CN101276158A - 抗蚀剂图案的形成方法和通过该方法制造的半导体装置 - Google Patents

抗蚀剂图案的形成方法和通过该方法制造的半导体装置 Download PDF

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Publication number
CN101276158A
CN101276158A CNA2008100885739A CN200810088573A CN101276158A CN 101276158 A CN101276158 A CN 101276158A CN A2008100885739 A CNA2008100885739 A CN A2008100885739A CN 200810088573 A CN200810088573 A CN 200810088573A CN 101276158 A CN101276158 A CN 101276158A
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China
Prior art keywords
substrate
water
agent
forming
soup
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Pending
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CNA2008100885739A
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English (en)
Chinese (zh)
Inventor
石桥健夫
寺井护
萩原琢也
山口敦美
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Renesas Electronics Corp
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Renesas Technology Corp
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Publication of CN101276158A publication Critical patent/CN101276158A/zh
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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/20—Exposure; Apparatus therefor
    • G03F7/2041—Exposure; Apparatus therefor in the presence of a fluid, e.g. immersion; using fluid cooling means
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70341—Details of immersion lithography aspects, e.g. exposure media or control of immersion liquid supply
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • H01L21/0271—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers
    • H01L21/0273—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34 comprising organic layers characterised by the treatment of photoresist layers
    • H01L21/0274—Photolithographic processes

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Materials For Photolithography (AREA)
CNA2008100885739A 2007-03-30 2008-03-28 抗蚀剂图案的形成方法和通过该方法制造的半导体装置 Pending CN101276158A (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007-094042 2007-03-30
JP2007094042 2007-03-30
JP2008-021604 2008-01-31

Publications (1)

Publication Number Publication Date
CN101276158A true CN101276158A (zh) 2008-10-01

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CNA2008100885739A Pending CN101276158A (zh) 2007-03-30 2008-03-28 抗蚀剂图案的形成方法和通过该方法制造的半导体装置

Country Status (4)

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JP (1) JP2008277748A (enExample)
KR (1) KR20080089296A (enExample)
CN (1) CN101276158A (enExample)
TW (1) TW200845128A (enExample)

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CN102598221A (zh) * 2009-10-28 2012-07-18 中央硝子株式会社 保护膜形成用化学溶液
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CN102971836A (zh) * 2010-06-28 2013-03-13 中央硝子株式会社 拒水性保护膜形成剂、拒水性保护膜形成用化学溶液和使用该化学溶液的晶片的清洗方法
CN103283004A (zh) * 2010-12-28 2013-09-04 中央硝子株式会社 晶片的清洗方法
CN103293859A (zh) * 2013-05-27 2013-09-11 苏州扬清芯片科技有限公司 光刻胶薄膜的制作方法
CN104145216A (zh) * 2012-04-19 2014-11-12 木本股份有限公司 玻璃掩模用热固化型保护液及玻璃掩模
US9228120B2 (en) 2010-06-07 2016-01-05 Central Glass Company, Limited Liquid chemical for forming protecting film
CN102598221B (zh) * 2009-10-28 2016-11-30 中央硝子株式会社 保护膜形成用化学溶液
CN107077072A (zh) * 2014-11-19 2017-08-18 日产化学工业株式会社 能够湿式除去的含有硅的抗蚀剂下层膜形成用组合物
CN107340684A (zh) * 2013-04-02 2017-11-10 富士胶片株式会社 图案形成方法及电子元件的制造方法
CN109991809A (zh) * 2017-12-31 2019-07-09 罗门哈斯电子材料有限责任公司 光致抗蚀剂组合物和方法
CN111463147A (zh) * 2019-01-22 2020-07-28 东京毅力科创株式会社 基片处理装置、基片处理方法和存储介质
CN111699546A (zh) * 2018-02-13 2020-09-22 中央硝子株式会社 拒水性保护膜形成剂、拒水性保护膜形成用化学溶液和晶片的表面处理方法
CN113169060A (zh) * 2018-11-22 2021-07-23 中央硝子株式会社 倒角部处理剂组合物和晶圆的制造方法
US11550234B2 (en) * 2018-10-01 2023-01-10 Asml Netherlands B.V. Object in a lithographic apparatus

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JP2009117832A (ja) 2007-11-06 2009-05-28 Asml Netherlands Bv リソグラフィの基板を準備する方法、基板、デバイス製造方法、密封コーティングアプリケータ及び密封コーティング測定装置
JP2010135428A (ja) * 2008-12-02 2010-06-17 Toshiba Corp 基板保持部材及び半導体装置の製造方法
US9053924B2 (en) 2008-12-26 2015-06-09 Central Glass Company, Limited Cleaning agent for silicon wafer
JP5533178B2 (ja) * 2009-04-24 2014-06-25 セントラル硝子株式会社 シリコンウェハ用洗浄剤
JP5242508B2 (ja) 2009-06-26 2013-07-24 東京エレクトロン株式会社 液処理装置、液処理方法および記憶媒体
JP5404364B2 (ja) * 2009-12-15 2014-01-29 株式会社東芝 半導体基板の表面処理装置及び方法
JP5501085B2 (ja) * 2010-04-28 2014-05-21 東京エレクトロン株式会社 基板処理方法
JP5708191B2 (ja) 2010-05-19 2015-04-30 セントラル硝子株式会社 保護膜形成用薬液
JP5716527B2 (ja) * 2010-06-28 2015-05-13 セントラル硝子株式会社 撥水性保護膜形成用薬液と該薬液を用いたウェハの洗浄方法
JP5712670B2 (ja) * 2011-02-25 2015-05-07 セントラル硝子株式会社 撥水性保護膜形成薬液
WO2012002243A1 (ja) * 2010-06-28 2012-01-05 セントラル硝子株式会社 撥水性保護膜形成剤、撥水性保護膜形成用薬液と該薬液を用いたウェハの洗浄方法
JP5678720B2 (ja) * 2011-02-25 2015-03-04 セントラル硝子株式会社 ウェハの洗浄方法
WO2012002200A1 (ja) * 2010-06-30 2012-01-05 セントラル硝子株式会社 ウェハの洗浄方法
JP2012033880A (ja) * 2010-06-30 2012-02-16 Central Glass Co Ltd 撥水性保護膜形成用薬液
KR101396271B1 (ko) * 2010-06-30 2014-05-16 샌트랄 글래스 컴퍼니 리미티드 웨이퍼의 세정방법
KR101266620B1 (ko) 2010-08-20 2013-05-22 다이닛뽕스크린 세이조오 가부시키가이샤 기판처리방법 및 기판처리장치
JP5662081B2 (ja) * 2010-08-20 2015-01-28 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法および基板処理装置
JP5320383B2 (ja) * 2010-12-27 2013-10-23 東京エレクトロン株式会社 基板液処理装置及び基板液処理方法並びに基板液処理プログラムを記録したコンピュータ読み取り可能な記録媒体
JP5611884B2 (ja) * 2011-04-14 2014-10-22 東京エレクトロン株式会社 エッチング方法、エッチング装置および記憶媒体
JP5816488B2 (ja) * 2011-08-26 2015-11-18 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6213616B2 (ja) * 2011-10-28 2017-10-18 セントラル硝子株式会社 保護膜形成用薬液の調製方法
JP5953721B2 (ja) * 2011-10-28 2016-07-20 セントラル硝子株式会社 保護膜形成用薬液の調製方法
WO2013115021A1 (ja) * 2012-02-01 2013-08-08 セントラル硝子株式会社 撥水性保護膜形成用薬液、撥水性保護膜形成用薬液キット、及びウェハの洗浄方法
JP6118309B2 (ja) * 2014-12-22 2017-04-19 株式会社Ｓｃｒｅｅｎホールディングス 基板処理方法
JP2016157779A (ja) 2015-02-24 2016-09-01 ルネサスエレクトロニクス株式会社 半導体装置の製造方法
JP6916731B2 (ja) * 2017-12-28 2021-08-11 東京応化工業株式会社 基板の撥水化方法、表面処理剤、及び基板表面を洗浄液により洗浄する際の有機パターン又は無機パターンの倒れを抑制する方法
JP7000177B2 (ja) * 2018-01-30 2022-01-19 株式会社Ｓｃｒｅｅｎホールディングス 処理液吐出配管および基板処理装置
US20230282474A1 (en) * 2020-05-21 2023-09-07 Central Glass Company, Limited Surface treatment method for semiconductor substrates and surface treatment agent composition
CN113823549B (zh) * 2020-06-19 2025-01-21 中国科学院微电子研究所 半导体结构的制造方法
CN118483879B (zh) * 2024-06-03 2025-03-14 浙江大学 基于有机介质的ic光刻设备浸没边界流场收束及撤除方法

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CN101993632A (zh) * 2009-08-17 2011-03-30 株式会社东进世美肯 油墨组合物
CN102598221A (zh) * 2009-10-28 2012-07-18 中央硝子株式会社 保护膜形成用化学溶液
CN102598221B (zh) * 2009-10-28 2016-11-30 中央硝子株式会社 保护膜形成用化学溶液
TWI425002B (zh) * 2010-06-07 2014-02-01 Central Glass Co Ltd Protective film forming liquid
US9228120B2 (en) 2010-06-07 2016-01-05 Central Glass Company, Limited Liquid chemical for forming protecting film
CN102934207B (zh) * 2010-06-07 2016-04-06 中央硝子株式会社 保护膜形成用化学溶液
CN102934207A (zh) * 2010-06-07 2013-02-13 中央硝子株式会社 保护膜形成用化学溶液
US9748092B2 (en) 2010-06-07 2017-08-29 Central Glass Company, Limited Liquid chemical for forming protecting film
CN102971836A (zh) * 2010-06-28 2013-03-13 中央硝子株式会社 拒水性保护膜形成剂、拒水性保护膜形成用化学溶液和使用该化学溶液的晶片的清洗方法
TWI461519B (zh) * 2010-06-28 2014-11-21 Central Glass Co Ltd A water-repellent protective film-forming agent, a liquid for forming a water-repellent protective film, and a method for cleaning the wafer using the liquid
CN102971836B (zh) * 2010-06-28 2016-06-08 中央硝子株式会社 拒水性保护膜形成剂、拒水性保护膜形成用化学溶液和使用该化学溶液的晶片的清洗方法
CN103283004B (zh) * 2010-12-28 2017-04-12 中央硝子株式会社 晶片的清洗方法
CN103283004A (zh) * 2010-12-28 2013-09-04 中央硝子株式会社 晶片的清洗方法
CN104145216A (zh) * 2012-04-19 2014-11-12 木本股份有限公司 玻璃掩模用热固化型保护液及玻璃掩模
CN107340684A (zh) * 2013-04-02 2017-11-10 富士胶片株式会社 图案形成方法及电子元件的制造方法
CN103293859A (zh) * 2013-05-27 2013-09-11 苏州扬清芯片科技有限公司 光刻胶薄膜的制作方法
CN107077072A (zh) * 2014-11-19 2017-08-18 日产化学工业株式会社 能够湿式除去的含有硅的抗蚀剂下层膜形成用组合物
CN107077072B (zh) * 2014-11-19 2021-05-25 日产化学工业株式会社 能够湿式除去的含有硅的抗蚀剂下层膜形成用组合物
CN109991809A (zh) * 2017-12-31 2019-07-09 罗门哈斯电子材料有限责任公司 光致抗蚀剂组合物和方法
CN109991809B (zh) * 2017-12-31 2022-10-11 罗门哈斯电子材料有限责任公司 光致抗蚀剂组合物和方法
CN111699546A (zh) * 2018-02-13 2020-09-22 中央硝子株式会社 拒水性保护膜形成剂、拒水性保护膜形成用化学溶液和晶片的表面处理方法
CN111699546B (zh) * 2018-02-13 2023-09-12 中央硝子株式会社 拒水性保护膜形成剂和拒水性保护膜形成用化学溶液
US11550234B2 (en) * 2018-10-01 2023-01-10 Asml Netherlands B.V. Object in a lithographic apparatus
CN113169060A (zh) * 2018-11-22 2021-07-23 中央硝子株式会社 倒角部处理剂组合物和晶圆的制造方法
CN111463147A (zh) * 2019-01-22 2020-07-28 东京毅力科创株式会社 基片处理装置、基片处理方法和存储介质
CN111463147B (zh) * 2019-01-22 2024-03-22 东京毅力科创株式会社 基片处理装置、基片处理方法和存储介质

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KR20080089296A (ko) 2008-10-06
TW200845128A (en) 2008-11-16
JP2008277748A (ja) 2008-11-13

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