CN101118864A - Substrate detecting mechanism and substrate processing device using the same - Google Patents
Substrate detecting mechanism and substrate processing device using the same Download PDFInfo
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- CN101118864A CN101118864A CNA2007101402238A CN200710140223A CN101118864A CN 101118864 A CN101118864 A CN 101118864A CN A2007101402238 A CNA2007101402238 A CN A2007101402238A CN 200710140223 A CN200710140223 A CN 200710140223A CN 101118864 A CN101118864 A CN 101118864A
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- state
- support component
- holding state
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
Abstract
The invention provides a substrate detector for detecting whether the supporting state of accurately and easily supporting substrate is normal or not. The said substrate detector comprises lifting pin (130) for supporting the substrate (G) at a height position which can be conveyed, a substrate detection light sensor (141) for detecting whether the substrate is exist or not at the height position of lifting pin (130) supporting the substrate (G), a space detection light sensor (142) for detecting whether the substrate is exist or not below the height position of lifting pin (130) supporting the substrate (G). When the substrate detection light sensor (141) detects the substrate and the space detection light sensor (142) detects that the substrate is not exist, the supporting state of substrate is judged to be normal and when the substrate detection light sensor (141) detects that the substrate is not exist and the space detection light sensor (142) detects the substrate, the supporting state of substrate is judged to be abnormal.
Description
Technical field
The present invention relates to a kind of substrate detecting mechanism and a kind of substrate board treatment that uses it that under the state of mounting, substrate is detected for substrates such as the glass substrate of liquid crystal indicator flat-panel monitors such as (LCD) (FPD) being made usefulness, semiconductor wafer carry out conveyance.
Background technology
In the manufacture process of flat-panel monitor (FPD) that with LCD (LCD) is representative, use the vacuum flush system of the so-called many chamber profile that comprise a plurality of vacuum treatment installations of under vacuum, regulations such as glass substrate enforcement etching, ashing, film forming being handled.
Such vacuum flush system comprises the carrying room of the carrying device that is provided with the conveyance substrate and a plurality of treatment chamber (process chamber) that are provided with around it, utilize the carrying arm in the carrying room, processed substrate is moved in each treatment chamber and with the substrate that disposes from the treatment chamber of each vacuum treatment installation, taken out of.Load-lock (1oad 1ock) chamber is connected with carrying room, and when moving into of the substrate of atmospheric side taken out of, it was constant and a plurality of substrates are handled treatment chamber and carrying room can be maintained vacuum state.The treatment system of many chamber profile like this is for example open in patent documentation 1.
In such treatment system, when glass substrate is moved into treatment chamber, utilize the carrying arm in the carrying room glass substrate conveyance to be arrived the top of handling the substrate-placing platform in the chamber, by making lifter pin outstanding from substrate-placing platform, glass substrate is positioned on the lifter pin, carrying arm is kept out of the way in carrying room.After this, lifter pin is descended, glass substrate is positioned on the substrate-placing platform.In addition, with glass substrate when treatment chamber is taken out of, utilize lifter pin that the glass substrate on the mounting table is risen, it is handover to carrying arm in the carrying room.
In this case, glass substrate is being handover under the state of lifter pin, glass substrate is offset sometimes or ruptures, but, the skew and the fracture of such glass substrate do not detected, even skew and fracture take place, the conveyance action is also proceeded in the past, accompany therewith, can occur in and produce scar in the device or secondary breakages such as complicated fracture do not take place for the glass substrate fracture of breaking state or the glass substrate that fracture,simple only takes place.
In order to prevent the secondary breakage of such glass substrate, need a kind of technology that under the state that glass substrate is risen by lifter pin, the state of substrate is detected.The technology that detects as state to substrate, typically use optical sensor, a kind of technology is disclosed in patent documentation 2: send light from illuminating part abreast with the plate surface as mounting table, when the light income in the light accepting part is lower than setting, think that the mounting of substrate takes place unusual.
[patent documentation 1] spy opens flat 11-340208 communique
[patent documentation 2] spy opens the 2002-353292 communique
But, in the technology of above-mentioned patent documentation 2, though the mounting that can detect when being positioned on the mounting table is unusual, but, glass substrate is thinner, sometimes under the state that bigger bending takes place, supported by lifter pin, so, even use the state that this technology also may not correctly be held glass substrate.In addition, require this detection simple and easy.
Summary of the invention
The present invention In view of the foregoing makes, its purpose be to provide a kind of can be correctly and simply to can conveyance ground the holding state of substrate during supporting substrate the no abnormal substrate detecting mechanism that detects is arranged and uses its substrate board treatment.
In order to solve above-mentioned problem, a first aspect of the present invention provides a kind of substrate detecting mechanism, this substrate detecting mechanism is used for the holding state with the supported substrate of state that can conveyance is detected, and it is characterized in that, comprising: at the support component of height and position supporting substrate that can conveyance; The first sensor that has or not substrate to detect to height and position at above-mentioned supporting units support substrate; Second transducer that has or not substrate to detect to lower position at the height and position of above-mentioned supporting units support substrate; With detected substrate and above-mentioned second sensor when above-mentioned first sensor when going out not have substrate, the holding state of judging the substrate on the above-mentioned support component is for normal, when above-mentioned first sensor detects no substrate or above-mentioned second sensor when going out substrate is arranged, the holding state of judging the substrate on the above-mentioned support component is unusual operational part.
In addition, a second aspect of the present invention provides a kind of substrate board treatment, it is characterized in that, comprising: the container handling of accommodating substrate; The mounting table of mounting substrate in above-mentioned container handling; The height and position of the regulation above above-mentioned mounting table is with the support component of state supporting substrate that can the conveyance substrate; Substrate on the mounting table is implemented the processing mechanism of processing; The first sensor that has or not substrate to detect to height and position at above-mentioned supporting units support substrate; Second transducer that has or not substrate to detect to lower position at the height and position of above-mentioned supporting units support substrate; When above-mentioned first sensor has detected substrate and above-mentioned second sensor when going out not have substrate, the holding state of judging the substrate on the above-mentioned support component is for normal, when above-mentioned first sensor detects no substrate or above-mentioned second sensor when going out substrate is arranged, the holding state of judging the substrate on the above-mentioned support component is unusual operational part; With when above-mentioned operational part judges that the holding state of substrate is unusual, provide the instruction department of the instruction that stops the conveyance substrate at least.
In above-mentioned first aspect and above-mentioned second aspect,, can use optical sensor with light-emitting component and photo detector as above-mentioned first sensor and above-mentioned second transducer.
In addition, in above-mentioned first aspect and above-mentioned second aspect, above-mentioned first sensor and above-mentioned second transducer respectively have 2, when 2 above-mentioned first sensor boths have detected substrate, and when 2 above-mentioned second transducer boths detect no substrate, above-mentioned operational part judges that the holding state of the substrate on the above-mentioned support component is for normal, in 2 above-mentioned first sensors at least one detects no substrate, when perhaps at least one in 2 above-mentioned second transducers detected substrate, above-mentioned operational part judged that the holding state of the substrate on the above-mentioned support component is for unusual.
In addition, in above-mentioned first aspect and above-mentioned second aspect, can constitute: a plurality of lifter pins of above-mentioned support component for being provided with up and down with respect to the mounting table of mounting substrate, this lifter pin from the outstanding position of above-mentioned mounting table with state supporting substrate that can the conveyance substrate.
In above-mentioned second aspect, can constitute: when above-mentioned operational part judged that the holding state of substrate is unusual, above-mentioned instruction department provided the instruction that gives the alarm.
According to the present invention, utilize support component to come supporting substrate at height and position that can conveyance, the first sensor that has or not substrate to detect to the height and position at the supporting units support substrate is set, with second transducer that has or not substrate to detect to lower position at the height and position of supporting units support substrate, when first sensor has detected substrate, and when second sensor goes out not have substrate, the holding state of judging the substrate on the support component is normal, when first sensor detects no substrate, when perhaps second sensor goes out substrate is arranged, the holding state of judging the substrate on the support component is unusual, therefore, adopt relatively more easy structure just can correctly detect can conveyance the holding state of the substrate during supporting substrate have no abnormal.In addition, because can detect the holding state of the substrate before the conveyance like this, so, at the holding state that detects substrate there is the unusual moment, can stop to major general's carrying device, thereby can prevent the secondary breakage of substrate effectively.
Description of drawings
Fig. 1 is equipped with stereogram as many chamber profile plasma etch system of the plasma-etching apparatus of an execution mode of substrate board treatment of the present invention for expression roughly.
Fig. 2 is the horizontal sectional view of the inside of the plasma etch system of presentation graphs 1 roughly.
Fig. 3 is the sectional view of A-A line among Fig. 2 of plasma-etching apparatus of an embodiment of the invention.
Fig. 4 is the horizontal sectional view of the plasma-etching apparatus of an embodiment of the invention.
Fig. 5 is the side view of the plasma-etching apparatus of an embodiment of the invention.
Fig. 6 is the block diagram of the apparatus control portion of expression plasma-etching apparatus.
Fig. 7 is used for the flow chart that the sequence of movement to the detection of the carrying state that comprises glass substrate of the plasma-etching apparatus of an embodiment of the invention describes.
Fig. 8 is used to illustrate that the carrying state of substrate is judged as the schematic diagram of normal state.
Fig. 9 is used to illustrate that the carrying state of substrate is judged as the schematic diagram of an example of unusual state.
Figure 10 is used to illustrate that the carrying state of substrate is judged as the schematic diagram of another example of unusual state.
Figure 11 is used to illustrate that the carrying state of substrate is judged as the schematic diagram of another example of unusual state.
Symbol description
1 plasma etch system
10 plasma-etching apparatus
20 carrying rooms
22 gate valves
30 load locking rooms
50 carrying devices
52 substrate transferring arms
60 process controllers (process controller)
102 chambers
104 pedestals
130 lifter pins
140a, 140b window
141 substrates detect optical sensor (first sensor)
Optical sensor (second transducer) is detected in 142 spaces
150 apparatus control portion
151 operational parts
152 instruction departments
153 alarm devices
The G glass substrate
Embodiment
Below, with reference to accompanying drawing optimal way of the present invention is described.At this, with as an execution mode of substrate board treatment of the present invention, to be equipped with the plasma etch system of many chamber profile that the glass substrate G that FPD is used carries out the plasma-etching apparatus of plasma etching be that example describes.At this,, can enumerate LCD (LCD), light-emitting diode (LED) display, electroluminescence (Electro Luminescence as FPD; EL) display, fluorescent display tube (Vacuum Fluorescent Display; VFD), plasma display (PDP) etc.
Fig. 1 is for roughly representing the stereogram of the plasma etch system of many chamber profile, and Fig. 2 is for roughly representing the horizontal sectional view that it is inner.
At the central portion of this plasma etch system 1, carrying room 20 is connected setting with load locking room 30.Around carrying room 20, be connected with 3 plasma-etching apparatus 10.
Be communicated with between carrying room 20 and the load locking room 30, will be communicated with between carrying room 20 and each plasma-etching apparatus 10 and, insert respectively and be provided with the gate valve 22 that can open and close sealing airtightly between them and constituting with the peristome that load locking room 30 is communicated with the air atmosphere in the outside.
Arranged outside at load locking room 30 has 2 box protractors (cassette indexer) 41, and mounting has the box 40 of accommodating glass substrate G respectively thereon.For example can in of these boxes 40, accommodate untreated substrate, in another, accommodate the substrate that disposes.These boxes 40 can carry out lifting by elevating mechanism 42.
Between these 2 boxes 40, brace table 44 is provided with transport mechanism 43, and this transport mechanism 43 possesses: the pick-up (pick) 45,46 about being arranged in 2 sections; And can pass in and out the pedestal 47 of keeping out of the way and supporting them rotatably integratedly.
As shown in Figure 2, each formation portion of plasma etch system 1 becomes the structure of being controlled by the process controller 60 with microprocessor.User interface 61 is connected with this process controller 60, and this user interface 61 is used for by the process management person that article on plasma body etch system 1 manages and the keyboard and the operational situation of plasma etch system 1 is visual and the display that shows etc. that carry out the input operation etc. of order constitute.In addition, storage part 62 is connected with process controller 60, and this storage part 62 stores the scheme that records the control program (software) that is used for being implemented in the various processing that plasma etch system 1 carries out under the control of crossing thread processor 60 and treatment conditions data etc.As required, according to from the indication of user interface 61 etc., from storage part 62, access arbitrarily scheme and it is carried out by process controller 60, thus, under the control of process controller 60, the processing of in plasma etch system 1, expecting.The scheme of above-mentioned control program and treatment conditions data etc. can be utilized the scheme that is stored in the state in the storage medium that computers such as CD-ROM, hard disk, floppy disk, flash memories for example can read.
Then, article on plasma body Etaching device 10 at length describes.Fig. 3 is the sectional view of A-A line among Fig. 2 of plasma-etching apparatus 10, and Fig. 4 is its horizontal sectional view, and Fig. 5 is its side view.This plasma Etaching device 10 for example has by the surface and has carried out the chamber that is shaped to the angle barrel shape 102 that the aluminium of alumite (anodized) is made.
Bottom in this chamber 102 be provided be used for mounting as the substrate-placing platform of the glass substrate G of processed substrate, be pedestal 104.In this pedestal 104, can insert up and down and be connected with the lifter pin 130 that is used for to the loading and unloading of its enterprising oozy glass substrate G.This lifter pin 130 rises to the conveyance position above the pedestal 104 when conveyance glass substrate G, the time beyond this, be in the state in the pedestal 104 that submerges.Pedestal 104 is supported on the bottom of chamber 102 by insulating element 107, and has the insulating element 106 that metal base material 105 and periphery at base material 105 are provided with.
The supply lines 123 that is used for supply high frequency electric power is connected with the base material 105 of pedestal 104, and adaptation 124 is connected with this supply lines 123 with high frequency electric source 125.Supply with for example High frequency power of 13.56MHz from high frequency electric source 125 to pedestal 104.
Above said base 104, with these pedestal 104 parallel shower nozzles 111 that work as upper electrode that relatively are provided with.Shower nozzle 111 is supported on the top of chamber 102, has inner space 112 in inside, and with the opposite face of pedestal 104 on be formed with a plurality of squit holes 113 that gas is handled in ejection.This shower nozzle 111 is grounded, and constitutes the pair of parallel plate electrode with pedestal 104.
On shower nozzle 111, be provided with gas introduction port 114, handle gas supply pipe 115 and be connected, handle gas supply source 118 and be connected with this processing gas supply pipe 115 with mass flow controller 117 by valve 116 with this gas introduction port 114.Be used for etched processing gas from handling 118 supplies of gas supply source.As handling gas, can use gas, the O of halogen system
2Normally used gas in this field such as gas, Ar gas.
Be formed with blast pipe 119 in the bottom of above-mentioned chamber 102, exhaust apparatus 120 is connected with this blast pipe 119.Exhaust apparatus 120 comprises turbomolecular pump equal vacuum pump, can will be evacuated to the reduced atmosphere of regulation in the chamber 102 thus.In addition, the sidewall of chamber 102 is provided with substrate and moves into and take out of mouthful 121 (with reference to Fig. 4), and this substrate is moved into and taken out of mouthfuls 121 and can open and close by above-mentioned gate valve 22.Under the state of this gate valve 22 being opened, utilize carrying room 20 interior carrying devices 50 that glass substrate G is moved into and take out of.
Moving on the pair of sidewalls 102a that takes out of mouthfuls 121 sidewall quadrature of chamber 102, take out of oral-lateral and opposition side is respectively arranged with window 140a and 140b moving into being formed with substrate.Each window 140a of 2 each other and 140b be oppositely arranged separately from each other, they all are set at the position of equal height of the top of the tight inside part of lifter pin 130 and pedestal 104.On the window 140a and 140b of a side, be provided with substrate in the position corresponding and detect optical sensor 141 with the glass substrate G of state after lifter pin 130 rises, thereunder be provided with the space and detect optical sensor 142.In addition, on the window 140a and 140b of opposite side, be provided with the speculum 143,144 that the light to optical sensor 141 and 142 reflects.Optical sensor 141 and 142 all has light-emitting component and photo detector, and the light that penetrates from light-emitting component is reflected by speculum 143 or 144, by photo detector this reverberation is detected.Utilize these optical sensors 141 and 142, the state of the glass substrate G on the lifter pin 130 that rises to the conveyance position is detected.The light transmission parts 145 that are made of quartz are installed on window 140a, 140b, in addition, utilize sectional fixture 146 that optical sensor 141,142 is installed on window 140a, the 140b.In addition, as the light of optical sensor 141 and 142, can suitably use the big infrared ray of diameter, but be not limited thereto.
In addition, plasma-etching apparatus 10 comprises the apparatus control portion 150 that its each formation portion is controlled.As shown in Figure 6, apparatus control portion 150 is connected with said process controller 60, and carries out the control of each formation portion according to its instruction.In addition, above-mentioned optical sensor 141 and 142 detection signal are transfused in the apparatus control portion 150, and apparatus control portion 150 comprises: operational part 151, according to this detection signal the state of glass substrate G is judged; With instruction department 152, the carrying state of judging glass substrate G at this operational part 151 has under the unusual situation, to alarm device 153 provide the instruction and give the alarm, and, by process controller 60 action of the carrying device 50 of carrying room 20 is stopped, in addition, each the formation portion to plasma-etching apparatus 10 provides the instruction that action is stopped.In addition, from the viewpoint of the secondary breakage that prevents glass substrate G, stop to get final product to the action of major general's carrying device 50.
Then, the action of the processing in the plasma etch system 1 of such formation is described.At first, 2 pick-ups, 45,46 advance and retreat of transport mechanism 43 are driven, from a box 40 that contains untreatment base, 2 sheet glass substrate G are moved in 2 sections the substrate reception room 31 of load locking room 30.
After pick- up 45,46 is kept out of the way, the gate valve 22 of the atmospheric side of load locking room 30 is closed.After this, to carrying out exhaust in the load locking room 30, with inner pressure relief to the specified vacuum degree.After vacuumizing end, push the location that substrate carries out glass substrate G by utilizing locator 33.
After positioning as described above, gate valve 22 between carrying room 20 and the load locking room 30 is opened, the glass substrate G that utilizes the carrying devices 50 in the carrying room 20 to receive in the substrate resettlement section 31 that is housed in load locking room 30, and it is moved into plasma-etching apparatus 10.
Specifically, under the state on the substrate transferring arm 52 that glass substrate G is positioned in carrying device 50, glass substrate G is moved in the chamber 102 of plasma-etching apparatus 10 from carrying room 20.Then, make lifter pin 130 rise to the conveyance position, glass substrate G is handed off on the lifter pin 130 from substrate transferring arm 52.After this, make substrate transferring arm 52 after carrying room 20 is kept out of the way, lifter pin 130 is descended, glass substrate G is being positioned on the pedestal 104.
After this, gate valve 22 is closed, utilize exhaust apparatus 120 to be evacuated to the specified vacuum degree in the chamber 102.Then, valve 116 is open, utilize mass flow controller 117 to adjust the flow of handling gas on one side, gas imports shower nozzle 111 by processing gas supply pipe 115, gas introduction port 114 from processing gas supply source 118 inner space 112 will be handled in one side, and then, spray to substrate G equably by squit hole 113, while regulate the pressure that air displacement is made as chamber 102 internal controls regulation.
Under this state, predetermined process gas is imported in the chamber 102 from handling gas supply source 118, and apply High frequency power to pedestal 104 from high frequency electric source 125, between as the pedestal 104 of lower electrode and shower nozzle 111, produce high-frequency electric field as upper electrode, and generate the plasma of handling gas, utilize this plasma that glass substrate G is implemented etch processes.
After like this implementing etch processes, stop to apply High frequency power from high frequency electric source 125 and stop to import handle gas after, the pressure in the chamber 102 are adjusted into the pressure of regulation, utilize lifter pin 130 to make glass substrate G rise to the conveyance position.Under this state, gate valve 22 is open, and in the substrate transferring arm 52 insertion chambers 102 with carrying device 50, the glass substrate G that will be positioned on the lifter pin 130 is handover to substrate transferring arm 52.Then, glass substrate G is moved into by substrate take out of mouthfuls 121 and in chamber 102, take out of to carrying room 20.
From chamber 102 by the glass substrate G that taken out of under the state that is positioned on the substrate transferring arm 52 of carrying device 50 by conveyance to load locking room 30, by transport mechanism 43 it is housed in the box 40.At this moment, can put back in the original box 40, also can be housed in another box 40.
Above such a series of action is repeated and the corresponding number of times of sheet number that is housed in the glass substrate G in the box 40, and processing finishes.
The processing of this moment was being carried out in the past automatically, and the unit that the conveyance to glass substrate G detects unusually is not set, and therefore, even conveyance is unusual, also proceeded conveyance and the processing of glass substrate G.Especially, glass substrate G is being handover under the state of lifter pin 130, when glass substrate G skew or fracture, after this, the conveyance action is proceeded, thus, can occur in and produce scar in the device or secondary breakages such as complicated fracture do not take place for the glass substrate fracture of breaking state or the glass substrate that fracture,simple only takes place.
Therefore, in the present embodiment, under the state on the lifter pin 130 that glass substrate G is positioned in rise to the conveyance position, the carrying state of glass substrate G is detected, it is no abnormal to judge that it has, thereby avoids above-mentioned undesirable condition.
Then, with reference to the flow chart of Fig. 7, the sequence of movement of the detection of the carrying state that comprises such glass substrate G is carried out specific description.At first, utilize substrate transferring arm 52 with substrate-placing (step 1) on the lifter pin 130 that is in the conveyance position.Then, make the substrate transferring arm 52 of carrying device 50 from chamber 102, keep out of the way (step 2), utilize substrate detection optical sensor 141 and space to detect optical sensor 142 and detect (step 3).
According to the testing result in this step 2, whether 150 couples of glass substrate G of apparatus control portion normally are positioned on the lifter pin 130 is judged (step 4).The judgement of this moment, the photo detector that 2 substrates is detected optical sensor 141 is not subjected to the photo detector of light, 2 space detection optical sensors 142 be judged as normally by the state of light, when photo detector that photo detector that any or two substrates detect optical sensors 141 is subjected to the state of light and any or two spaces to detect optical sensors 142 is not existed by in the state of light at least one, be judged as unusual.
Promptly, under glass substrate G normally is positioned in situation on the lifter pin 130, as shown in Figure 8, the light that substrate detection optical sensor 141 will send because of glass substrate G covers and is not subjected to light (substrate detection optical sensor: OK), because of the space segment under it does not exist whatever,, the space receives light (the space detection optical sensor: OK) that sends so detecting optical sensor 142.Relative therewith, receive under the situation of the light that sends when detecting in the optical sensors 141 at any or two substrates at least, expression light is not covered by glass substrate G, judges that the carrying state of glass substrate G is unusual.For example, as shown in Figure 9, under the situation of a lifter pin 130 skews, the substrate of a side that comes off detects optical sensor 141 not by shading (substrate detecting sensor: NG), therefore be judged as unusual at glass substrate G.
But,, also have the unusual situation of carrying state even two substrates detect optical sensor 141 by glass substrate G shading.For example, as shown in figure 10, when taking place under the situation of fracture in the direction that detects the light emission direction quadrature of optical sensor 141 with substrate, although the carrying state of glass substrate G is actually unusually, but the light that sends from 2 substrates detection optical sensors 141 is all covered by glass substrate G, and it is the OK state that substrate detects optical sensor 141.Therefore, detect optical sensor 141 iff substrate is set, the carrying state of the glass substrate G that then can't judge rightly is normally or unusual.But, in the present embodiment, except substrate detects optical sensor 141, also be provided with the space down at it and detect optical sensor 142, because of the glass substrate G of fracture also can cover that (the space detecting sensor: NG), the carrying state that can judge glass substrate G thus is for unusual with detect the light that optical sensor 142 sends from the space.Figure 11 is the situation that glass substrate G ruptures in the direction along the direction of light of sending from optical sensor 141 and 142, in this case, at least one light that sends that substrate detects optical sensor 141 is not blocked, at least one light that sends that optical sensor 142 is detected in the space is blocked, therefore, substrate detection optical sensor 141 and space are detected optical sensor 142 and are NG.
Under the carrying state of judging glass substrate G in step 4 is unusual situation, stop the action of carrying device 50 and plasma-etching apparatus 10, and (the step 5) that gives the alarm.
On the other hand,, lifter pin 130 is descended, glass substrate G is positioned in (step 6) on the pedestal 104 when the carrying state of judging glass substrate G in step 4 is under the normal situation.Then, under this state, glass substrate G is carried out plasma etch process (step 7).
After plasma etch process finishes, lifter pin 130 is risen, make glass substrate G rise to conveyance position (step 8).Then, before carrying arm 52 is inserted into, utilizes substrate detection optical sensor 141 and space to detect optical sensor 142 and detect (step 9).According to the testing result in this step 9, Setup Controller 150 is judged (step 10) according to step 4 same standard whether glass substrate G normally being positioned on the lifter pin 130.
Under the carrying state of judging glass substrate G in step 10 is unusual situation, enter above-mentioned steps 5, the action of carrying device 50 and plasma-etching apparatus 10 is stopped, and give the alarm.
On the other hand, when the carrying state of judging glass substrate G in step 10 is under the normal situation, the substrate transferring arm 52 of carrying device 50 is inserted glass substrate G following, and (step 11) is positioned in glass substrate G on the substrate transferring arm 52, and it is taken out of (step 12) from chamber 102.Thus, a series of release.
Substrate detects optical sensor 141 and the space carrying state of detection 142 couples of glass substrate G of optical sensor on lifter pin 130 detects because be provided with like this, so the carrying state that adopts relatively more easy structure just can correctly detect glass substrate G has no abnormal.In addition, arranged detecting carrying state the unusual moment, can take to stop the action of carrying device 50 and plasma-etching apparatus 10 and the countermeasure that gives the alarm, thereby can prevent the secondary breakage of glass substrate G effectively.In addition, can utilize the extremely easy equipment of only preparing optical sensor detecting unusually to the carrying state of glass substrate G.In addition, also be provided with the space and detect optical sensor 142 except substrate detects optical sensor 141, the carrying state that can detect glass substrate G thus has no abnormal clock like precision.
In addition, the present invention is not limited to above-mentioned execution mode, can carry out various distortion.For example, represented example that the carrying state that is positioned in the substrate on the lifter pin is detected in the above-described embodiment, still, so long as, just be not limited to this to detecting by the supported substrate in conveyance ground.In addition, in the above-described embodiment, detect optical sensor and optical sensor is detected in the space as substrate, used the type that light-emitting component and photo detector is set and reflects in identical position, but also can be the type that light-emitting component and photo detector are oppositely arranged with speculum.And, be not limited to optical sensor, also can be other transducer, number of sensors also is not limited to above-mentioned execution mode.Detect because the space detecting sensor is used for substrate do not existed,, can scan in the horizontal direction so needn't be provided with regularly.In addition, in the above-described embodiment, the example that applies the present invention in the plasma-etching apparatus is illustrated, but be not limited thereto, also can be applied to other substrate board treatment, and then the substrate that also can be applied to the carrying state of the substrate in above-mentioned load locking room 30 preparatory vacuum chambers such as grade detects.
In addition, in the above-described embodiment, as substrate, being illustrated with the example of glass substrate using FPD, still being not limited thereto, also can be other substrate such as semiconductor wafer.
Utilizability on the industry
The present invention can be applied to using lifting pin supporting member that substrate is risen from mounting table After state under, all processes when utilizing carrying device conveyance substrate.
Claims (9)
1. substrate detecting mechanism is used for the holding state with the supported substrate of state that can conveyance is detected, and it is characterized in that, comprising:
Support component at height and position supporting substrate that can conveyance;
The first sensor that has or not substrate to detect to height and position at described supporting units support substrate;
Second transducer that has or not substrate to detect to lower position at the height and position of described supporting units support substrate; With
When described first sensor has detected substrate and described second sensor when going out not have substrate, the holding state of judging the substrate on the described support component is for normal, when described first sensor detects no substrate or described second sensor when going out substrate is arranged, the holding state of judging the substrate on the described support component is unusual operational part.
2. substrate detecting mechanism as claimed in claim 1 is characterized in that:
Described first sensor and described second transducer are the optical sensor with light-emitting component and photo detector.
3. substrate detecting mechanism as claimed in claim 1 is characterized in that:
Described first sensor and described second transducer respectively have 2, when 2 described first sensor boths have detected substrate and 2 described second transducer boths when detecting no substrate, described operational part judges that the holding state of the substrate on the described support component is for normal, when in 2 described first sensors at least one detects in no substrate or 2 described second transducers at least one when having detected substrate, described operational part judges that the holding state of the substrate on the described support component is for unusual.
4. as each described substrate detecting mechanism in the claim 1～3, it is characterized in that:
The a plurality of lifter pins of described support component for being provided with up and down with respect to the mounting table of mounting substrate, this lifter pin from the outstanding position of described mounting table with state supporting substrate that can the conveyance substrate.
5. a substrate board treatment is characterized in that, comprising:
Accommodate the container handling of substrate;
The mounting table of mounting substrate in described container handling;
The height and position of the regulation above described mounting table is with the support component of state supporting substrate that can the conveyance substrate;
Substrate on the mounting table is implemented the processing mechanism of processing;
The first sensor that has or not substrate to detect to height and position at described supporting units support substrate;
Second transducer that has or not substrate to detect to lower position at the height and position of described supporting units support substrate;
When described first sensor has detected substrate and described second sensor when going out not have substrate, the holding state of judging the substrate on the described support component is for normal, when described first sensor detects no substrate or described second sensor when going out substrate is arranged, the holding state of judging the substrate on the described support component is unusual operational part; With
When described operational part judges that the holding state of substrate is unusual, provide the instruction department of the instruction that stops the conveyance substrate at least.
6. substrate board treatment as claimed in claim 5 is characterized in that:
Described first sensor and described second transducer are the optical sensor with light-emitting component and photo detector.
7. substrate board treatment as claimed in claim 5 is characterized in that:
Described first sensor and described second transducer respectively have 2, when 2 described first sensor boths have detected substrate and 2 described second transducer boths when detecting no substrate, described operational part judges that the holding state of the substrate on the described support component is for normal, when in 2 described first sensors at least one detects in no substrate or 2 described second transducers at least one when having detected substrate, described operational part judges that the holding state of the substrate on the described support component is for unusual.
8. as each described substrate board treatment in the claim 5～7, it is characterized in that:
The a plurality of lifter pins of described support component for being provided with up and down with respect to described mounting table, this lifter pin from the outstanding position of described mounting table with state supporting substrate that can the conveyance substrate.
9. as each described substrate board treatment in the claim 5～8, it is characterized in that:
When described operational part judged that the holding state of substrate is unusual, described instruction department provided the instruction that gives the alarm.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2006213541A JP2008041896A (en) | 2006-08-04 | 2006-08-04 | Substrate sensing mechanism, and substrate processor using same |
| JP2006-213541 | 2006-08-04 | ||
| JP2006213541 | 2006-08-04 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101118864A true CN101118864A (en) | 2008-02-06 |
| CN101118864B CN101118864B (en) | 2010-06-02 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007101402238A Expired - Fee Related CN101118864B (en) | 2006-08-04 | 2007-08-03 | Substrate detecting mechanism and substrate processing device using the same |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2008041896A (en) |
| KR (1) | KR20080012779A (en) |
| CN (1) | CN101118864B (en) |
| TW (1) | TWI428585B (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839852A (en) * | 2012-11-20 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Wafer detection device and method used for ashing machine |
| CN107093570A (en) * | 2016-02-17 | 2017-08-25 | 株式会社斯库林集团 | The abnormal inspection area of substrate hold mode automatically determines method and processing unit |
| CN111233313A (en) * | 2018-11-29 | 2020-06-05 | 塔工程有限公司 | Substrate cutting device |
| CN111554600A (en) * | 2019-02-12 | 2020-08-18 | 日本电产三协株式会社 | Substrate transfer apparatus and method for controlling substrate transfer apparatus |
| CN111579365A (en) * | 2020-05-22 | 2020-08-25 | 常熟市江威真空玻璃有限公司 | Novel vacuum glass vacuum degree reduction slowing down and intensity detection device |
| CN112514047A (en) * | 2018-07-30 | 2021-03-16 | 日本爱发科泰克能株式会社 | Substrate lifting device and substrate transportation method |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010087343A (en) * | 2008-10-01 | 2010-04-15 | Toray Eng Co Ltd | Substrate processing device and substrate placing method |
| JP5473820B2 (en) * | 2010-07-29 | 2014-04-16 | 株式会社日立ハイテクノロジーズ | Substrate holder and substrate transfer system |
| KR102092150B1 (en) * | 2013-08-30 | 2020-03-23 | 세메스 주식회사 | Apparatus and Method for treating substrate |
| CN107610997A (en) * | 2017-07-20 | 2018-01-19 | 江苏鲁汶仪器有限公司 | A kind of gaseous corrosion cavity with wafer position detection means |
| JP7279406B2 (en) * | 2019-02-26 | 2023-05-23 | 東京エレクトロン株式会社 | LOADLOCK MODULE, SUBSTRATE PROCESSING APPARATUS, AND SUBSTRATE CONVEYING METHOD |
| KR102396431B1 (en) | 2020-08-14 | 2022-05-10 | 피에스케이 주식회사 | Substrate processing apparatus and substrate transfer method |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH065691B2 (en) * | 1987-09-26 | 1994-01-19 | 株式会社東芝 | Semiconductor element test method and test apparatus |
| JPH11195695A (en) * | 1997-12-26 | 1999-07-21 | Advanced Display Inc | Electronic device manufacturing apparatus |
| JP2003218187A (en) * | 2002-01-23 | 2003-07-31 | Nec Kagoshima Ltd | Glass substrate transfer device |
| CN1220256C (en) * | 2002-12-27 | 2005-09-21 | 友达光电股份有限公司 | Detector for substrate defect |
| JP4367165B2 (en) * | 2004-02-13 | 2009-11-18 | 株式会社デンソー | Inspection method of semiconductor mechanical quantity sensor |
-
2006
- 2006-08-04 JP JP2006213541A patent/JP2008041896A/en active Pending
-
2007
- 2007-08-02 KR KR1020070077693A patent/KR20080012779A/en not_active Application Discontinuation
- 2007-08-03 TW TW096128624A patent/TWI428585B/en not_active IP Right Cessation
- 2007-08-03 CN CN2007101402238A patent/CN101118864B/en not_active Expired - Fee Related
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103839852A (en) * | 2012-11-20 | 2014-06-04 | 上海华虹宏力半导体制造有限公司 | Wafer detection device and method used for ashing machine |
| CN107093570A (en) * | 2016-02-17 | 2017-08-25 | 株式会社斯库林集团 | The abnormal inspection area of substrate hold mode automatically determines method and processing unit |
| CN107093570B (en) * | 2016-02-17 | 2020-07-10 | 株式会社斯库林集团 | Method for automatically determining inspection area with abnormal substrate holding state and processing apparatus |
| CN112514047A (en) * | 2018-07-30 | 2021-03-16 | 日本爱发科泰克能株式会社 | Substrate lifting device and substrate transportation method |
| CN111233313A (en) * | 2018-11-29 | 2020-06-05 | 塔工程有限公司 | Substrate cutting device |
| CN111233313B (en) * | 2018-11-29 | 2022-11-01 | 塔工程有限公司 | Substrate cutting device |
| CN111554600A (en) * | 2019-02-12 | 2020-08-18 | 日本电产三协株式会社 | Substrate transfer apparatus and method for controlling substrate transfer apparatus |
| CN111554600B (en) * | 2019-02-12 | 2023-09-01 | 日本电产三协株式会社 | Substrate conveying device and control method of substrate conveying device |
| CN111579365A (en) * | 2020-05-22 | 2020-08-25 | 常熟市江威真空玻璃有限公司 | Novel vacuum glass vacuum degree reduction slowing down and intensity detection device |
| CN111579365B (en) * | 2020-05-22 | 2022-12-27 | 常熟市江威真空玻璃有限公司 | Novel vacuum glass vacuum degree reduction slowing down and intensity detection device |
Also Published As
| Publication number | Publication date |
|---|---|
| TW200827707A (en) | 2008-07-01 |
| TWI428585B (en) | 2014-03-01 |
| KR20080012779A (en) | 2008-02-12 |
| JP2008041896A (en) | 2008-02-21 |
| CN101118864B (en) | 2010-06-02 |
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