CN101164150B - 将芯片转移到接触基底的装置和方法 - Google Patents

将芯片转移到接触基底的装置和方法 Download PDF

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CN101164150B
CN101164150B CN2006800111703A CN200680011170A CN101164150B CN 101164150 B CN101164150 B CN 101164150B CN 2006800111703 A CN2006800111703 A CN 2006800111703A CN 200680011170 A CN200680011170 A CN 200680011170A CN 101164150 B CN101164150 B CN 101164150B
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substrate
chip
contact
transfer
foil
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CN101164150A (zh
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E·扎克尔
G·阿特达斯特
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Pac Tech Packaging Technologies GmbH
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Pac Tech Packaging Technologies GmbH
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  • Engineering & Computer Science (AREA)
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  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
CN2006800111703A 2005-04-08 2006-04-10 将芯片转移到接触基底的装置和方法 Active CN101164150B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE102005016521 2005-04-08
DE102005016521.4 2005-04-08
PCT/DE2006/000628 WO2006105782A2 (de) 2005-04-08 2006-04-10 Verfahren und vorrichtung zur übertragung eines chips auf ein kontaktsubstrat

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Publication Number Publication Date
CN101164150A CN101164150A (zh) 2008-04-16
CN101164150B true CN101164150B (zh) 2010-08-18

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US20080210368A1 (en) 2008-09-04
WO2006105782A2 (de) 2006-10-12
WO2006105782A3 (de) 2007-08-30
DE112006001493A5 (de) 2008-03-20
JP2008535275A (ja) 2008-08-28
KR101250186B1 (ko) 2013-04-05
US9401298B2 (en) 2016-07-26
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EP1869701A2 (de) 2007-12-26
EP1869701B1 (de) 2017-02-08

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