CN100511633C - 处理装置和对位方法 - Google Patents

处理装置和对位方法 Download PDF

Info

Publication number
CN100511633C
CN100511633C CNB2006100802949A CN200610080294A CN100511633C CN 100511633 C CN100511633 C CN 100511633C CN B2006100802949 A CNB2006100802949 A CN B2006100802949A CN 200610080294 A CN200610080294 A CN 200610080294A CN 100511633 C CN100511633 C CN 100511633C
Authority
CN
China
Prior art keywords
chamber
substrate
handled object
processing
contraposition
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006100802949A
Other languages
English (en)
Chinese (zh)
Other versions
CN1866493A (zh
Inventor
志村昭彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Tokyo Electron Ltd
Original Assignee
Tokyo Electron Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tokyo Electron Ltd filed Critical Tokyo Electron Ltd
Publication of CN1866493A publication Critical patent/CN1866493A/zh
Application granted granted Critical
Publication of CN100511633C publication Critical patent/CN100511633C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67063—Apparatus for fluid treatment for etching
    • H01L21/67069—Apparatus for fluid treatment for etching for drying etching
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Drying Of Semiconductors (AREA)
CNB2006100802949A 2005-05-18 2006-05-16 处理装置和对位方法 Expired - Fee Related CN100511633C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005144886 2005-05-18
JP2005144886A JP4849825B2 (ja) 2005-05-18 2005-05-18 処理装置、位置合わせ方法、制御プログラムおよびコンピュータ記憶媒体

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN2008101866824A Division CN101447444B (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Publications (2)

Publication Number Publication Date
CN1866493A CN1866493A (zh) 2006-11-22
CN100511633C true CN100511633C (zh) 2009-07-08

Family

ID=37425464

Family Applications (2)

Application Number Title Priority Date Filing Date
CNB2006100802949A Expired - Fee Related CN100511633C (zh) 2005-05-18 2006-05-16 处理装置和对位方法
CN2008101866824A Expired - Fee Related CN101447444B (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN2008101866824A Expired - Fee Related CN101447444B (zh) 2005-05-18 2006-05-16 处理装置和对位方法

Country Status (4)

Country Link
JP (1) JP4849825B2 (enrdf_load_stackoverflow)
KR (1) KR100809125B1 (enrdf_load_stackoverflow)
CN (2) CN100511633C (enrdf_load_stackoverflow)
TW (1) TWI390657B (enrdf_load_stackoverflow)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107591346A (zh) * 2016-07-08 2018-01-16 佳能特机株式会社 基板处理装置及对准方法
CN110504185A (zh) * 2019-08-27 2019-11-26 北京智芯微电子科技有限公司 Esd保护单元的测试及加固方法

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101007710B1 (ko) * 2008-03-26 2011-01-13 주식회사 에스에프에이 화학 기상 증착 장치의 로드락 챔버
TWI458587B (zh) * 2012-01-17 2014-11-01 Chin Yen Wang 位置校正裝置
CN103569672B (zh) * 2012-07-20 2016-03-09 上海微电子装备有限公司 一种兼容硅片和玻璃基板的传输装置
JP2014075432A (ja) * 2012-10-03 2014-04-24 Hioki Ee Corp 基板支持装置および基板検査装置
CN105529278B (zh) * 2014-09-29 2019-08-16 盛美半导体设备（上海）有限公司 加工半导体结构的装置
JP7105629B2 (ja) * 2018-06-20 2022-07-25 東京エレクトロン株式会社 自動教示方法及び制御装置
CN109904101B (zh) * 2019-01-28 2021-09-03 拓荆科技股份有限公司 一种晶圆转移及测量系统
JP7259476B2 (ja) 2019-03-27 2023-04-18 東京エレクトロン株式会社 アライメント装置、基板処理装置、アライメント方法及び基板処理方法
JP7578362B2 (ja) * 2021-03-04 2024-11-06 東京エレクトロン株式会社 基板位置制御方法、及び基板処理システム
CN117352452A (zh) * 2023-11-23 2024-01-05 北京北方华创微电子装备有限公司 半导体工艺设备及其校准装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6510365B1 (en) * 1998-10-27 2003-01-21 Tokyo Electron Limited Carrier system positioning method
JP2004241428A (ja) * 2003-02-03 2004-08-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
CN1573568A (zh) * 2003-06-03 2005-02-02 东京毅力科创株式会社 基板处理装置及基板交接位置的调整方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2622525B2 (ja) * 1989-03-31 1997-06-18 東京エレクトロン株式会社 液晶基板の製造装置
US5558482A (en) * 1992-07-29 1996-09-24 Tokyo Electron Limited Multi-chamber system
JP3139155B2 (ja) * 1992-07-29 2001-02-26 東京エレクトロン株式会社 真空処理装置
JP3335983B2 (ja) * 1993-02-26 2002-10-21 東京エレクトロン株式会社 Ｌｃｄ用ガラス基板の位置合わせ機構及び真空処理装置
JP3299338B2 (ja) * 1993-04-28 2002-07-08 東京エレクトロン株式会社 真空処理装置
JP3350234B2 (ja) * 1994-06-06 2002-11-25 東京エレクトロン株式会社 被処理体のバッファ装置、これを用いた処理装置及びその搬送方法
JP3650495B2 (ja) * 1995-12-12 2005-05-18 東京エレクトロン株式会社 半導体処理装置、その基板交換機構及び基板交換方法
US7280883B2 (en) * 2001-09-06 2007-10-09 Dainippon Screen Mfg. Co., Ltd. Substrate processing system managing apparatus information of substrate processing apparatus
KR20030043220A (ko) * 2001-11-27 2003-06-02 엘지.필립스 엘시디 주식회사 액정표시장치의 유리 기판 파손 감지장치
TWI257497B (en) * 2003-02-20 2006-07-01 Applied Materials Inc Methods and apparatus for positioning a substrate relative to a support stage
KR100523277B1 (ko) * 2003-06-10 2005-10-25 브룩스오토메이션아시아(주) 로드락 장치의 얼라이너

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6510365B1 (en) * 1998-10-27 2003-01-21 Tokyo Electron Limited Carrier system positioning method
JP2004241428A (ja) * 2003-02-03 2004-08-26 Tokyo Electron Ltd 基板処理装置及び基板処理方法
CN1573568A (zh) * 2003-06-03 2005-02-02 东京毅力科创株式会社 基板处理装置及基板交接位置的调整方法

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107591346A (zh) * 2016-07-08 2018-01-16 佳能特机株式会社 基板处理装置及对准方法
CN113808975A (zh) * 2016-07-08 2021-12-17 佳能特机株式会社 基板处理装置及对准方法
CN107591346B (zh) * 2016-07-08 2022-02-11 佳能特机株式会社 基板处理装置及对准方法
CN113808975B (zh) * 2016-07-08 2023-05-16 佳能特机株式会社 基板处理装置及对准方法
CN110504185A (zh) * 2019-08-27 2019-11-26 北京智芯微电子科技有限公司 Esd保护单元的测试及加固方法
CN110504185B (zh) * 2019-08-27 2022-02-11 北京芯可鉴科技有限公司 Esd保护单元的测试及加固方法

Also Published As

Publication number Publication date
JP2006324366A (ja) 2006-11-30
TWI390657B (zh) 2013-03-21
KR20060119815A (ko) 2006-11-24
CN101447444B (zh) 2011-04-13
JP4849825B2 (ja) 2012-01-11
TW200709327A (en) 2007-03-01
KR100809125B1 (ko) 2008-03-03
CN101447444A (zh) 2009-06-03
CN1866493A (zh) 2006-11-22

Similar Documents

Publication Publication Date Title
CN100511633C (zh) 处理装置和对位方法
US11908721B2 (en) Tool auto-teach method and apparatus
CN100499060C (zh) 晶片定位方法和装置,晶片加工系统及晶片定位装置的晶片座旋转轴定位方法
TWI279876B (en) Substrate support, load-lock chamber for transferring substrates and methods for aligning a substrate on a substrate support
JP2023092532A (ja) エンドエフェクターを供給するための器具、システム、及び方法
KR100699207B1 (ko) 웨이퍼이송로봇용 네스트를 갖춘 대기 웨이퍼이송모듈과 이를 이용하는 방법
US6577923B1 (en) Apparatus and method for robotic alignment of substrates
CN101131366B (zh) 基板检测机构以及基板收纳容器
US9111976B2 (en) Transfer system
JP2000127069A (ja) 搬送システムの搬送位置合わせ方法
CN100374911C (zh) 基板传送系统
JP2006277298A (ja) 基板処理装置、履歴情報記録方法、履歴情報記録プログラム及び履歴情報記録システム
CN101118864A (zh) 基板检测机构和使用其的基板处理装置
US6519502B2 (en) Apparatus and method for positioning a cassette pod onto a loadport by an overhead hoist transport system
KR100281454B1 (ko) 로드로크용 로드암
CN117798941A (zh) 搬运系统以及搬运方法
KR101187516B1 (ko) 결함 분포 패턴의 대조 방법 및 장치
CN103203738B (zh) 搬运系统
KR102783215B1 (ko) 반송 로봇의 오토 티칭 장치 및 방법
JP2006080198A (ja) 基板搬送装置及び基板搬送方法
US20240228166A1 (en) Storage apparatus, a transfer system including the same, and a transferring method using the transfer system
US20240109200A1 (en) Transfer system and transfer method
JPH0790884B2 (ja) 基板の収納・取り出し管理システム
JP2021184426A (ja) 搬送装置、搬送方法および搬送システム
JPH09110109A (ja) 自動倉庫のワーク収納方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090708

CF01 Termination of patent right due to non-payment of annual fee