JP4849825B2 - 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体 - Google Patents

処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体 Download PDF

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Publication number
JP4849825B2
JP4849825B2 JP2005144886A JP2005144886A JP4849825B2 JP 4849825 B2 JP4849825 B2 JP 4849825B2 JP 2005144886 A JP2005144886 A JP 2005144886A JP 2005144886 A JP2005144886 A JP 2005144886A JP 4849825 B2 JP4849825 B2 JP 4849825B2
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Japan
Prior art keywords
processing
chamber
processed
positioning
alignment
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Expired - Fee Related
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JP2005144886A
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English (en)
Japanese (ja)
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JP2006324366A (ja
JP2006324366A5 (enrdf_load_stackoverflow
Inventor
昭彦 志村
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Tokyo Electron Ltd
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Tokyo Electron Ltd
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Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Priority to JP2005144886A priority Critical patent/JP4849825B2/ja
Priority to CN2008101866824A priority patent/CN101447444B/zh
Priority to CNB2006100802949A priority patent/CN100511633C/zh
Priority to KR1020060044442A priority patent/KR100809125B1/ko
Priority to TW095117510A priority patent/TWI390657B/zh
Publication of JP2006324366A publication Critical patent/JP2006324366A/ja
Publication of JP2006324366A5 publication Critical patent/JP2006324366A5/ja
Application granted granted Critical
Publication of JP4849825B2 publication Critical patent/JP4849825B2/ja
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Expired - Fee Related legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
JP2005144886A 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体 Expired - Fee Related JP4849825B2 (ja)

Priority Applications (5)

Application Number Priority Date Filing Date Title
JP2005144886A JP4849825B2 (ja) 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体
CN2008101866824A CN101447444B (zh) 2005-05-18 2006-05-16 处理装置和对位方法
CNB2006100802949A CN100511633C (zh) 2005-05-18 2006-05-16 处理装置和对位方法
KR1020060044442A KR100809125B1 (ko) 2005-05-18 2006-05-17 처리 장치, 위치설정 방법 및 컴퓨터 기억 매체
TW095117510A TWI390657B (zh) 2005-05-18 2006-05-17 Processing device and alignment method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005144886A JP4849825B2 (ja) 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体

Publications (3)

Publication Number Publication Date
JP2006324366A JP2006324366A (ja) 2006-11-30
JP2006324366A5 JP2006324366A5 (enrdf_load_stackoverflow) 2008-05-29
JP4849825B2 true JP4849825B2 (ja) 2012-01-11

Family

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Family Applications (1)

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JP2005144886A Expired - Fee Related JP4849825B2 (ja) 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体

Country Status (4)

Country Link
JP (1) JP4849825B2 (enrdf_load_stackoverflow)
KR (1) KR100809125B1 (enrdf_load_stackoverflow)
CN (2) CN100511633C (enrdf_load_stackoverflow)
TW (1) TWI390657B (enrdf_load_stackoverflow)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007710B1 (ko) * 2008-03-26 2011-01-13 주식회사 에스에프에이 화학 기상 증착 장치의 로드락 챔버
TWI458587B (zh) * 2012-01-17 2014-11-01 Chin Yen Wang 位置校正裝置
CN103569672B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种兼容硅片和玻璃基板的传输装置
JP2014075432A (ja) * 2012-10-03 2014-04-24 Hioki Ee Corp 基板支持装置および基板検査装置
CN105529278B (zh) * 2014-09-29 2019-08-16 盛美半导体设备（上海）有限公司 加工半导体结构的装置
JP6298109B2 (ja) * 2016-07-08 2018-03-20 キヤノントッキ株式会社 基板処理装置及びアライメント方法
JP7105629B2 (ja) * 2018-06-20 2022-07-25 東京エレクトロン株式会社 自動教示方法及び制御装置
CN109904101B (zh) * 2019-01-28 2021-09-03 拓荆科技股份有限公司 一种晶圆转移及测量系统
JP7259476B2 (ja) 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
CN110504185B (zh) * 2019-08-27 2022-02-11 北京芯可鉴科技有限公司 Esd保护单元的测试及加固方法
JP7578362B2 (ja) * 2021-03-04 2024-11-06 東京エレクトロン株式会社 基板位置制御方法、及び基板処理システム
CN117352452A (zh) * 2023-11-23 2024-01-05 北京北方华创微电子装备有限公司 半导体工艺设备及其校准装置

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622525B2 (ja) * 1989-03-31 1997-06-18 東京エレクトロン株式会社 液晶基板の製造装置
US5558482A (en) * 1992-07-29 1996-09-24 Tokyo Electron Limited Multi-chamber system
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3335983B2 (ja) * 1993-02-26 2002-10-21 東京エレクトロン株式会社 Ｌｃｄ用ガラス基板の位置合わせ機構及び真空処理装置
JP3299338B2 (ja) * 1993-04-28 2002-07-08 東京エレクトロン株式会社 真空処理装置
JP3350234B2 (ja) * 1994-06-06 2002-11-25 東京エレクトロン株式会社 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
JP4674705B2 (ja) * 1998-10-27 2011-04-20 東京エレクトロン株式会社 搬送システムの搬送位置合わせ方法及び搬送システム
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
KR20030043220A (ko) * 2001-11-27 2003-06-02 엘지.필립스 엘시디 주식회사 액정표시장치의 유리 기판 파손 감지장치
JP2004241428A (ja) * 2003-02-03 2004-08-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
TWI257497B (en) * 2003-02-20 2006-07-01 Applied Materials Inc Methods and apparatus for positioning a substrate relative to a support stage
JP4376116B2 (ja) * 2003-06-03 2009-12-02 東京エレクトロン株式会社 基板受け渡し位置の調整方法
KR100523277B1 (ko) * 2003-06-10 2005-10-25 브룩스오토메이션아시아(주) 로드락 장치의 얼라이너

Also Published As

Publication number Publication date
JP2006324366A (ja) 2006-11-30
TWI390657B (zh) 2013-03-21
KR20060119815A (ko) 2006-11-24
CN101447444B (zh) 2011-04-13
TW200709327A (en) 2007-03-01
CN100511633C (zh) 2009-07-08
KR100809125B1 (ko) 2008-03-03
CN101447444A (zh) 2009-06-03
CN1866493A (zh) 2006-11-22

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