CN101044801A - 具有降低的电容耦合的电路板组件 - Google Patents

具有降低的电容耦合的电路板组件 Download PDF

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Publication number
CN101044801A
CN101044801A CNA2005800315532A CN200580031553A CN101044801A CN 101044801 A CN101044801 A CN 101044801A CN A2005800315532 A CNA2005800315532 A CN A2005800315532A CN 200580031553 A CN200580031553 A CN 200580031553A CN 101044801 A CN101044801 A CN 101044801A
Authority
CN
China
Prior art keywords
conductor
circuit board
spacer
pad
resist
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CNA2005800315532A
Other languages
English (en)
Chinese (zh)
Inventor
尹英洙
费尔南多·阿吉雷
尼古拉斯·J·特内克基斯
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Teradyne Inc
Original Assignee
Teradyne Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Teradyne Inc filed Critical Teradyne Inc
Publication of CN101044801A publication Critical patent/CN101044801A/zh
Pending legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H05K1/111—Pads for surface mounting, e.g. lay-out
    • H05K1/112—Pads for surface mounting, e.g. lay-out directly combined with via connections
    • H05K1/113—Via provided in pad; Pad over filled via
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/0218—Reduction of cross-talk, noise or electromagnetic interference by printed shielding conductors, ground planes or power plane
    • H05K1/0219—Printed shielding conductors for shielding around or between signal conductors, e.g. coplanar or coaxial printed shielding conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/025—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance
    • H05K1/0251—Impedance arrangements, e.g. impedance matching, reduction of parasitic impedance related to vias or transitions between vias and transmission lines
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/07—Electric details
    • H05K2201/0776—Resistance and impedance
    • H05K2201/0792—Means against parasitic impedance; Means against eddy currents
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09718—Clearance holes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09781—Dummy conductors, i.e. not used for normal transport of current; Dummy electrodes of components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09809—Coaxial layout
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistors
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistors electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3431—Leadless components
    • H05K3/3436—Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49126—Assembling bases
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
CNA2005800315532A 2004-09-17 2005-07-27 具有降低的电容耦合的电路板组件 Pending CN101044801A (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/817,785 2004-09-17
US10/817,785 US7388158B2 (en) 2004-09-17 2004-09-17 Concentric spacer for reducing capacitive coupling in multilayer substrate assemblies

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN201210074096.7A Division CN102638931B (zh) 2004-09-17 2005-07-27 电子组件、使寄生电容最小的方法及电路板结构制造方法

Publications (1)

Publication Number Publication Date
CN101044801A true CN101044801A (zh) 2007-09-26

Family

ID=35482356

Family Applications (2)

Application Number Title Priority Date Filing Date
CNA2005800315532A Pending CN101044801A (zh) 2004-09-17 2005-07-27 具有降低的电容耦合的电路板组件
CN201210074096.7A Expired - Lifetime CN102638931B (zh) 2004-09-17 2005-07-27 电子组件、使寄生电容最小的方法及电路板结构制造方法

Family Applications After (1)

Application Number Title Priority Date Filing Date
CN201210074096.7A Expired - Lifetime CN102638931B (zh) 2004-09-17 2005-07-27 电子组件、使寄生电容最小的方法及电路板结构制造方法

Country Status (6)

Country Link
US (1) US7388158B2 (https=)
EP (1) EP1795057A1 (https=)
JP (1) JP5172341B2 (https=)
KR (1) KR101136423B1 (https=)
CN (2) CN101044801A (https=)
WO (1) WO2006036282A1 (https=)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196666A (zh) * 2010-03-04 2011-09-21 美国博通公司 多层印刷电路板

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8059423B2 (en) * 2007-02-06 2011-11-15 Sanmina-Sci Corporation Enhanced localized distributive capacitance for circuit boards
US20110139484A1 (en) * 2009-12-15 2011-06-16 Advanced Bionics, Llc Hermetic Electrical Feedthrough
US10572416B1 (en) 2016-03-28 2020-02-25 Aquantia Corporation Efficient signaling scheme for high-speed ultra short reach interfaces
KR102362243B1 (ko) * 2017-10-18 2022-02-11 삼성전자주식회사 Rf 패키지 모듈 및 rf 패키지 모듈을 포함하는 전자 장치
CN108650777B (zh) * 2018-05-16 2020-10-16 新华三技术有限公司 印制电路板及通信设备
US11855056B1 (en) 2019-03-15 2023-12-26 Eliyan Corporation Low cost solution for 2.5D and 3D packaging using USR chiplets
US12438095B1 (en) 2021-05-06 2025-10-07 Eliyan Corp. Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US11855043B1 (en) 2021-05-06 2023-12-26 Eliyan Corporation Complex system-in-package architectures leveraging high-bandwidth long-reach die-to-die connectivity over package substrates
US12204794B1 (en) 2021-05-18 2025-01-21 Eliyan Corporation Architecture for DRAM control optimization using simultaneous bidirectional memory interfaces
US12190038B1 (en) 2021-11-25 2025-01-07 Eliyan Corporation Multi-chip module (MCM) with multi-port unified memory
US11842986B1 (en) 2021-11-25 2023-12-12 Eliyan Corporation Multi-chip module (MCM) with interface adapter circuitry
US11841815B1 (en) 2021-12-31 2023-12-12 Eliyan Corporation Chiplet gearbox for low-cost multi-chip module applications
US12579093B1 (en) 2021-12-31 2026-03-17 Eliyan Corp. Chiplet gearbox for low-cost multi-chip module applications
US12248419B1 (en) 2022-05-26 2025-03-11 Eliyan Corporation Interface conversion circuitry for universal chiplet interconnect express (UCIe)
US12058874B1 (en) 2022-12-27 2024-08-06 Eliyan Corporation Universal network-attached memory architecture
US12182040B1 (en) 2023-06-05 2024-12-31 Eliyan Corporation Multi-chip module (MCM) with scalable high bandwidth memory
US12525540B1 (en) 2023-06-05 2026-01-13 Eliyan Corp. Multi-chip module (MCM) with scalable high bandwidth memory
US12204482B1 (en) 2023-10-09 2025-01-21 Eliyan Corporation Memory chiplet with efficient mapping of memory-centric interface to die-to-die (D2D) unit interface modules
US12204468B1 (en) 2023-10-11 2025-01-21 Eliyan Corporation Universal memory interface with dynamic bidirectional data transfers

Family Cites Families (21)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0377393A (ja) * 1989-08-21 1991-04-02 Ok Print:Kk 配線基板装置
CN2155126Y (zh) * 1993-03-13 1994-02-02 张鹏志 一种新型印制电路板
NL9400261A (nl) * 1994-02-22 1995-10-02 Hollandse Signaalapparaten Bv Werkwijze voor het vervaardigen van een multilayer microwave board alsmede op deze wijze verkregen boards.
JPH10107391A (ja) * 1996-09-30 1998-04-24 O K Print:Kk 配線基板および配線基板用基材
JP3737597B2 (ja) * 1997-02-07 2006-01-18 日本特殊陶業株式会社 フリップチップ実装用配線基板
JPH1174645A (ja) * 1997-08-29 1999-03-16 Sumitomo Kinzoku Electro Device:Kk 多層セラミック基板の製造方法
US6137062A (en) * 1998-05-11 2000-10-24 Motorola, Inc. Ball grid array with recessed solder balls
US6456502B1 (en) * 1998-09-21 2002-09-24 Compaq Computer Corporation Integrated circuit device/circuit board connection apparatus
JP4204150B2 (ja) 1998-10-16 2009-01-07 パナソニック株式会社 多層回路基板
JP2001308547A (ja) 2000-04-27 2001-11-02 Sharp Corp 高周波多層回路基板
US6834426B1 (en) * 2000-07-25 2004-12-28 International Business Machines Corporation Method of fabricating a laminate circuit structure
JP3546823B2 (ja) * 2000-09-07 2004-07-28 インターナショナル・ビジネス・マシーンズ・コーポレーション スルーホール構造および該スルーホール構造を含むプリント基板
JP2002353588A (ja) * 2001-05-29 2002-12-06 Mitsubishi Electric Corp 配線基板及び配線基板の製造方法
US6767252B2 (en) * 2001-10-10 2004-07-27 Molex Incorporated High speed differential signal edge card connector and circuit board layouts therefor
JP2003309378A (ja) * 2002-04-18 2003-10-31 Mitsubishi Electric Corp 信号伝送用多層配線板
US6828513B2 (en) 2002-04-30 2004-12-07 Texas Instruments Incorporated Electrical connector pad assembly for printed circuit board
US7271349B2 (en) * 2002-09-04 2007-09-18 Intel Corporation Via shielding for power/ground layers on printed circuit board
US6753679B1 (en) * 2002-12-23 2004-06-22 Nortel Networks Limited Test point monitor using embedded passive resistance
CN1799290A (zh) * 2003-06-02 2006-07-05 日本电气株式会社 印刷电路板用小型转接传输线路及其设计方法
US7141742B2 (en) * 2003-07-17 2006-11-28 Hewlett-Packard Development Company, L.P. Alternating voided areas of anti-pads
US7348498B2 (en) * 2003-07-17 2008-03-25 Hewlett-Packard Development Company, L.P. Partially voided anti-pads

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102196666A (zh) * 2010-03-04 2011-09-21 美国博通公司 多层印刷电路板
CN102196666B (zh) * 2010-03-04 2013-12-18 美国博通公司 多层印刷电路板

Also Published As

Publication number Publication date
US20060060376A1 (en) 2006-03-23
WO2006036282A1 (en) 2006-04-06
CN102638931B (zh) 2014-09-24
KR101136423B1 (ko) 2012-04-19
CN102638931A (zh) 2012-08-15
US7388158B2 (en) 2008-06-17
KR20070114692A (ko) 2007-12-04
JP2008513998A (ja) 2008-05-01
JP5172341B2 (ja) 2013-03-27
EP1795057A1 (en) 2007-06-13

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Application publication date: 20070926