JP7233290B2 - 電気部品用ソケット - Google Patents
電気部品用ソケット Download PDFInfo
- Publication number
- JP7233290B2 JP7233290B2 JP2019076386A JP2019076386A JP7233290B2 JP 7233290 B2 JP7233290 B2 JP 7233290B2 JP 2019076386 A JP2019076386 A JP 2019076386A JP 2019076386 A JP2019076386 A JP 2019076386A JP 7233290 B2 JP7233290 B2 JP 7233290B2
- Authority
- JP
- Japan
- Prior art keywords
- opening
- closing
- socket
- link mechanism
- pressing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000007246 mechanism Effects 0.000 claims description 107
- 230000000630 rising effect Effects 0.000 claims description 6
- 238000012360 testing method Methods 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000002093 peripheral effect Effects 0.000 description 3
- 239000002184 metal Substances 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2896—Testing of IC packages; Test features related to IC packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/97—Holders with separate means to prevent loosening of the coupling or unauthorised removal of apparatus held
Landscapes
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
11 ソケット本体
12 操作部材
13 付勢手段
14 開閉体
15 開閉リンク機構
15a 基端部
15b 先端部
16 押下機構
17 ベース部
18 立上り片
21 圧縮バネ
22 バネ保持部
23 端部ブロック
24 第1付勢レバー
25 第2付勢レバー
26 第1開閉レバー
26a 基端部
26b 先端部
26c 開閉体連結部
27 第2開閉レバー
27a 基端部
27b 先端部
28 押下部材
29 揺動レバー
29a 基端部
29b 先端部
31 開閉リンク係止部
31a 係止開口
31b係止段差
32 揺動レバー係止部
32a 収容部
32b 押下段差
33 案内突起
34 案内カム
35 押上バネ
Claims (3)
- コンタクトピンを有するソケット本体と、
前記ソケット本体に上下動可能に設けられて上向きに付勢された操作部材と、
前記ソケット本体に開閉可能に設けられ、閉じることで前記ソケット本体上に配置された電気部品を押圧して前記コンタクトピンに圧接させる開閉体と、
前記ソケット本体及び前記操作部材に基端部が連結し、前記操作部材が上昇することで前記開閉体を閉じるように前記開閉体に連結した開閉リンク機構と、
前記開閉体が閉じるときに前記開閉リンク機構の先端部を押下げる押下機構と、
を備えていることを特徴とする電気部品用ソケット。 - 前記押下機構は、前記開閉体が開くときに前記開閉リンク機構を開放し、前記開閉体が閉じるときに前記開閉リンク機構の前記先端部を係止して押し下げる押下部材を有していることを特徴とする請求項1に記載の電気部品用ソケット。
- 前記押下機構は、前記ソケット本体に揺動可能に支持され、基端部で前記操作部材に連結されるとともに先端部で前記押下部材に係止された揺動レバーを有し、前記操作部材が上昇することで前記揺動レバーの前記先端部が前記押下部材を押下げるように構成されていることを特徴とする請求項2に記載の電気部品用ソケット。
Priority Applications (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019076386A JP7233290B2 (ja) | 2019-04-12 | 2019-04-12 | 電気部品用ソケット |
US17/603,198 US20220187359A1 (en) | 2019-04-12 | 2020-04-02 | Socket for electrical component |
PCT/JP2020/015236 WO2020209182A1 (ja) | 2019-04-12 | 2020-04-02 | 電気部品用ソケット |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019076386A JP7233290B2 (ja) | 2019-04-12 | 2019-04-12 | 電気部品用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2020174016A JP2020174016A (ja) | 2020-10-22 |
JP7233290B2 true JP7233290B2 (ja) | 2023-03-06 |
Family
ID=72751606
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2019076386A Active JP7233290B2 (ja) | 2019-04-12 | 2019-04-12 | 電気部品用ソケット |
Country Status (3)
Country | Link |
---|---|
US (1) | US20220187359A1 (ja) |
JP (1) | JP7233290B2 (ja) |
WO (1) | WO2020209182A1 (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2022071373A (ja) * | 2020-10-28 | 2022-05-16 | 山一電機株式会社 | ヒートシンクユニット、icソケット、半導体パッケージの製造方法、及び半導体パッケージ |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005327628A (ja) | 2004-05-14 | 2005-11-24 | Three M Innovative Properties Co | Icソケット |
US20170176493A1 (en) | 2015-12-18 | 2017-06-22 | Samsung Electronics Co., Ltd. | Test socket and method for testing a semiconductor package |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3755701B2 (ja) * | 1997-11-28 | 2006-03-15 | 株式会社エンプラス | 電気部品用ソケット |
JPH11329643A (ja) * | 1998-05-14 | 1999-11-30 | Wells Cti Kk | Icソケット |
JP2004014873A (ja) * | 2002-06-07 | 2004-01-15 | Yamaichi Electronics Co Ltd | 電子部品用ソケット |
JP4495200B2 (ja) * | 2007-09-28 | 2010-06-30 | 山一電機株式会社 | 半導体装置用ソケット |
JP2010118275A (ja) * | 2008-11-13 | 2010-05-27 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
JP6373130B2 (ja) * | 2014-09-01 | 2018-08-15 | 株式会社エンプラス | 電気部品用ソケット |
JP2019032930A (ja) * | 2017-08-04 | 2019-02-28 | 株式会社エンプラス | 電気部品用ソケット |
-
2019
- 2019-04-12 JP JP2019076386A patent/JP7233290B2/ja active Active
-
2020
- 2020-04-02 WO PCT/JP2020/015236 patent/WO2020209182A1/ja active Application Filing
- 2020-04-02 US US17/603,198 patent/US20220187359A1/en active Pending
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005327628A (ja) | 2004-05-14 | 2005-11-24 | Three M Innovative Properties Co | Icソケット |
US20170176493A1 (en) | 2015-12-18 | 2017-06-22 | Samsung Electronics Co., Ltd. | Test socket and method for testing a semiconductor package |
Also Published As
Publication number | Publication date |
---|---|
JP2020174016A (ja) | 2020-10-22 |
WO2020209182A1 (ja) | 2020-10-15 |
US20220187359A1 (en) | 2022-06-16 |
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