JP6373130B2 - 電気部品用ソケット - Google Patents
電気部品用ソケット Download PDFInfo
- Publication number
- JP6373130B2 JP6373130B2 JP2014177214A JP2014177214A JP6373130B2 JP 6373130 B2 JP6373130 B2 JP 6373130B2 JP 2014177214 A JP2014177214 A JP 2014177214A JP 2014177214 A JP2014177214 A JP 2014177214A JP 6373130 B2 JP6373130 B2 JP 6373130B2
- Authority
- JP
- Japan
- Prior art keywords
- contact
- cover member
- socket
- main body
- electrical component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
- H01R13/6278—Snap or like fastening comprising a pin snapping into a recess
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/633—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for disengagement only
- H01R13/635—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for disengagement only by mechanical pressure, e.g. spring force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
- H01R4/5066—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw mounted in an insulating housing having a cover providing clamping force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Description
2 ICパッケージ(電気部品)
5 冷却ヘッド
10 ICソケット(電気部品用ソケット)
20 ソケット本体
30 カバー部材
31 カバー部材本体
31a 第1カバー部材本体
31b 第2カバー部材本体
32 ヒートスラグ
36 上側壁部
40 フローティングプレート(収容部)
60 コンタクトピン
70 規制手段
71 トリガー部材
73 上部接触部
74 下部接触部
74a 第1突起部
74b 第2突起部
75 付勢部材
Claims (1)
- 配線基板上に配置され、上面に電気部品が収容される収容部を有し、前記収容部に、前記配線基板の電極と前記電気部品の端子とを電気的に接続させるコンタクトピンが配設されたソケット本体と、
前記ソケット本体に対して開閉可能に配設されたカバー部材と、
を有し、
前記カバー部材は、カバー部材本体と、前記カバー部材本体に配設されて前記カバー部材が閉じられた状態で前記収容部に収容された前記電気部品に接触するヒートスラグと、
を有し、
前記ヒートスラグは、前記カバー部材が閉じられた状態において、所定の冷却ヘッドにより上方から押圧されることにより、前記カバー部材本体に対して下降して、前記電気部品を押圧するようになっており、
かつ、前記収容部に前記電気部品が収容されている状態では前記ヒートスラグの下降を許容する一方、前記収容部に前記電気部品が収容されていない状態では前記ヒートスラグの下降を阻止する規制手段が設けられ、
前記規制手段は、
上部接触部と下部接触部とを有すると共に双方の接触部の間で前記カバー部材本体に対して移動可能に配設されたトリガー部材と、
前記トリガー部材を第1の移動方向に付勢する付勢部材と、
を有しており、
前記収容部に前記電気部品が収容されていない状態では、前記カバー部材が閉じられる過程において、前記カバー部材本体の一部が前記電気部品が収容されていない前記収容部に接触する前に前記下部接触部が前記ソケット本体に接触することで、前記付勢部材の付勢力に抗して前記トリガー部材が第1の移動方向と逆の第2の移動方向に移動し、これにより、前記上部接触部が前記カバー部材の上側壁部に接触して前記ヒートスラグの下降を阻止するようにロックが掛かり、前記冷却ヘッドにより上方から押圧されても、前記ヒートスラグが前記コンタクトピンに接触しない位置で停止するようになっており、前記収容部に前記電気部品が収容されている状態では、前記カバー部材が閉じられる過程において、前記下部接触部が前記ソケット本体に接触する前に前記カバー部材本体の一部が前記電気部品に接触することで、前記トリガー部材が移動せず、これにより、前記上部接触部が前記上側壁部に接触しないでロックが掛からず、前記冷却ヘッドにより上方から押圧されたときに、前記ヒートスラグが前記電気部品を押圧するようになっていることを特徴とする電気部品用ソケット。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014177214A JP6373130B2 (ja) | 2014-09-01 | 2014-09-01 | 電気部品用ソケット |
CN201580046954.9A CN106797090B (zh) | 2014-09-01 | 2015-08-27 | 电气组件用插座 |
US15/506,540 US9807909B1 (en) | 2014-09-01 | 2015-08-27 | Socket for electric component |
PCT/JP2015/074156 WO2016035658A1 (ja) | 2014-09-01 | 2015-08-27 | 電気部品用ソケット |
MYPI2017700641A MY179606A (en) | 2014-09-01 | 2015-08-27 | Socket for electric component |
TW104128633A TWI674713B (zh) | 2014-09-01 | 2015-08-31 | 電氣零件用插座 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014177214A JP6373130B2 (ja) | 2014-09-01 | 2014-09-01 | 電気部品用ソケット |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2016051644A JP2016051644A (ja) | 2016-04-11 |
JP6373130B2 true JP6373130B2 (ja) | 2018-08-15 |
Family
ID=55439723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2014177214A Expired - Fee Related JP6373130B2 (ja) | 2014-09-01 | 2014-09-01 | 電気部品用ソケット |
Country Status (6)
Country | Link |
---|---|
US (1) | US9807909B1 (ja) |
JP (1) | JP6373130B2 (ja) |
CN (1) | CN106797090B (ja) |
MY (1) | MY179606A (ja) |
TW (1) | TWI674713B (ja) |
WO (1) | WO2016035658A1 (ja) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7018310B2 (ja) * | 2017-12-27 | 2022-02-10 | 株式会社エンプラス | 電気部品用ソケット |
JP7262185B2 (ja) * | 2018-07-03 | 2023-04-21 | 株式会社エンプラス | 電気部品用ソケット |
JP7233290B2 (ja) * | 2019-04-12 | 2023-03-06 | 株式会社エンプラス | 電気部品用ソケット |
CN111836498B (zh) * | 2020-08-12 | 2022-01-21 | 苏州祺烁信息科技有限公司 | 一种用于互联网大数据设备的防泡水装置 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69401040T2 (de) * | 1993-07-12 | 1997-06-05 | Nec Corp | Gehäusestruktur für Mikrowellenschaltung |
US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
TW440699B (en) * | 1998-06-09 | 2001-06-16 | Advantest Corp | Test apparatus for electronic parts |
TW432752B (en) * | 1999-07-15 | 2001-05-01 | Urex Prec Inc | Modular integrated circuit socket |
JP3822005B2 (ja) * | 1999-10-04 | 2006-09-13 | 株式会社エンプラス | 電気部品用ソケット |
KR100706216B1 (ko) * | 2001-07-12 | 2007-04-11 | 가부시키가이샤 아드반테스트 | 전자부품 핸들링 장치 및 전자부품의 온도제어방법 |
JP3812939B2 (ja) * | 2002-04-09 | 2006-08-23 | 日本航空電子工業株式会社 | カード接続用コネクタ |
JP2006308517A (ja) * | 2005-05-02 | 2006-11-09 | Nippon Eng Kk | バーンインボード、及び、バーンインシステム |
US7277291B2 (en) * | 2005-08-08 | 2007-10-02 | Verifone Holdings, Inc. | Thermal transfer device |
JP4421540B2 (ja) | 2005-09-15 | 2010-02-24 | 日本エンジニアリング株式会社 | バーンインボード、及び、半導体試験装置 |
US7679917B2 (en) * | 2007-02-02 | 2010-03-16 | Deck Joseph F | Electronic assembly cooling |
US7495922B2 (en) * | 2007-03-29 | 2009-02-24 | Intel Corporation | Spring loaded heat sink retention mechanism |
JP4925907B2 (ja) * | 2007-04-27 | 2012-05-09 | 株式会社エンプラス | 電気部品用ソケット |
US20110036538A1 (en) * | 2007-09-07 | 2011-02-17 | International Business Machines Corporation | Method and device for cooling a heat generating component |
JP4942639B2 (ja) * | 2007-12-27 | 2012-05-30 | 株式会社エンプラス | 電気部品用ソケット |
JP2012182224A (ja) * | 2011-02-28 | 2012-09-20 | Tdk Corp | 電子部品の固定用ばね具及び放熱構造体 |
US9907208B2 (en) * | 2011-11-21 | 2018-02-27 | Thomson Licensing | Hold down for retaining a heat sink |
US8702052B2 (en) * | 2012-07-05 | 2014-04-22 | Globe Motors, Inc. | Retention structure for heat generating component |
US9812795B2 (en) * | 2015-11-03 | 2017-11-07 | Ironwood Electronics, Inc. | Packaged device adapter with force applied using bearing apparatus |
-
2014
- 2014-09-01 JP JP2014177214A patent/JP6373130B2/ja not_active Expired - Fee Related
-
2015
- 2015-08-27 MY MYPI2017700641A patent/MY179606A/en unknown
- 2015-08-27 CN CN201580046954.9A patent/CN106797090B/zh not_active Expired - Fee Related
- 2015-08-27 US US15/506,540 patent/US9807909B1/en not_active Expired - Fee Related
- 2015-08-27 WO PCT/JP2015/074156 patent/WO2016035658A1/ja active Application Filing
- 2015-08-31 TW TW104128633A patent/TWI674713B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
MY179606A (en) | 2020-11-11 |
TWI674713B (zh) | 2019-10-11 |
WO2016035658A1 (ja) | 2016-03-10 |
JP2016051644A (ja) | 2016-04-11 |
CN106797090A (zh) | 2017-05-31 |
TW201622257A (zh) | 2016-06-16 |
US20170295661A1 (en) | 2017-10-12 |
US9807909B1 (en) | 2017-10-31 |
CN106797090B (zh) | 2019-04-16 |
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Legal Events
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A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20170801 |
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