CN101305468B - 在半导体/电介质界面处具有晶体区域的非晶氧化物场效应晶体管 - Google Patents

在半导体/电介质界面处具有晶体区域的非晶氧化物场效应晶体管 Download PDF

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Publication number
CN101305468B
CN101305468B CN2006800415569A CN200680041556A CN101305468B CN 101305468 B CN101305468 B CN 101305468B CN 2006800415569 A CN2006800415569 A CN 2006800415569A CN 200680041556 A CN200680041556 A CN 200680041556A CN 101305468 B CN101305468 B CN 101305468B
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amorphous oxide
interface
amorphous
region
film
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Chinese (zh)
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CN101305468A (zh
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饗场利明
佐野政史
加地信幸
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Canon Inc
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Canon Inc
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    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/674Thin-film transistors [TFT] characterised by the active materials
    • H10D30/6755Oxide semiconductors, e.g. zinc oxide, copper aluminium oxide or cadmium stannate
    • H10D30/6756Amorphous oxide semiconductors
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D30/00Field-effect transistors [FET]
    • H10D30/60Insulated-gate field-effect transistors [IGFET]
    • H10D30/67Thin-film transistors [TFT]
    • H10D30/6757Thin-film transistors [TFT] characterised by the structure of the channel, e.g. transverse or longitudinal shape or doping profile
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10DINORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D62/00Semiconductor bodies, or regions thereof, of devices having potential barriers
    • H10D62/40Crystalline structures

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  • Thin Film Transistor (AREA)
  • Dram (AREA)
CN2006800415569A 2005-11-08 2006-11-01 在半导体/电介质界面处具有晶体区域的非晶氧化物场效应晶体管 Expired - Fee Related CN101305468B (zh)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP2005323689 2005-11-08
JP323689/2005 2005-11-08
JP2006283893A JP4560505B2 (ja) 2005-11-08 2006-10-18 電界効果型トランジスタ
JP283893/2006 2006-10-18
PCT/JP2006/322327 WO2007055256A1 (en) 2005-11-08 2006-11-01 Amorphous oxide field-effect transistor having crystalline region at the semiconductor/dielectric interface

Publications (2)

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CN101305468A CN101305468A (zh) 2008-11-12
CN101305468B true CN101305468B (zh) 2011-01-05

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US (1) US7851792B2 (enExample)
EP (1) EP1946383A1 (enExample)
JP (1) JP4560505B2 (enExample)
KR (1) KR100995520B1 (enExample)
CN (1) CN101305468B (enExample)
BR (1) BRPI0618329A2 (enExample)
RU (1) RU2390072C2 (enExample)
TW (1) TWI328288B (enExample)
WO (1) WO2007055256A1 (enExample)

Families Citing this family (31)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA2585190A1 (en) * 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
JP5305630B2 (ja) 2006-12-05 2013-10-02 キヤノン株式会社 ボトムゲート型薄膜トランジスタの製造方法及び表示装置の製造方法
JP5354862B2 (ja) * 2007-02-19 2013-11-27 キヤノン株式会社 アモルファス絶縁体膜及び薄膜トランジスタ
CN101849306B (zh) 2007-09-06 2013-06-12 佳能株式会社 锂离子储存/释放材料的制备方法、锂离子储存/释放材料、使用该材料的电极结构体和储能器件
JP5213421B2 (ja) * 2007-12-04 2013-06-19 キヤノン株式会社 酸化物半導体薄膜トランジスタ
US9082857B2 (en) * 2008-09-01 2015-07-14 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device comprising an oxide semiconductor layer
WO2010038596A1 (en) * 2008-10-03 2010-04-08 Semiconductor Energy Laboratory Co., Ltd. Modulation circuit and semiconductor device including the same
TWI536577B (zh) * 2008-11-13 2016-06-01 半導體能源研究所股份有限公司 半導體裝置及其製造方法
JP2010153802A (ja) * 2008-11-20 2010-07-08 Semiconductor Energy Lab Co Ltd 半導体装置及び半導体装置の作製方法
EP3217435A1 (en) * 2009-09-16 2017-09-13 Semiconductor Energy Laboratory Co., Ltd. Transistor and display device
TWI512997B (zh) * 2009-09-24 2015-12-11 Semiconductor Energy Lab 半導體裝置,電源電路,和半導體裝置的製造方法
KR101877149B1 (ko) * 2009-10-08 2018-07-10 가부시키가이샤 한도오따이 에네루기 켄큐쇼 산화물 반도체층, 반도체 장치 및 그 제조 방법
CN102576737B (zh) * 2009-10-09 2015-10-21 株式会社半导体能源研究所 半导体器件及其制造方法
KR20190066086A (ko) 2009-11-06 2019-06-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치 및 그 제작 방법
WO2011058934A1 (en) 2009-11-13 2011-05-19 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and driving method thereof
KR101800852B1 (ko) * 2009-11-20 2017-12-20 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
KR101800854B1 (ko) * 2009-11-20 2017-11-23 가부시키가이샤 한도오따이 에네루기 켄큐쇼 트랜지스터
WO2011062042A1 (en) * 2009-11-20 2011-05-26 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
WO2011065230A1 (en) * 2009-11-30 2011-06-03 Semiconductor Energy Laboratory Co., Ltd. Liquid crystal display device, method for driving the same, and electronic device including the same
CN104992962B (zh) 2009-12-04 2018-12-25 株式会社半导体能源研究所 半导体器件及其制造方法
KR101773641B1 (ko) 2010-01-22 2017-09-12 가부시키가이샤 한도오따이 에네루기 켄큐쇼 반도체 장치
US8416622B2 (en) * 2010-05-20 2013-04-09 Semiconductor Energy Laboratory Co., Ltd. Driving method of a semiconductor device with an inverted period having a negative potential applied to a gate of an oxide semiconductor transistor
US8987728B2 (en) * 2011-03-25 2015-03-24 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and method of manufacturing semiconductor device
JP6023453B2 (ja) * 2011-04-15 2016-11-09 株式会社半導体エネルギー研究所 記憶装置
JP6006572B2 (ja) * 2011-08-18 2016-10-12 株式会社半導体エネルギー研究所 半導体装置
JP5832399B2 (ja) * 2011-09-16 2015-12-16 株式会社半導体エネルギー研究所 発光装置
WO2013047629A1 (en) 2011-09-29 2013-04-04 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device
US9057126B2 (en) * 2011-11-29 2015-06-16 Semiconductor Energy Laboratory Co., Ltd. Method for manufacturing sputtering target and method for manufacturing semiconductor device
US20150329371A1 (en) * 2014-05-13 2015-11-19 Semiconductor Energy Laboratory Co., Ltd. Oxide, semiconductor device, module, and electronic device
RU168641U1 (ru) * 2016-01-26 2017-02-13 Акционерное общество "Научно-исследовательский институт полупроводниковых приборов" (АО "НИИПП") Конструкция высокочастотного полевого транзистора с дополнительным полевым электродом
KR20180124934A (ko) 2016-03-18 2018-11-21 가부시키가이샤 리코 전계 효과형 트랜지스터의 제조 방법

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1564324A (zh) * 2004-03-31 2005-01-12 浙江大学 一种ZnO基透明薄膜晶体管及其制备方法

Family Cites Families (27)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6187371A (ja) * 1984-10-05 1986-05-02 Hitachi Ltd 薄膜半導体装置
US5849601A (en) 1990-12-25 1998-12-15 Semiconductor Energy Laboratory Co., Ltd. Electro-optical device and method for manufacturing the same
EP0535979A3 (en) 1991-10-02 1993-07-21 Sharp Kabushiki Kaisha A thin film transistor and a method for producing the same
JPH0595002A (ja) 1991-10-02 1993-04-16 Sharp Corp 薄膜トランジスタ
RU2069417C1 (ru) * 1994-06-08 1996-11-20 Акционерное общество открытого типа "Научно-исследовательский институт молекулярной электроники и завод "Микрон" Способ изготовления тонкопленочных транзисторов матриц жидкокристаллических экранов
US6172296B1 (en) 1996-05-17 2001-01-09 Canon Kabushiki Kaisha Photovoltaic cell
US6123824A (en) 1996-12-13 2000-09-26 Canon Kabushiki Kaisha Process for producing photo-electricity generating device
JPH1146006A (ja) 1997-07-25 1999-02-16 Canon Inc 光起電力素子およびその製造方法
JPH11233801A (ja) 1998-02-17 1999-08-27 Canon Inc 微結晶シリコン膜の形成方法、および光起電力素子
JP4208281B2 (ja) 1998-02-26 2009-01-14 キヤノン株式会社 積層型光起電力素子
US6303945B1 (en) 1998-03-16 2001-10-16 Canon Kabushiki Kaisha Semiconductor element having microcrystalline semiconductor material
US6344608B2 (en) 1998-06-30 2002-02-05 Canon Kabushiki Kaisha Photovoltaic element
US6472248B2 (en) 1999-07-04 2002-10-29 Canon Kabushiki Kaisha Microcrystalline series photovoltaic element and process for fabrication of same
JP2002134772A (ja) 2000-10-24 2002-05-10 Canon Inc シリコン系薄膜及び光起電力素子
JP2002206168A (ja) 2000-10-24 2002-07-26 Canon Inc シリコン系薄膜の形成方法、シリコン系半導体層の形成方法及び光起電力素子
JP2002305315A (ja) 2001-01-31 2002-10-18 Canon Inc 半導体素子の形成方法及び半導体素子
US6706336B2 (en) 2001-02-02 2004-03-16 Canon Kabushiki Kaisha Silicon-based film, formation method therefor and photovoltaic element
US6858308B2 (en) 2001-03-12 2005-02-22 Canon Kabushiki Kaisha Semiconductor element, and method of forming silicon-based film
JP2003007629A (ja) 2001-04-03 2003-01-10 Canon Inc シリコン系膜の形成方法、シリコン系膜および半導体素子
US7339187B2 (en) 2002-05-21 2008-03-04 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Transistor structures
JP2004335823A (ja) 2003-05-09 2004-11-25 Canon Inc 光起電力素子及び光起電力素子の形成方法
JP4108633B2 (ja) * 2003-06-20 2008-06-25 シャープ株式会社 薄膜トランジスタおよびその製造方法ならびに電子デバイス
US20050017244A1 (en) 2003-07-25 2005-01-27 Randy Hoffman Semiconductor device
KR100975523B1 (ko) 2003-12-30 2010-08-13 삼성전자주식회사 조절된 이동도를 가지는 반도체 소자 및 이를 적용한 tft
CN1998087B (zh) * 2004-03-12 2014-12-31 独立行政法人科学技术振兴机构 非晶形氧化物和薄膜晶体管
CA2585190A1 (en) 2004-11-10 2006-05-18 Canon Kabushiki Kaisha Amorphous oxide and field effect transistor
JP5037808B2 (ja) 2005-10-20 2012-10-03 キヤノン株式会社 アモルファス酸化物を用いた電界効果型トランジスタ、及び該トランジスタを用いた表示装置

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1564324A (zh) * 2004-03-31 2005-01-12 浙江大学 一种ZnO基透明薄膜晶体管及其制备方法

Non-Patent Citations (3)

* Cited by examiner, † Cited by third party
Title
CHIANG H Q ET AL.High mobility transport thin-film transistor with amorphous zinctin oxide channel layer.APPLIED PHYSICS LETTERS86.2004,8612503-1. *
MARTINS R ET AL.Transport in high mobility amorphous wide band gapindiumzinc oxide films.PHYSICA STATUS SOLIDI202 9.2005,202(9),95-97.
MARTINS R ET AL.Transport in high mobility amorphous wide band gapindiumzinc oxide films.PHYSICA STATUS SOLIDI202 9.2005,202(9),95-97. *

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Publication number Publication date
BRPI0618329A2 (pt) 2012-05-08
KR20080074931A (ko) 2008-08-13
US7851792B2 (en) 2010-12-14
JP4560505B2 (ja) 2010-10-13
CN101305468A (zh) 2008-11-12
TWI328288B (en) 2010-08-01
JP2007158307A (ja) 2007-06-21
WO2007055256A1 (en) 2007-05-18
TW200737525A (en) 2007-10-01
US20090272970A1 (en) 2009-11-05
RU2008122971A (ru) 2009-12-20
RU2390072C2 (ru) 2010-05-20
KR100995520B1 (ko) 2010-11-22
EP1946383A1 (en) 2008-07-23

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