CN101447444B - 处理装置和对位方法 - Google Patents

处理装置和对位方法 Download PDF

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Publication number
CN101447444B
CN101447444B CN2008101866824A CN200810186682A CN101447444B CN 101447444 B CN101447444 B CN 101447444B CN 2008101866824 A CN2008101866824 A CN 2008101866824A CN 200810186682 A CN200810186682 A CN 200810186682A CN 101447444 B CN101447444 B CN 101447444B
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CN
China
Prior art keywords
processing
chamber
processed
alignment
processing chamber
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Expired - Fee Related
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CN2008101866824A
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English (en)
Chinese (zh)
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CN101447444A (zh
Inventor
志村昭彦
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Publication of CN101447444A publication Critical patent/CN101447444A/zh
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Publication of CN101447444B publication Critical patent/CN101447444B/zh
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CN2008101866824A 2005-05-18 2006-05-16 处理装置和对位方法 Expired - Fee Related CN101447444B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005-144886 2005-05-18
JP2005144886A JP4849825B2 (ja) 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体
JP2005144886 2005-05-18

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
CNB2006100802949A Division CN100511633C (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Publications (2)

Publication Number Publication Date
CN101447444A CN101447444A (zh) 2009-06-03
CN101447444B true CN101447444B (zh) 2011-04-13

Family

ID=37425464

Family Applications (2)

Application Number Title Priority Date Filing Date
CN2008101866824A Expired - Fee Related CN101447444B (zh) 2005-05-18 2006-05-16 处理装置和对位方法
CNB2006100802949A Expired - Fee Related CN100511633C (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CNB2006100802949A Expired - Fee Related CN100511633C (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Country Status (4)

Country Link
JP (1) JP4849825B2 (enrdf_load_stackoverflow)
KR (1) KR100809125B1 (enrdf_load_stackoverflow)
CN (2) CN101447444B (enrdf_load_stackoverflow)
TW (1) TWI390657B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007710B1 (ko) * 2008-03-26 2011-01-13 주식회사 에스에프에이 화학 기상 증착 장치의 로드락 챔버
TWI458587B (zh) * 2012-01-17 2014-11-01 Chin Yen Wang 位置校正裝置
CN103569672B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种兼容硅片和玻璃基板的传输装置
JP2014075432A (ja) * 2012-10-03 2014-04-24 Hioki Ee Corp 基板支持装置および基板検査装置
CN105529278B (zh) * 2014-09-29 2019-08-16 盛美半导体设备（上海）有限公司 加工半导体结构的装置
JP6298109B2 (ja) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 基板処理装置及びアライメント方法
JP7105629B2 (ja) * 2018-06-20 2022-07-25 東京エレクトロン株式会社 自動教示方法及び制御装置
CN109904101B (zh) * 2019-01-28 2021-09-03 拓荆科技股份有限公司 一种晶圆转移及测量系统
JP7259476B2 (ja) 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
CN110504185B (zh) * 2019-08-27 2022-02-11 北京芯可鉴科技有限公司 Esd保护单元的测试及加固方法
JP7578362B2 (ja) 2021-03-04 2024-11-06 東京エレクトロン株式会社 基板位置制御方法、及び基板処理システム
CN117352452A (zh) * 2023-11-23 2024-01-05 北京北方华创微电子装备有限公司 半导体工艺设备及其校准装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509771A (en) * 1992-07-29 1996-04-23 Tokyo Electron Limited Vacuum processing apparatus
US5558482A (en) * 1992-07-29 1996-09-24 Tokyo Electron Limited Multi-chamber system
US6510365B1 (en) * 1998-10-27 2003-01-21 Tokyo Electron Limited Carrier system positioning method
CN1404102A (zh) * 2001-09-06 2003-03-19 大日本屏影象制造株式会社 管理衬底加工设备的设备信息的衬底加工系统

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622525B2 (ja) * 1989-03-31 1997-06-18 東京エレクトロン株式会社 液晶基板の製造装置
JP3335983B2 (ja) * 1993-02-26 2002-10-21 東京エレクトロン株式会社 Ｌｃｄ用ガラス基板の位置合わせ機構及び真空処理装置
JP3299338B2 (ja) * 1993-04-28 2002-07-08 東京エレクトロン株式会社 真空処理装置
JP3350234B2 (ja) * 1994-06-06 2002-11-25 東京エレクトロン株式会社 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
KR20030043220A (ko) * 2001-11-27 2003-06-02 엘지.필립스 엘시디 주식회사 액정표시장치의 유리 기판 파손 감지장치
JP2004241428A (ja) * 2003-02-03 2004-08-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
JP4620365B2 (ja) * 2003-02-20 2011-01-26 アプライド マテリアルズ インコーポレイテッド 支持ステージに対して基板を位置決めするアライメント装置および基板較正システム
JP4376116B2 (ja) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 基板受け渡し位置の調整方法
KR100523277B1 (ko) * 2003-06-10 2005-10-25 브룩스오토메이션아시아(주) 로드락 장치의 얼라이너

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5509771A (en) * 1992-07-29 1996-04-23 Tokyo Electron Limited Vacuum processing apparatus
US5558482A (en) * 1992-07-29 1996-09-24 Tokyo Electron Limited Multi-chamber system
US6510365B1 (en) * 1998-10-27 2003-01-21 Tokyo Electron Limited Carrier system positioning method
CN1404102A (zh) * 2001-09-06 2003-03-19 大日本屏影象制造株式会社 管理衬底加工设备的设备信息的衬底加工系统

Non-Patent Citations (4)

* Cited by examiner, † Cited by third party
Title
JP特开2002-57205A 2002.02.22
JP特开2003-158170A 2003.05.30
JP特开2003-309159A 2003.10.31
JP特开平5-337774A 1993.12.21

Also Published As

Publication number Publication date
TWI390657B (zh) 2013-03-21
CN100511633C (zh) 2009-07-08
TW200709327A (en) 2007-03-01
CN101447444A (zh) 2009-06-03
JP2006324366A (ja) 2006-11-30
JP4849825B2 (ja) 2012-01-11
KR100809125B1 (ko) 2008-03-03
CN1866493A (zh) 2006-11-22
KR20060119815A (ko) 2006-11-24

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