CN101142280B - 可固化的有机硅组合物和由其生产的电子器件 - Google Patents

可固化的有机硅组合物和由其生产的电子器件 Download PDF

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Publication number
CN101142280B
CN101142280B CN200680008265XA CN200680008265A CN101142280B CN 101142280 B CN101142280 B CN 101142280B CN 200680008265X A CN200680008265X A CN 200680008265XA CN 200680008265 A CN200680008265 A CN 200680008265A CN 101142280 B CN101142280 B CN 101142280B
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China
Prior art keywords
curable silicone
weight
silicone composition
parts
component
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Expired - Fee Related
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CN200680008265XA
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Chinese (zh)
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CN101142280A (zh
Inventor
森田好次
一色实
植木浩
加藤智子
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DuPont Toray Specialty Materials KK
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Dow Corning Toray Co Ltd
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W40/00—Arrangements for thermal protection or thermal control
    • H10W40/20—Arrangements for cooling
    • H10W40/25—Arrangements for cooling characterised by their materials
    • H10W40/251—Organics
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C08L83/06—Polysiloxanes containing silicon bound to oxygen-containing groups
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/321—Structures or relative sizes of die-attach connectors
    • H10W72/325—Die-attach connectors having a filler embedded in a matrix
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/352—Materials of die-attach connectors comprising metals or metalloids, e.g. solders
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/851—Dispositions of multiple connectors or interconnections
    • H10W72/874—On different surfaces
    • H10W72/877—Bump connectors and die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/15—Encapsulations, e.g. protective coatings characterised by their shape or disposition on active surfaces of flip-chip devices, e.g. underfills
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/721—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors
    • H10W90/724—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bump connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/734—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked insulating package substrate, interposer or RDL
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T428/00—Stock material or miscellaneous articles
    • Y10T428/31504—Composite [nonstructural laminate]
    • Y10T428/31511—Of epoxy ether

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Silicon Polymers (AREA)
CN200680008265XA 2005-03-15 2006-03-15 可固化的有机硅组合物和由其生产的电子器件 Expired - Fee Related CN101142280B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2005072395A JP5166677B2 (ja) 2005-03-15 2005-03-15 硬化性シリコーン組成物および電子部品
JP072395/2005 2005-03-15
PCT/JP2006/305639 WO2006098493A1 (en) 2005-03-15 2006-03-15 Curable silicone composition and electronic device produced therefrom

Publications (2)

Publication Number Publication Date
CN101142280A CN101142280A (zh) 2008-03-12
CN101142280B true CN101142280B (zh) 2010-12-08

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Country Status (9)

Country Link
US (1) US20090214870A1 (https=)
EP (1) EP1858983B1 (https=)
JP (1) JP5166677B2 (https=)
KR (1) KR101247176B1 (https=)
CN (1) CN101142280B (https=)
AT (1) ATE408649T1 (https=)
DE (1) DE602006002808D1 (https=)
TW (1) TWI383025B (https=)
WO (1) WO2006098493A1 (https=)

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JP4931366B2 (ja) * 2005-04-27 2012-05-16 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
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US7879739B2 (en) * 2006-05-09 2011-02-01 Intel Corporation Thin transition layer between a group III-V substrate and a high-k gate dielectric layer
JP5388409B2 (ja) * 2006-09-28 2014-01-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
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JP5306592B2 (ja) * 2006-12-04 2013-10-02 東レ・ダウコーニング株式会社 硬化性エポキシ樹脂組成物、硬化物、およびその用途
JP5248012B2 (ja) * 2006-12-25 2013-07-31 東レ・ダウコーニング株式会社 硬化性シリコーン組成物
JP5238157B2 (ja) * 2006-12-25 2013-07-17 東レ・ダウコーニング株式会社 硬化性シリコーン組成物および電子部品
JP2008255295A (ja) * 2007-04-09 2008-10-23 Asahi Kasei Chemicals Corp 熱硬化性組成物及び光半導体封止材
CN100573856C (zh) * 2007-07-11 2009-12-23 南茂科技股份有限公司 增进散热效益的卷带式半导体封装构造
EP2188836A2 (en) * 2007-09-11 2010-05-26 Dow Corning Corporation Thermal interface material, electronic device containing the thermal interface material, and methods for their preparation and use
CN101803009B (zh) * 2007-09-11 2012-07-04 陶氏康宁公司 组合物，包括这种组合物的热界面材料,及其制备方法和用途
JP5547369B2 (ja) * 2007-09-28 2014-07-09 東レ・ダウコーニング株式会社 硬化性液状エポキシ樹脂組成物およびその硬化物
JP5422109B2 (ja) * 2007-10-16 2014-02-19 東レ・ダウコーニング株式会社 硬化性シリコーン組成物およびその硬化物
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JP5278386B2 (ja) * 2010-06-22 2013-09-04 信越化学工業株式会社 実装用封止材及びそれを用いて封止した半導体装置
JP5278385B2 (ja) * 2010-06-22 2013-09-04 信越化学工業株式会社 実装用封止材及びそれを用いて封止した半導体装置
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JP2014169415A (ja) * 2013-03-05 2014-09-18 Dow Corning Toray Co Ltd 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6141064B2 (ja) * 2013-03-21 2017-06-07 日立オートモティブシステムズ株式会社 回路基板と筐体の接続方法
US9318450B1 (en) * 2014-11-24 2016-04-19 Raytheon Company Patterned conductive epoxy heat-sink attachment in a monolithic microwave integrated circuit (MMIC)
EP3467043B1 (en) * 2016-05-31 2020-10-28 Sekisui Polymatech Co., Ltd. Heat-conducting member, heat-conducting composition and heat-conducting composition production method
KR102318181B1 (ko) 2017-02-08 2021-10-27 엘켐 실리콘즈 유에스에이 코포레이션 열 관리가 개선된 이차 배터리 팩
US10050010B1 (en) * 2017-03-22 2018-08-14 International Business Machines Corporation Selectively cross-linked thermal interface materials
KR20230077716A (ko) * 2020-09-30 2023-06-01 세키수이 폴리머텍 가부시키가이샤 열전도성 시트, 그 장착 방법 및 제조 방법
CN115602646A (zh) * 2021-07-08 2023-01-13 碁达科技股份有限公司（Tw） 热介面组成物、热介面材料及其制备方法
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Publication number Publication date
JP5166677B2 (ja) 2013-03-21
WO2006098493A1 (en) 2006-09-21
ATE408649T1 (de) 2008-10-15
CN101142280A (zh) 2008-03-12
JP2006257115A (ja) 2006-09-28
EP1858983A1 (en) 2007-11-28
US20090214870A1 (en) 2009-08-27
TW200636012A (en) 2006-10-16
EP1858983B1 (en) 2008-09-17
KR20070117597A (ko) 2007-12-12
TWI383025B (zh) 2013-01-21
KR101247176B1 (ko) 2013-03-25
DE602006002808D1 (de) 2008-10-30

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