CN101473059B - Cu-Mn合金溅射靶及半导体布线 - Google Patents
Cu-Mn合金溅射靶及半导体布线 Download PDFInfo
- Publication number
- CN101473059B CN101473059B CN2007800225817A CN200780022581A CN101473059B CN 101473059 B CN101473059 B CN 101473059B CN 2007800225817 A CN2007800225817 A CN 2007800225817A CN 200780022581 A CN200780022581 A CN 200780022581A CN 101473059 B CN101473059 B CN 101473059B
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- China
- Prior art keywords
- weight
- wiring
- ppm
- copper alloy
- target
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C9/00—Alloys based on copper
- C22C9/05—Alloys based on copper with manganese as the next major constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/28—Manufacture of electrodes on semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/268
- H01L21/283—Deposition of conductive or insulating materials for electrodes conducting electric current
- H01L21/285—Deposition of conductive or insulating materials for electrodes conducting electric current from a gas or vapour, e.g. condensation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
- H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
- H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
- H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
- H01L23/53204—Conductive materials
- H01L23/53209—Conductive materials based on metals, e.g. alloys, metal silicides
- H01L23/53228—Conductive materials based on metals, e.g. alloys, metal silicides the principal metal being copper
- H01L23/53233—Copper alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
Description
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2006271449 | 2006-10-03 | ||
JP271449/2006 | 2006-10-03 | ||
PCT/JP2007/068501 WO2008041535A1 (en) | 2006-10-03 | 2007-09-25 | Cu-Mn ALLOY SPUTTERING TARGET AND SEMICONDUCTOR WIRING |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101473059A CN101473059A (zh) | 2009-07-01 |
CN101473059B true CN101473059B (zh) | 2013-03-20 |
Family
ID=39268397
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2007800225817A Active CN101473059B (zh) | 2006-10-03 | 2007-09-25 | Cu-Mn合金溅射靶及半导体布线 |
Country Status (7)
Country | Link |
---|---|
US (1) | US20100013096A1 (zh) |
EP (1) | EP2014787B1 (zh) |
JP (2) | JP4955008B2 (zh) |
KR (1) | KR101070185B1 (zh) |
CN (1) | CN101473059B (zh) |
TW (1) | TW200821401A (zh) |
WO (1) | WO2008041535A1 (zh) |
Families Citing this family (42)
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EP1602747B1 (en) * | 2003-03-17 | 2011-03-30 | Nippon Mining & Metals Co., Ltd. | Process for producing copper alloy sputtering target |
USD847985S1 (en) | 2007-03-14 | 2019-05-07 | Bayer Healthcare Llc | Syringe plunger cover |
USD942005S1 (en) | 2007-03-14 | 2022-01-25 | Bayer Healthcare Llc | Orange syringe plunger cover |
JP5263665B2 (ja) * | 2007-09-25 | 2013-08-14 | 日立金属株式会社 | 配線膜用Cu合金膜および配線膜形成用スパッタリングターゲット材 |
JP5420328B2 (ja) | 2008-08-01 | 2014-02-19 | 三菱マテリアル株式会社 | フラットパネルディスプレイ用配線膜形成用スパッタリングターゲット |
WO2010038642A1 (ja) * | 2008-09-30 | 2010-04-08 | 日鉱金属株式会社 | 高純度銅又は高純度銅合金スパッタリングターゲット、同スパッタリングターゲットの製造方法及び高純度銅又は高純度銅合金スパッタ膜 |
WO2010038641A1 (ja) | 2008-09-30 | 2010-04-08 | 日鉱金属株式会社 | 高純度銅及び電解による高純度銅の製造方法 |
JP2010248619A (ja) * | 2009-03-26 | 2010-11-04 | Hitachi Metals Ltd | 酸素含有Cu合金膜の製造方法 |
US20110281136A1 (en) * | 2010-05-14 | 2011-11-17 | Jenq-Gong Duh | Copper-manganese bonding structure for electronic packages |
JP5723171B2 (ja) * | 2011-02-04 | 2015-05-27 | 株式会社神戸製鋼所 | Al基合金スパッタリングターゲット |
KR101934977B1 (ko) * | 2011-08-02 | 2019-03-19 | 삼성디스플레이 주식회사 | 박막 트랜지스터 표시판 및 그 제조 방법 |
KR101323151B1 (ko) * | 2011-09-09 | 2013-10-30 | 가부시키가이샤 에스에이치 카퍼프로덕츠 | 구리-망간합금 스퍼터링 타겟재, 그것을 사용한 박막 트랜지스터 배선 및 박막 트랜지스터 |
CN103797152A (zh) | 2011-09-14 | 2014-05-14 | 吉坤日矿日石金属株式会社 | 高纯度铜锰合金溅射靶 |
US8492897B2 (en) | 2011-09-14 | 2013-07-23 | International Business Machines Corporation | Microstructure modification in copper interconnect structures |
EP2698447B1 (en) * | 2011-09-14 | 2016-04-06 | JX Nippon Mining & Metals Corp. | High-purity copper-manganese-alloy sputtering target |
KR20140029532A (ko) * | 2011-09-30 | 2014-03-10 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 스퍼터링 타깃 및 그 제조 방법 |
TWI633624B (zh) * | 2011-12-01 | 2018-08-21 | 應用材料股份有限公司 | 用於銅阻障層應用之摻雜的氮化鉭 |
CN104066868B (zh) * | 2012-01-23 | 2016-09-28 | 吉坤日矿日石金属株式会社 | 高纯度铜锰合金溅射靶 |
JP5952653B2 (ja) * | 2012-06-26 | 2016-07-13 | 株式会社コベルコ科研 | ターゲット接合体 |
JP2014043643A (ja) * | 2012-08-03 | 2014-03-13 | Kobelco Kaken:Kk | Cu合金薄膜形成用スパッタリングターゲットおよびその製造方法 |
CN103849795A (zh) * | 2012-11-29 | 2014-06-11 | 日月光半导体制造股份有限公司 | 用于半导体装置的铜合金导线 |
JP5724998B2 (ja) * | 2012-12-10 | 2015-05-27 | 三菱マテリアル株式会社 | 保護膜形成用スパッタリングターゲットおよび積層配線膜 |
JP6091911B2 (ja) * | 2013-01-29 | 2017-03-08 | 株式会社Shカッパープロダクツ | Cu−Mn合金スパッタリングターゲット材、Cu−Mn合金スパッタリングターゲット材の製造方法、および半導体素子 |
KR20150053805A (ko) | 2013-03-07 | 2015-05-18 | 제이엑스 닛코 닛세키 킨조쿠 가부시키가이샤 | 구리 합금 스퍼터링 타깃 |
JPWO2015099119A1 (ja) * | 2013-12-27 | 2017-03-23 | Jx金属株式会社 | 高純度銅又は銅合金スパッタリングターゲット及びその製造方法 |
EP3119453B1 (en) | 2014-03-19 | 2019-02-27 | Bayer Healthcare LLC | System for syringe engagement to an injector |
JP5783293B1 (ja) * | 2014-04-22 | 2015-09-24 | 三菱マテリアル株式会社 | 円筒型スパッタリングターゲット用素材 |
US9297775B2 (en) | 2014-05-23 | 2016-03-29 | Intermolecular, Inc. | Combinatorial screening of metallic diffusion barriers |
JP5972317B2 (ja) * | 2014-07-15 | 2016-08-17 | 株式会社マテリアル・コンセプト | 電子部品およびその製造方法 |
JP6435981B2 (ja) * | 2015-04-28 | 2018-12-12 | 三菱マテリアル株式会社 | 銅合金スパッタリングターゲット |
WO2016186070A1 (ja) | 2015-05-21 | 2016-11-24 | Jx金属株式会社 | 銅合金スパッタリングターゲット及びその製造方法 |
CN106480348B (zh) * | 2015-08-24 | 2018-03-20 | 湖南稀土院有限责任公司 | 一种灰控制棒用吸收体材料及其制备方法 |
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US10760156B2 (en) * | 2017-10-13 | 2020-09-01 | Honeywell International Inc. | Copper manganese sputtering target |
US11035036B2 (en) | 2018-02-01 | 2021-06-15 | Honeywell International Inc. | Method of forming copper alloy sputtering targets with refined shape and microstructure |
US11167375B2 (en) | 2018-08-10 | 2021-11-09 | The Research Foundation For The State University Of New York | Additive manufacturing processes and additively manufactured products |
CN110106458B (zh) * | 2019-04-30 | 2020-06-19 | 中国科学院合肥物质科学研究院 | 一种锻造态锰铜减振合金的热处理方法 |
US11725270B2 (en) * | 2020-01-30 | 2023-08-15 | Taiwan Semiconductor Manufacturing Co., Ltd. | PVD target design and semiconductor devices formed using the same |
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KR102386696B1 (ko) * | 2020-11-17 | 2022-04-15 | 주식회사 케이에스엠테크놀로지 | 액상 금속 도가니를 이용한 고융점 금속 산화물의 환원 시스템 및 방법 |
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CN101395290B (zh) * | 2006-02-28 | 2010-11-10 | 合同会社先端配线材料研究所 | 半导体装置、其制造方法以及用于该制造方法的溅射用靶材 |
-
2007
- 2007-09-25 JP JP2008537466A patent/JP4955008B2/ja active Active
- 2007-09-25 CN CN2007800225817A patent/CN101473059B/zh active Active
- 2007-09-25 WO PCT/JP2007/068501 patent/WO2008041535A1/ja active Application Filing
- 2007-09-25 KR KR1020087029476A patent/KR101070185B1/ko active IP Right Grant
- 2007-09-25 EP EP07828318.1A patent/EP2014787B1/en active Active
- 2007-09-25 US US12/300,173 patent/US20100013096A1/en not_active Abandoned
- 2007-10-01 TW TW096136710A patent/TW200821401A/zh unknown
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2012
- 2012-01-11 JP JP2012003251A patent/JP5420685B2/ja active Active
Also Published As
Publication number | Publication date |
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JP2012149346A (ja) | 2012-08-09 |
JP4955008B2 (ja) | 2012-06-20 |
KR20090031508A (ko) | 2009-03-26 |
EP2014787A4 (en) | 2009-05-06 |
JPWO2008041535A1 (ja) | 2010-02-04 |
EP2014787A1 (en) | 2009-01-14 |
EP2014787B1 (en) | 2017-09-06 |
CN101473059A (zh) | 2009-07-01 |
KR101070185B1 (ko) | 2011-10-05 |
TWI368660B (zh) | 2012-07-21 |
WO2008041535A1 (en) | 2008-04-10 |
US20100013096A1 (en) | 2010-01-21 |
JP5420685B2 (ja) | 2014-02-19 |
TW200821401A (en) | 2008-05-16 |
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