating elements 314.5 that are connected with control device 111.1.

Heating element 314.5 is arranged on the submergence frame 110.2.Heating element 314.5 is launched target infrared radiation IR to last lens element 109 under the control of control device 111.1, to heat last lens element 109.Heating element 314.5 can form through so-called hollow cored fibre, and these fibers guide to last lens element 109 with the infrared radiation of the coupling infrared origin of control device 111.1.

The function of radiant heating device 314.4 is equivalent to the function like the top resistive heating device of having described 114.4 to a great extent.Therefore, here can be mainly referring to top explanation.

Here, the actual temperature distribution TE in last lens element 109, control device 111.1 confirms to be used for the 3rd controlling value C of radiant heating device 314.4 according to the given theoretical temperatures distribution TSE in last lens element 109.Regulate the radiation intensity of heating element 314.5 through the 3rd controlling value C.Therefore, heating element 314.5 last lens element 109 of heating make actual temperature distribution TE near the theoretical temperatures distribution TSE in last lens element 109.

Thereby the radiation intensity of heating element 314.5 is illustrated in the controlled variable CP on the meaning of the present invention, because can influence the heat transmission between heating element 314.5 and last lens element 109 through this radiation intensity.Therefore, heating element 314.5 is illustrated respectively in the device that influences on the meaning of the present invention.

Should be appreciated that radiant heating device 314.4 can allow last lens element 109 is passed through the radiation of any fine segmentation.What in other words, radiant heating device 314.4 can comprise any amount can be by the section of control device 111.1 selective control.In this way, can radiation intensity distribution arbitrarily be provided through radiant heating device 314.4.

Heat fade control device 111 comprises that also form is first shield assembly of the thermal insulation coating 115 of last lens element 109, and this coating 115 constitutes hot decoupling, and the form of this hot decoupling is the first passive heat fade parts of damping controller 111.

The coating 115 in the end whole surface portion 109.1 of a projection element 109 is extended, and this surface portion is with immersing medium 110.1 adjacency and when projection pattern being projected on the wafer 105, optically be not used.Through this thermal insulation coating 115; Last lens element 109 and the submergence district 110 part underground heat decouplings that have immersing medium 110.1; Outside the surface portion 109.2 of feasible lens element 109 an optics use at least in the end, prevent that the heat of immersing medium 110.1 from disturbing directly lens element 109 interior propagation in the end.

Coating 115 can be processed by any suitable material of enough heat insulation characteristics or combination of materials of providing.In embodiment shown in Figure 2; Coating 115 comprises organic material layer; Here be polyurethane (PU) resin, this organic material layer is applied on the surface portion 109.1 of last lens element 109 through suitable technology (for example casting technique, lacquering technique etc.).After applying, can use any known process of surface treatment that the surface of organic layer is handled, so that desired surface roughness to be provided.

Organic layer can not be provided with suitable reflectance coating with the part or all of surface that last lens element 109 contacts.The reflection of this reflectance coating is by the projected light of the surface scattering of wafer 105.1 and/or immersing medium 110.1 and/or submergence frame 110.2 etc., thereby (chronically) prevents the damage of the organic layer of coating 115, this damage otherwise possibly caused by such scatter projection light.

Shield assembly 115 can design in principle in any suitable manner provides last lens element 109 hot decoupling from its environment, particularly immersing medium.Especially, it can be simple single or multiple lift thermal insulating device.Will specify as following, shield assembly 15 also can be two or more layers combination, comprising at least one height heat-conducting layer and at least one thermal insulation layer.In this case, the height heat-conducting layer can be used for the periphery (transferring to the heat abstractor that is located at this position where necessary) with heat transfer to last lens element, thereby prevents or reduce this heat to be introduced in last lens element.

Preferably, shield assembly 115 can have hydrophobic surface on a side of last lens element 109 dorsad.This hydrophobic surface can form by being merely the independent layer that this reason provides where necessary.In this way, at least in most of the cases can avoid on the independent drop of immersing medium 110 or (cated in case of necessity) surface that droplet accumulates in last lens element 109.

Such immersing medium 110.1 drops or droplet can be for example in the end lens 109 just temporarily got wet and form on the surf zone of (for example at the duration of work of micro-lithography device 101, the immersing medium liquid level that causes owing to movement of wafers changes) by immersing medium 110.1.Hydrophobic surface stops such immersing medium 110.1 drops or droplet in the end to form on the surface of a lens element 109 (coating is arranged where necessary) in an advantageous manner.

Fig. 6 is the hot decoupling of thermal shield apparatus 415 with the form that the synoptic diagram corresponding to the detail D of Fig. 2 has illustrated according to the another kind of embodiment of micro-lithography device 101 of the present invention.Can use this shield assembly 415 to replace the shield assembly 115 of Fig. 2.

As visible from Fig. 6, shield assembly 415 has the multilayer design as mentioning in the above.This shield assembly 415 comprise with the heat-insulating ground floor 415.1 of last lens element 109 adjacent adjacency and with the combination of the second layer 415.2 of the height heat conduction of ground floor 415.1 adjacent adjacency.In addition, hydrophobic the 3rd layer 415.3 is applied on the outside surface of the second layer 415.2.

Heat-insulating ground floor 415.1 comprises interval body 415.1.This interval body 415.4 has enough rigidity, under any normal running conditions of micro-lithography device 101, to keep its shape.Thereby in normal working conditions, this interval body 415.4 provides the predetermined distance between last lens element 109 and the second layer 415.2.But, should be appreciated that in other embodiments of the present invention, can be provided with spacer element separately and replace single interval body.

This interval body 415.4 can permeate fluid (being gas and/or liquid).For example, can use open celled foam to form interval body 415.4.Thereby, in the end define the space between the surface of a lens element 109 and the second layer 415.2, form ground floor 415.1.The space that forms ground floor 415.1 is filled with the fluid (for example gas or liquid) of low heat conductivity.Where necessary, space 415.1 can (continuously or with gap) with the fluid flushing of regulating through proper temperature, to guarantee the expectation thermal insulation effect of ground floor 415.1.

In order to prevent immersing medium 110.1 entering spaces 415.1, in the end between the lens element 109 and the second layer 415.2 peripheral seal element 415.5 is set.Sealing element 415.5 can be the ring that is formed by bonding agent, and fixing with respect to first lens element 109 is provided on this external second layer 415.2 of this ring.

The second layer 415.2 has guaranteed along the good transfer of heat of the radial direction R of last lens element 109 owing to its high thermal conductivity.Therefore, the heat that is caused by immersing medium 110.1 disturbs the heat transmission through the corresponding high level in the second layer 415.2 to be reduced fast or even full remuneration.Therefore, even disturbing, such heat has also only to propagate to last lens element 109 with the degree that reduces.In other words, realized effective hot decoupling.The propagation that such heat is disturbed further reduces through thermal insulation layer 415.1.In other words, through forming the shield assembly 415 of the hot decoupling on the meaning of the present invention, last lens element 109 is effectively from its environment, particularly from immersing medium 110.1 hot decouplings.

In order to be implemented in the Rapid Thermal transmission in the second layer 415.2, stabilising arrangement 415.6 can be set on the periphery of the second layer 415.2.This stabilising arrangement has high thermal capacitance, thereby has stable temperature at the duration of work of micro-lithography device 101.For example, this stabilising arrangement 415.6 can be formed by the heating agent loop.

Hydrophobic the 3rd layer 415.3 reduced again owing to as the evaporation of the drop that gathers of the top immersing medium of having described 110.1 or droplet form the possibility of local heat abstractor.Hydrophobic the 3rd layer 415.3 for example can be by forming like polyimide (PI) material of having mentioned.

Fig. 7 has illustrated the thermal shield apparatus 515 according to the another kind of embodiment of micro-lithography device 101 of the present invention with the synoptic diagram corresponding to the detail D of Fig. 2.Can use this thermal shield apparatus 515 to replace the shield assembly 115 of Fig. 2 perhaps to replace the shield assembly 415 of Fig. 6.

As visible from Fig. 7, shield assembly 515 has multilayer design as mentioned above.This shield assembly 515 comprise with the heat-insulating ground floor 515.1 of last lens element 109 adjacent adjacency and with the combination of the second layer 515.2 of ground floor 515.1 adjacent adjacency.

Heat-insulating ground floor 515.1 comprises a plurality of spacer elements 515.4, and they are evenly distributed on the periphery of last lens element 109.These spacer elements 515.4 have enough rigidity, under any normal running conditions of micro-lithography device 101, to keep their shape.Therefore, spacer element 515.4 provides the fixed range between last lens element 109 and the second layer 515.2 in normal working conditions.

Spacer element 515.4 defines the space that forms ground floor 515.1.The space that forms ground floor 515.1 is filled with low heat-conducting fluid (for example gas or liquid).Where necessary, space 515.1 can (continuously or with gap) with the fluid flushing of regulating through proper temperature, to guarantee the expectation thermal insulation effect of ground floor 515.1.

In order to prevent immersing medium 110.1 entering spaces 515.1, in the end between the lens element 109 and the second layer 515.2 peripheral seal element 515.5 is set.Sealing element 515.5 can be the ring that is formed by bonding agent, and this ring provides fixing with respect to first lens element 109 in addition on the second layer 515.2.

The second layer 515.2 provides again along the good transfer of heat of the radial direction R of last lens element 109.Therefore, the heat that is caused by immersing medium 110.1 disturbs the heat transmission through the corresponding high level in the second layer 515.2 to be reduced fast or even full remuneration.Therefore, even disturbing, such heat has also only to propagate to last lens element 109 with the degree that reduces.In other words, realized effective heat fade effect.The further minimizing of the propagation that such heat is disturbed is to be provided by heat-insulating ground floor 515.1.In other words, through forming the shield assembly 515 of the hot decoupling on the meaning of the present invention, last lens element 109 effectively from its environment, hot decoupling from immersing medium 110.1 particularly.

Rapid Thermal transmission in the second layer 515.2 is to realize through the channel system 515.7 that R extension radially is set in the second layer 515.2.Form is that the stabilising arrangement of pumping and temperature control equipment 515.6 provides the heating agent circulation, and this circulation comprises heating agent stream 515.8 of (preferably continuous) in channel system 515.7.The heating agent of this stream 515.8 is to be adjusted to temperature and/or the flow velocity with regulation through stabilising arrangement 515.6.

In the first passage 515.9 of the second layer 515.2, stream 515.8 is advanced to the zone of locating in interior week 515.10 of changing its course of the second layer 515.2 along radial direction R at first.At these regional 515.10 places of changing its course, the direction of stream 515.8 is changed, and refluxes with the periphery to the second layer 515.2 in the second channel 515.11 of the second layer 515.2.Leave second channel 515.11, stream 515.8 is got back to stabilising arrangement 515.6, and this stream is regulated temperature and/or flow velocity herein again, and is re-circulated in the heating agent circulation.

Under the simplest situation as shown in Figure 7, channel system 515.9 to 515.11 is formed with slim rib 515.12 by slim ducted body 515.2.This slim rib 515.12 is positioned at ducted body 515.2 and extends along the radial direction R and the circumferential direction of last lens element 109.Rib 515.12 separates first passage 515.9 and second channel 515.11.Second channel 515.11 (heating agent radially outwards is transferred to stabilising arrangement 515.6 again via this passage) preferably is arranged on the side of last lens element 109 dorsad, removes fast from the zone of last lens element 109 to realize heat disturbed.But, should be appreciated that any other the suitable structure that can use the heat that can provide such to disturb the such channel system that removes fast.

Hydrophobic the 3rd layer can be arranged on again on the outside surface of the second layer 515.2, forms the possibility of local heat abstractor to reduce because like the evaporation of the drop of the top immersing medium of having described that gathers 110.1 or droplet.

As shown in Figure 7, stabilising arrangement 515.6 can be connected with control device 111.1 and by its control.Therefore, can there be the seedbed to be controlled at the heat fade effect on the shield assembly 515.As a result, shield assembly 515 has formed the active hot decoupling on meaning of the present invention.

Preferably; Stabilising arrangement 515.6 Be Controlled; Make and keep given Temperature Distribution, preferably constant temperature basically towards the surface (in the entire work process of micro-lithography device 101) of last lens element 109 at the second layer 515.2 (forming the heat shield element on the meaning of the present invention).For this reason, other temperature sensors 514.2 that are connected with control device 111.1 can be set on this surface.Then, this control device 111.1 can use the temperature data that is provided by temperature sensor 514.2, and the control stabilization device 515.6 in the above described manner.

Fig. 8 has illustrated the thermal shield apparatus 615 according to the another kind of embodiment of micro-lithography device 101 of the present invention with the synoptic diagram corresponding to the detail D of Fig. 2.Can use this shield assembly 615 to replace the shield assembly 515 of the shield assembly 115 of Fig. 2, the shield assembly 415 that replaces Fig. 6 or replacement Fig. 7.

As visible from Fig. 8, shield assembly 615 is formed by (preferably continuous) stream 615.13 of heating agent 615.14, and this stream is arranged in the gap portion 110.4 of not filling immersing medium 110.1 between last lens element 109 and the submergence frame 110.2.Stream 615.13 is to be that the stabilising arrangement of pumping and temperature control equipment 615.6 provides by form, and this stabilising arrangement provides the heating agent with set point of temperature and flow velocity.

Stream 615.13 at first radially R flow to contact area 615.14.In contact area 615.15, heating agent 615.14 contacts with immersing medium 110.1 and mixes where necessary.In the zone of contact area 615.5, in submergence frame 110.2, be provided with passage 615.16.This passage 615.16 leads to contact area 615.5.Through this passage 615.16, the part of heating agent 615.14 and immersing medium in case of necessity 110.1 (mixing with heating agent 615.14 in case of necessity) is extracted out and is recycled back into the stabilising arrangement 615.6 by the gap between last lens element 109 and submergence frame 110.2.

In stabilising arrangement 615.6, when needed, will separate from heating agent 615.14 with immersing medium 110.1 parts that heating agent 615.14 is extracted out.Stabilising arrangement 615.6 is regulated the temperature and the flow velocity of heating agent 615.4 again and is circulated to again in the heating agent circulation.

Stabilising arrangement 615.6 also provides immersing medium 110.1 with the flow velocity of expectation to submergence district 110.Be to be understood that; Provide to the flow velocity of the immersing medium 110.1 in submergence district 110 and provide to the flow velocity of the heating agent of the gap portion 110.4 between last lens element 109 and the submergence frame 110.2; And the flow velocitys in the passage 615.16 are couplings each other, to realize structure as described above (being that immersing medium 110.1 contacts in contact area 615.15 with heating agent 615.14).In addition, these flow velocitys mate each other, to avoid in the end the unwelcome pressure surge in the lens element 109.

Stream 615.13 provides the good thermal conductivity of leaving last lens element 109 along the radial direction R of last lens element 109.Therefore, the heat that is caused by immersing medium 110.1 or submergence frame 110.2 disturbs the heat conduction through flowing the 615.13 corresponding high level that provide to be reduced fast or even full remuneration.Therefore, have also and can only propagate to last lens element 109 even such heat is disturbed with the degree that reduces.In other words, realized effective heat fade effect.The further minimizing of the propagation that such heat is disturbed can be provided by the heat-insulating ground floor that is located on last lens element, and this ground floor is 615.1 expressions of with dashed lines profile in Fig. 8.In other words, through forming the shield assembly 615 of the hot decoupling on the meaning of the present invention, last lens element 109 effectively from its environment, hot decoupling from immersing medium 110.1 particularly.

As shown in Figure 8, stabilising arrangement 615.6 can be connected with control device 111.1 and by its control.Therefore, can there be the seedbed to be controlled at the heat fade effect on the shield assembly 615.

Heat fade device 111 also comprises the secondary shielding device 116 of annular; This secondary shielding device is arranged between the support 118 of support 117 and penult lens element 108 of last lens element 109; And form the second passive heat fade parts, thereby form the hot decoupling on the meaning of the present invention.

Secondary shielding device 116 extends a lens element 109 optically untapped surface portion 109.3 the process that projection pattern is projected on the wafer to the last from the join domain of two supports 117 and 118 (being connected on the housing of object lens 104).Secondary shielding device 116 also is used as the carrier of Peltier's element 114.1.

Secondary shielding device 116 as shown in Figure 2 is made up of high thermal conducting material.In the join domain of two supports 117 and 118; Secondary shielding device 116 is connected with the intermediary element 119 of temperature stabilization; This intermediary element through circular passage 119.1 by for example for the heating agent of water passes through, this heating agent remains under the stationary temperature through heating agent source 119.2.

The steady temperature of the intermediary element 119 through temperature stabilization and the high-termal conductivity of secondary shielding device 116 have produced the temperature of approximately constant on the side of support 117 at secondary shielding device 116.Therefore, realize the thermoshield effect between other parts of a part and object lens 104 of support 117 and last lens element 109, made here, realized the attenuating that the heat that last lens element 109 is introduced through this side is disturbed equally.

Should be appreciated that in principle secondary shielding device 116 can design with any mode again.Especially, in other flexible programs of the present invention, it also can be designed to the similarly simple single or multiple lift thermal insulating device of flexible program with above-described first shield assembly.But it also can be two or more layers combination, comprising at least one height heat-conducting layer and at least one thermal insulation layer.Especially, in embodiment shown in Figure 8, on a side of support 117, can form the corresponding insulation layer at secondary shielding device 116.

Fig. 9 shows the block diagram according to a kind of preferred implementation of optical imaging method of the present invention, and this method can utilize micro-lithography device 101 to implement.

At first, in step 120.1, begin the enforcement of this method.In step 120.2, the parts of micro-lithography device 101 are located against each other, to realize above-described structure.

In step 120.3,, at least a portion of projection pattern is projected on the wafer 105.1 with the top mode of having described.In step 120.3, with projection concurrently, describe as top, through heat fade device 111 heat fade to the fluctuation that is caused by the environment (particularly immersing medium) of last lens element in the Temperature Distribution of last lens element 109 is provided.

For this reason, as described above in step 120.4, through temperature sensor 112.2,112.3,114.2,114.3 confirm corresponding temperature.In addition, as described above, confirm other parameters, for example the flow velocity of the effective supply temperature T IF of immersing medium 110.1, immersing medium 110.1 and the actual light power of lighting device 102.

In step 120.5, control device 111 is confirmed the actual temperature distribution TE of the actual temperature distribution TI in the immersing medium 110.1 and last lens element 109 in submergence district 110.As described above, this temperature characterisitic model through storage is accomplished with use established data in step 120.3.In addition, control device 111 confirms to be used for the independent controlling value C that influences device (for example temperature control equipment 112.2, feedway 112.1, second feedway 113.2, Peltier's element 114.1 etc.).

Here, the temperature characterisitic model representation is caught or the temperature confirmed and other parameters (for example the luminous power of the flow velocity of immersing medium 110.1, lighting device 102 etc.) and the relation between the Temperature Distribution to be expected in the corresponding object of temperature characterisitic model.

Can confirm the appropriate section of temperature characterisitic model for the corresponding object (being last lens element 109 or immersing medium 110.1) of temperature characterisitic model with the mode of experience and/or through analog computation.Particularly for the situation of regular repetition in micro-lithography device 101, can realize to the actual temperature distribution TI in the immersing medium in submergence district 110 110.1 and in the end the enough accurate of actual temperature distribution TE in lens element 109 estimate.

In step 120.6; Use the controlling value C that confirms; Through in the above described manner, influence device (for example temperature control equipment 112.2, feedway 112.1, second feedway 113.2, Peltier's element 114.1 etc.) accordingly through control device 111.1 control, influence controlled variable CP.

In step 120.7, check whether the enforcement of this method need stop.If the situation that need stop, being implemented in the step 120.3 of method stops.Otherwise, skip back to step 120.3.

At preceding text, be provided with the example of a plurality of active heat fade control circuits 112,113,114 and passive heat fade parts 115,116 through mode with combination, invention has been described.But, to should be mentioned that here in other flexible programs of the present invention, single active heat fade control circuit and passive heat fade parts can use separately or use with any array mode.

In addition, at preceding text, the part through last lens element 109 immerses the example in the immersing medium 110.1 during forming images, and invention has been described.But; Be to be understood that; The present invention also can be used in such immersion system, and in these systems, the submergence district (adding or substituting as the submergence district between last lens element and the wafer) that at least temporarily is filled with immersing medium is between two optical elements of optical elements sets.Many immersion systems system like this or two soaking system and test are for example by WO2006/080212A1; WO2004/019128A2, WO 2006/051689A1, WO 2006/126522A1; WO2006/121008A1 and US 7; 180,572B1 is open, and whole disclosures of all these documents are incorporated this paper by reference into.

Figure 10 uses with the corresponding view of the view of Fig. 2 and schematically shows two immersion systems that can be used in the micro-lithography device 101.Here, lens element 109 is not to be arranged to be right after wafer 105.1, but is arranged to and form is another optical element 709 adjacency between lens element 109 and wafer 105.1.Submergence district 110 is between lens element 109 and lens element 709, and another submergence district 710 that is filled with another kind of immersing medium 710 is between one of lenses element 709 and wafer 105.1.

Heat fade device 111 constitutes in a manner mentioned above, and so that the heat fade that the heat that is caused by environment is disturbed to be provided, these hot interference possibly cause the heat interference that the Temperature Distribution of lens element 109 is interior.Should be appreciated that another heat fade device can be set, provide by environment that the particularly heat fade disturbed of the heat that causes of immersing medium, these interference possibly cause that the heat in the Temperature Distribution of one of lenses element 709 disturbs.This another heat fade device can be according to designing with heat fade device 111 similar modes.In addition, heat fade device 111 also can be configured to this one of lenses element 709 such heat fade is provided.

Immersing medium 110.1 can be identical or different with immersing medium 610.1.Can use any suitable immersing medium.The example of such immersing medium is such as D ₂O, D ₂O ^*, H ₂O ^*And so on heavy water or heavy oxygen water, wherein O ^*Can comprise isotope O ¹⁶, O ¹⁷And O ¹⁸These immersing mediums can mix according to arbitrary ratio; So that in

corresponding submergence district

110 and 710, realize the refractive index of expectation respectively, and/or so that between the refractive index of two kinds of immersing mediums realization expected relationship and/or at one of the refractive index of optical element 109,709 and immersing medium 110.1,710.1 or realize expected relationship between the two.Corresponding example and refractive index value for such potpourri provide in US 2006/092533 A1, US 2006/066926 A1 and WO 2005/106589 A1, and whole disclosures of every piece of document are incorporated this paper by reference into.

At preceding text, the example of the optical elements sets through including only refraction optical element, invention has been described.But, here to should be mentioned that, particularly under different wave length, carry out certainly using the optical elements sets that comprises refraction, reflection or diffraction optical element with the mode of independent or combination in any under the situation of imaging process.

In addition, should be mentioned that at preceding text, through the example in the micro-lithography field, invention has been described.But, should be appreciated that the present invention also can correspondingly be used for other any application and imaging processes.

Claims

1. optical imaging device comprises:

Be used to receive the mask set of mask, this mask comprises projection pattern,

The projection arrangement that comprises optical elements sets,

Be used to receive the substrate devices of substrate, and

The submergence district, wherein,

Said optical elements sets can project to projection pattern on the said substrate,

Said optical elements sets comprises a plurality of optical elements with submergence element, and this submergence element temporarily is arranged to the adjacency with said submergence district at least, and

During operation, said submergence district at least temporarily is filled with immersing medium or is set between last optical element and said substrate that forms said submergence element,

Be provided with the heat fade device, said attenuating device can reduce the fluctuation that in the Temperature Distribution of said submergence element (TE), caused by said immersing medium, wherein,

Said heat fade device comprises at least one hot decoupling, and this hot decoupling provides at least portion of hot decoupling of said submergence element from least a portion of its environment,

Said submergence element is included in said projection pattern is projected to first area and the optically untapped second area that optically uses in the process on the said substrate, and comprises at least one in the following characteristic:

Be provided with first shield assembly as hot decoupling; Said first shield assembly makes at least one and the said immersing medium thermoshield at least a portion of first section and said second area whole basically first section of said second area; Wherein, Said first section is said second area and said immersing medium adjacency whole section

With

Be provided with secondary shielding device as hot decoupling; Said secondary shielding device makes at least one and the adjacent segments thermoshield of said projection arrangement at least a portion of second section and said second area whole basically second section of said second area; Wherein, said second section is whole section of said adjacent segments adjacency of said second area and said projection arrangement.

2. optical imaging device according to claim 1 is characterized in that, said submergence element is last optical element in a plurality of optical elements of said optical elements sets.

3. optical imaging device according to claim 1 is characterized in that,

Said submergence element keep by holding device and

Said secondary shielding device also makes at least a portion and its environment thermoshield of said holding device.

4. optical imaging device according to claim 3 is characterized in that, said secondary shielding device makes whole basically holding device and its environment thermoshield.

5. optical imaging device according to claim 3 is characterized in that, said secondary shielding device makes at least a portion and its environment thermoshield in zone of the adjacent segments adjacency of said holding device and said projection arrangement.

6. optical imaging device according to claim 5 is characterized in that, said secondary shielding device makes whole zone and the said adjacent segments thermoshield of said projection arrangement of the adjacent segments adjacency of said holding device and said projection arrangement.

7. optical imaging device according to claim 1 is characterized in that, said hot decoupling has at least one in the following characteristic:

Comprise at least one passive thermal insulating device,

With

Comprise at least one active shielding device; This active shielding device has at least one shielding element and at least one temperature control equipment that is connected with said shielding element; Wherein, Said temperature control equipment is configured such that the selectable Temperature Distribution of basic maintenance at least one surface of said shielding element

With

Comprise at least one active shielding device; Said at least one active shielding device has at least one shielding element and at least one temperature control equipment that is connected to said shielding element, and said temperature control equipment can provide heating agent stream in the zone of said at least one shielding element.

8. optical imaging device according to claim 1 is characterized in that, said hot decoupling comprises at least one hydrophobic surface of said dorsad submergence element and at least one in the hydrophobic coating.

9. optical imaging device according to claim 1 is characterized in that,

For the given theoretical temperatures of said submergence element distribute (TSE) and

Said heat fade device can keep the given maximum deviation (Δ TE) with said theoretical temperatures distribution (TSE).

10. optical imaging device according to claim 9 is characterized in that, said maximum deviation (Δ TE) is less than 10mK or less than 1mK at least.

11. optical imaging device according to claim 1 is characterized in that,

Said submergence element have that actual temperature distributes (TE) and for the given theoretical temperatures of said submergence element distribute (TSE) and

Said heat fade device comprises that at least one confirms device, control device that at least temporarily is connected with said definite device and the device that influences that at least temporarily is connected with said control device, wherein,

Said definite device confirms that at least one influences the parameter (P) that said actual temperature distributes (TE) or representes said actual temperature distribution (TE),

Said control device is confirmed at least one controlling value (C) according to said definite parameter (P) and said theoretical temperatures distribution (TSE), and

The said device that influences influences the controlled variable (CP) that influences said actual temperature distribution (TE) according to said at least one controlling value (C) of confirming, makes the deviation of said actual temperature distribution TE and said theoretical temperatures distribution (TSE) be cancelled.

12. optical imaging device according to claim 11 is characterized in that, comprises in the following characteristic at least one:

Said parameter (P) is at least one local temperature of one in said immersing medium and the said submergence element,

With

Said definite device comprises at least one temperature sensor that is used to measure said at least one local temperature,

With

Said definite device comprises at least one estimation unit that is used to estimate said at least one local temperature.

13. optical imaging device according to claim 11 is characterized in that, said controlled variable (CP) is one of the following:

The temperature of said immersing medium,

The flow velocity of said immersing medium,

The temperature of the gas atmosphere that contacts with said immersing medium,

The humidity of the gas atmosphere that contacts with said immersing medium,

The flow velocity of the gas atmosphere that contacts with said immersing medium,

The temperature of at least one temperature control component that is operably connected with said submergence element.

14. optical imaging device according to claim 11 is characterized in that, said control device has following characteristic:

Said control device can use said submergence element and/or the temperature characterisitic model of said immersing medium in the said submergence district to confirm said controlling value (C).

15. optical imaging device according to claim 11; It is characterized in that; Said control device comprises storer; The model data that in this storer, stores expression temperature characterisitic model perhaps stores the parameter of the model data that is used for the said temperature characterisitic model of represents, and said control device uses said model data to confirm said controlling value (C).

16. optical imaging device according to claim 11; It is characterized in that; Said heat fade device comprises at least one first temperature control equipment that influences device as said, and this first temperature control equipment is used to regulate the temperature that said immersing medium imposes on said submergence district.

17. optical imaging device according to claim 16 is characterized in that,

Said control device confirms to be used for the said first thermostatic said controlling value (C) according to the variable quantity (Δ TIE) of the said Temperature Distribution (TI) in said immersing medium to be expected; Make said first temperature control equipment that the said adjustment that said immersing medium imposes on said submergence district is arrived supplying temperature (TIF); Wherein

Choose said supplying temperature (TIF), make that the given Temperature Distribution (TSI) in said immersing medium will be anticipated owing to the said variable quantity (Δ TIE) of the said Temperature Distribution (TI) in said immersing medium said to be expected.

18. optical imaging device according to claim 16 is characterized in that, said first temperature control equipment is arranged in the entry zone that said immersing medium gets into said submergence district.

19. optical imaging device according to claim 11 is characterized in that,

Said heat fade device comprises a regulating device that influences device as said, this regulating device be used to influence said immersing medium with contact area that the gas atmosphere of adjacency contacts in the cooling that causes by evaporation, wherein,

Said regulating device is regulated at least one state parameter of the said gas atmosphere that contacts with said immersing medium, and

The humidity (HA) of the temperature (TA) that said at least one state parameter is said gas atmosphere, said gas atmosphere or the flow velocity (VA) of said gas atmosphere.

20. optical imaging device according to claim 19; It is characterized in that; Said control device confirms to be used for the said controlling value (C) of said regulating device according to the state of said immersing medium in said contact area, makes in the given cooling that is caused by evaporation of said immersing medium and the cooling that do not caused by evaporation basically one of in said contact area expectability.

21. optical imaging device according to claim 19 is characterized in that, said contact area extends above the whole Free Surface of said immersing medium basically.

22. optical imaging device according to claim 7; It is characterized in that; Said heat fade device comprises that this second temperature control equipment is operably connected to regulate the temperature of said submergence element with said submergence element as at least one second temperature control equipment that influences device.

23. optical imaging device according to claim 11; It is characterized in that; Said heat fade device comprises that this second temperature control equipment is operably connected to regulate the temperature of said submergence element with said submergence element as at least one second temperature control equipment that influences device.

24. optical imaging device according to claim 23; It is characterized in that; Said control device is according to the Temperature Distribution (TI) in the said immersing medium of being confirmed by said definite device in said submergence district; Confirm to be used for the said second thermostatic said controlling value (C); Make said second temperature control equipment regulate the temperature of said submergence element, (TE) is cancelled with the deviation of said theoretical temperatures distribution (TSE) thereby said actual temperature distributes, and this deviation is owing to the said definite Temperature Distribution (TI) in said immersing medium.

25. optical imaging device according to claim 22 is characterized in that, said second temperature control equipment is arranged in the neighboring area of said submergence element.

26. optical imaging device according to claim 22 is characterized in that, said second temperature control equipment comprises at least one in the following characteristic:

Comprise at least one Peltier's element,

With

Comprise at least one resistive heating device that is arranged on said submergence element place, wherein, said resistive heating device is embedded in the said submergence element or covers avoiding the influence of said immersing medium with protective seam,

With

Comprise at least one radiant heating device, be used for providing adding heat radiation to said submergence element.

27. optical imaging device according to claim 9 is characterized in that, said theoretical temperatures distribution (TSE) is selected at least one that has in the following characteristic:

At least a image error of said submergence element is reduced or reaches minimum,

With

At least a image error of said optical elements sets is reduced or reaches minimum.

28., it is characterized in that said submergence element has at least one in the following characteristic according to each described optical imaging device in the aforementioned claim:

Said submergence element is processed with showing than at least one material in the higher temperature control of quartz glass refractive index by having the refractive index bigger than quartz glass refractive index,

Said submergence element is processed by spinel or LuAG.

29. optical imaging device according to claim 1 is characterized in that, said submergence element be said optical elements sets during operation at least temporarily with last optical element of said substrate adjacency.

30. optical imaging device according to claim 1 is characterized in that, numerical aperture be at least 1.3 be at least at least one in 1.4.

31. an optical imaging method that is used for microlithography technology, wherein,

Optical element through optical elements sets projects to projection pattern on the substrate, wherein,

In the scope in submergence district, with the submergence element of said optical elements sets, be immersed at least in part in the immersing medium,

Be provided at reducing of the fluctuation that causes by said immersing medium in the Temperature Distribution (TE) of said submergence element through the heat fade device, wherein,

Through said heat fade device, at least portion of hot decoupling of said submergence element from least a portion of its environment is provided,

With at least one and the shielding of said immersing medium in first section at least a portion of said second area and said second area whole basically first section, wherein, said first section is said second area and said immersing medium adjacency whole section,

With

With at least one and the adjacent segments shielding of said projection arrangement in second section at least a portion of said second area and said second area whole basically second section; Wherein, said second section is whole section of said adjacent segments adjacency of said second area and said projection arrangement.

32. optical imaging method according to claim 31 is characterized in that, said submergence element is last optical element in the said optical elements sets, and with said substrate proximity.

33. optical imaging method according to claim 31 is characterized in that,

Keep said submergence element through holding device, and

Make at least one and the shielding of its environment at least a portion of said holding device and the whole basically holding device,

With

Make at least one and the said adjacent segments shielding of said projection arrangement in the whole basically zone of at least a portion and said holding device and adjacent segments adjacency said projection arrangement in zone of said holding device and adjacent segments adjacency said projection arrangement.

34. optical imaging method according to claim 31 is characterized in that, said hot decoupling has at least one in the following characteristic:

Said hot decoupling is to provide through at least one passive thermal insulating device,

With

Said hot decoupling is to provide through at least one active shielding device; This active shielding device has at least one shielding element and at least one temperature control equipment that is connected with said shielding element; Wherein, Said temperature control equipment is configured such that the selectable Temperature Distribution of basic maintenance at least one surface of said shielding element

With

Said hot decoupling is to provide through at least one active shielding device; Said at least one active shielding device has at least one shielding element and at least one temperature control equipment that is connected to this at least one shielding element, and wherein said temperature control equipment provides heating agent stream in the zone of said at least one shielding element.

35. optical imaging method according to claim 31 is characterized in that,

Through the given maximum deviation (Δ TE) of said heat fade device maintenance with said theoretical temperatures distribution (TSE).

36. optical imaging method according to claim 35 is characterized in that, said maximum deviation (Δ TE) is less than among 10mK and the 1mK at least one.

37. optical imaging method according to claim 31 is characterized in that,

Said last submergence element have that actual temperature distributes (TE) and for the given theoretical temperatures of said submergence element distribute (TSE) and

Through said heat fade device

Confirm to influence at least one parameter (P) that said actual temperature distributes (TE) or representes said actual temperature distribution (TE),

Distribute (TSE) according to said definite parameter (P) and said theoretical temperatures, confirm at least one controlling value (C), and

According to said at least one controlling value (C) of confirming, the controlled variable (CP) that influences said actual temperature distribution (TE) is influenced, make the said actual temperature distribution (TE) and the deviation of said theoretical temperatures distribution (TSE) be cancelled.

38., it is characterized in that said parameter (P) is at least one local temperature of at least one local temperature and said submergence element of said immersing medium according to the described optical imaging method of claim 37.

39., it is characterized in that having at least one in the following characteristic according to the described optical imaging method of claim 38:

Measure said at least one local temperature,

With

Estimate said at least one local temperature.

40., it is characterized in that said controlled variable (CP) is one of the following according to the described optical imaging method of claim 37:

The temperature of said immersing medium,

The flow velocity of said immersing medium,

The temperature of the gas atmosphere that contacts with said immersing medium,

The humidity of the gas atmosphere that contacts with said immersing medium,

41., it is characterized in that according to the described optical imaging method of claim 37, use said submergence element and at least one the temperature characterisitic model in the said immersing medium in said submergence district, confirm said controlling value (C).

42. according to the described optical imaging method of claim 41, it is characterized in that,

The data that use a model are confirmed said controlling value (C), wherein

Said model data is represented said temperature characterisitic model or is used to calculate the parameter of said temperature characterisitic model.

43. according to the described optical imaging method of claim 37, it is characterized in that,

Regulate said immersing medium and impose on the temperature in said submergence district,

The temperature of the said immersing medium of adjusting in the zone in the inlet of said immersing medium to said submergence district,

With

Variable quantity (Δ TIE) according to the Temperature Distribution in said immersing medium (TI) to be expected is confirmed said controlling value (C); The feasible said adjustment that said immersing medium is imposed on said submergence district is to supplying temperature (TIF); Wherein, Choose said supplying temperature (TIF), make that the given Temperature Distribution (TSI) in said immersing medium will be anticipated owing to the said variable quantity (Δ TIE) of the said Temperature Distribution (TI) in said immersing medium to be expected.

44. according to the described optical imaging method of claim 37, it is characterized in that,

Said heat fade device influence said immersing medium with the contact area of the gas atmosphere of adjacency in the cooling that causes by evaporation, wherein,

Regulate the said gas atmosphere contact with said immersing medium at least one state parameter and

In the humidity (HA) of the temperature (TA) that said at least one state parameter is said gas atmosphere, said gas atmosphere and the flow velocity (VA) of said gas atmosphere one.

45. according to the described optical imaging method of claim 44; It is characterized in that; Confirm said controlling value (C) according to the state of said immersing medium in said contact area, make the given cooling that causes by evaporation will be anticipated said immersing medium in said contact area with basically less than one in the cooling that causes by evaporation.

46., it is characterized in that said contact area extends basically according to the described optical imaging method of claim 44 above the whole Free Surface of said immersing medium.

47., it is characterized in that having at least one in the following characteristic according to the described optical imaging method of claim 37:

Through said heat fade device, the temperature of directly regulating said submergence element,

With

In the neighboring area of said submergence element, regulate the temperature of said submergence element,

With

According to the Temperature Distribution (TI) in the said immersing medium in said submergence district; Confirm said controlling value (C); Thereby regulate the temperature of said submergence element; Make the said actual temperature distribution (TE) and the deviation of said theoretical temperatures distribution (TSE) be cancelled, this deviation is owing to the said definite Temperature Distribution (TI) in said immersing medium.

48., it is characterized in that at least one adjusting in can be in the following manner of the temperature of said submergence element according to the described optical imaging method of claim 47:

Regulate through at least one Peltier's element,

With

At least one resistive heating device through being arranged on said submergence element place is regulated, and wherein, said resistive heating device is embedded in the said submergence element or covers avoiding the influence of said immersing medium with protective seam,

With

Regulate through at least one radiant heating device, be used for providing adding heat radiation to said submergence element.

49., it is characterized in that having at least one in the following characteristic according to the described optical imaging method of claim 37:

Select said theoretical temperatures to distribute (TSE), make at least a image error of said submergence element be reduced or reach minimum,

With

Select said theoretical temperatures to distribute (TSE), make at least a image error of said optical elements sets be reduced or reach minimum.

50. optical imaging method according to claim 31 is characterized in that having at least one in the following characteristic:

Said submergence element is to process by having the refractive index materials bigger than quartz glass refractive index,

Said submergence element is to process by having the material that shows the temperature control higher than quartz glass refractive index,

Said submergence element is processed by spinel or LuAG.

51. optical imaging method according to claim 31 is characterized in that, numerical aperture is at least one that is at least in 1.3 and 1.4.

52. an optical imaging device that is used for microlithography technology comprises:

The projection arrangement that comprises optical elements sets,

Be used to receive the substrate devices of substrate, wherein,

Said optical elements sets comprises a plurality of optical elements, comprising at least one heat control optical element,

Wherein,

Be provided with the heat fade device, it is associated with said heat control optical element, and said heat fade device can reduce the fluctuation in the Temperature Distribution (TE) of said heat control optical element,

Said heat fade device uses the temperature characterisitic model of said heat control optical element to reduce the fluctuation in the temperature of said heat control optical element, and wherein said temperature characterisitic model is used for predicting or estimating the Temperature Distribution (TE) of said heat control optical element.

53. an optical imaging method, wherein,

Said optical element comprises the heat control optical element,

Reduce the fluctuation in the Temperature Distribution (TE) of said heat control optical element through the heat fade device, wherein,

Use the temperature characterisitic model of said heat control optical element to reduce the fluctuation in the temperature of said heat control optical element, wherein said temperature characterisitic model is used for predicting or estimating the Temperature Distribution (TE) of said heat control optical element.