CN101447444B - Processing apparatus and positioning method - Google Patents
Processing apparatus and positioning method Download PDFInfo
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- CN101447444B CN101447444B CN2008101866824A CN200810186682A CN101447444B CN 101447444 B CN101447444 B CN 101447444B CN 2008101866824 A CN2008101866824 A CN 2008101866824A CN 200810186682 A CN200810186682 A CN 200810186682A CN 101447444 B CN101447444 B CN 101447444B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67201—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the load-lock chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67063—Apparatus for fluid treatment for etching
- H01L21/67069—Apparatus for fluid treatment for etching for drying etching
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67236—Apparatus for manufacturing or treating in a plurality of work-stations the substrates being processed being not semiconductor wafers, e.g. leadframes or chips
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
Abstract
The invention provides a processing apparatus and positioning method, which can make alignment for accurate control of position of a substrate in a process chamber even if a plurality of process chambers are provided. In a load lock chamber 30, positioners 33a, 33b, 33c, and 33d are arranged for aligning a substrate S placed on buffers 31 and 32. A rectangular substrate S is pressed at four points by the abutment block 36 of the positioners 33a, 33b, 33c, and 33d, in the load lock chamber 30 for alignment in X-Y direction. The position is set for each process chamber, corresponding to processing position in each process chamber.
Description
The application is
On May 16th, 2006, application number is
200610080294.9, denomination of invention is
Processing unit and to method for positionThe dividing an application of patent application.
Technical field
The present invention relates to processing unit and, in detail, relate in the manufacture process of flat-panel monitor (FPD) etc., glass employed processing unit and to method for position in the processing of handled objects such as glass substrate method for position.
Background technology
As in the manufacture process of FPD, under vacuum state, substrate as handled object is carried out the vacuum treatment installation that etching or polishing, film forming etc. are handled, use the so-called multi-cavity type vacuum treatment installation that is equipped with a plurality of vacuum processing chambers that are used for carrying out aforementioned processing.In this vacuum treatment installation, be provided with load locking room by opening and closing freely the family of power and influence, so that the vacuum treatment of substrate being feeded/be discharged to there is no need to make the indoor normal pressure that returns to of vacuum treatment when indoor at every turn as preparatory vacuum chamber.As the substrate of handled object, before being transplanted on vacuum processing chamber, temporarily move into load locking room, load-lock is indoor become with the same vacuum state of vacuum processing chamber after, it is indoor to be transplanted on above-mentioned vacuum treatment.
And, in above-mentioned this processing unit, in the indoor contraposition mechanism that is provided with of load-lock, so that when substrate being transplanted on vacuum processing chamber by transfer mechanism, can be positioned over correct processing position, therefore proposed substrate to the position that is positioned at regulation after, be transplanted on the method (for example, patent documentation 1) of vacuum processing chamber by transfer mechanism.
In addition, though be processing unit, in order to prevent the position changing of the relative positions of wafer, the information such as position of carrying out the wafer handing-over on the mobile route of the handover arm of transfer mechanism are stored in computer as position coordinates about semiconductor wafer.So-called method (for example, patent documentation 2) of carrying out teaching has been proposed.
[patent documentation 1] spy opens 2002-57205 communique (claims etc.)
[patent documentation 2] spy opens 2000-127069 communique (claims etc.)
The contraposition mechanism of above-mentioned patent documentation 1 because be the contraposition mechanism that is positioned an indoor position of load-lock, exists following problem.
At first, in having the processing unit of a plurality of vacuum processing chambers, it is difficult that the relative position of the transfer chamber that transfer mechanism is arranged and each vacuum processing chamber is fully similarly evened up, and often vacuum processing chamber produces the small position changing of the relative positions with respect to transfer chamber.This ' the position changing of the relative positions ' results from step-up error when the vacuum processing chamber is set.; because it is indoor at load-lock as previously mentioned; the location of fixing a position; even so position in that load-lock is indoor; being transplanted under the state that each vacuum processing chamber that dislocation is arranged on the position slightly is set, just can't be placed on substrate on the indoor correct processing position of vacuum treatment.The relative position of vacuum processing chamber and substrate also is that each vacuum processing chamber is all uneven as a result, becomes to carry out the accurate obstruction of handling.Thereby, in a plurality of vacuum processing chambers, carry out when the processing (for example etching) etc. of identical content, except becoming because of vacuum processing chamber the reason that creates a difference on the contents processings such as etching precision or rate of finished products, also become the reason that reduces processing accuracy even in a plurality of vacuum processing chambers, carry out under the situation of processing (for example, etching and polishing etc.) of different content.
Therefore, in the indoor location of not only carrying out substrate of load-lock, and then, as patent documentation 2, be necessary by transfer mechanism being implemented accurate teaching, make not produce deviation on the indoor processing position of vacuum treatment.In this teaching, the action of the handover arm of transfer mechanism is adjusted, make in each vacuum processing chamber, to change, become for the average precision to a certain degree of a plurality of vacuum processing chambers.But, in this case, because become the teaching of the corresponding relation of the one-to-many that the indoor position of load-lock is adjusted by the number of vacuum processing chamber, thus need a lot of work operations amounts in adjusting, and also the control of transfer mechanism also becomes very complicated.
In addition, the deviation of the processing position that above-mentioned vacuum treatment is indoor is becoming more deep problem along with the maximization of substrate size.For example, as shown in Figure 9, because be under the situation of substrate S of rectangle of 2200mm size on long limit, even the changing of the relative positions of the angle of vacuum processing chamber 100 and substrate S, mouthful G side of moving at substrate S only is 0.025 °, the changing of the relative positions of maximum 1mm also takes place in the depth side at vacuum processing chamber 100, so worry the influence to processing accuracy.And big more in the changing of the relative positions of the indoor processing of each vacuum treatment position, then the correspondence that the teaching of transfer mechanism is caused also becomes difficult more.
Summary of the invention
The present invention makes in view of above-mentioned actual conditions, even purpose is to provide a kind of and has under the situation of a plurality of process chambers, and the also processing unit of the indoor processing position of control and treatment and correctly to method for position.
In order to solve above-mentioned problem, the 1st viewpoint of the present invention provides a kind of processing unit, has: a plurality of process chambers that are used for handling handled object; Transfer the transfer mechanism of handled object to aforementioned process chamber; By aforementioned transfer mechanism handled object before aforementioned process chamber is transferred, carry out the contraposition mechanism of the location of handled object in the outside of aforementioned processing chamber; At each of aforementioned a plurality of process chambers, corresponding to the storing mechanism of the position of the aforementioned contraposition of the processing location storage mechanism of the handled object in this process chamber; And the controlling organization of controlling aforementioned contraposition mechanism based on the aforementioned location that is stored in aforementioned storing mechanism.
In the processing unit of the 1st viewpoint, owing to having the storing mechanism of storing the position that obtains according to contraposition mechanism corresponding to the processing position of the handled object in the process chamber, with based on the controlling organization that is stored in the Position Control contraposition mechanism in this storing mechanism, so by in advance will with the predetermined corresponding location storage of process chamber of transferring handled object in storing mechanism, can in process chamber, carry out contraposition respectively.Thereby, contraposition workpiece transfer under the situation of process chamber, with process chamber that the changing of the relative positions is set is irrelevant, can be transplanted on regular processing position.
In above-mentioned the 1st viewpoint, aforementioned contraposition mechanism can have by be contacted with a plurality of contact sites that aforementioned handled object positions from mutually orthogonal both direction.Being contacted with handled object by the both direction from quadrature, is under the situation of substrate of rectangle at for example handled object, contraposition reliably.In the case, preferably aforementioned a plurality of contact sites displacement independently of each other and contacting with handled object.Whereby, high-precision contraposition becomes possibility, also can be reflected in contraposition even the changing of the relative positions of process chamber is very little.
In addition, preferably the aforementioned processing chamber is the vacuum processing chamber of under vacuum state handled object being handled.In the case, can have and be connected in aforementioned vacuum processing chamber and have the transfer chamber of aforementioned transfer mechanism and be connected in this transfer chamber, have the preparatory vacuum chamber of aforementioned contraposition mechanism.
In addition, at least one of aforementioned vacuum processing chamber can be the process chamber that handled object is carried out dry ecthing.
In addition, aforementioned handled object also can be the glass substrate of rectangle.
In addition, the aforementioned processing device also can be used in the manufacturing of flat-panel monitor.
The 2nd viewpoint of the present invention provide a kind of in processing unit, before handling handled object, position to method for position, described processing unit has a plurality of process chambers that are used for handling handled object; Transfer the transfer mechanism of handled object to aforementioned process chamber; By aforementioned transfer mechanism handled object before aforementioned process chamber is transferred, in the orientation room of the outside of aforementioned processing chamber, carry out the contraposition mechanism of the location of handled object; In aforementioned a plurality of process chambers, corresponding to the storing mechanism of the definite position of the aforementioned contraposition of the processing location storage mechanism of the handled object in this process chamber; And control the controlling organization of aforementioned contraposition mechanism based on the aforementioned location that is stored in aforementioned storing mechanism, and wherein, read aforementioned location corresponding to the predetermined aforementioned processing chamber of handling from aforementioned storing mechanism, carry out the location that aforementioned contraposition mechanism determines.
In the 2nd viewpoint, by reading the location of carrying out contraposition mechanism corresponding to the position of the predetermined process chamber of handling from storing mechanism, consider that the location that the changing of the relative positions etc. is set of process chamber becomes possibility.Therefore, the processing position that control correctly is transplanted on the handled object in the process chamber becomes possibility, can improve the processing accuracy of etching etc., and carries out can realizing the uniformity of handling under the situation of processing of identical content in a plurality of process chambers.
In the 2nd viewpoint, the operation of storage aforementioned location can comprise in aforementioned storing mechanism:
Handled object is moved in any of aforementioned processing chamber, is placed on the step of handling the position,
By aforementioned transfer mechanism, from aforementioned process chamber in aforementioned orientation room, with keep with the aforementioned processing chamber in the state of corresponding relation of aforementioned processing position, transfer the step of the handled object that contraposition finishes, and
Based on the position of the handled object of in aforementioned orientation room, transferring, set aforementioned contraposition mechanism, as corresponding to the location storage of aforementioned processing chamber in the step of aforementioned storing mechanism.
Like this, by the one-to-one relationship of process chamber and orientation room, can easily determine position, and the position changing of the relative positions of process chamber can correctly be reflected in determined position corresponding to process chamber.Thereby, when handling, by on determined position, positioning like this, the position of the handled object when the control and treatment chamber is transferred reliably.In addition, owing to do not need as always, to transferring the high-precision teaching of arm, so can reduce needed work operations amount and time in the teaching.
In addition, aforementioned orientation room is preferably preparatory vacuum chamber.
According to the 3rd viewpoint of the present invention, a kind of control program can be provided, it is characterized in that, action on computers, control aforementioned processing device when carrying out so as to carry out above-mentioned the 2nd viewpoint to method for position.
According to the 4th viewpoint of the present invention, a kind of computer storage media may can be provided, its storage is the control program of action on computers, aforementioned control program is control aforementioned processing device when carrying out so that carry out above-mentioned the 2nd viewpoint to method for position.
According to the present invention, by in each process chamber, carrying out contraposition respectively, under the situation of the workpiece transfer that will finish contraposition in the process chamber outside in the process chamber, with process chamber that the position changing of the relative positions is set is irrelevant, can be positioned over regular position.And, owing to do not need as always to the high-precision teaching of transferring arm, so can reduce needed work operations amount and time in the teaching.
Description of drawings
Fig. 1 is the stereogram of summary of the plasma processing apparatus of expression an embodiment of the invention.
Fig. 2 is the horizontal cross of the plasma processing apparatus of Fig. 1.
Fig. 3 is the figure that the summary of expression control part constitutes.
Fig. 4 is the stereogram that the inside of expression load locking room constitutes.
Fig. 5 is the flow chart of order of the contraposition of expression locator.
Fig. 6 is the key diagram of the indoor state of the load-lock when the expression contraposition.
Fig. 7 is the flow chart of the order of expression processing substrate.
Fig. 8 is the figure of explanation position location.
Fig. 9 is the schematic diagram that is used for illustrating the changing of the relative positions of the substrate position in the process chamber.
Label declaration: 1 plasma processing apparatus; 10a, 10b, 10c treatment chamber; 20 transfer chamber; 30 load locking rooms; 31,32 buffers; 33a, 33b, 33c, 33d locator; 34 actuator portions; 35 bars; 36 contact blocks; 50 transfer mechanisms; 60 control parts; 61 process controllers; 62 user interfaces; 63 storage parts.
Embodiment
Below, with reference to accompanying drawing, describe with regard to optimal way of the present invention.Here, illustrate the plasma processing apparatus that FPD is carried out the multi-cavity type that etch processes uses with glass substrate (below, only be designated as ' substrate ') S.Here,, LCD (LCD) is arranged for example, light-emitting diode (LED) display, electroluminescence (Electro Luminescence as FPD; EL) display, fluorescent display tube (Vacuum Fluorescent Display:VFD), plasma scope (PDP) etc.
Fig. 1 is the stereogram of the general survey of expression plasma processing apparatus, and Fig. 2 is its inner horizontal cross of expression.In addition, in Fig. 1 and Fig. 2, omitted the diagram of thin portion.
This plasma processing unit 1, portion's connection is being provided with transfer chamber 20 and load locking room 30 in the central.Around transfer chamber 20, disposing three treatment chamber 10a, 10b, 10c.Like this, plasma processing apparatus 1 is because have three treatment chamber 10a, 10b, 10c, so for example wherein two treatment chamber constitute as etch process chamber, surplus next treatment chamber constitutes as the polishing chamber, perhaps three treatment chamber is all constituted as the etch process chamber of carrying out same treatment or polishing chamber.In addition, the quantity of treatment chamber is not limited to three, also can dispose for example eight around transfer chamber 20.
Between transfer chamber 20 and the load locking room 30, between transfer chamber 20 and each treatment chamber 10a, 10b, the 10c, and in the peristome of the atmospheric environment that is communicated with the load locking room 30 and the outside respectively plug-in mounting seal between them and the family of power and influence 22 that can constitute airtightly with opening and closing.
In the outside of load locking room 30, be provided with two box protractors 41, placing the box 40 of accommodating substrate S thereon respectively.Side at these boxes 40 for example can accommodate untreatment base, accommodates the substrate of handling the opposing party.These boxes 40 can be by elevating mechanism 42 liftings.
Between these two boxes 40, supporting to be provided with substrate transfer mechanism 43 on the platform 44, this transfer mechanism 43 possesses the arm 45,46 of being arranged to two sections and the base 47 of supporting them, and this base can pass in and out described arm integratedly to keep out of the way and rotates.
On arm 45,46, form four projections 48 of support substrate S.Projection 48 is made up of the elastomer of the high synthetic rubber system of coefficient of friction, can prevent the substrate S changing of the relative positions or fall in the substrate support.
The inner space of aforementioned processing chamber 10a, 10b, 10c can remain on the reduced atmosphere of regulation, and portion for example can carry out etch processes within it.In addition, the basic comprising of treatment chamber 10a, 10b, 10c is roughly the same.
Each formation portion of plasma processing apparatus 1 becomes the formation (omitting diagram in Fig. 1) that is connected in control part 60 and is subjected to its control.The summary of control part 60 is shown in Fig. 3.Control part 60 is being equipped with the process controller 61 that has CPU, connecting user interface 62 on this process controller 61, this user interface is carried out the keyboard of input operation of order etc. for managing plasma processing unit 1 by the process management person and display that the working condition of plasma processing apparatus 1 is shown visually etc. is formed.
In addition, connecting storage part 63 on plasma processing apparatus 1, this storage portion stores is used for control by process controller 61 and is implemented in the control program (software) of the various processing that plasma processing apparatus 1 carries out and records prescription of treatment conditions data etc.
And, as required,, in process controller 61, carry out by accessing prescription arbitrarily from storage part 63 from the indication of user's interface 62 etc., under the control of process controller 61, carry out the processing that needs in the plasma processing apparatus 1.In addition, for example the positional information corresponding to each treatment chamber 10a, 10b, 10c is stored in the storage part 63 in advance, in the stage of the treatment chamber of determining treatment substrate S, read positional information from storage part 63, can implement the location by locator 33a, 33b, 33c, 33d corresponding to this treatment chamber.
Prescriptions such as aforementioned control program or treatment conditions data can be stored in the medium that computer can read, CD-ROM for example, the state of hard disk, floppy disk, flash memories etc. uses down, perhaps can install from other, for example transmits the online use in ground at any time by special circuit.
Next, with reference to Fig. 4～Fig. 8, describe to contraposition mechanism of the present invention with to method for position.Fig. 4 is the stereogram that the inside of expression load locking room 30 constitutes.Among Fig. 4, untreated substrate S is moved in the load locking room 30 from atmospheric side peristome 30a, takes out of to transfer chamber 20 from inlet side peristome 30b shown in thick arrow.
In load locking room 30, be provided with substrate S temporarily is positioned over inside and keeps their buffer gear.Specifically, buffer gear is made of buffer opposite each other 31,32.Buffer 31 has the placement section 31a to the side-prominent shelf-like of buffer 32, and same buffer 32 has the placement section 32a to the side-prominent shelf-like of buffer 31.On these placement sections 31a, 32a, constitute the edge part of the inside that can support substrate S.In addition, also can be set as multistage to the placement section 31a and the 32a of buffer 31,32, for example two sections, so that can place a plurality of substrate S.
In load locking room 30, disposing locator 33a, 33b, 33c and the 33d of the contraposition that is used for being positioned over the substrate S on the buffer 31,32.These locators 33a, 33b and locator 33c, 33d across the substrate-placing area configurations on position substantially symmetrical to the other so that be contacted with near two relative bights of substrate S from four point locations.
The basic comprising of each locator 33a, 33b, 33c and 33d is identical.That is to say the bar 35 that each locator 33a, 33b, 33c, 33d advance and retreat on rectilinear direction by the actuator portion 34 of built-in for example not shown stepping motor, by the power of this actuator portion 34 and be located at the front end of this bar 35 and the contact block 36 that is contacted with the end of substrate S and pushes it gently constitutes.In addition, as long as locator 33a, 33b, 33c, 33d can be contacted with substrate S and contraposition is just passable, are not limited to the formation of present embodiment.
Each locator 33a, 33b, 33c, the 33d of non operating state for example can be positioned on the retreating position in vertical direction by not shown elevating mechanism, so that do not become substrate S are not moved into obstacle when the load locking room 30.In addition, also can be disposed at the position of staggering to locator 33a, 33b, 33c, 33d regularly with the handover path of substrate S.For example, situation to Fig. 4 describes, by locator 33b being disposed at side by side the next door of locator 33a, locator 33d is disposed at side by side the next door of locator 33c, and by at the front end of locator 33b, 33d, the known direction transformation mechanism that press direction with bar 35 is transformed into orthogonal direction (from directions X to the Y direction) is housed can realize.
Form the substrate S of rectangle, in load locking room 30, locate contact at 4, carry out the contraposition of X-Y direction by the contact block 36 of locator 33a, 33b, 33c, 33d.The position of the substrate S of institute's contraposition this moment as described later, corresponding to the processing position in each treatment chamber 10a, 10b, the 10c, with regard to each treatment chamber 10a, 10b, 10c, can be distinguished separately and set.And, be used for the corresponding position, processing position of each treatment chamber 10a, 10b, 10c on make locator 33a, the 33b of substrate S contraposition, the contact position of 33c, 33d, can be stored in storage part 63 as positional information based on the displacement of each contact block 36.In addition, in storage part 63, positional information as locator 33a, 33b, 33c, 33d, except aforementioned contact position, for example can store corresponding to by transfer mechanism 43 substrate S from load locking room 30 when atmospheric side is taken out of the positional information of taking out of the position and be not contacted with the positional information of the off-position (OFF position) of substrate S corresponding to contact block 36.
Like this, that is adjusted in load locking room 30 transmits intactly preserving when the handing-over of the substrate support plate 54 of the fork shape of transfer mechanism 50 corresponding to the position (mainly being the angle of the XY direction of substrate S) of the substrate S of each treatment chamber 10a, 10b, 10c, is reflected in the processing position of the substrate S when being disposed in each treatment chamber 10a, 10b, the 10c by substrate support plate 54 to substrate S.
In addition, though in the execution mode, in order to carry out inching easily, so locator 33a, 33b, 33c, 33d all have movable bar 35 and contact block 36, form and be on the XY direction on one side pushing gently at 4 contacts site and push substrate S and the formation of contraposition on one side, but also can locator 33a, 33b or 33c, 33d arbitrary group for movable but be fixed in certain position.For example, it is fixed can making locator 33a, 33b, carries out contraposition by the pushing of locator 33c, 33d.
Because the maximization of substrate S in recent years, treatment chamber 10a, 10b, 10c also are in the tendency of maximization, so even the error when the set handling chamber 10a, 10b, 10c is very little, it is very big that the changing of the relative positions of the allocation position of substrate S also becomes easily.Always,, exist the danger that influence is handled so the small error that the position is set of treatment chamber 10a, 10b, 10c all can be reflected in the configuration of the opposing substrates S in the treatment chamber because in load locking room 30, on a position, carry out contraposition.Therefore, by at treatment chamber 10a, 10b, the 10c action of teaching transfer mechanism 50 respectively, be configured the inching of position.But, for the action of teaching transfer mechanism 50 critically, so that can need very big work operations amount corresponding to the small changing of the relative positions of the position of treatment chamber 10a, 10b, 10c.That is to say, always, in the location of in load locking room 30, being carried out, even to transfer mechanism 50 (the 1st arm 52, the 2nd arm 53 and substrate support plate 54) delivery position can unify, manage throughout on the position of the substrate S in chamber 10a, 10b, the 10c and also produce deviation.
In the present invention, not only carry out the location in the load locking room 30 of transfer mechanism 50 and the handing-over usefulness of substrate support plate 54, and consider the small difference that the position is set intrinsic among each treatment chamber 10a, 10b, the 10c, in load locking room 30, on a plurality of positions, position, substrate S is under the state of moving into each treatment chamber 10a, 10b, 10c thus, in officely where manages among chamber 10a, 10b, the 10c all that may command becomes chamber identical with the relative position relation of substrate S.Because use this control of locator 33a, 33b, 33c, 33d, make the correct processing position among each treatment chamber 10a, 10b, the 10c corresponding just passable with 1: 1 ground of contact position of locator 33a, 33b, 33c, 33d, so can be extremely simply, and easily implement.Therefore, compare with teaching always to transfer mechanism 50, can be especially easily, and stipulate allocation position among each treatment chamber 10a, 10b, the 10c reliably.
Next, with reference to Fig. 5 and Fig. 6, to method for position is elaborated in the present embodiment.Fig. 5 is for example flow chart of the contraposition order under the situation of treatment chamber 10a of expression.Fig. 6 schematically represents the treatment chamber 10a when the contraposition and the key diagram of the state in the load locking room 30.
As shown in Fig. 6 (a), at first, transfer substrate S by substrate support plate 54, move into handle chamber 10a after, consider and the relative position of treatment chamber 10a, to being positioned at correct processing position, (step S10) is set.In addition, here because purpose is the correct contraposition of carrying out among the treatment chamber 10a,, also can for example manually carry out by other means so when substrate S being moved into processing chamber 10a, there is no need necessarily to use substrate support plate 54.
Then, as shown in Fig. 6 (b), take out the substrate S that is arranged in the treatment chamber 10a with substrate support plate 54, conveyance is positioned on the buffer 31,32 (step S11) to load locking room 30.At this moment, the placement location of substrate S is reflecting the correct processing position in the aforementioned processing chamber 10a.Under this state, make locator 33a, 33b, 33c, 33d work and bar 35 is extended, make contact block 36 approaching according to the mode of not moving substrate S, as shown in Fig. 6 (c), be contacted with substrate S (step S12).So, the position corresponding to the substrate S in the load locking room 30 of treatment chamber 10a is determined.This position as the positional information corresponding to treatment chamber 10a, passes out to control part 60 based on the displacement (the turnover amount of bar 35) of each contact block 36 among locator 33a, 33b, 33c, the 33d, is stored in memory 63 (step S13).
As above, by the order of the step S10 shown in Fig. 5～step S13, can determine locator 33a, the 33b corresponding to treatment chamber 10a, the contact position of 33c, 33d, store as positional information.Repeat this order by number (in the present embodiment, treatment chamber has three, is 10a, 10b, 10c), can determine the contact position of locator 33a, 33b, 33c, 33d, store at each treatment chamber according to treatment chamber.
In addition, Fig. 6 (d) illustrates based on the position corresponding to treatment chamber 10a that is stored in storage part 63, untreated substrate S is carried out the state of contraposition in load locking room 30.Comprise that an example of the substrate disposal order in this stage is shown in the flow chart of Fig. 7.At first,, substrate S is moved into load locking room 30, be positioned on the buffer 31,32 (step S20) by substrate transfer mechanism 43 according to common handling process.Then, among treatment chamber 10a, 10b, 10c, determine the predetermined chamber of transferring (step S21).Here, by the state of process controller 61, for example whether can use, whether be to be in the chamber of processing intent and the processing progress of a last substrate S etc. to be the basis, determine to transfer the chamber of destination with each treatment chamber 10a, 10b, 10c.Then, in step S22, read the positional information of treatment chamber (for example treatment chamber 10a) from the storage part 63 of control part 60 corresponding to determined handover destination.This processing is undertaken by process controller 61.
Then, in step S23, based on the positional information of being read, process controller 61 makes locator 33a, 33b, 33c, 33d work, for example location of implementing substrate S according to the mode that becomes fixed position in treatment chamber 10a.Specifically, as shown in Figure 8,, in the treatment chamber 10a that transfers the destination,, for example carry out the location of substrate S according to the mode that becomes position A as intrinsic position with respect to the position of being moved into by the substrate transfer mechanism 43 of atmospheric side (moving into the position).In addition, for example transferring under the situation that the destination is treatment chamber 10b, position B is selected, is under the situation of treatment chamber 10c transferring the destination, and position C is selected.In addition, in Fig. 8,, only illustrate a part and locator 33a, the 33b of substrate S, and more emphasized the position (angle etc.) of the substrate S in each position than reality for the facility that illustrates.
The location keeps out of the way locator 33a, 33b, 33c, 33d after finishing, and by substrate support plate 54 substrate S is taken out of from load locking room 30, is transplanted on selected treatment chamber (for example, treatment chamber 10a) (step S24).Then, in treatment chamber 10a, carry out processing (step S25) such as plasma etch process.At this moment, because substrate S is positioned over regular processing position in treatment chamber 10a, so can realize not producing the irregular high-precision processing of processing.
In addition, after substrate S enforcement predetermined process, take out of substrate S from treatment chamber 10a, move into load locking room 30 once more by substrate support plate 54.At this moment, locator 33a, 33b, 33c, 33d are moved once more, make substrate S take out of the position being positioned at.This take out of position and substrate S when atmospheric side is moved into load locking room 30 at first to move into position (with reference to Fig. 8) as initial position aforementioned be identical, this positional information also can be stored in storage part 63 in advance.Like this, by the substrate S that finishes processing is resetted in the position of taking out of as the home position, can successfully use the handing-over when the substrate transfer mechanism 43 taking-up substrate S of atmospheric side for example are contained in box 40 in load locking room 30.
In addition, the invention is not restricted to above-mentioned execution mode, all distortion are possible.For example, as handled object, being not limited to the glass substrate that FPD uses, also can be semiconductor wafer.
And then, though in load locking room 30, be equipped with locator 33a, 33b, 33c, 33d in the above-described embodiment, but also can be provided to locator 33a, 33b, 33c, 33d for example in the transfer chamber 20, by carrying out contraposition, also can obtain and above-mentioned same effect in this case corresponding to treatment chamber 10a, 10b, 10c.And then, the dedicated chamber (for example locating chamber) that is used for locating also can be set, be equipped with locator 33a, 33b, 33c, 33d therein and carry out contraposition.
Claims (8)
1. one kind to method for position, and this, positioned in processing unit before handling handled object method for position, it is characterized in that,
Described processing unit possesses:
Be used to handle the process chamber of handled object;
Transfer the transfer mechanism of handled object to described process chamber;
Contraposition mechanism, described contraposition mechanism by described transfer mechanism with handled object before described process chamber is transferred, in the orientation room of the outside of described process chamber, carry out the location of handled object;
Storing mechanism, described storing mechanism will be stored accordingly as the positional information on the basis of the location of being undertaken by described contraposition mechanism and the processing position of the handled object in the described process chamber; And
Controlling organization, described controlling organization is controlled described contraposition mechanism based on the described positional information that is stored in the described storing mechanism,
The operation that described positional information is stored in the described storing mechanism comprises:
Teaching is moved into described process chamber with handled object, to being positioned at the step of correct processing position;
By described transfer mechanism, the teaching that contraposition is finished with handled object with keep with described process chamber in the state of corresponding relation of described processing position, the step of in described orientation room, transferring from described process chamber; And
Based on the teaching in described orientation room, transferred position, regulate described contraposition mechanism, as the step that is stored in corresponding to the positional information of described process chamber in the described storing mechanism with handled object.
2. as claimed in claim 1 method for position be is characterized in that,
Described process chamber exists a plurality of, described contraposition mechanism, based on be stored in described storing mechanism and with described a plurality of process chambers in the corresponding a plurality of positional informations in processing position of handled object among, with the predetermined corresponding positional information of process chamber that will handle, carry out the location of handled object.
3. as claimed in claim 1 or 2 method for position be is characterized in that,
Described orientation room is a preparatory vacuum chamber.
4. as claimed in claim 1 or 2 method for position be is characterized in that,
Described orientation room is the transfer chamber that possesses described transfer mechanism.
5. a processing unit is characterized in that,
Possess:
Be used to handle the process chamber of handled object;
Transfer the transfer mechanism of handled object to described process chamber;
Contraposition mechanism, described contraposition mechanism by described transfer mechanism with handled object before described process chamber is transferred, carry out the contraposition of handled object in the outside of described process chamber;
Storing mechanism, described storing mechanism will with the corresponding contraposition position, processing position of handled object in the described process chamber as positional information, store; And
Controlling organization, described controlling organization be based on the described positional information that is stored in the described storing mechanism, described contraposition mechanism controlled,
Wherein,
Described contraposition mechanism has by being contacted with a plurality of contact sites that handled object carries out contraposition,
Described positional information obtains with handled object by making described contact site be contacted with the teaching of having carried out contraposition in advance in described process chamber.
6. processing unit as claimed in claim 5 is characterized in that,
Described process chamber exists a plurality of, described contraposition mechanism, based on be stored in described storing mechanism and with described a plurality of process chambers in the corresponding a plurality of positional informations in processing position of handled object among, with the predetermined corresponding positional information of process chamber that will handle, carry out the contraposition of handled object.
7. as claim 5 or 6 described processing unit, it is characterized in that,
Described contraposition mechanism positions by make described contact site be contacted with described handled object from mutually orthogonal both direction.
8. processing unit as claimed in claim 7 is characterized in that,
Described a plurality of contact site, displacement independently of each other and contacting with handled object.
Applications Claiming Priority (3)
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| JP2005144886 | 2005-05-18 | ||
| JP2005144886A JP4849825B2 (en) | 2005-05-18 | 2005-05-18 | Processing apparatus, alignment method, control program, and computer storage medium |
| JP2005-144886 | 2005-05-18 |
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| CNB2006100802949A Division CN100511633C (en) | 2005-05-18 | 2006-05-16 | Processing unit and aligning method |
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| CN101447444A CN101447444A (en) | 2009-06-03 |
| CN101447444B true CN101447444B (en) | 2011-04-13 |
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| JP (1) | JP4849825B2 (en) |
| KR (1) | KR100809125B1 (en) |
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| KR101007710B1 (en) * | 2008-03-26 | 2011-01-13 | 주식회사 에스에프에이 | Loadlock chamber for chemical vapor deposition apparatus |
| TWI458587B (en) * | 2012-01-17 | 2014-11-01 | Chin Yen Wang | Calibration apparatus |
| CN103569672B (en) * | 2012-07-20 | 2016-03-09 | 上海微电子装备有限公司 | The transmitting device of a kind of compatible silicon chip and glass substrate |
| JP2014075432A (en) * | 2012-10-03 | 2014-04-24 | Hioki Ee Corp | Substrate support device and substrate checking device |
| CN105529278B (en) * | 2014-09-29 | 2019-08-16 | 盛美半导体设备（上海）有限公司 | Process the device of semiconductor structure |
| JP6298109B2 (en) * | 2016-07-08 | 2018-03-20 | キヤノントッキ株式会社 | Substrate processing apparatus and alignment method |
| JP7105629B2 (en) * | 2018-06-20 | 2022-07-25 | 東京エレクトロン株式会社 | Automatic teaching method and control device |
| CN109904101B (en) * | 2019-01-28 | 2021-09-03 | 拓荆科技股份有限公司 | Wafer transferring and measuring system |
| JP7259476B2 (en) | 2019-03-27 | 2023-04-18 | 東京エレクトロン株式会社 | Alignment apparatus, substrate processing apparatus, alignment method, and substrate processing method |
| CN110504185B (en) * | 2019-08-27 | 2022-02-11 | 北京芯可鉴科技有限公司 | Testing and reinforcing method of ESD protection unit |
| JP2022135185A (en) * | 2021-03-04 | 2022-09-15 | 東京エレクトロン株式会社 | Substrate position control method and substrate processing system |
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| JP4849825B2 (en) | 2012-01-11 |
| TWI390657B (en) | 2013-03-21 |
| CN101447444A (en) | 2009-06-03 |
| CN1866493A (en) | 2006-11-22 |
| TW200709327A (en) | 2007-03-01 |
| CN100511633C (en) | 2009-07-08 |
| JP2006324366A (en) | 2006-11-30 |
| KR100809125B1 (en) | 2008-03-03 |
| KR20060119815A (en) | 2006-11-24 |
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