CN101261973B - 半导体装置 - Google Patents

半导体装置 Download PDF

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Publication number
CN101261973B
CN101261973B CN2008100825992A CN200810082599A CN101261973B CN 101261973 B CN101261973 B CN 101261973B CN 2008100825992 A CN2008100825992 A CN 2008100825992A CN 200810082599 A CN200810082599 A CN 200810082599A CN 101261973 B CN101261973 B CN 101261973B
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CN
China
Prior art keywords
signal
inner lead
leads
interval
lead
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2008100825992A
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English (en)
Chinese (zh)
Other versions
CN101261973A (zh
Inventor
三角和幸
畑内和士
高田泰纪
安田直世
新川秀之
福留胜幸
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Renesas Electronics Corp
Original Assignee
Renesas Electronics Corp
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Filing date
Publication date
Application filed by Renesas Electronics Corp filed Critical Renesas Electronics Corp
Publication of CN101261973A publication Critical patent/CN101261973A/zh
Application granted granted Critical
Publication of CN101261973B publication Critical patent/CN101261973B/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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    • H—ELECTRICITY
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/60—Protection against electrostatic charges or discharges, e.g. Faraday shields
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    • H01L24/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/48253—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a potential ring of the item
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    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2924/3011—Impedance

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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
CN2008100825992A 2007-03-06 2008-03-05 半导体装置 Expired - Fee Related CN101261973B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置
JP2007055247 2007-03-06
JP2007-055247 2007-03-06

Publications (2)

Publication Number Publication Date
CN101261973A CN101261973A (zh) 2008-09-10
CN101261973B true CN101261973B (zh) 2011-12-21

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2008100825992A Expired - Fee Related CN101261973B (zh) 2007-03-06 2008-03-05 半导体装置

Country Status (4)

Country Link
US (1) US7763966B2 (enExample)
JP (1) JP2008218776A (enExample)
CN (1) CN101261973B (enExample)
TW (1) TW200845342A (enExample)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5499696B2 (ja) 2009-12-25 2014-05-21 富士通セミコンダクター株式会社 半導体装置及び実装構造
CN104851863B (zh) * 2015-04-17 2017-11-28 华为技术有限公司 一种集成电路、引线键合封装芯片及倒装封装芯片
DE112019003540T5 (de) * 2018-07-12 2021-03-25 Rohm Co., Ltd. Halbleiterbauteil

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JPH0714976A (ja) 1993-06-24 1995-01-17 Shinko Electric Ind Co Ltd リードフレーム及び半導体装置
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JP2866572B2 (ja) * 1994-02-07 1999-03-08 三菱電機株式会社 半導体製造方法
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JP4373531B2 (ja) * 1999-06-18 2009-11-25 パナソニック株式会社 差動平衡信号伝送基板
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JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP4319339B2 (ja) * 2000-08-30 2009-08-26 株式会社ルネサステクノロジ 半導体装置
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Publication number Priority date Publication date Assignee Title
US6538336B1 (en) * 2000-11-14 2003-03-25 Rambus Inc. Wirebond assembly for high-speed integrated circuits

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Publication number Publication date
JP2008218776A (ja) 2008-09-18
US7763966B2 (en) 2010-07-27
TW200845342A (en) 2008-11-16
US20080217750A1 (en) 2008-09-11
CN101261973A (zh) 2008-09-10

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