KR101250186B1 - 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 - Google Patents

콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 Download PDF

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KR101250186B1
KR101250186B1 KR1020077025897A KR20077025897A KR101250186B1 KR 101250186 B1 KR101250186 B1 KR 101250186B1 KR 1020077025897 A KR1020077025897 A KR 1020077025897A KR 20077025897 A KR20077025897 A KR 20077025897A KR 101250186 B1 KR101250186 B1 KR 101250186B1
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substrate
contact
chip
transfer
chips
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KR20070120583A (ko
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엘케 자켈
가셈 아즈다쉬트
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파크 테크-파카징 테크놀로지이스 게엠베하
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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020077025897A 2005-04-08 2006-04-10 콘택트 기판에 칩을 트랜스퍼하는 방법 및 디바이스 Active KR101250186B1 (ko)

Applications Claiming Priority (3)

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WO2006105782A3 (de) 2007-08-30
DE112006001493A5 (de) 2008-03-20
JP2008535275A (ja) 2008-08-28
US9401298B2 (en) 2016-07-26
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