JP2008218776A - 半導体装置 - Google Patents

半導体装置 Download PDF

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Publication number
JP2008218776A
JP2008218776A JP2007055247A JP2007055247A JP2008218776A JP 2008218776 A JP2008218776 A JP 2008218776A JP 2007055247 A JP2007055247 A JP 2007055247A JP 2007055247 A JP2007055247 A JP 2007055247A JP 2008218776 A JP2008218776 A JP 2008218776A
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JP
Japan
Prior art keywords
lead
inner leads
differential signal
pad
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2007055247A
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English (en)
Japanese (ja)
Other versions
JP2008218776A5 (enExample
Inventor
Kazuyuki Misumi
和幸 三角
Kazushi Hatauchi
和士 畑内
Yasunori Takada
泰紀 高田
Naotsugu Yasuda
直世 安田
Hideyuki Shinkawa
秀之 新川
Katsuyuki Fukutome
勝幸 福留
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Renesas Technology Corp
Original Assignee
Renesas Technology Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Renesas Technology Corp filed Critical Renesas Technology Corp
Priority to JP2007055247A priority Critical patent/JP2008218776A/ja
Priority to TW097107439A priority patent/TW200845342A/zh
Priority to US12/073,384 priority patent/US7763966B2/en
Priority to CN2008100825992A priority patent/CN101261973B/zh
Publication of JP2008218776A publication Critical patent/JP2008218776A/ja
Publication of JP2008218776A5 publication Critical patent/JP2008218776A5/ja
Pending legal-status Critical Current

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    • H—ELECTRICITY
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    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49541—Geometry of the lead-frame
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    • H01L23/495—Lead-frames or other flat leads
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  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP2007055247A 2007-03-06 2007-03-06 半導体装置 Pending JP2008218776A (ja)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置
TW097107439A TW200845342A (en) 2007-03-06 2008-03-04 Semiconductor device
US12/073,384 US7763966B2 (en) 2007-03-06 2008-03-05 Resin molded semiconductor device and differential amplifier circuit
CN2008100825992A CN101261973B (zh) 2007-03-06 2008-03-05 半导体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2007055247A JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置

Publications (2)

Publication Number Publication Date
JP2008218776A true JP2008218776A (ja) 2008-09-18
JP2008218776A5 JP2008218776A5 (enExample) 2010-04-08

Family

ID=39740812

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2007055247A Pending JP2008218776A (ja) 2007-03-06 2007-03-06 半導体装置

Country Status (4)

Country Link
US (1) US7763966B2 (enExample)
JP (1) JP2008218776A (enExample)
CN (1) CN101261973B (enExample)
TW (1) TW200845342A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134941A (ja) * 2009-12-25 2011-07-07 Fujitsu Semiconductor Ltd 半導体装置及び実装構造

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Publication number Priority date Publication date Assignee Title
CN104851863B (zh) * 2015-04-17 2017-11-28 华为技术有限公司 一种集成电路、引线键合封装芯片及倒装封装芯片
DE112019003540T5 (de) * 2018-07-12 2021-03-25 Rohm Co., Ltd. Halbleiterbauteil

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JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
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JPS5530210A (en) * 1978-08-25 1980-03-04 Hitachi Ltd Transistor amplifier circuit
JPH0388356A (ja) * 1989-08-31 1991-04-12 Toshiba Corp 集積回路及びその接続回路
JP2001007458A (ja) * 1999-06-18 2001-01-12 Matsushita Electric Ind Co Ltd 差動平衡信号伝送基板
JP2001102488A (ja) * 1999-09-28 2001-04-13 Hitachi Cable Ltd 半導体装置
JP2002084107A (ja) * 2000-07-04 2002-03-22 Matsushita Electric Ind Co Ltd 伝送線路を有する多層配線基板
JP2002076235A (ja) * 2000-08-30 2002-03-15 Hitachi Ltd 半導体装置
JP2007043146A (ja) * 2005-07-22 2007-02-15 Marvell World Trade Ltd 高速集積回路用のパッケージング

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011134941A (ja) * 2009-12-25 2011-07-07 Fujitsu Semiconductor Ltd 半導体装置及び実装構造
US8811028B2 (en) 2009-12-25 2014-08-19 Fujitsu Semiconductor Limited Semiconductor device and circuit board

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US7763966B2 (en) 2010-07-27
TW200845342A (en) 2008-11-16
US20080217750A1 (en) 2008-09-11
CN101261973B (zh) 2011-12-21
CN101261973A (zh) 2008-09-10

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