CN100586262C - Ic插座 - Google Patents

Ic插座 Download PDF

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Publication number
CN100586262C
CN100586262C CN200580023917A CN200580023917A CN100586262C CN 100586262 C CN100586262 C CN 100586262C CN 200580023917 A CN200580023917 A CN 200580023917A CN 200580023917 A CN200580023917 A CN 200580023917A CN 100586262 C CN100586262 C CN 100586262C
Authority
CN
China
Prior art keywords
pressing
pivot
socket
force
pressing surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200580023917A
Other languages
English (en)
Chinese (zh)
Other versions
CN1985554A (zh
Inventor
小林正彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN1985554A publication Critical patent/CN1985554A/zh
Application granted granted Critical
Publication of CN100586262C publication Critical patent/CN100586262C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/02—Arrangements of circuit components or wiring on supporting structure
    • H05K7/10—Plug-in assemblages of components, e.g. IC sockets
    • H05K7/1053—Plug-in assemblages of components, e.g. IC sockets having interior leads
    • H05K7/1061—Plug-in assemblages of components, e.g. IC sockets having interior leads co-operating by abutting

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Connecting Device With Holders (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Measuring Leads Or Probes (AREA)
  • Details Of Connecting Devices For Male And Female Coupling (AREA)
CN200580023917A 2004-05-14 2005-04-13 Ic插座 Expired - Fee Related CN100586262C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2004145262A JP2005327628A (ja) 2004-05-14 2004-05-14 Ｉｃソケット
JP145262/2004 2004-05-14

Publications (2)

Publication Number Publication Date
CN1985554A CN1985554A (zh) 2007-06-20
CN100586262C true CN100586262C (zh) 2010-01-27

Family

ID=34965684

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200580023917A Expired - Fee Related CN100586262C (zh) 2004-05-14 2005-04-13 Ic插座

Country Status (5)

Country Link
US (1) US7666016B2 (enExample)
EP (1) EP1769660A1 (enExample)
JP (2) JP2005327628A (enExample)
CN (1) CN100586262C (enExample)
WO (1) WO2005115069A1 (enExample)

Families Citing this family (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWM348403U (en) * 2008-05-26 2009-01-01 Hon Hai Prec Ind Co Ltd Electrical connector
JP5288963B2 (ja) * 2008-09-19 2013-09-11 株式会社エンプラス 電気部品用ソケット
JP5197297B2 (ja) * 2008-10-17 2013-05-15 スリーエム イノベイティブ プロパティズ カンパニー Ｉｃソケット
JP5196327B2 (ja) * 2008-12-22 2013-05-15 山一電機株式会社 半導体装置用ソケット
TWM368910U (en) * 2009-02-23 2009-11-11 Hon Hai Prec Ind Co Ltd Electrical connector
US8033854B1 (en) * 2010-05-06 2011-10-11 Hon Hai Precision Ind. Co., Ltd. IC socket having individual latch hinge
US8837162B2 (en) 2010-05-06 2014-09-16 Advanced Micro Devices, Inc. Circuit board socket with support structure
US8938876B2 (en) * 2010-05-06 2015-01-27 Advanced Micro Devices, Inc. Method of mounting a circuit board
TWM411712U (en) * 2011-01-27 2011-09-11 Hon Hai Prec Ind Co Ltd Electrical connector
DE202011101848U1 (de) * 2011-06-10 2011-08-11 Epants Gmbh Testanordnung zur elektrischen Prüfung von vereinzelten Schaltungsträgern
JP6195372B2 (ja) * 2013-12-11 2017-09-13 センサータ テクノロジーズ マサチューセッツ インコーポレーテッド ソケット
EP3112830B1 (en) 2015-07-01 2018-08-22 Sensata Technologies, Inc. Temperature sensor and method for the production of a temperature sensor
JP6706494B2 (ja) 2015-12-14 2020-06-10 センサータ テクノロジーズ インコーポレーテッド インターフェース構造
US10428716B2 (en) 2016-12-20 2019-10-01 Sensata Technologies, Inc. High-temperature exhaust sensor
US10502641B2 (en) 2017-05-18 2019-12-10 Sensata Technologies, Inc. Floating conductor housing
JP6991782B2 (ja) 2017-08-23 2022-01-13 センサータ テクノロジーズ インコーポレーテッド ソケット
CN111164434B (zh) * 2017-09-25 2022-10-28 约翰国际有限公司 用于集成电路测试的具有测试引脚和壳体的高隔离接触器
JP7233290B2 (ja) * 2019-04-12 2023-03-06 株式会社エンプラス 電気部品用ソケット
CN113764947B (zh) * 2020-06-02 2025-10-14 山一电机株式会社 插座、ic封装以及接触片对连接器壳体的安装方法

Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1226758A (zh) * 1998-02-16 1999-08-25 日本电气株式会社 测试用集成电路插座
US6280219B1 (en) * 2000-01-28 2001-08-28 Texas Instruments Incorporated Socket apparatus for IC packages
US6322384B1 (en) * 1999-12-24 2001-11-27 Texas Instruments Incorporated Electrical socket apparatus
US20010046795A1 (en) * 2000-05-17 2001-11-29 Hisao Ohshima Socket for electrical parts
US6375484B1 (en) * 1999-05-31 2002-04-23 Enplas Corporation Electrical part socket with pivotable latch
US20020177347A1 (en) * 2001-05-25 2002-11-28 Yamaichi Electronics Co., Ltd. Socket for IC package
US20030054675A1 (en) * 2001-09-14 2003-03-20 Kiyokazu Ikeya Socket for removably mounting electronic packages

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5498970A (en) 1995-02-06 1996-03-12 Minnesota Mining And Manufacturing Top load socket for ball grid array devices
JP3575866B2 (ja) * 1995-03-31 2004-10-13 株式会社エンプラス 接続器
KR100276826B1 (ko) 1998-04-20 2001-01-15 윤종용 패키지되지않은칩을테스트하기위한케리어
JP3257994B2 (ja) 1999-08-30 2002-02-18 日本テキサス・インスツルメンツ株式会社 ソケット
JP3842048B2 (ja) 2001-02-02 2006-11-08 株式会社エンプラス 電気部品用ソケット
JP2003115361A (ja) 2001-10-03 2003-04-18 Yamaichi Electronics Co Ltd Ｉｃソケット
JP2003168532A (ja) 2001-11-29 2003-06-13 Texas Instr Japan Ltd 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法
JP3566691B2 (ja) * 2001-12-17 2004-09-15 日本テキサス・インスツルメンツ株式会社 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法
JP3866123B2 (ja) 2002-03-11 2007-01-10 株式会社エンプラス 電気部品用ソケット
JP3803099B2 (ja) 2002-12-17 2006-08-02 山一電機株式会社 半導体装置用ソケット
TW200401899A (en) 2003-08-11 2004-02-01 Speed Tech Corp Matrix type connector
JP4464250B2 (ja) 2004-10-29 2010-05-19 株式会社エンプラス 電気部品用ソケット

Patent Citations (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1226758A (zh) * 1998-02-16 1999-08-25 日本电气株式会社 测试用集成电路插座
US6375484B1 (en) * 1999-05-31 2002-04-23 Enplas Corporation Electrical part socket with pivotable latch
US6322384B1 (en) * 1999-12-24 2001-11-27 Texas Instruments Incorporated Electrical socket apparatus
US6280219B1 (en) * 2000-01-28 2001-08-28 Texas Instruments Incorporated Socket apparatus for IC packages
US20010046795A1 (en) * 2000-05-17 2001-11-29 Hisao Ohshima Socket for electrical parts
US20020177347A1 (en) * 2001-05-25 2002-11-28 Yamaichi Electronics Co., Ltd. Socket for IC package
US20030054675A1 (en) * 2001-09-14 2003-03-20 Kiyokazu Ikeya Socket for removably mounting electronic packages

Also Published As

Publication number Publication date
US20080188110A1 (en) 2008-08-07
US7666016B2 (en) 2010-02-23
JP2005327628A (ja) 2005-11-24
JP2008508663A (ja) 2008-03-21
EP1769660A1 (en) 2007-04-04
CN1985554A (zh) 2007-06-20
WO2005115069A1 (en) 2005-12-01

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100127

Termination date: 20120413