CN101385142A - 半导体模组和具有半导体模组的混合动力车辆驱动装置 - Google Patents

半导体模组和具有半导体模组的混合动力车辆驱动装置 Download PDF

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CN101385142A
CN101385142A CNA2007800058388A CN200780005838A CN101385142A CN 101385142 A CN101385142 A CN 101385142A CN A2007800058388 A CNA2007800058388 A CN A2007800058388A CN 200780005838 A CN200780005838 A CN 200780005838A CN 101385142 A CN101385142 A CN 101385142A
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semiconductor module
power
electrode
dielectric substrate
layer
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CN101385142B (zh
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吉田忠史
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Toyota Motor Corp
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Toyota Motor Corp
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    • B60K6/00Arrangement or mounting of plural diverse prime-movers for mutual or common propulsion, e.g. hybrid propulsion systems comprising electric motors and internal combustion engines ; Control systems therefor, i.e. systems controlling two or more prime movers, or controlling one of these prime movers and any of the transmission, drive or drive units Informative references: mechanical gearings with secondary electric drive F16H3/72; arrangements for handling mechanical energy structurally associated with the dynamo-electric machine H02K7/00; machines comprising structurally interrelated motor and generator parts H02K51/00; dynamo-electric machines not otherwise provided for in H02K see H02K99/00
    • B60K6/20Arrangement or mounting of plural diverse prime-movers for mutual or common propulsion, e.g. hybrid propulsion systems comprising electric motors and internal combustion engines ; Control systems therefor, i.e. systems controlling two or more prime movers, or controlling one of these prime movers and any of the transmission, drive or drive units Informative references: mechanical gearings with secondary electric drive F16H3/72; arrangements for handling mechanical energy structurally associated with the dynamo-electric machine H02K7/00; machines comprising structurally interrelated motor and generator parts H02K51/00; dynamo-electric machines not otherwise provided for in H02K see H02K99/00 the prime-movers consisting of electric motors and internal combustion engines, e.g. HEVs
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    • B60K6/44Series-parallel type
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    • B60K6/36Arrangement or mounting of plural diverse prime-movers for mutual or common propulsion, e.g. hybrid propulsion systems comprising electric motors and internal combustion engines ; Control systems therefor, i.e. systems controlling two or more prime movers, or controlling one of these prime movers and any of the transmission, drive or drive units Informative references: mechanical gearings with secondary electric drive F16H3/72; arrangements for handling mechanical energy structurally associated with the dynamo-electric machine H02K7/00; machines comprising structurally interrelated motor and generator parts H02K51/00; dynamo-electric machines not otherwise provided for in H02K see H02K99/00 the prime-movers consisting of electric motors and internal combustion engines, e.g. HEVs characterised by apparatus, components or means specially adapted for HEVs characterised by the transmission gearings
    • B60K6/365Arrangement or mounting of plural diverse prime-movers for mutual or common propulsion, e.g. hybrid propulsion systems comprising electric motors and internal combustion engines ; Control systems therefor, i.e. systems controlling two or more prime movers, or controlling one of these prime movers and any of the transmission, drive or drive units Informative references: mechanical gearings with secondary electric drive F16H3/72; arrangements for handling mechanical energy structurally associated with the dynamo-electric machine H02K7/00; machines comprising structurally interrelated motor and generator parts H02K51/00; dynamo-electric machines not otherwise provided for in H02K see H02K99/00 the prime-movers consisting of electric motors and internal combustion engines, e.g. HEVs characterised by apparatus, components or means specially adapted for HEVs characterised by the transmission gearings with the gears having orbital motion
    • BPERFORMING OPERATIONS; TRANSPORTING
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    • B60K6/00Arrangement or mounting of plural diverse prime-movers for mutual or common propulsion, e.g. hybrid propulsion systems comprising electric motors and internal combustion engines ; Control systems therefor, i.e. systems controlling two or more prime movers, or controlling one of these prime movers and any of the transmission, drive or drive units Informative references: mechanical gearings with secondary electric drive F16H3/72; arrangements for handling mechanical energy structurally associated with the dynamo-electric machine H02K7/00; machines comprising structurally interrelated motor and generator parts H02K51/00; dynamo-electric machines not otherwise provided for in H02K see H02K99/00
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Abstract

本发明提供半导体模组和具有半导体模组的混合动力车辆驱动装置。母线(40P)组成电源线,母线(40N)组成接地线。母线(40P、40N)通过绝缘构件沿绝缘衬底(50)的法向分层。这里,布置在上侧的母线(40P)由金属构件形成,布置在下侧的母线(40N)由形成在绝缘衬底(50)上的布线层形成。因为母线中的一个是固定到绝缘衬底(50)的布线层,所以可以确保母线的散热。因此,可以将母线制造为具有相对较小横截面积的布线层并且可以降低半导体模组沿法向的尺寸。通过将半导体模组安装在混合动力车辆的驱动装置上,可以降低当安装在车辆时的垂直方向尺寸并降低车辆的中心以提高行驶稳定性。

Description

半导体模组和具有半导体模组的混合动力车辆驱动装置
技术领域
本发明涉及半导体模组和包括半导体模组的混合动力车辆驱动装置。更具体而言,本发明涉及由逆变器和转换器形成的半导体模组以及包括半导体模组的混合动力车辆驱动装置。
背景技术
最近,作为考虑环境的车辆,混合动力车辆和电动车辆已经引起了关注。除了已经传统用作机械动力源的发动机之外,混合动力车辆还采用由DC电力供应装置通过逆变器驱动的电动机作为主要的机械动力源。在混合动力车辆中,更具体地,驱动发动机,以获得机械动力。此外,逆变器将DC电力供应装置产生的DC电压转换成AC电压,电动机由转换的AC电压旋转,以获得机械动力。另一方面,电动车辆采用由DC电力供应装置通过逆变器驱动的电动机作为机械动力源。
安装在混合动力车辆或电动车辆上的智能电力模组(IPM)在高速时切换半导体切换元件(功率半导体元件)(诸如,IGBT(绝缘栅极双极晶体管)),由此将来自DC电力供应装置供应的DC电力转换成AC电力;由此电动机被驱动(例如,参考日本专利早期公开No.2003-9507,日本专利早期公开No.2005-33882,日本专利早期公开No.11-299056以及日本专利早期公开No.11-187542)。
例如,日本专利早期公开No.2003-9507公开一种切换电路,其包括用作将切换元件连接到电力供应装置或负载的导体的母线。在这样的切换电路中,不同类型的母线固定到基体并且通过插入到其间的绝缘体而彼此紧固到一起。
这里,这里使用的每条母线是用作导体的金属构件,其具有足以在电力供应装置或负载和切换电路之间流动电流的较宽横截面面积。然后,连接到电力供应装置的正电极的电力供应装置正电极侧母线和连接到电力供应装置的负电极的电力供应装置负电极侧母线固定到基体,并且通过插入到其间的绝缘体而彼此紧固到一起。
但是,在上述的切换电路中,每条都是金属构件的母线被布置成沿基体的法向彼此堆叠,其间插入绝缘体。由此产生这样的问题,即切换电路沿基体的法向的尺寸增大。虽然对IPM的最小化需求很强烈,但是这个问题妨碍切换电路沿法向的最小化。
此外,日本专利早期公开No.2003-9057公开了切换元件和电力供应装置侧母线之间的连接关系以及切换元件和负载侧母线(U相侧母线、V相侧母线、W相侧母线)之间的连接关系,但是没有公开信号线的引出线的布置,其中每个切换元件通过信号线接收控制切换操作的信号。因此,为了最小化IPM,必须对信号线的引出线的布置给予充分的考虑。
完成本发明,以解决上述问题,并且本发明的目标在于提供能够获得最小化的半导体模组以及包括半导体模组的混合动力车辆驱动装置。
发明内容
根据本发明,半导体模组模组包括:第一电源线;第二电源线;第一和第二切换元件以及绝缘衬底。第一电源线连接到电源的第一电极。第二电源线连接到电源的第二电极。第一和第二切换元件连接在第一电源线和第二电源线之间。绝缘衬底具有安装在其上的第一和第二切换元件。这里,第一电源线包括耦合到第一切换元件的第一电极层的母线,第二电源线包括布置在绝缘衬底上并耦合到第二切换元件的第二电极层的布线层。
在半导体模组中,已经是由金属材料制成的第一和第二电源线中的一个安装为绝缘衬底上的布线层。这样的构造确保从布线层延伸到绝缘衬底的散热路径。因此,布线层可以制造的较薄,使得半导体模组沿垂直于衬底的方向最小化。
优选地,半导体模组还包括信号线层、第一导体构件和第二导体构件。信号线层布置在绝缘衬底上以传递控制信号,从而控制第一和第二切换元件的电极。第一导体构件使得第一电源线、第一和第二切换元件以及第二电源线进行导电。第二导体构件使得第一和第二开关元件的控制电极与信号线层进行导电。这里,信号线层被布置使得第一导体构件的延伸方向基本上垂直于第二导体构件的延伸方向。
在半导体模组中,已经设置有插入其间的信号线层的第一切换元件的第一电极层和第二切换元件的第二电极层可以布置以彼此邻接。这样的构造允许分配到电极层的电感减小,导致切换操作中产生的感应电压(逆程电压)降低。因此,切换元件可以由耐低压的小尺寸元件形成。因此,这样的构造允许半导体模组的进一步最小化和成本降低。
优选地,第一电极层和第二电极层被布置使得经过第一切换元件的电流方向与经过第二开关元件的电流方向相反。
在半导体模组中,第一电极层附近产生的磁场的旋转方向与第二电极层附近产生的磁场相反。因此,两个磁场抵消。这样的构造允许分配到电极层的电感减小。
优选地,半导体模组还包括散热构件,附装到绝缘衬底的底侧。
在半导体模组中,形成用于散发从布线层通过绝缘衬底传播到散热构件的热量。这样的构造允许进一步提高布线层的冷却效率。因此,布线层可以变得更薄,导致半导体模组的最小化。
根据本发明的另一个方面,一种用于混合动力车辆的驱动装置,包括:阻尼器、旋转电机、动力传递机构、壳体和动力控制单元。阻尼器,与内燃机的曲轴耦合。旋转电机被布置使得其旋转轴线与阻尼器的旋转轴线对准。动力传递机构将内燃机产生的机械动力和旋转电机产生的机械动力的结合传递到驱动轴。壳体容纳阻尼器、旋转电机和动力传递机构。动力控制单元包括半导体模组并且控制旋转电机。这里,半导体模组模组包括:第一电源线;第二电源线;第一和第二切换元件以及绝缘衬底。第一电源线连接到电源的第一电极。第二电源线连接到电源的第二电极。第一和第二切换元件连接在第一电源线和第二电源线之间。绝缘衬底具有安装在其上的第一和第二切换元件。第一电源线包括耦合到第一切换元件的第一电极层的母线,第二电源线包括布置在绝缘衬底上并耦合到第二切换元件的第二电极层的布线层。在安装在车辆上的情况下,当沿旋转轴线投影时,动力控制单元布置在壳体中,以落在壳体的投影部分的水平尺寸内,壳体容纳投影部分阻尼器、旋转电机和动力传递机构。
这样的构造使得混合动力车辆的驱动装置更紧凑。
优选地,半导体模组还包括信号线层、第一导体层和第二导体层。信号线层布置在绝缘衬底上以传递控制信号,从而控制第一和第二切换元件的电极。第一导体构件使得第一电源线、第一和第二切换元件以及第二电源线进行电传导。第二导体构件使得第一和第二开关元件的控制电极与信号线层进行导电。这里,信号线层被布置使得第一导体构件的延伸方向基本上垂直于第二导体构件的延伸方向。
在混合动力车辆的驱动装置中,这样的构造允许半导体模组的进一步最小化和成本降低。因此,这样的构造使得混合动力车辆的驱动装置更紧凑。
优选地,第一电极层和第二电极层被布置使得经过第一切换元件的电流方向与经过第二开关元件的电流方向相反。
在混合动力车辆的驱动装置中,这样的构造允许分配到电极层的电感降低。因此,这样的构造允许半导体模组的进一步最小化和成本降低。
优选地,半导体模组还包括散热构件,附装到绝缘衬底的底侧。
在混合动力车辆的驱动装置中,这样的构造有利于半导体模组的最小化。因此,这样的构造使得混合动力车辆的驱动装置更紧凑。
根据本发明的又一个方面,一种用于混合动力车辆的驱动装置,包括:阻尼器、旋转电机、动力传递机构、壳体和动力控制单元。阻尼器与内燃机的曲轴耦合。旋转电机被布置使得其旋转轴线与阻尼器的旋转轴线对准。动力传递机构将内燃机产生的机械动力和旋转电机产生的机械动力的结合传递到驱动轴。壳体容纳阻尼器、旋转电机和动力传递机构。动力控制单元,包括半导体模组并且控制旋转电机。这里,半导体模组模组包括:第一电源线;第二电源线;第一和第二切换元件以及绝缘衬底。第一电源线连接到电源的第一电极。第二电源线连接到电源的第二电极。第一和第二切换元件连接在第一电源线和第二电源线之间。绝缘衬底具有安装在其上的第一和第二切换元件。第一电源线包括耦合到第一切换元件的第一电极层的母线,第二电源线包括布置在绝缘衬底上并耦合到第二切换元件的第二电极层的布线层。当安装在车辆上时,动力控制单元被布置在壳体中,以在沿旋转轴线的方向投影时落在壳体的投影部分的容纳阻尼器、旋转电机和动力传递机构的水平尺寸内。
在混合动力车辆的驱动装置中,逆变器是集成的。这样的构造实现混合动力车辆的最小化。
优选地,半导体模组还包括信号线层、第一导体层和第二导体层。信号线层布置在绝缘衬底上以传递控制信号,从而控制第一和第二切换元件的电极。第一导体构件使得第一电源线、第一和第二切换元件以及第二电源线进行电传导。第二导体构件使得第一和第二开关元件的控制电极与信号线层进行导电。这里,信号线层被布置使得第一导体构件的延伸方向基本上垂直于第二导体构件的延伸方向。
在混合动力车辆的驱动装置中,这样的构造允许半导体模组的进一步最小化和成本降低。因此,这样的构造使得混合动力车辆的驱动装置更紧凑。
优选地,第一电极层和第二电极层被布置使得经过第一切换元件的电流方向与经过第二开关元件的电流方向相反。
在混合动力车辆的驱动装置中,这样的构造允许分配到电极层的电感降低。因此,这样的构造允许半导体模组的进一步最小化和成本降低。
优选地,半导体模组还包括散热构件,附装到绝缘衬底的底侧。
在混合动力车辆的驱动装置中,这样的构造有利于半导体模组的最小化。因此,这样的构造使得混合动力车辆的驱动装置更紧凑。
优选地,动力控制单元包括电抗器和电容器。电抗器,相对于旋转中心轴线布置在旋转电机的第一侧。电容器相对于旋转中心轴线布置在旋转电机的第二侧。
混合动力车辆的驱动装置的重量变低并且尺寸变小。此外,半导体模组使得车辆的重心低并且提高车辆的行驶稳定性。
根据本发明,每个都连接到电源的第一和第二电源线中的一个安装为绝缘衬底上的布线层,导致半导体模组沿法向的最小化。
此外,第一切换元件的第一电极层和邻近于第一切换元件的第二切换元件的第二电极层可以布置彼此邻接,导致分配到电极层的电感的降低。因此,这样的构造允许切换元件的最小化。另外,这样的构造允许半导体模组的进一步最小化和成本降低。
此外,根据本发明的半导体模组使得在混合动力车辆的驱动装置安装到车辆上时驱动装置沿垂直方向变小。此外,半导体模组使得车辆的重心变低并且提高车辆的行驶稳定性。
附图说明
图1是示出根据本发明装备有半导体模组的电动机驱动装置的示意性框图。
图2是示出根据本发明的半导体模组的一般构造的俯视图。
图3是示出逆变器的三相臂的具体构造的俯视图。
图4是沿图3的线IV-IV的剖视图。
图5是沿图3的线V-V的剖视图。
图6是示出根据本发明的半导体模组的主要部件的构造的俯视图。
图7是示出半导体模组的主要部件的另一种构造的俯视图。
图8是示出与根据本发明的混合动力车辆中的电动机-发动机控制的构造的电路图。
图9是图示图8中所示的动力分离机构和减速器的每一个细节的示意图。
图10是图示根据本发明混合动力车辆的外观的立体图。
图11是示出混合动力车辆驱动装置的俯视图。
图12是示出沿图11中所示的X1方向所观察的混合动力车辆驱动装置的侧视图。
图13是示出混合动力车辆驱动装置的油混合路径的剖视图。
图14是沿图13中线XIV-XIV所取的部分剖视图。
具体实施方式
下文中,参考附图,给出本发明优选实施例的详细描述。在附图中,相同或对用部分用相同标号来表示,因此,不在给出其重复描述。
图1是根据本发明装备有半导体模组的电动机驱动装置的示意图框图。
参考图1,电动机驱动装置100包括电池B、电容器C1和C2、升压转换器12、逆变器14和31以及控制装置30。
电动机发电机MG1和MG2分别是三相AC旋转电机。每个电动机-发电机MG1和MG2用作发电机和电动机。这里,电动机-发电机MG1主要用作发电机,而电动机-发电机MG2主要用作电动机。
升压转换器12包括电抗器L1、切换元件Q1和Q2以及二极管D1和D2。电抗器L1居于连接到电池B的电源线LN1的第一端和连接到切换元件Q1和切换元件Q2之间的中间点(即,连接在切换元件Q1的发射极和切换元件Q2的集电极之间)的第二端。切换元件Q1和Q2串联连接在电源线LN1和接地线LN2之间。切换元件Q1具有连接到电源线LN1的集电极,切换元件Q2具有连接到接地线LN2的发射极。此外,二极管D1连接在切换元件Q1的集电极和发射极之间,二极管D2连接在切换元件Q2的集电极和发射极之间,使得电流从每个发射极流向每个集电极。
逆变器14包括U相臂15、V相臂16和W相臂17。U相臂15、V相臂16和W相臂17并联连接在电源线LN1和接地线LN2之间。
U相臂15包括串联连接的切换元件Q3和Q4,V相臂16包括串联连接的切换元件Q5和Q6,W相臂17具有串联连接的切换元件Q7和Q8。二极管D3连接在切换元件Q3的集电极和发射极之间,二极管D4连接在切换元件Q4的集电极和发射极之间,二极管D5连接在切换元件Q5的集电极和发射极之间,二极管D6连接在切换元件Q6的集电极和发射极之间,二极管D7连接在切换元件Q7的集电极和发射极之间,二极管D8连接在切换元件Q8的集电极和发射极之间,使得电流从每个发射极流向每个集电极。
U相臂15的中间点连接到电动机-发电机MG1的U相线圈的U相端,V相臂16的中间点连接到电动机-发电机MG1的V相线圈的V相端,W相臂17的中间点连接到电动机-发电机MG1的W相线圈的U相端。即,在电动机-发电机MG1中,U、V和W相线圈的第一端共同连接到中性点。另一方面,在电动机-发电机MG1中,U相线圈的第二端连接到切换元件Q3和Q4之间的中间点,V相线圈的第二端连接到切换元件Q5和Q6之间的中间点,W相线圈的第二端连接到切换元件Q7和Q8之间的中间点。
逆变器31的构造类似于逆变器15。这里,例如,MOS晶体管用作升压转换器12、逆变器14和逆变器31的切换元件Q1-Q8。
电池B是高压电池,其具有大量的蓄电池单元(诸如镍氢电池或锂离子电池)串联连接的结构。除了这样的蓄电池之外,电池B可以时电容或燃料电池。
电容C1使从电池B供应的DC电压平滑,并且将平滑的DC电压供应到升压转换器12。
升压转换器12升压从电容器C1供应的DC电压,并将得到的电压供应到电容器C2。更具体而言,在接收到来自控制装置30的信号PWMC的情况下,升压转换器12根据切换元件Q2由信号PWMC开启的时间长度而升压DC电压,并将得到的电压供应到电容C2。
此外,在接收到来自控制装置30的信号PWMC的情况下,升压转换器12通过电容器C2将从逆变器14和/或逆变器31供应的DC电压降压,以对电池B充电。
电容C2使从升压转换器12供应的DC电压平滑,并将平滑的DC电压供应到逆变器14和31。
在通过电容C2接收到来自电池B的DC电压的情况下,逆变器14基于来自控制装置30的信号PWMI1将DC电压转换AC电压,以驱动电动机-发电机MG1。由此,电动机-发电机MG1被驱动,以根据扭矩命令值TR1产生扭矩。
此外,在装备有电动机驱动装置100的混合动力车辆的再生制动时,逆变器14基于来自控制装置30的信号PWMI1将电动机-发电机MG1产生的AC电压转换成DC电压,并将转换的DC电压通过电容C2供应到升压转换器12。这里提及的再生制动的示例包括:以混合动力车辆的驾驶者下压脚制动器的方式完成再生的制动;以及以当车辆行驶时驾驶者不下压脚制动器但关闭加速器踏板的方式完成再生的减速(或停止加速)。
在通过电容C2接收到来自电池B的DC电压的情况下,逆变器31基于来自控制装置30的信号PWMI2将DC电压转换AC电压,以驱动电动机-发电机MG2。由此,电动机-发电机MG2被驱动,以根据扭矩命令值TR2产生扭矩。
此外,在装备有电动机驱动装置100的混合动力车辆的再生制动时,逆变器31基于来自控制装置30的信号PWMI2将电动机-发电机MG2产生的AC电压转换成DC电压,并将转换的DC电压通过电容C2供应到升压转换器12。
在上述构造中,逆变器14、逆变器31和升压转换器12一体形成本发明的半导体模组。这里,阻抗器L1和升压转换器12中的电压平滑电容器C2的尺寸比较大,由此分别布置在半导体模组的外侧。
接着,参考图2,给出根据本发明的半导体模组的具体构造示例的说明。
图2是示出根据本发明的半导体模组的一般构造的俯视图。为了方便的原因,将下述图2的上下方向定义为纵向,而将图2的左右方向定义为横向。
参考图2,半导体模组10包括每个都在绝缘衬底50上沿横向延伸的母线40P、40N、42P和42N以及布置在母线40P和40N上方和下方的切换元件Q1-Q8,其中母线40P和40N插入在切换元件Q1-Q8之间。
绝缘衬底50例如由聚酰亚胺制成。注意,与绝缘衬底50由氮化铝制成的情况相比,由聚酰亚胺制成的绝缘衬底50提高衬底由于热膨胀所产生的应力的耐用性。这有利于成倍提高。
此外,散热板60安装到绝缘衬底50的底侧。如下所述,散热板60冷却半导体模组10。
母线40P形成连接在升压转换器12与图1中各个逆变器14和31之间的电源线LN1,母线40N形成连接在升压转换器12与图1中各个逆变器14和31之间的接地线LN2。如下所述,母线40P和母线40N沿绝缘衬底50的法向(对应于图中的垂直方向)堆叠,并且绝缘构件(未示出)插入在其间。
此外,母线40P通过切换元件Q1连接到母线42P,母线40N通过切换元件Q2连接到母线40N。母线40P和40N分别连接到电池B的正和负电极(未示出)。即,母线40P和母线42P一体形成图1中所示的电源线LN1,并且母线40N和母线42N一体形成图1中所示的接地线LN2。
布置在母线40P和40N上方的切换元件Q3-Q8形成图1中所示的逆变器31。另一方面,布置在母线40P和40N下方的切换元件Q3-Q8形成图1中所示的逆变器14。此外,布置在母线40P和40N上方和下方的切换元件Q1和Q2形成图1中所示的升压转换器12。
在图2中所示的示例中,逆变器14和31的U相臂15(切换元件Q3和Q4)、逆变器14和31的V相臂16(切换元件Q5和Q6)以及逆变器14和31的W相臂17(切换元件Q7和Q8)在图中从左到右依次布置。这里,每个切换元件Q3-Q8由并联连接的两个切换元件形成,以防止每个切换元件由于经过电流的增大而接收额外负载。
在逆变器14和31的U、V和W相臂中,串联连接在母线40P和母线40N之间的两个切换元件以这样的方式形成:形成作为绝缘衬底50上的图案的电极层通过电线连接到每个切换元件。
图3是示出逆变器14和31的三相臂15-17的具体构造的俯视图。注意,三相臂15-17的构造彼此相同,因此,图3中有代表性地图示逆变器14和31的U相臂15的构造。
图4是沿图3的线IV-IV的剖视图。
参考图3和4,逆变器31的U相臂15布置在母线40P和40N上方,并且包括切换元件Q3-Q4、P侧电极层31PU、中间电极层31U和N侧电极层31NU。
P侧电极层31PU、中间电极层31U和N侧电极层31NU中每一个均形成为绝缘衬底50上的图案。P侧电极层31PU具有耦合到形成电源线LN1的母线40P的第一端。N侧电极层31NU具有耦合到形成接地线LN2的母线40N的第一端。中间电极层31U对应于图1中所示的U相臂15的中间点,并且通过母线(未示出)连接到电动机-发电机MG2的U相线圈。
切换元件Q3具有紧固到中间电极层31U的集电极,以与中间电极层31U建立电传导。切换元件Q3还具有通过电线WL1连接到P侧电极层31PU的发射极。
切换元件Q4具有紧固到N侧电极层31NU的集电极,以与N侧电极层31NU建立电传导。切换元件Q4还具有通过电线WL1连接到中间电极层31U的发射极。
这里假设,MOS晶体管用作切换元件Q3和Q4。切换元件Q3和Q4还具有二极管D3和D4的整流性能,因此分别整合有二极管D3和D4。
绝缘衬底50紧固到散热板60,使得其底侧通过焊剂52粘附到散热板60。散热板60通过硅脂62布置在散热器70上。
散热器70具有多个沟槽72。这里假设,采用水冷系统作为逆变器14和31的冷却系统。散热器(未示出)设置在半导体模组10的外侧,以提供冷却水。冷却水沿垂直于图的方向流经散热器70的多个沟槽72,以通过散热板60和绝缘衬底50冷却切换元件Q3-Q4。
图5是沿图3的线V-V的剖视图。
参考图5,逆变器31的U相臂15的中间电极层31U和逆变器14的U相臂15的中间电极层14U沿绝缘衬底50的纵向(对应于图中的左右方向)布置。切换元件Q3紧固到中间电极层31U和中间电极层41U中的每一个。
然后,母线40P和40N布置在中间电极层31U和中间电极层14U之间。母线40P和母线40N沿绝缘衬底50的法向堆叠通过绝缘构件80。
这里,形成堆叠结构的母线40P和40N中的上母线40P是金属构件,例如由铜等制成。相反,母线40P和40N中的下母线40N是形成在绝缘衬底50上的布线层。
如上所述,根据本发明的半导体模组具有这样的特征构造:形成电源线LN1和接地线LN2的母线40P和40N中的一个是布线层。
不同于包括都是金属构件的母线40P和40N的传统半导体模组,在这样构造的情况下,根据本发明的半导体模组带来以下优点。
具体而言,每个母线40P和40N分别用作在电池B和每个电动机-发电机MG1和MG2之间的电力传递/接收的介质。因此,电流沿垂直于图的方向流过每个母线40P和40N。这里,母线40P和40N产生与经过的电流和内阻成比例的热量。为了防止母线40P和40N由于流经电流的增大而过热,传统半导体模组尝试为每条母线提供具有较大横截面积的金属构件而降低内阻。因此,半导体模组沿法向的尺寸增大对应于两个金属构件的长度,由此不利于半导体模组沿法向的最小化。
另一方面,在根据本发明的半导体模组10中,母线40N设置为布线层,并且紧固到绝缘衬底50。这种构造实现了半导体模组10沿法向的最小化,同时确保从母线40N的热量散发。
即,设置为布线层的母线40N带来这样的优点:母线40N处产生的热量由冷却水通过绝缘衬底50、散热板60和形成于散热器70上的多个沟槽72冷却。这样的构造确保母线40N的散热性能,使得母线40N可以由具有较小横截面积的布线层形成。结果,半导体模制10沿法向(对应于图中的“h1”)的长度显著变短。
如上所述,根据本发明的半导体模组通过设置为母线的布线层优点而实现法向的最小化。此外,如下所述,根据本发明的半导体模组具有这样的信号线布置特征:通过信号线,切换元件Q1和Q2以及切换元件Q3-Q8的栅极接收来自控制装置30的信号PWMC或PWMI。
图6是示出根据本发明的半导体模组的主要部件的构造的俯视图。在图6中,用于将信号PWMI输出到切换元件Q3-Q8的信号线层14G3、14G4、31G3和31G4被增加到图3中所示的逆变器14和31的U相臂15的构造中。
更具体而言,参考图6,对应于逆变器31的U相臂15的切换元件Q3的信号线层31G3分别布置在中间电极层31U的上方和下方。这里,布置在中间电极层31U下方的信号线31G3沿半导体模组10的法向位于母线40P上方。信号线层31G3通过电线WL2连接到切换元件Q3的栅极。
同样,对应于逆变器31的U相臂15的切换元件Q4的信号线层31G4布置在N侧电极层31NU的上方和下方。这里,布置在N侧电极层31NU下方的信号线31G4沿半导体模组10的法向位于母线40P上方。信号线层31G4通过电线WL2连接到切换元件Q4的栅极。
对应于逆变器14的U相臂15的信号线14G3和14G4的构造类似于信号线层31G3和31G4。然后,信号线层14G3、14G4、31G3和31G4沿半导体模组10的法向布置在上方,并且连接到装备有控制装置30的控制面板(未示出)。U、V和W相臂15、16和17沿半导体模组10的横向布置,并且U相臂15定义为基本单元。
对应于U、V和W相臂的信号线层如图6所示布置,以形成沿半导体模组10的横向经过P侧电极层31PU、切换元件Q3、中间电极层31U、切换元件Q4和N侧电极层31NU的电流路径。然后,用于输入控制信号PWMI2的路径沿半导体模组10的纵向形成,即沿基本垂直于电流路径的方向。
这样的结构相对于控制信号输入路径和电流路径沿单向形成的布置结构(图7)带来下面优点。
更具体而言,如图7所示,假设对应于U相臂15、V相臂16和W相臂17的信号线层沿半导体模组的横向布置,同其它电极层的情况一样。
参考图7,U相臂15、V相臂16和W相臂17沿半导体模组的横向布置,U相臂15定义为基本单元。因此,作为U相臂15和V相臂16的边界,对应于逆变器31的V相臂16的信号线层31G6布置在U相臂15的P侧电极层31PU与V相臂16的N层电极层31NV之间。此外,对应于逆变器14的V相臂16的信号线层14G6布置在U相臂15的P层电极层14PU和V相臂16的N侧电极层14NV之间。
即,U相臂15的P侧电极层31PU(或14PU)和V相臂16的N侧电极层31NV(14NV)被布置成其间设定间隔。此间隔对应于信号线层31G6(或14G6)沿横向的长度。
另一方面,在如图6中所示的布置中,U相臂15的P侧电极层31PU(或14PU)和V相臂16的N侧电极层31NV(或14NV)可以布置,以彼此邻接,其间没有插入信号线层31G6(或14G6)。
如上所述,一个臂的P侧电极层和与该臂相邻的另一个臂的N侧电极层布置成彼此邻接。这样的构造带来这样的优点:根据本发明的半导体模组10可以降低分配到每个电极层的电感。
例如,对于电流的流动方向,P侧电极层31PU和与P侧电极层31PU相邻的N侧电极层31NV彼此相反。在此实施例中,电流从母线40P流到P侧电极层31PU,同时电流从N侧电极层31NV流到母线40N。因此,P侧电极层31PU周围由电流产生的磁场的旋转方向与N侧电极层31NV周围由电流产生的磁场的旋转方向相反。这样的构造允许降低P侧电极层31PU的电感和N侧电极层31NV的电感,引起因切换操作的电感引起的逆程电压的降低。逆程电流的降低获得高速切换操作。此外,由耐高压的切换元件形成以吸收逆程电压的每个逆变器14和31可以由小尺寸的耐低压的切换元件形成。因此,这样的构造允许半导体模组10的进一步最小化和成本降低。
在上述实施例中,升压转换器12、逆变器14和逆变器31的各个臂封装为一个半导体模组,但是半导体模组的构造不限于此。例如,单相或整个逆变器以及升压转换器的上下臂可以封装为一个半导体模组。
(根据本发明的半导体模组的应用示例)
最后,作为根据本发明的半导体模组的应用示例,给出混合动力车辆驱动装置的描述,其中包括半导体模组和电动机的电动机驱动装置容纳在一个壳体中。
经常,混合动力车辆的电流驱动装置采用简单的构造:形成逆变器的较大箱状壳体放置在电动机壳体上。另一方面,如下所述,根据本发明的混合动力车辆的驱动装置在驱动装置安装在车辆的情况下改善了车辆的重心沿高度方向的位置,并且节省了安装空间。
图8是示出根据本发明的混合动力车辆200的电动机-发电机控制构造的电路图。在图8所示的混合动力车辆200中,图1中所示的电动机驱动装置100、动力分离机构PSD和减速器RD重新形成驱动装置20。
参考图8,车辆200包括电池B、驱动装置20、控制装置30、发动机(未示出)和车轮(未示出)。
驱动装置20包括电动机-发电机MG1和MG2、动力分离机构PSD、减速器RD和用于控制电动机-发电机MG1和MG2的动力控制单元21。
基本上,动力分离机构PSD将机械动力分配到耦合到其上的发动机、电动机-发电机MG1和电动机-发电机MG2。动力分离机构PSD例如可以是具有三个旋转轴(即,太阳齿轮、行星架和环形齿轮)的行星齿轮机构。
动力分离机构PSD具有三个旋转轴,更具体而言,连接到发动机的旋转轴的旋转轴、连接到电动机-发电机MG1的旋转轴的旋转轴以及连接到减速器RD的旋转轴。与动力分离机构PSD集成的减速器RD降低电动机-发电机MG2的扭矩,并将降低的扭矩传递到动力分离机构PSD。
如下所述,减速器具有通过减速齿轮或差速齿轮(未示出)而连接到车轮的旋转轴。
动力控制单元21包括分别对应于电动机-发电机MG1和MG2而设置的逆变器14和31、以及逆变器14和31共同设置的升压转换器12。
在动力控制单元21中,逆变器14的三相臂15-17、逆变器31的三相臂15-17以及升压转换器12的臂部分彼此集成,以形成半导体模组10。半导体模组10的构造与图1中所示安装到电动机驱动装置的半导体模组10相同,因此,这里不在给出其详细描述。
图9是图示图8中所述的动力分离机构PSD和减速器RD的每个细节的示意图。
参考图9,车辆驱动装置包括电动机-发电机MG2、连接到电动机-发电机MG2的旋转轴的减速器RD、根据由减速器RD降低的旋转轴的扭矩而旋转的轮轴、发动机ENG、电动机-发电机MG1以及将机械动力分配至减速器RD、发动机ENG和电动机-发电机MG1的动力分离机构PSD。例如在减速器RD中,从电动机-发电机MG2到动力分离机构PSD的减速比不低于两倍。
发动机ENG的曲轴500、电动机-发电机MG1的转子320和电动机-发电机MG2的转子370绕单一轴线旋转。
动力分离机构PSD在图9中所示的示例中是行星齿轮。动力分离机构PSD包括太阳齿轮510、环形齿轮520、小齿轮530和行星架540。太阳齿轮510耦合到中空太阳齿轮轴,曲轴500插入穿过中空太阳齿轮轴的轴心。环形齿轮520以可旋转方式被支撑,以与曲轴500共轴。小齿轮530布置在太阳齿轮510和环形齿轮520之间,并在旋转的同时绕太阳齿轮510的周边周转。行星架540耦合到曲轴500的一端,以支撑小齿轮530的旋转轴。
动力分离机构PSD包括三个轴作为机械动力传递/接收轴,即,耦合到太阳齿轮510的太阳齿轮轴、耦合到环形齿轮520的环形齿轮壳体以及耦合到行星架540的曲轴500。当传递到/或接收自这三个轴中的两个的机械动力被确定时,基于前一机械动力确定传递到/或接收自剩余一个轴的机械动力。
用于提取机械动力的反驱动齿轮700设置在环形齿轮壳体外部,以与环形齿轮520一起旋转。反驱动齿轮700连接到减速齿轮RG。机械动力在反驱动齿轮700和减速器RG之间传递。减速齿轮RG驱动差速齿轮DEF。在下坡路等情况下,车轮的扭矩被传递到差速齿轮DEF,使得减速齿轮RG被差速齿轮DEF驱动。
电动机-发电机MG1包括定子310和转子320。定子310形成旋转磁场。转子320布置在转子310内侧,并且具有多个嵌入其中的永磁体。定子310包括定子芯330和绕定子芯330缠绕的三相线圈340。转子320耦合到与动力分离机构PSD的太阳齿轮510一起旋转的太阳齿轮轴。定子芯330通过电磁薄钢板堆叠形成,并且固定到壳体(未示出)。
电动机-发电机MG1用作通过嵌入在转子320中的永磁体所产生的磁场和由三相线圈340所形成的磁场之间的接触而旋转驱动转子320的电机。电动机-发电机MG1还用作通过由永磁体所产生的磁场和转子320所产生的扭矩之间的接触而在三相线圈340的两端产生电力的发电机。
电动机-发电机MG2包括定子360和转子370。定子360形成旋转磁场。转子370布置在转子360内侧,并且具有多个嵌入其中的永磁体。转子360包括转子芯380和绕转子芯380缠绕的三相线圈390。
转子370通过减速器RD耦合到与动力分离机构PSD的环形齿轮520一起旋转的环形齿轮轴。定子芯380由电磁薄钢板的堆叠形成,并且固定到壳体(未示出)。
电动机-发电机MG2用作通过由永磁体所产生的磁场和转子370所产生的扭矩之间的接触而在三相线圈390的两端产生电力的发电机。电动机-发电机MG2还用作通过永磁体所产生的磁场和由三相线圈390所形成的磁场之间的接触而旋转驱动转子320的电机。
减速器RD通过行星齿轮的旋转元件中一个的行星架600固定到车辆驱动装置的壳体的结构降低速度。即,减速器RD包括太阳齿轮620、环形齿轮680和小齿轮640。太阳齿轮620耦合到转子370的轴。环形齿轮680与环形齿轮520一起旋转。小齿轮640与环形齿轮680和太阳齿轮620,以将太阳齿轮620的扭矩传递到环形齿轮680。
例如,环形齿轮680的齿数不少于太阳齿轮620的齿数的两倍,使得减速比不低于两倍。
图10是示出根据本发明的混合动力车辆驱动装置20的外观的立体图。
图11是示出驱动装置20的俯视图。
参考图10和11,驱动装置20的壳体可以被分割成壳体104和壳体102。壳体104对应于主要容纳电动机-发电机MG1的部分,壳体102对应于主要容纳电动机-发电机MG2和动力控制单元21的部分。
壳体104设置有凸缘106,壳体102设置由凸缘105。凸缘106和凸缘105通过螺栓等彼此固定,因此,壳体104和壳体102彼此一体。
壳体102还设置有用于组装动力控制单元21的开口108。在开口108中,电容C2容纳在左侧(沿车辆行驶方向的一侧),半导体模组10以及端子基体116和118容纳在中间,而电抗器L1容纳在右侧。在驱动装置20安装在车辆上的状态下,开口108被盖关闭。在开口108中,可以替代地,电容C2可以容纳在右侧,而电抗器L1可以容纳在半导体模组10的左侧。
即,电抗器L1布置在电动机-发电机MG1和MG2的旋转轴中一个的一侧,而电容C2布置在电动机-发电机MG1和MG2的旋转轴中另一个的一侧。然后,半导体模组10布置在电容C2和电抗器L1之间的区域。电动机-发电机MG2布置在半导体模组10的下方。
半导体模组10的构造类似于参考图2所述的构造。
具体而言,逆变器14和31的切换元件Q1-Q8布置在绝缘衬底50的顶侧。此外,母线40P和40N设置在逆变器14和逆变器31之间的区域,以沿绝缘衬底50的法向(对应于图中的垂直方向)彼此重叠。
母线40P用作堆叠结构的上层并形成电源线LN1。这里,母线40P是金属构件。另一方面,母线40N用作堆叠结构的下层并形成接地线LN2。这里,母线40N是布线层。
此外,散热器70(未示出)通过散热板60(未示出)设置在绝缘衬底的底侧。散热器70设置由多个沟槽72,每个沟槽72形成水槽,并且壳体102具有分别连接到水槽的冷却水入口114和冷却水出口112。这些入口和出口以这样的方式形成:使得凸缘106和105被开孔,并且然将接合螺栓等插入到壳体102的孔中。
这里,水槽可以这样的方式形成,使得冷却水不通过散热器70而直接在散热板60的底侧流动。这样的构造允许半导体模组10沿法向的长度减小。
此外,在逆变器14中,U相臂15、V相臂16和W相臂17分别设置有母线,母线被导向到连接至电动机-发电机MG2的定子线圈的端子基体116。同样,在逆变器31中,U相臂15、V相臂16和W相臂17分别设置有母线,母线被导向到连接至电动机-发电机MG1的定子线圈的端子基体118。
图12是示出当从图11中所示的X1方向观察时的驱动装置20的侧视图。
参考图12,壳体102设置有开口109,用于组装电动机-发电机和用于维护。在驱动装置20安装在车辆上的状态下,开口109被盖关闭。
电动机-发电机MG2布置开口109中。转子370布置在定子360中,U、V和W母线连接到定子360。从转子370的中心可观察空心轴600。
如图12所示,电动机-发电机MG2的定子360大部分接合在壳体102中用于容纳动力控制单元21的室中。因此,电抗器L1布置在电动机-发电机MG2的第一侧,电容C2布置在电动机-发电机MG2的第二侧。即,有效地容纳大尺寸的部件。另外,半导体模组10布置在电动机-发电机MG2的定子360上方。
根据这样的布置结构,形成动力控制单元21的电容C2、半导体模组10和电抗器L1在当车辆驱动装置安装在车辆上时布置在水平方向内。这里,基于容纳阻尼器124、电动机-发电机MG2、减速齿轮RG和差速齿轮DEF的壳体的投影部分确定水平方向尺寸。因此,混合动力车辆驱动装置可以变得紧凑。
沿安装在车辆上的垂直方向,半导体模组10以这样的方式布置,使得容纳半导体模组10的壳体的投影部分的高度不超过容纳阻尼器124、电动机-发电机MG2、减速齿轮RG和差速齿轮DEF的壳体的空间的高度。由于通过将母线40P和40N中用于电源的一个形成为布线层而显著降低半导体模组10沿法向的高度这样的布置,实现这样的布置。
从上面说明书中可以理解,形成控制单元21的半导体模组10、电抗器L1和电容C2布置在由容纳差速齿轮DEF的壳体部分的外边缘和容纳阻尼器124的壳体部分的外边缘所限定的垂直尺寸内。这样的构造使得车辆的重心低并且提高车辆的行驶稳定性。
(修改)
在上述的混合动力车辆中,包括半导体模组10的动力控制单元21采用一般的水冷系统作为冷却系统。
这里假设,在高温下可以致动的元件(诸如SiC-MOS元件)用作切换元件。因此,切换元件可以在几乎等于电动机-发电机的耐热温度的温度下致动。因此,取代仅用于动力控制单元21的水冷系统,切换元件可以采用与电动机-发电机共用的油冷系统作为冷却系统。因此,整个装置的构造可以变得更紧凑。此外,冷却操作可以在半导体模组10上不提供冷却水路径的情况下进行。这样的构造使得车辆的重心低低并且提高了车辆的行驶稳定性。
作为根据本发明的半导体模组应用的混合动力车辆的修改,下面将给出采用油冷系统作为动力控制单元21的冷却系统的混合动力车辆驱动装置的描述。
在这样的修改中,在包括半导体模组的动力控制单元21处产生的热量和在电动机-发电机MG1和MG2处产生的热量部分通过散热等散发,主要由与润滑剂的热交换来冷却。
因此,在动力控制单元21处产生的热量和在电动机-发电机MG1和电动机-发电机MG2处产生的热量通过润滑剂传递到电动机-发电机MG1的壳体,然后从壳体传递到发动机ENG的缸体。缸体由冷却水冷却,使得可以抑制温度升高。因此,动力控制单元21、电动机-发电机MG1和电动机-发电机MG2中的每一个的温度也被防止升高。
图13是示出驱动装置20中的油循环路径的剖视图。
参考图13,示出用于容纳电动机-发电机MG2的室和容纳动力控制单元21的室之间的边界部分的剖面、以及用于容纳减速齿轮RG和差速齿轮DEF的壳体部分的剖面。
图14是沿图13的线XIV-XIV的部分剖视图。
参考图13和14,壳体102设置有隔离壁210,用于隔离两个空间,即:用于容纳动力控制单元21的室和用于容纳电动机-发电机MG2的室。用于冷却半导体模组10的油的油路122设置在隔离壁210的顶侧,并且与蓄油器470和用于容纳电动机-发电机MG2连通。为了防止电动机-发电机MG2的润滑剂向半导体模组10泄漏,半导体模组10用隔离壁210和液体垫圈密封。
润滑剂在壳体的底部存储到油水平OL。壳体的这个底部对应于油盘。这里油盘可以分别设置在壳体的底部。
图9中所示的反向驱动齿轮700根据转子370的扭矩旋转。然后,反向从动齿轮132由反向驱动齿轮700旋转。因此,差速齿轮DEF根据反向从动齿轮132的扭矩旋转。
如图13中的箭头所示,然后,差速齿轮DEF升高润滑剂。挡油板486设置在壳体的上侧,并且由差速齿轮DEF所升高的油存储在蓄油器470中。蓄油器470在润滑剂循环路径中位于包括半导体模组10的动力控制单元21的上游侧。蓄油器470设置有出游口472。如图14所示,出游口472与每个都延伸到半导体模组10的下部空间的进油口474、476和478连通。
在半导体模制10中与切换元件安装表面的相对表面处,设置用于和油一起散热的散热片490、492和494。切换元件的热量通过这些散热片由润滑剂散发。因此,润滑剂经过设置在隔离壁210中的出油口480、483和484,然后流入定子360的上部。润滑剂沿着定子360的外周边流动,并且再次回到壳体的底部。
如上所述,半导体模组10被驱动电动机-发电机加热,然后通过使用电动机-发电机的润滑剂冷却。循环通过电动机-发电机的润滑剂的热量朝向发动机的壳体散发。
因此,冷却操作可以在电动机和逆变器的结合部分处不设置冷却水路径的情况下进行。因此,半导体模组10需要在水冷系统中提供水槽的散热器70。因此,这样的构造允许半导体模组10沿法向的长度进一步减小。因此,这样的构造使得车辆的重心变低,实现节省空间并且提高设计的自由度。
在上述实施例中,有代表性地,半导体模组应用到电动机驱动装置和混合动力驱动装置,但是,根据本发明的半导体模组的应用范围不限于此。例如,本发明可以应用到车辆中采用功率半导体元件的交流发电机或点火装置。
应当注意,这里公开的实施例在各个方面都是示例性而非限制。因为本发明的范围由权利要求而非以上描述所限定,并且落在权利要求的边界和范围内的改变这些边界和范围的等同内容均包含在权利要求中。
工业应用性
本发明可以应用到由安装到电动机驱动装置的逆变器和转换器所形成的半导体模组以及包括半导体模组的混合动力车辆驱动装置。

Claims (13)

1.一种半导体模组,包括:
第一电源线(LN1),连接到电源(B)的第一电极;
第二电源线(LN2),连接到所述电源(B)的第二电极;
第一和第二开关元件(Q3-Q8),连接在所述第一电源线(LN1)和所述第二电源线(LN2)之间;以及
绝缘衬底(50),其上安装有所述第一和第二开关元件(Q3-Q8);其中
所述第一电源线(LN1)包括连接到所述第一开关元件(Q3,Q5,Q7)的第一电极层的母线(40P);并且
所述第二电源线(LN2)包括布置在所述绝缘衬底(50)上并且连接到所述第二开关元件(Q4,Q6,Q8)的第二电极层的布线层(40N)。
2.根据权利要求1所述的半导体模组,还包括:
信号线层,布置在所述绝缘衬底(50)上,以将控制信号传递到所述第一和第二开关元件(Q3-Q8)的控制电极;
第一导体构件(WL1),使得所述第一电源线(LN1)、所述第一和第二开关元件(Q3-Q8)和所述第二电源线(LN2)电导通;以及
第二导体构件(WL2),使得所述第一和第二开关元件(Q3-Q8)的所述控制电极与所述信号线层电导通;其中
所述信号线层被布置使得所述第一导体构件(WL1)的延伸方向大致垂直于所述第二导体构件(WL2)的延伸方向。
3.根据权利要求2所述的半导体模组,其中
所述第一电极层和所述第二电极层被布置使得经过所述第一开关元件的电流方向与经过所述第二开关元件的电流方向相反。
4.根据权利要求1所述的半导体模组,还包括:
散热构件(60),附装到所述绝缘衬底(50)的底侧。
5.一种用于混合动力车辆的驱动装置,包括:
阻尼器(124),与内燃机(ENG)的曲轴连接;
旋转电机(MG2),被布置使得其旋转轴线与所述阻尼器(124)的旋转轴线重合;
动力传递机构(PSD,RG,DEF),将所述内燃机(ENG)产生的机械动力和所述旋转电机(MG2)产生的机械动力的结合传递到驱动轴;
壳体(102,104),容纳所述阻尼器(124)、所述旋转电机(MG2)和所述动力传递机构(PSD、RG、DEF);以及
动力控制单元(21),包括半导体模组(10)并且控制所述旋转电机(MG2),其中
所述半导体模组(10)包括:
第一电源线(LN1),连接到电源(B)的第一电极;
第二电源线(LN2),连接到所述电源(B)的第二电极;
第一和第二开关元件(Q3-Q8),连接在所述第一电源线(LN1)和所述第二电源线(LN2)之间;以及
绝缘衬底(50),其上安装有所述第一和第二开关元件(Q3-Q8);
所述第一电源线(LN1)包括连接到所述第一开关元件(Q3,Q5,Q7)的第一电极层的母线(40P),所述第二电源线(LN2)包括布置在所述绝缘衬底(50)上并且连接到所述第二开关元件(Q4,Q6,Q8)的第二电极层的布线层(40N);并且
当安装在所述车辆上时,所述动力控制单元(21)被布置在所述壳体(102,104)中,以在沿所述旋转轴线的方向投影时落在所述壳体(102,104)的投影部分的容纳所述阻尼器(124)、所述旋转电机(MG2)和所述动力传递机构(PSD、RG、DEF)的水平尺寸内。
6.根据权利要求5所述的驱动装置,其中
所述半导体模组(10)还包括:
信号线层,布置在所述绝缘衬底(50)上,以将控制信号传递到所述第一和第二开关元件(Q3-Q8)的控制电极;
第一导体构件(WL1),使得所述第一电源线(LN1)、所述第一和第二开关元件(Q3-Q8)以及所述第二电源线(LN2)电导通;以及
第二导体构件(WL2),使得所述第一和第二开关元件(Q3-Q8)的所述控制电极与所述信号线层电导通;并且
所述信号线层被布置使得所述第一导体构件(WL1)的延伸方向大致垂直于所述第二导体构件(WL2)的延伸方向。
7.根据权利要求6所述的驱动装置,其中
所述第一电极层和所述第二电极层被布置使得经过所述第一开关元件的电流方向与经过所述第二开关元件的电流方向相反。
8.根据权利要求5所述的驱动装置,其中
所述半导体模组(10)还包括附装到所述绝缘衬底(50)的底侧的散热构件(60)。
9.一种用于混合动力车辆的驱动装置,包括:
阻尼器(124),与内燃机(ENG)的曲轴连接;
旋转电机(MG2),被布置使得其旋转轴线与所述阻尼器(124)的旋转轴线重合;
动力传递机构(PSD、RG、DEF),将所述内燃机(ENG)产生的机械动力和所述旋转电机(MG2)产生的机械动力的结合传递到驱动轴;
壳体(102,104),容纳所述阻尼器(124)、所述旋转电机(MG2)和所述动力传递机构(PSD、RG、DEF);以及
动力控制单元(21),包括半导体模组(10)并且控制所述旋转电机(MG2),其中
所述半导体模组(10)包括:
第一电源线(LN1),连接到电源(B)的第一电极;
第二电源线(LN2),连接到所述电源(B)的第二电极;
第一和第二开关元件(Q3-Q8),连接在所述第一电源线(LN1)和所述第二电源线(LN2)之间;以及
绝缘衬底(50),其上安装有所述第一和第二开关元件(Q3-Q8);
所述第一电源线(LN1)包括连接到所述第一开关元件(Q3,Q5,Q7)的第一电极层的母线(40P),所述第二电源线(LN2)包括布置在所述绝缘衬底(50)上并且耦合到所述第二开关元件(Q4,Q6,Q8)的第二电极层的布线层(40N);并且
当安装在所述车辆上时,所述动力控制单元(21)被布置在所述壳体(102,104)中,以在沿所述旋转轴线的方向投影时落在所述壳体(102,104)的投影部分的容纳所述阻尼器(124)、所述旋转电机(MG2)和所述动力传递机构(PSD、RG、DEF)的竖直尺寸内。
10.根据权利要求9所述的驱动装置,其中
所述半导体模组(10)还包括:
信号线层,布置在所述绝缘衬底(50)上,以将控制信号传递到所述第一和第二开关元件(Q3-Q8)的控制电极;
第一导体构件(WL1),使得所述第一电源线(LN1)、所述第一和第二开关元件(Q3-Q8)以及所述第二电源线(LN2)电导通;以及
第二导体构件(WL2),使得所述第一和第二开关元件(Q3-Q8)的所述控制电极与所述信号线层电导通;并且
所述信号线层被布置使得所述第一导体构件(WL1)的延伸方向大致垂直于所述第二导体构件(WL2)的延伸方向。
11.根据权利要求10所述的驱动装置,其中
所述第一电极层和所述第二电极层被布置使得经过所述第一开关元件的电流方向与经过所述第二开关元件的电流方向相反。
12.根据权利要求9所述的驱动装置,其中
所述半导体模组(10)还包括附装到所述绝缘衬底(50)的底侧的散热构件(60)。
13.根据权利要求5-12中任一项所述的驱动装置,其中
所述动力控制单元(21)还包括:
电抗器(L1),相对于旋转中心轴线布置在所述旋转电机(MG2)的第一侧;以及
电容器(C2),相对于所述旋转中心轴线布置在所述旋转电机(MG2)的第二侧。
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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714198A (zh) * 2010-01-13 2012-10-03 丰田自动车株式会社 电力模块制造方法以及由之制造的电力模块
US9520344B2 (en) 2012-05-16 2016-12-13 Panasonic Intellectual Property Management Co., Ltd. Semiconductor module for electric power
CN106416044A (zh) * 2014-01-31 2017-02-15 丰田自动车株式会社 电力控制单元
CN113097154A (zh) * 2021-03-22 2021-07-09 西安交通大学 一种双向开关功率模块及其制备方法

Families Citing this family (34)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4191689B2 (ja) * 2005-02-25 2008-12-03 三菱重工業株式会社 インバータ装置
JP4297951B2 (ja) * 2007-05-25 2009-07-15 トヨタ自動車株式会社 車両の駆動システム
JP2009081273A (ja) * 2007-09-26 2009-04-16 Rohm Co Ltd 半導体装置
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JP5329187B2 (ja) * 2008-11-19 2013-10-30 住友重機械工業株式会社 ハイブリッド型建設機械
CN102216198B (zh) 2008-11-18 2014-09-10 住友重机械工业株式会社 工作机械
JP5306786B2 (ja) * 2008-11-19 2013-10-02 住友重機械工業株式会社 サーボ制御システム及び作業機械
DE202009004186U1 (de) * 2009-03-25 2010-08-12 Liebherr-Elektronik Gmbh Spannungswandler
JP2011192809A (ja) * 2010-03-15 2011-09-29 Omron Corp パワーコンディショナー装置およびこの装置に使用するモジュール基板構造
CN201708684U (zh) * 2010-06-07 2011-01-12 柳州五菱汽车有限责任公司 电动汽车驱动控制器散热系统
US9822580B2 (en) * 2011-02-22 2017-11-21 Guardian Glass, LLC Localized heating techniques incorporating tunable infrared element(s) for vacuum insulating glass units, and/or apparatuses for same
JP5464159B2 (ja) 2011-03-08 2014-04-09 三菱電機株式会社 パワーモジュール
JP5517988B2 (ja) * 2011-04-22 2014-06-11 日立オートモティブシステムズ株式会社 エンジン始動装置
US11161403B2 (en) 2012-02-03 2021-11-02 Ge Hybrid Technologies, Llc Apparatus and method for delivering power in a hybrid vehicle
US8981727B2 (en) 2012-05-21 2015-03-17 General Electric Company Method and apparatus for charging multiple energy storage devices
JP5862502B2 (ja) * 2012-07-27 2016-02-16 アイシン・エィ・ダブリュ株式会社 車両用駆動装置
US20140077611A1 (en) * 2012-09-14 2014-03-20 Henry Todd Young Capacitor bank, laminated bus, and power supply apparatus
JP5858309B2 (ja) * 2012-11-28 2016-02-10 富士電機株式会社 電力変換システム及びその制御方法
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JP5862606B2 (ja) * 2013-05-17 2016-02-16 株式会社デンソー 電力変換装置
JP6102691B2 (ja) * 2013-11-15 2017-03-29 株式会社デンソー 電力変換装置
US9834098B2 (en) 2014-01-30 2017-12-05 General Electric Company Vehicle propulsion system with multi-channel DC bus and method of manufacturing same
CN103825479A (zh) * 2014-02-20 2014-05-28 华为技术有限公司 一种功率变换器
JP6245365B2 (ja) 2014-07-03 2017-12-13 日産自動車株式会社 ハーフブリッジパワー半導体モジュール及びその製造方法
US10756057B2 (en) * 2014-11-28 2020-08-25 Nissan Motor Co., Ltd. Half-bridge power semiconductor module and method of manufacturing same
US9893646B2 (en) 2015-09-30 2018-02-13 General Electric Company System for a low profile, low inductance power switching module
US11025031B2 (en) 2016-11-29 2021-06-01 Leonardo Electronics Us Inc. Dual junction fiber-coupled laser diode and related methods
CA3109659C (en) * 2018-08-13 2023-10-31 Leonardo Electronics Us Inc. Use of metal-core printed circuit board (pcb) for generation of ultra-narrow, high-current pulse driver
US11056854B2 (en) 2018-08-14 2021-07-06 Leonardo Electronics Us Inc. Laser assembly and related methods
CN111196144B (zh) * 2018-11-16 2023-04-21 丰田自动车株式会社 车辆用驱动装置
JP7143441B2 (ja) * 2018-12-27 2022-09-28 本田技研工業株式会社 電動二輪車のモータ冷却構造
US11296481B2 (en) 2019-01-09 2022-04-05 Leonardo Electronics Us Inc. Divergence reshaping array
US11752571B1 (en) 2019-06-07 2023-09-12 Leonardo Electronics Us Inc. Coherent beam coupler
US10833596B1 (en) * 2019-06-10 2020-11-10 Ford Global Technologies, Llc Integrated power unit for a power supply device

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3380117B2 (ja) * 1995-07-24 2003-02-24 セイコーインスツルメンツ株式会社 半導体装置とその製造方法
JPH11187542A (ja) 1997-12-18 1999-07-09 Furukawa Electric Co Ltd:The バスバー配線板の製造方法
JPH11299056A (ja) 1998-04-15 1999-10-29 Harness Syst Tech Res Ltd 電気接続箱のバスバー構造
JP3692906B2 (ja) * 2000-05-25 2005-09-07 日産自動車株式会社 電力配線構造及び半導体装置
DE10049723A1 (de) 2000-09-29 2002-04-11 Daimler Chrysler Ag Anordnung von Leistungshalbleitern zum Steuern eines elektrischen Energieflusses
JP2002217364A (ja) * 2001-01-15 2002-08-02 Nissan Motor Co Ltd 半導体実装構造
JP3809346B2 (ja) 2001-06-15 2006-08-16 トヨタ自動車株式会社 スイッチング回路
JP3769228B2 (ja) * 2001-12-25 2006-04-19 三菱電機株式会社 電力半導体装置
JP3876770B2 (ja) 2002-06-07 2007-02-07 日産自動車株式会社 配線構造
JP4523240B2 (ja) 2003-04-23 2010-08-11 三菱電機株式会社 車両用電動発電装置
JP2005033882A (ja) 2003-07-09 2005-02-03 Sumitomo Wiring Syst Ltd 電気接続箱の回路構造
JP4658481B2 (ja) * 2004-01-16 2011-03-23 ルネサスエレクトロニクス株式会社 半導体装置
US7298027B2 (en) * 2004-09-02 2007-11-20 International Rectifier Corporation SMT three phase inverter package and lead frame

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102714198A (zh) * 2010-01-13 2012-10-03 丰田自动车株式会社 电力模块制造方法以及由之制造的电力模块
CN102714198B (zh) * 2010-01-13 2015-05-27 丰田自动车株式会社 电力模块制造方法以及由之制造的电力模块
US9520344B2 (en) 2012-05-16 2016-12-13 Panasonic Intellectual Property Management Co., Ltd. Semiconductor module for electric power
CN104303297B (zh) * 2012-05-16 2017-05-17 松下知识产权经营株式会社 电力用半导体模块
CN106416044A (zh) * 2014-01-31 2017-02-15 丰田自动车株式会社 电力控制单元
CN106416044B (zh) * 2014-01-31 2019-03-01 丰田自动车株式会社 电力控制单元
CN113097154A (zh) * 2021-03-22 2021-07-09 西安交通大学 一种双向开关功率模块及其制备方法

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TW200737636A (en) 2007-10-01
DE112007000378T5 (de) 2008-12-24
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US7932624B2 (en) 2011-04-26
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