US20170295661A1 - Socket for electric component - Google Patents
Socket for electric component Download PDFInfo
- Publication number
- US20170295661A1 US20170295661A1 US15/506,540 US201515506540A US2017295661A1 US 20170295661 A1 US20170295661 A1 US 20170295661A1 US 201515506540 A US201515506540 A US 201515506540A US 2017295661 A1 US2017295661 A1 US 2017295661A1
- Authority
- US
- United States
- Prior art keywords
- contact
- cover member
- electric component
- heat slug
- housed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/2049—Pressing means used to urge contact, e.g. springs
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/627—Snap or like fastening
- H01R13/6278—Snap or like fastening comprising a pin snapping into a recess
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/633—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for disengagement only
- H01R13/635—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for disengagement only by mechanical pressure, e.g. spring force
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/648—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding
- H01R13/652—Protective earth or shield arrangements on coupling devices, e.g. anti-static shielding with earth pin, blade or socket
-
- H01R23/6806—
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R33/00—Coupling devices specially adapted for supporting apparatus and having one part acting as a holder providing support and electrical connection via a counterpart which is structurally associated with the apparatus, e.g. lamp holders; Separate parts thereof
- H01R33/74—Devices having four or more poles, e.g. holders for compact fluorescent lamps
- H01R33/76—Holders with sockets, clips, or analogous contacts adapted for axially-sliding engagement with parallely-arranged pins, blades, or analogous contacts on counterpart, e.g. electronic tube socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
- H01R4/28—Clamped connections, spring connections
- H01R4/50—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw
- H01R4/5066—Clamped connections, spring connections utilising a cam, wedge, cone or ball also combined with a screw mounted in an insulating housing having a cover providing clamping force
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
- H01L23/4093—Snap-on arrangements, e.g. clips
Definitions
- the present invention relates to a socket for an electric component electrically connected to an electric component such as a semiconductor device (hereinafter referred to as “IC package”).
- IC package an electric component such as a semiconductor device
- an IC socket is conventionally known in which a contact pin is disposed.
- This IC socket is designed to be disposed on a wiring circuit board to house an IC package which is an object to be inspected, and a terminal of this IC package and an electrode of the wiring circuit board are electrically connected together via the contact pin to conduct a test such as a conductivity test.
- a plurality of IC sockets may be arranged side by side, and IC packages may be housed in the respective IC sockets to simultaneously conduct tests on the plurality of IC packages (e.g., see Japanese Patent Laid-Open No. 2007-78576).
- a cooling apparatus provided with a cooling head for cooling an IC package may be used to keep an IC package under testing at a predetermined temperature (e.g., see Japanese Patent Laid-Open No. 2007-78576).
- the IC socket may be provided with a heat slug made of a material with high thermal conductivity, the heat slug may be pressed by the cooling head to move downward, and the heat slug may press the IC package so that the IC package is cooled by the cooling head via the heat slug.
- the apparatus that conducts tests on a plurality of IC packages simultaneously using a plurality of IC sockets is provided with a number of cooling heads for cooling IC packages corresponding to all IC sockets. All the cooling heads press the heat slugs of the corresponding IC sockets, causing them to move downward, the heat slugs press the respective IC packages so as to cool all the IC packages via the heat slugs.
- an electric component e.g., IC socket
- a socket for an electric component includes a socket body which is disposed on a wiring circuit board and provided with a housing part to house an electric component on a top surface of the housing part, a contact pin to electrically connect an electrode of the wiring circuit board and a terminal of the electric component is disposed on the housing part, a cover member disposed so as to be able to open or close with respect to the socket body, wherein, the cover member includes a cover member body and a heat slug disposed on the cover member body and contact with the electric component housed to the housing part in a state in which the cover member is closed, the heat slug is configured to be pressed from above by a cooling head in a state in which the cover member is closed and caused to move downward with respect to the cover member body so as to press the electric component, and the cover member is provided with a restricting mechanism that allows, in a state in which the electric component is housed in the housing part, the cooling head to cause the heat slug
- the socket for an electric component of the present invention is preferably configured such that the restricting mechanism is provided with a trigger member disposed on the cover member body so as to be movable with respect to the cover member body, an urging member that urges the trigger member in a first direction to keep the trigger member at a position where the heat slug is allowed to move downward, and a trigger stopper that moves, when the cover member body further moves downward by a predetermined distance from a lowest downward moving position when the electric component is housed in the housing part in a process in which the cover member is closed, the trigger member in a second direction which is opposite to the first direction against an urging force of the urging member to thereby cause the trigger member to prevent the heat slug from moving downward.
- the socket for an electric component of the present invention is preferably configured such that the heat slug is provided with a concave part to insert an upper contact part of the trigger member, the trigger stopper is provided with a slope to rotate the trigger member when the trigger stopper comes into contact with a lower contact part of the trigger member, the cover member reaches the lowest downward moving position when the electric component is housed in the housing part, without the lower contact part of the trigger member contacting the slope of the trigger stopper in a state in which the upper contact part faces the concave part, the lower contact part of the trigger member rotates and moves in contact with the slope of the trigger stopper when no electric component is housed in the housing part, and the cover member reaches the lowest downward moving position after the upper contact part reaches a position facing a surface outside a peripheral edge of the concave part.
- the socket for an electric component of the present invention is preferably provided with a pusher plate that is provided on an undersurface of the cover member body, comes into contact with a peripheral portion of the electric component from above when the electric component is housed in the housing part, and comes into contact with a top surface of the housing part when no electric component is housed in the housing part, in which the lowest downward moving position of the cover member is defined by the pusher plate.
- the socket for an electric component of the present invention is preferably configured such that the housing part is a floating plate disposed so as to be movable upward/downward with respect to the socket body, the floating plate includes a through hole into which a first contact part of the contact pin is inserted, and in a state in which the electric component is housed in the floating plate, when the restricting mechanism moves downward and presses the floating plate, a pressing force thereof causes the floating plate to move downward, the first contact part of the contact pin comes into contact with a terminal of the electric component, then the cooling head presses the heat slug to move downward, the heat slug thereby comes into contact with the electric component, whereas in a state in which no electric component is housed in the floating plate, when the restricting mechanism moves downward and presses the floating plate, the pressing force causes the restricting mechanism to be switched to a state in which the restricting mechanism prevents the heat slug from moving downward, and the restricting mechanism prevents the heat slug from moving downward when the cooling head presses the heat slug so
- the restricting mechanism is provided in the configuration in which the electric component housed in the housing part is pressed by the cooling head via the heat slug, it is possible to allow the heat slug to move downward in a state in which the electric component is housed in the housing part, whereas in a state in which no electric component is housed in the housing part, it is possible to prevent the heat slug from moving downward.
- the present invention adopts a configuration in which the restricting mechanism is provided with the trigger member and the urging member and the trigger stopper causes the trigger member to move, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- the upper contact part of the trigger member is caused to face the concave part of the heat slug when the electric component is housed in the housing part and the upper contact part of the trigger member is caused to rotate and move to a position deviated from the concave part of the heat slug when no electric component is housed in the housing part, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- the lowest downward moving position of the cover member body is changed using the pusher plate depending on whether the electric component is housed in the housing part or not, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- the present invention when no electric component is housed in the housing part, it is possible to prevent the heat slug from moving downward, thus prevent the heat slug from coming into contact with the first contact part of the contact pin, and thereby prevent the heat slug from damaging the contact pin or prevent a foreign substance from adhering to the contact part of the contact pin.
- FIG. 1 is a perspective view of an IC socket in a closed state according to an embodiment of the present invention.
- FIG. 2 is a perspective view of the IC socket in an open state according to the embodiment of the present invention.
- FIG. 3 is an A-A cross-sectional view of the IC socket in FIG. 2 in which an IC package is housed and a cooling head is disposed.
- FIG. 4 is a cross-sectional view in the middle of closing the cover member from the state in FIG. 3 .
- FIG. 5 is a cross-sectional view of a state in which the cover member is further closed from the state in FIG. 4 .
- FIG. 6 is a partially enlarged cross-sectional view of FIG. 5 .
- FIG. 7 is a cross-sectional view of a state in which the cover member is further closed from the state in FIG. 6 and the cover member is totally closed.
- FIG. 8 is a cross-sectional view of a state in which the cooling head is brought into contact with the heat slug of the IC socket in the state in FIG. 7 .
- FIG. 9 is a cross-sectional view of a state in which the cooling head presses the heat slug to cause the heat slug to move down to a lowest position from the state in FIG. 8 .
- FIG. 10 is an A-A cross-sectional view of a state in which the cooling head is disposed without housing the IC package in the IC socket in FIG. 2 .
- FIG. 11 is a cross-sectional view in the middle of closing the cover member from the state in FIG. 10 .
- FIG. 12 is a cross-sectional view of a state in which the cover member is further closed from the state in FIG. 11 .
- FIG. 13 is a partially enlarged cross-sectional view of FIG. 12 .
- FIG. 14 is a cross-sectional view of a state in which the cover member is further closed from the state in FIG. 13 and the cover member is totally closed.
- FIG. 15 is a cross-sectional view of a state in which the cooling head is brought into contact with the heat slug of the IC socket in the state in FIG. 14 .
- FIG. 16 is a cross-sectional view of a state in which the cooling head presses the heat slug causing the heat slug to move down to the lowest position from the state in FIG. 15 .
- FIG. 1 to FIG. 16 illustrate the embodiment of the present invention.
- An IC socket 10 as a “socket for an electric component” is disposed on a wiring circuit board 1 as shown in each figure, on a top surface of which an IC package 2 is housed as an “electric component” and is configured so as to electrically connect an electrode (not shown) of the wiring circuit board 1 and a solder ball (not shown) as a “terminal” of the IC package 2 .
- This IC socket 10 is used for a testing apparatus for a conductivity test such as a burn-in test on the IC package 2 , for example.
- a plurality of spherical solder balls are provided in a matrix shape in a predetermined substantially square range of an undersurface of a substantially square package body 3 of the IC package 2 of the present embodiment.
- the present embodiment includes a cooling head 5 (see FIG. 3 or the like) above the IC socket 10 , provided for a cooling apparatus (not shown) that cools the IC package 2 under testing and keeps it at a predetermined temperature.
- the cooling head 5 is configured to move upward/downward between an upper position which is a position not in contact with the IC socket 10 and a lower position which is a position in contact with the IC socket 10 .
- the IC socket 10 is provided with a socket body 20 that includes, on a top surface side, a floating plate 40 as a “housing part” disposed on the wiring circuit board 1 that houses the IC package 2 , a pair of cover members 30 so as to rotate with respect to the socket body 20 and disposed so as to be able to open/close, and a frame-shaped operation member 50 to operate the rotation of the cover member 30 .
- the cover member 30 is provided with a heat slug 32 that moves between a position at which the heat slug 32 is in contact with the IC package 2 and a position at which the heat slug 32 is not in contact with the IC package 2 , and heat of the IC package 2 is transmitted to the cooling head 5 via the heat slug 32 .
- the IC socket 10 is provided with a restricting mechanism 70 that restricts, when no IC package 2 is housed on the floating plate 40 , the movement of the heat slug 32 at a predetermined position to prevent the heat slug 32 from contacting the contact pin 60 . Details will be described hereinafter.
- a contact module 22 is disposed in a rectangular frame-shaped outer frame 21 as shown in FIG. 3 .
- a plurality of contact pins 60 are arranged in a matrix shape on the contact module 22 and the IC package 2 is housed on the top surface side.
- the contact module 22 is provided with an upper holding member 23 , a central holding member 24 , a lower holding member 25 , the floating plate 40 or the like.
- the upper holding member 23 , the central holding member 24 and the lower holding member 25 are held at a predetermined interval.
- the floating plate 40 is disposed in a state in which the floating plate 40 is urged by a spring 26 to a direction toward an upper side of the socket body 20 . This allows the floating plate 40 to move upward/downward with respect to the upper holding member 23 , the central holding member 24 and the lower holding member 25 by being held at the predetermined interval.
- the contact pins 60 are disposed by being inserted into through holes 23 a , 24 a , 25 a and 40 a provided so as to penetrate the upper holding member 23 , the central holding member 24 , the lower holding member 25 and the floating plate 40 in the upward/downward direction.
- the contact pins 60 are configured to be able to expand/contract in the upward/downward direction.
- each contact pin 60 includes a first conductive stepped cylindrical plunger 61 , a second conductive stepped cylindrical plunger 62 and a coil spring 63 .
- the first plunger 61 includes an outer cylindrical part 64 having an inner diameter greater than an outer diameter of the coil spring 63 , a first contact part 65 having an inner diameter smaller than an outer diameter of the coil spring 63 , and a stepped part 66 that connects the outer cylindrical part 64 and the first contact part 65 .
- the stepped part 66 of the first plunger 61 comes into contact with a step part 23 b provided in the through hole 23 a of the upper holding member 23 and thereby restricts the upward movement of the contact pin 60 .
- the floating plate 40 moves downward as will be described later, and the first contact part 65 can thereby come into contact with a solder ball of the IC package 2 .
- the second plunger 62 includes a body part 67 having an outer diameter larger than an inner diameter of the outer cylindrical part 64 of the first plunger 61 , a second contact part 68 having an outer diameter smaller than the outer diameter of the body part 67 and an inner contact part 69 having an outer diameter smaller than the inner diameter of the outer cylindrical part 64 of the first plunger 61 , and the inner contact part 69 is inserted into the outer cylindrical part 64 of the first plunger 61 so as to be vertically movable.
- the inner contact part 69 is tapered, with the diameter thereof expanding from a top end (one end on the first plunger 61 side) to a bottom end (the other end on the body part 62 side) and the diameter at the bottom end being larger than the diameter at the top end.
- the inner contact part 69 is configured to come into contact with an inner surface of the outer cylindrical part 64 and be brought into conduction.
- the wiring circuit board 1 is disposed at a predetermined position on the undersurface side of the socket body 20 , and the second contact part 68 of the second plunger 62 is thereby configured to come into contact with an electrode of the wiring circuit board 1 .
- the coil spring 63 is inserted into the outer cylindrical part 64 of the first plunger 61 , a top end thereof is in contact with the stepped part 66 of the first plunger 61 , a bottom end thereof is in contact with one end of the inner contact part 69 of the second plunger 62 , thus urging the second plunger 62 downward.
- the cover member 30 which will be described later, is rotated and closed, the floating plate 40 moves downward so as to approach the upper holding member 23 , the central holding member 24 and the lower holding member 25 , causing a distal end of the first contact part 65 provided on the first plunger 61 of the contact pin 60 to protrude from the top surface side of the floating plate 40 and come into contact with the solder ball of the IC package 2 .
- the plurality of contact pins 60 are arranged in a matrix shape with respect to the socket body 20 in the present embodiment as described above, only one contact pin 60 is described in the figure for the sake of convenience.
- the cover member 30 includes a pair of cover member bodies 31 (that is, first and second cover member bodies 31 a and 31 b ) and the heat slug 32 made of a highly thermoconductive material such as metal, provided on one of the cover member bodies 31 (here, the first cover member 31 a ) and configured to be vertically movable with respect to the cover member body 31 .
- the pair of cover member bodies 31 is attached to both ends of the side face of the socket body 20 so as to be rotatable via rotating shafts 39 .
- the pair of cover member bodies 31 are supported by their respective rotating shafts 39 and disposed so as to sandwich a substantially center of the socket body 20 .
- the first and second cover member bodies 31 a and 31 b making up the cover member body 31 are configured to open/close outward and upward in a so-called double-swinging door form.
- one end of a tabular link member 34 that is fixed to the cover member body 31 and rotates together with the cover member body 31 through a rotation operation around the rotating shafts 39 engages with shafts 51 provided in the four corners of the side face of the operation member 50 .
- the shaft 51 moves upward/downward with the vertical movement of the operation member 50
- one end of the link member 34 also moves upward/downward, causing the cover member body 31 to rotate around the rotating shaft 39 .
- the operation member 50 is urged upward by an urging member (not shown) and if the operation member 50 is pressed and moved downward against the upward urging force by the urging member, the cover member body 31 that engages with the operation member 50 via the link member 34 is configured to rotate upward and outward so that the cover member 30 is placed in an open state.
- the operation member 50 moves upward by the upward urging force of the urging member.
- the cover member body 31 that engages with the operation member 50 via the link member 34 is configured to rotate downward and inward so that the cover member 30 is placed in a closed state.
- the pair of cover member bodies 31 is configured to open/close upward in a so-called double-swinging door form.
- a pusher plate 38 is disposed on an undersurface side of the cover member body 31 .
- the pusher plate 38 is a member to press the IC package 2 housed on the floating plate 40 from above when the cover member body 31 is closed and fix the IC package 2 to the floating plate 40 .
- the pusher plate 38 according to the present embodiment is disposed in a nearly U-shape so as to surround the periphery of a pressing part 35 (which will be described later) provided on the heat slug 32 on the undersurface side of the cover member body 31 (that is, one first cover member body 31 a and second cover member body 31 b ).
- the heat slug 32 is disposed so as to be vertically movable with respect to the cover member body 31 . More specifically, a plurality of pin members 27 are inserted from an end of the top surface of the heat slug 32 and a pin member coil spring 28 is provided for each pin member 27 , which urges the pin member 27 and the heat slug 32 upward with respect to the socket body 20 .
- the heat slug 32 is provided on only the first cover member body 31 a which is one of the pair of cover member bodies 31 , and the heat slug 32 has a shape including an overhang part 33 formed so as to overhang on the other second cover member body 31 b side when the cover member 30 is closed.
- the heat slug 32 moves downward with respect to the cover member body 31 , in a state in which the first cover member body 31 a is closed, when the heat slug 32 comes into contact from above with the cooling head 5 which has moved to a lower position and is pressed from above by the cooling head 5 .
- the pressing part 35 provided on the undersurface of the heat slug 32 comes into contact with the IC package 2 housed on the floating plate 40 and presses the IC package 2 . It is thereby possible for the cooling head 5 to cool the IC package 2 via the heat slug 32 .
- the pressing part 35 on the undersurface of the heat slug 32 has a position and a size that the pressing part 35 can press a substantially entire top surface of the IC package 2 housed on the floating plate 40 from above.
- the cover member body 31 is provided with the restricting mechanism 70 .
- the restricting mechanism 70 allows the heat slug 32 to move downward when the IC package 2 is housed on the floating plate 40 of the socket body 20 , whereas, when no IC package 2 is housed on the floating plate 40 of the socket body 20 , the restricting mechanism 70 prevents the heat slug 32 from moving downward.
- the restricting mechanism 70 of the present embodiment is provided on the first cover member body 31 a of the cover member body 31 as shown in FIG. 2 .
- the restricting mechanism 70 is attached at two locations, on the left and right sides of an opening/closing boundary surface with respect to the second cover member body 31 b of the first cover member body 31 a .
- the restricting mechanism 70 includes a trigger member 71 and an urging member 75 .
- the left and right restricting mechanisms 70 are configured to be arranged in a direction reversed left and right. Note that the right restricting mechanism 70 is the same as the left restricting mechanism 70 except in that the left and right parts are inverted, and therefore the left restricting mechanism 70 will be mainly described and description of the right restricting mechanism 70 will be omitted hereinafter.
- the trigger member 71 is configured so as to be rotatable with respect to the first cover member body 31 a around a shaft 72 formed near a center thereof as shown in FIG. 6 .
- An upper contact part 73 is provided at a top of the trigger member 71 and a lower contact part 74 is provided at a bottom of the trigger member 71 .
- the urging member 75 is made up of a torsion spring or the like wound around a body part 76 and both end portions 77 of the torsion spring protrude from above and a side thereof.
- the end portions 77 come into contact with part of the first cover member body 31 a (undersurface side of part of the first cover member body 31 a in the figure) and the lower part of the trigger member 71 (bottom left side in the figure) so as to urge the trigger member 71 in a predetermined direction (counterclockwise in the figure).
- a concave part 37 is provided on the undersurface side of an upper wall part 36 of part of the heat slug 32 and configured such that the position where the upper contact part 73 of the trigger member 71 is urged counterclockwise by the urging member 75 is located directly below the concave part 37 .
- the lower contact part 74 of the trigger member 71 is disposed at a position shifted leftward with respect to the shaft 72 and includes a first protrusion part 74 a on the left side of the undersurface and a second protrusion 74 b on the right side of the undersurface.
- the lower contact part 74 is normally stopped by the urging member 75 at a position urged counterclockwise by a predetermined amount.
- a trigger stopper 29 made up of a metal plate or the like with which the lower contact part 74 is in contact is disposed on the floating plate 40 of the socket body 20 .
- the first protrusion part 74 a on the left side is located lower than the second protrusion part 74 b on the right side.
- the trigger stopper 29 may have a plane shape parallel to the top surface of the floating plate 40 , but the part with which the lower contact part 74 comes into contact is inclined in a lower left direction, and when the lower contact part 74 comes into contact with this part, it is readily shifted in the lower left direction, and as a result, the trigger member 71 is likely to rotate clockwise.
- the pressing part 35 on the undersurface of the heat slug 32 comes into contact with the IC package 2 from above and further presses the IC package 2 . This ensures that the cooling head 5 , the heat slug 32 and the IC package 2 come into contact with each other.
- a conductivity test such as a burn-in test
- the testing is conducted by housing the IC packages 2 to be tested in some of the IC sockets 10 . That is, the testing is conducted on the plurality of IC sockets 10 arranged side by side, where the IC sockets 10 housing the IC package 2 and the IC sockets 10 housing no IC package 2 are mixed.
- each IC socket 10 a plurality of contact pins 60 are disposed in the socket body 20 respectively and the plurality of contact pins 60 are in contact with the corresponding electrodes of the wiring circuit board 1 on the undersurface of the socket body 20 and are electrically connected to the electrodes.
- the operation member 50 is located at an upper position and in this way, the first cover member body 31 a and the second cover member body 31 b of the pair of cover members 30 are rotated in a lower inward direction, that is, the cover member 30 is in a closed state.
- the operation member 50 is pressed using an automatic machine or the like against the urging force of the urging member and moved to a lower position, the first cover member body 31 a and the second cover member body 31 b of the pair of cover members 30 engaging with each other via the link member 34 are rotated in an upper outward direction, that is, the cover member 30 is in an open state.
- the IC package 2 is housed on the floating plate 40 of the IC socket 10 using an automatic machine or the like. After that, the pressure on the operation member 50 is canceled as shown in FIG. 1 , the operation member 50 is moved to the upper position by the urging force of the urging member, the first cover member body 31 a and the second cover member body 31 b engaging with each other via the link member 34 are rotated in a lower inward direction, and the cover member 30 is thereby placed in a closed state.
- the test is conducted with some IC packages 2 being housed in some of the plurality of IC sockets 10 , and no IC packages 2 being housed in other IC sockets 10 .
- the IC socket 10 in which the IC package 2 is housed will be described using FIG. 3 to FIG. 9 .
- the first cover member body 31 a and the second cover member body 31 b including the heat slug 32 is changed from the open state as shown in FIG. 2 to the closed state as shown in FIG. 1 .
- the floating plate 40 in which the IC package 2 is housed is pressed downward and moves down to a predetermined position.
- the distal end of the first contact part 65 provided in the first plunger 61 of the contact pin 60 protrudes from the top surface of the floating plate 40 and comes into contact with a solder ball (not shown) provided in the IC package 2 .
- the plurality of disposed IC sockets 10 are provided with their respective cooling heads 5 . All the cooling heads 5 perform pressing or pressure releasing under the same control. That is, all the cooling heads 5 are configured to operate simultaneously. However, for the reason below, the cooling head 5 can perform operation of pressing the heat slug 32 to move down to a predetermined position for only those of the IC sockets 10 in which the IC packages 2 are housed.
- the IC socket 10 in which no IC package 2 is housed will be described using FIG. 10 to FIG. 16 .
- the first cover member body 31 a and the second cover member body 31 b including the heat slug 32 are changed from the open state as shown in FIG. 2 to the closed state as shown in FIG. 1 .
- the IC package 2 is not housed at the position shown in FIG.
- the first protrusion part 74 a of the lower contact part 74 moves along the leftward slope of the trigger stopper 29 against the counterclockwise urging force of the urging member 75 , which causes the trigger member 71 to rotate clockwise around the rotation part 72 . Furthermore, when the first cover member body 31 a including the heat slug 32 is caused to rotate in a closing direction, the trigger member 71 further rotates clockwise and the right-side second protrusion part 74 b also comes into contact with the trigger stopper 29 .
- the upper contact part 73 of the trigger member 71 rotates up to a position facing the upper wall part 36 at the peripheral edge of the concave part 37 located thereabove which is provided in the heat slug 32 so as to be able to contact the upper wall part 36 . As shown in FIG. 14 , this locks the downward movement of the heat slug 32 , preventing the heat slug 32 from further moving downward.
- the pusher plate 38 comes into contact with the floating plate 40 in the middle of the process in which the lower contact part 74 of the trigger member 71 comes into contact with the trigger stopper 29 and rotates clockwise.
- the pusher plate 38 presses the floating plate 40 downward in the process in which the first cover member body 31 a is closed, and the floating plate 40 thereby moves down to a predetermined position. Accordingly, the distal end of the first contact part 65 in the first plunger 61 of the contact pin 60 protrudes from the top surface of the floating plate 40 .
- the heat slug 32 is not locked so as to allow the heat slug 32 to move downward in a state in which the IC package 2 is housed on the floating plate 40 in the process of closing the cover member 30 , the heat slug 32 presses the IC package 2 , whereas in a state in which no IC package 2 is housed on the floating plate 40 , the heat slug 32 is locked so as to prevent the heat slug 32 from moving downward and the heat slug 32 stops at a position at which it does not contact the contact pin 60 .
- the floating plate 40 on which no IC package 2 is housed can reliably prevent, using a simple mechanism, problems such that the downward moving heat slug 32 may contact the contact pin 60 , damage the contact pin 60 or a foreign substance may adhere to the first contact part 65 of the contact pin 60 . As a result, it is possible to improve durability of the IC socket 10 .
- the present embodiment uses the restricting mechanism including the rotating trigger member, the urging member that urges the rotating trigger member in one rotating direction, and the trigger stopper disposed on the floating plate, but the present embodiment is not limited to this, and a restricting mechanism in any other configuration may also be used if the heat slug is caused to move downward in the IC socket in which the IC package 2 is housed and allowed to contact the IC package and the heat slug is prevented from moving downward so as to prevent the heat slug from contacting the contact pin in the IC socket in which no IC package 2 is housed.
- the cover member includes a pair of cover member bodies that open/close in a so-called double-swinging door form, but the cover member is not limited to this.
- the cover member may be constructed of a member which opens/closes through a movement other than the double-swinging door form, or the cover member may be constructed of one or three or more movable members.
- substantially the entire heat slug is made of a member having high thermal conductivity, but the heat slug is not limited to this, and the heat slug may be composed appropriately, for example, of only a portion contacting the cooling head and the IC package and a portion connecting them being made of a member having high thermal conductivity and the rest of the heat slug being made of different members.
- the terminal of the IC package is made up of a solder ball, but the terminal is not limited to this, and the present invention may be applied to an IC package including a terminal of another shape such as a tabular terminal.
- the contact pin of the present invention is not limited to a contact pin having a structure similar to that of the present embodiment, but may be one having another structure such as a contact pin formed into a tabular spring shape.
- the “socket for an electric component” of the present invention is applied to an IC socket, but the present invention is not limited to this, and the present invention is also applicable to other electric components.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Power Engineering (AREA)
- Thermal Sciences (AREA)
- Connecting Device With Holders (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Details Of Connecting Devices For Male And Female Coupling (AREA)
Abstract
Description
- This application is a U.S. National Stage Application, which claims the benefit under 35 U.S.C. §371 of International Patent Application No. PCT/JP2015/074156, filed Aug. 27, 2015, which claims the foreign priority benefit under 35 U.S.C. §119 of Japanese Patent Application No. 2014-177214, filed Sep. 1, 2014, the contents of which are incorporated herein by reference.
- The present invention relates to a socket for an electric component electrically connected to an electric component such as a semiconductor device (hereinafter referred to as “IC package”).
- As such a type of socket for an electric component, an IC socket is conventionally known in which a contact pin is disposed. This IC socket is designed to be disposed on a wiring circuit board to house an IC package which is an object to be inspected, and a terminal of this IC package and an electrode of the wiring circuit board are electrically connected together via the contact pin to conduct a test such as a conductivity test.
- Conventionally, to conduct a test efficiently, a plurality of IC sockets may be arranged side by side, and IC packages may be housed in the respective IC sockets to simultaneously conduct tests on the plurality of IC packages (e.g., see Japanese Patent Laid-Open No. 2007-78576).
- Conventionally, a cooling apparatus provided with a cooling head for cooling an IC package may be used to keep an IC package under testing at a predetermined temperature (e.g., see Japanese Patent Laid-Open No. 2007-78576). The IC socket may be provided with a heat slug made of a material with high thermal conductivity, the heat slug may be pressed by the cooling head to move downward, and the heat slug may press the IC package so that the IC package is cooled by the cooling head via the heat slug.
- As described above, the apparatus that conducts tests on a plurality of IC packages simultaneously using a plurality of IC sockets is provided with a number of cooling heads for cooling IC packages corresponding to all IC sockets. All the cooling heads press the heat slugs of the corresponding IC sockets, causing them to move downward, the heat slugs press the respective IC packages so as to cool all the IC packages via the heat slugs.
- However, as described in
Patent Literature 1, when a plurality of IC packages are simultaneously tested using the plurality of IC sockets, depending on the number of IC packages to be tested, some IC packages may not be housed in some IC sockets. Even when the IC packages are not housed in some IC sockets, all the cooling heads operate similarly. For that reason, when the cooling heads press the heat slugs of the IC sockets in which no IC package is housed and the heat slugs are caused to move downward, the heat slugs may directly come into contact with the contact pin because no IC package is housed, causing damage to the contact pin or causing a foreign substance to adhere to the contact part of the contact pin. - It is therefore an object of the present invention to provide a socket for an electric component (e.g., IC socket) having a configuration in which the electric component (e.g., IC package) is cooled by a cooling head via a heat slug, capable of preventing damage of the contact pin or adhesion of a foreign substance to the contact part of the contact pin due to the heat slug.
- In order to solve the above-described problems, a socket for an electric component according to the present invention includes a socket body which is disposed on a wiring circuit board and provided with a housing part to house an electric component on a top surface of the housing part, a contact pin to electrically connect an electrode of the wiring circuit board and a terminal of the electric component is disposed on the housing part, a cover member disposed so as to be able to open or close with respect to the socket body, wherein, the cover member includes a cover member body and a heat slug disposed on the cover member body and contact with the electric component housed to the housing part in a state in which the cover member is closed, the heat slug is configured to be pressed from above by a cooling head in a state in which the cover member is closed and caused to move downward with respect to the cover member body so as to press the electric component, and the cover member is provided with a restricting mechanism that allows, in a state in which the electric component is housed in the housing part, the cooling head to cause the heat slug to move downward to press the electric component and prevents, in a state in which no electric component is housed in the housing part, the cooling head from causing the heat slug to move downward.
- The socket for an electric component of the present invention is preferably configured such that the restricting mechanism is provided with a trigger member disposed on the cover member body so as to be movable with respect to the cover member body, an urging member that urges the trigger member in a first direction to keep the trigger member at a position where the heat slug is allowed to move downward, and a trigger stopper that moves, when the cover member body further moves downward by a predetermined distance from a lowest downward moving position when the electric component is housed in the housing part in a process in which the cover member is closed, the trigger member in a second direction which is opposite to the first direction against an urging force of the urging member to thereby cause the trigger member to prevent the heat slug from moving downward.
- The socket for an electric component of the present invention is preferably configured such that the heat slug is provided with a concave part to insert an upper contact part of the trigger member, the trigger stopper is provided with a slope to rotate the trigger member when the trigger stopper comes into contact with a lower contact part of the trigger member, the cover member reaches the lowest downward moving position when the electric component is housed in the housing part, without the lower contact part of the trigger member contacting the slope of the trigger stopper in a state in which the upper contact part faces the concave part, the lower contact part of the trigger member rotates and moves in contact with the slope of the trigger stopper when no electric component is housed in the housing part, and the cover member reaches the lowest downward moving position after the upper contact part reaches a position facing a surface outside a peripheral edge of the concave part.
- The socket for an electric component of the present invention is preferably provided with a pusher plate that is provided on an undersurface of the cover member body, comes into contact with a peripheral portion of the electric component from above when the electric component is housed in the housing part, and comes into contact with a top surface of the housing part when no electric component is housed in the housing part, in which the lowest downward moving position of the cover member is defined by the pusher plate.
- The socket for an electric component of the present invention is preferably configured such that the housing part is a floating plate disposed so as to be movable upward/downward with respect to the socket body, the floating plate includes a through hole into which a first contact part of the contact pin is inserted, and in a state in which the electric component is housed in the floating plate, when the restricting mechanism moves downward and presses the floating plate, a pressing force thereof causes the floating plate to move downward, the first contact part of the contact pin comes into contact with a terminal of the electric component, then the cooling head presses the heat slug to move downward, the heat slug thereby comes into contact with the electric component, whereas in a state in which no electric component is housed in the floating plate, when the restricting mechanism moves downward and presses the floating plate, the pressing force causes the restricting mechanism to be switched to a state in which the restricting mechanism prevents the heat slug from moving downward, and the restricting mechanism prevents the heat slug from moving downward when the cooling head presses the heat slug so that the heat slug does not come into contact with the first contact part of the contact pin.
- According to the present invention, since the restricting mechanism is provided in the configuration in which the electric component housed in the housing part is pressed by the cooling head via the heat slug, it is possible to allow the heat slug to move downward in a state in which the electric component is housed in the housing part, whereas in a state in which no electric component is housed in the housing part, it is possible to prevent the heat slug from moving downward.
- The present invention adopts a configuration in which the restricting mechanism is provided with the trigger member and the urging member and the trigger stopper causes the trigger member to move, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- According to the present invention, the upper contact part of the trigger member is caused to face the concave part of the heat slug when the electric component is housed in the housing part and the upper contact part of the trigger member is caused to rotate and move to a position deviated from the concave part of the heat slug when no electric component is housed in the housing part, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- According to the present invention, the lowest downward moving position of the cover member body is changed using the pusher plate depending on whether the electric component is housed in the housing part or not, and it is thereby possible to prevent, with a simple configuration, the heat slug from moving downward.
- According to the present invention, when no electric component is housed in the housing part, it is possible to prevent the heat slug from moving downward, thus prevent the heat slug from coming into contact with the first contact part of the contact pin, and thereby prevent the heat slug from damaging the contact pin or prevent a foreign substance from adhering to the contact part of the contact pin.
-
FIG. 1 is a perspective view of an IC socket in a closed state according to an embodiment of the present invention. -
FIG. 2 is a perspective view of the IC socket in an open state according to the embodiment of the present invention. -
FIG. 3 is an A-A cross-sectional view of the IC socket inFIG. 2 in which an IC package is housed and a cooling head is disposed. -
FIG. 4 is a cross-sectional view in the middle of closing the cover member from the state inFIG. 3 . -
FIG. 5 is a cross-sectional view of a state in which the cover member is further closed from the state inFIG. 4 . -
FIG. 6 is a partially enlarged cross-sectional view ofFIG. 5 . -
FIG. 7 is a cross-sectional view of a state in which the cover member is further closed from the state inFIG. 6 and the cover member is totally closed. -
FIG. 8 is a cross-sectional view of a state in which the cooling head is brought into contact with the heat slug of the IC socket in the state inFIG. 7 . -
FIG. 9 is a cross-sectional view of a state in which the cooling head presses the heat slug to cause the heat slug to move down to a lowest position from the state inFIG. 8 . -
FIG. 10 is an A-A cross-sectional view of a state in which the cooling head is disposed without housing the IC package in the IC socket inFIG. 2 . -
FIG. 11 is a cross-sectional view in the middle of closing the cover member from the state inFIG. 10 . -
FIG. 12 is a cross-sectional view of a state in which the cover member is further closed from the state inFIG. 11 . -
FIG. 13 is a partially enlarged cross-sectional view ofFIG. 12 . -
FIG. 14 is a cross-sectional view of a state in which the cover member is further closed from the state inFIG. 13 and the cover member is totally closed. -
FIG. 15 is a cross-sectional view of a state in which the cooling head is brought into contact with the heat slug of the IC socket in the state inFIG. 14 . -
FIG. 16 is a cross-sectional view of a state in which the cooling head presses the heat slug causing the heat slug to move down to the lowest position from the state inFIG. 15 . - Hereinafter, an embodiment of the present invention will be described.
-
FIG. 1 toFIG. 16 illustrate the embodiment of the present invention. - An
IC socket 10 as a “socket for an electric component” according to this embodiment is disposed on awiring circuit board 1 as shown in each figure, on a top surface of which anIC package 2 is housed as an “electric component” and is configured so as to electrically connect an electrode (not shown) of thewiring circuit board 1 and a solder ball (not shown) as a “terminal” of theIC package 2. ThisIC socket 10 is used for a testing apparatus for a conductivity test such as a burn-in test on theIC package 2, for example. - A plurality of spherical solder balls are provided in a matrix shape in a predetermined substantially square range of an undersurface of a substantially
square package body 3 of theIC package 2 of the present embodiment. - The present embodiment includes a cooling head 5 (see
FIG. 3 or the like) above theIC socket 10, provided for a cooling apparatus (not shown) that cools theIC package 2 under testing and keeps it at a predetermined temperature. Thecooling head 5 is configured to move upward/downward between an upper position which is a position not in contact with theIC socket 10 and a lower position which is a position in contact with theIC socket 10. - Furthermore, as shown in
FIG. 3 , theIC socket 10 is provided with asocket body 20 that includes, on a top surface side, afloating plate 40 as a “housing part” disposed on thewiring circuit board 1 that houses theIC package 2, a pair ofcover members 30 so as to rotate with respect to thesocket body 20 and disposed so as to be able to open/close, and a frame-shaped operation member 50 to operate the rotation of thecover member 30. - The
cover member 30 is provided with aheat slug 32 that moves between a position at which theheat slug 32 is in contact with theIC package 2 and a position at which theheat slug 32 is not in contact with theIC package 2, and heat of theIC package 2 is transmitted to thecooling head 5 via theheat slug 32. TheIC socket 10 is provided with arestricting mechanism 70 that restricts, when noIC package 2 is housed on thefloating plate 40, the movement of theheat slug 32 at a predetermined position to prevent theheat slug 32 from contacting thecontact pin 60. Details will be described hereinafter. - Regarding the
socket body 20, acontact module 22 is disposed in a rectangular frame-shapedouter frame 21 as shown inFIG. 3 . A plurality of contact pins 60 (seeFIG. 6 etc.) are arranged in a matrix shape on thecontact module 22 and theIC package 2 is housed on the top surface side. - As shown in
FIGS. 3, 6 etc., thecontact module 22 is provided with anupper holding member 23, acentral holding member 24, alower holding member 25, thefloating plate 40 or the like. Theupper holding member 23, thecentral holding member 24 and thelower holding member 25 are held at a predetermined interval. Above theupper holding member 23, thefloating plate 40 is disposed in a state in which thefloating plate 40 is urged by aspring 26 to a direction toward an upper side of thesocket body 20. This allows thefloating plate 40 to move upward/downward with respect to theupper holding member 23, thecentral holding member 24 and thelower holding member 25 by being held at the predetermined interval. - The contact pins 60 are disposed by being inserted into through
holes member 23, the central holdingmember 24, the lower holdingmember 25 and the floatingplate 40 in the upward/downward direction. The contact pins 60 are configured to be able to expand/contract in the upward/downward direction. - As shown in
FIG. 6 , eachcontact pin 60 includes a first conductive steppedcylindrical plunger 61, a second conductive steppedcylindrical plunger 62 and acoil spring 63. - The
first plunger 61 includes an outercylindrical part 64 having an inner diameter greater than an outer diameter of thecoil spring 63, afirst contact part 65 having an inner diameter smaller than an outer diameter of thecoil spring 63, and a steppedpart 66 that connects the outercylindrical part 64 and thefirst contact part 65. The steppedpart 66 of thefirst plunger 61 comes into contact with astep part 23 b provided in the throughhole 23 a of the upper holdingmember 23 and thereby restricts the upward movement of thecontact pin 60. The floatingplate 40 moves downward as will be described later, and thefirst contact part 65 can thereby come into contact with a solder ball of theIC package 2. - The
second plunger 62 includes abody part 67 having an outer diameter larger than an inner diameter of the outercylindrical part 64 of thefirst plunger 61, asecond contact part 68 having an outer diameter smaller than the outer diameter of thebody part 67 and aninner contact part 69 having an outer diameter smaller than the inner diameter of the outercylindrical part 64 of thefirst plunger 61, and theinner contact part 69 is inserted into the outercylindrical part 64 of thefirst plunger 61 so as to be vertically movable. Theinner contact part 69 is tapered, with the diameter thereof expanding from a top end (one end on thefirst plunger 61 side) to a bottom end (the other end on thebody part 62 side) and the diameter at the bottom end being larger than the diameter at the top end. Theinner contact part 69 is configured to come into contact with an inner surface of the outercylindrical part 64 and be brought into conduction. Thewiring circuit board 1 is disposed at a predetermined position on the undersurface side of thesocket body 20, and thesecond contact part 68 of thesecond plunger 62 is thereby configured to come into contact with an electrode of thewiring circuit board 1. - The
coil spring 63 is inserted into the outercylindrical part 64 of thefirst plunger 61, a top end thereof is in contact with the steppedpart 66 of thefirst plunger 61, a bottom end thereof is in contact with one end of theinner contact part 69 of thesecond plunger 62, thus urging thesecond plunger 62 downward. - When the
IC package 2 is housed on the floatingplate 40, thecover member 30, which will be described later, is rotated and closed, the floatingplate 40 moves downward so as to approach the upper holdingmember 23, the central holdingmember 24 and the lower holdingmember 25, causing a distal end of thefirst contact part 65 provided on thefirst plunger 61 of thecontact pin 60 to protrude from the top surface side of the floatingplate 40 and come into contact with the solder ball of theIC package 2. Note that although the plurality of contact pins 60 are arranged in a matrix shape with respect to thesocket body 20 in the present embodiment as described above, only onecontact pin 60 is described in the figure for the sake of convenience. - Furthermore, as shown in
FIGS. 1 and 2 , thecover member 30 includes a pair of cover member bodies 31 (that is, first and secondcover member bodies heat slug 32 made of a highly thermoconductive material such as metal, provided on one of the cover member bodies 31 (here, thefirst cover member 31 a) and configured to be vertically movable with respect to thecover member body 31. The pair ofcover member bodies 31 is attached to both ends of the side face of thesocket body 20 so as to be rotatable via rotatingshafts 39. - More specifically, the pair of
cover member bodies 31 are supported by their respectiverotating shafts 39 and disposed so as to sandwich a substantially center of thesocket body 20. The first and secondcover member bodies cover member body 31 are configured to open/close outward and upward in a so-called double-swinging door form. Furthermore, one end of atabular link member 34 that is fixed to thecover member body 31 and rotates together with thecover member body 31 through a rotation operation around the rotatingshafts 39 engages withshafts 51 provided in the four corners of the side face of theoperation member 50. When theshaft 51 moves upward/downward with the vertical movement of theoperation member 50, one end of thelink member 34 also moves upward/downward, causing thecover member body 31 to rotate around the rotatingshaft 39. - The
operation member 50 is urged upward by an urging member (not shown) and if theoperation member 50 is pressed and moved downward against the upward urging force by the urging member, thecover member body 31 that engages with theoperation member 50 via thelink member 34 is configured to rotate upward and outward so that thecover member 30 is placed in an open state. When the downward pressure on theoperation member 50 is canceled, theoperation member 50 moves upward by the upward urging force of the urging member. Then, thecover member body 31 that engages with theoperation member 50 via thelink member 34 is configured to rotate downward and inward so that thecover member 30 is placed in a closed state. As a result, the pair ofcover member bodies 31 is configured to open/close upward in a so-called double-swinging door form. - A
pusher plate 38 is disposed on an undersurface side of thecover member body 31. Thepusher plate 38 is a member to press theIC package 2 housed on the floatingplate 40 from above when thecover member body 31 is closed and fix theIC package 2 to the floatingplate 40. As shown inFIG. 2 , thepusher plate 38 according to the present embodiment is disposed in a nearly U-shape so as to surround the periphery of a pressing part 35 (which will be described later) provided on theheat slug 32 on the undersurface side of the cover member body 31 (that is, one firstcover member body 31 a and secondcover member body 31 b). - Furthermore, as shown in
FIGS. 1 and 6 , theheat slug 32 is disposed so as to be vertically movable with respect to thecover member body 31. More specifically, a plurality ofpin members 27 are inserted from an end of the top surface of theheat slug 32 and a pinmember coil spring 28 is provided for eachpin member 27, which urges thepin member 27 and theheat slug 32 upward with respect to thesocket body 20. - When the
cover member body 31 is closed, theheat slug 32 is urged upward by the pinmember coil spring 28, and theheat slug 32 is urged upward with respect to thecover member body 31, and as a result, thepressing part 35 on the undersurface of theheat slug 32 is located above the floatingplate 40 of thesocket body 20 by a predetermined amount. - As shown in
FIG. 9 , when the top surface of theheat slug 32 is pressed downward by the coolinghead 5, theheat slug 32 is moved downward with respect to thecover member body 31 against the upward urging force by the pinmember coil spring 28. As a result, thepressing part 35 on the undersurface of theheat slug 32 is caused to move down to a position that can come into contact with the floatingplate 40 of thesocket body 20. - Note that as shown in
FIGS. 1 and 2 , theheat slug 32 is provided on only the firstcover member body 31 a which is one of the pair ofcover member bodies 31, and theheat slug 32 has a shape including anoverhang part 33 formed so as to overhang on the other secondcover member body 31 b side when thecover member 30 is closed. - Furthermore, as described above, the
heat slug 32 moves downward with respect to thecover member body 31, in a state in which the firstcover member body 31 a is closed, when theheat slug 32 comes into contact from above with the coolinghead 5 which has moved to a lower position and is pressed from above by the coolinghead 5. Thepressing part 35 provided on the undersurface of theheat slug 32 comes into contact with theIC package 2 housed on the floatingplate 40 and presses theIC package 2. It is thereby possible for thecooling head 5 to cool theIC package 2 via theheat slug 32. - Note that in the present embodiment, the
pressing part 35 on the undersurface of theheat slug 32 has a position and a size that thepressing part 35 can press a substantially entire top surface of theIC package 2 housed on the floatingplate 40 from above. - Furthermore, as shown in
FIGS. 2, 5 and 6 , thecover member body 31 is provided with the restrictingmechanism 70. The restrictingmechanism 70 allows theheat slug 32 to move downward when theIC package 2 is housed on the floatingplate 40 of thesocket body 20, whereas, when noIC package 2 is housed on the floatingplate 40 of thesocket body 20, the restrictingmechanism 70 prevents theheat slug 32 from moving downward. - To be more specific, the restricting
mechanism 70 of the present embodiment is provided on the firstcover member body 31 a of thecover member body 31 as shown inFIG. 2 . The restrictingmechanism 70 is attached at two locations, on the left and right sides of an opening/closing boundary surface with respect to the secondcover member body 31 b of the firstcover member body 31 a. The restrictingmechanism 70 includes atrigger member 71 and an urgingmember 75. The left and right restrictingmechanisms 70 are configured to be arranged in a direction reversed left and right. Note that the right restrictingmechanism 70 is the same as the left restrictingmechanism 70 except in that the left and right parts are inverted, and therefore the left restrictingmechanism 70 will be mainly described and description of the right restrictingmechanism 70 will be omitted hereinafter. - Of the configuration of the above-described restricting
mechanism 70, thetrigger member 71 is configured so as to be rotatable with respect to the firstcover member body 31 a around ashaft 72 formed near a center thereof as shown inFIG. 6 . Anupper contact part 73 is provided at a top of thetrigger member 71 and alower contact part 74 is provided at a bottom of thetrigger member 71. - Furthermore, as shown in
FIG. 6 , the urgingmember 75 is made up of a torsion spring or the like wound around abody part 76 and both endportions 77 of the torsion spring protrude from above and a side thereof. Theend portions 77 come into contact with part of the firstcover member body 31 a (undersurface side of part of the firstcover member body 31 a in the figure) and the lower part of the trigger member 71 (bottom left side in the figure) so as to urge thetrigger member 71 in a predetermined direction (counterclockwise in the figure). - Furthermore, as shown in
FIG. 6 , aconcave part 37 is provided on the undersurface side of anupper wall part 36 of part of theheat slug 32 and configured such that the position where theupper contact part 73 of thetrigger member 71 is urged counterclockwise by the urgingmember 75 is located directly below theconcave part 37. - Furthermore, as shown in
FIG. 6 , thelower contact part 74 of thetrigger member 71 is disposed at a position shifted leftward with respect to theshaft 72 and includes afirst protrusion part 74 a on the left side of the undersurface and asecond protrusion 74 b on the right side of the undersurface. Thelower contact part 74 is normally stopped by the urgingmember 75 at a position urged counterclockwise by a predetermined amount. On the other hand, atrigger stopper 29 made up of a metal plate or the like with which thelower contact part 74 is in contact is disposed on the floatingplate 40 of thesocket body 20. Of thelower contact part 74, thefirst protrusion part 74 a on the left side is located lower than thesecond protrusion part 74 b on the right side. - As shown in
FIG. 3 toFIG. 9 , in a state in which theIC package 2 is housed on the floatingplate 40, when the firstcover member body 31 a having theheat slug 32 is closed, thepusher plate 38 provided on the firstcover member body 31 a comes into contact with the top surface of theIC package 2 as shown inFIG. 6 before thelower contact part 74 comes into contact with thetrigger stopper 29 of the floatingplate 40 of thesocket body 20. - Note that the
trigger stopper 29 may have a plane shape parallel to the top surface of the floatingplate 40, but the part with which thelower contact part 74 comes into contact is inclined in a lower left direction, and when thelower contact part 74 comes into contact with this part, it is readily shifted in the lower left direction, and as a result, thetrigger member 71 is likely to rotate clockwise. - As described above, since the
pusher plate 38 comes into contact with theIC package 2 and thelower contact part 74 does not come into contact with thetrigger stopper 29, as shown inFIG. 6 toFIG. 8 , when the firstcover member body 31 a is closed, thetrigger member 71 does not rotate but remains at a position where it is urged counterclockwise by the urgingmember 75. As a result, as shown inFIG. 7 , theupper contact part 73 remains at a position where it is just inserted into theconcave part 37 provided in theupper wall part 36 of part of theheat slug 32. This prevents the downward movement of theheat slug 32 from being locked, and so when theheat slug 32 is pressed by the coolinghead 5 as shown inFIGS. 8 and 9 , thepressing part 35 on the undersurface of theheat slug 32 comes into contact with theIC package 2 from above and further presses theIC package 2. This ensures that the coolinghead 5, theheat slug 32 and theIC package 2 come into contact with each other. - Furthermore, as shown in
FIG. 10 toFIG. 16 , in a state in which noIC package 2 is housed on the floatingplate 40, since theIC package 2 is absent when the firstcover member body 31 a including theheat slug 32 is closed, thelower contact part 74 comes into contact with thetrigger stopper 29 of the floatingplate 40 as shown inFIG. 13 before thepusher plate 38 comes into contact with the floatingplate 40. - More specifically, as shown in
FIG. 13 first, only the left-sidefirst protrusion part 74 a of thelower contact part 74 comes into contact with thetrigger stopper 29, whereas the right-sidesecond protrusion 74 b does not come into contact with thetrigger stopper 29. After that, when thecover member 30 is further closed, thetrigger member 71 rotates (rotates clockwise in the figure) around theshaft 72 against the urging force of the urgingmember 75. Due to the rotation, the right-sidesecond protrusion part 74 b also comes into contact with thetrigger stopper 29 and further rotates, causing thefirst protrusion part 74 a to separate from thetrigger stopper 29 as shown inFIG. 14 , with only thesecond protrusion part 74 b remaining in contact with thetrigger stopper 29. As a result, as shown inFIG. 14 , theupper contact part 73 also rotates clockwise, coming into contact with theupper wall part 36 at a peripheral edge of theconcave part 37 without being inserted into theconcave part 37 of theheat slug 32 and reaching a position at which it is locked. Thus, when the coolinghead 5 presses theheat slug 32, as shown inFIGS. 15 and 16 , theheat slug 32 does not move downward from a predetermined position and thepressing part 35 on the undersurface of theheat slug 32 stops at a position where thepressing part 35 is not in contact with thecontact pin 60 that protrudes upward from the floatingplate 40. - Next, operation of the
IC socket 10 provided with thesocket body 20 and thecover member 30 will be described. - First, when a conductivity test, such as a burn-in test, of the
IC sockets 10 is conducted, a plurality ofIC sockets 10 are arranged side by side, and the testing is conducted by housing the IC packages 2 to be tested in some of theIC sockets 10. That is, the testing is conducted on the plurality ofIC sockets 10 arranged side by side, where theIC sockets 10 housing theIC package 2 and theIC sockets 10 housing noIC package 2 are mixed. - In each
IC socket 10, a plurality of contact pins 60 are disposed in thesocket body 20 respectively and the plurality of contact pins 60 are in contact with the corresponding electrodes of thewiring circuit board 1 on the undersurface of thesocket body 20 and are electrically connected to the electrodes. - As shown in
FIG. 1 , theoperation member 50 is located at an upper position and in this way, the firstcover member body 31 a and the secondcover member body 31 b of the pair ofcover members 30 are rotated in a lower inward direction, that is, thecover member 30 is in a closed state. - As shown in
FIG. 2 , theoperation member 50 is pressed using an automatic machine or the like against the urging force of the urging member and moved to a lower position, the firstcover member body 31 a and the secondcover member body 31 b of the pair ofcover members 30 engaging with each other via thelink member 34 are rotated in an upper outward direction, that is, thecover member 30 is in an open state. - The
IC package 2 is housed on the floatingplate 40 of theIC socket 10 using an automatic machine or the like. After that, the pressure on theoperation member 50 is canceled as shown inFIG. 1 , theoperation member 50 is moved to the upper position by the urging force of the urging member, the firstcover member body 31 a and the secondcover member body 31 b engaging with each other via thelink member 34 are rotated in a lower inward direction, and thecover member 30 is thereby placed in a closed state. - By this means, the test is conducted with some
IC packages 2 being housed in some of the plurality ofIC sockets 10, and noIC packages 2 being housed inother IC sockets 10. - Hereinafter, the
IC socket 10 in which theIC package 2 is housed will be described usingFIG. 3 toFIG. 9 . When closing thecover member 30 of theIC socket 10 in which theIC package 2 is housed, in a state in which theupper contact part 73 of thetrigger member 71 is located directly below theconcave part 37 formed on theupper wall part 36 of theheat slug 32, the firstcover member body 31 a and the secondcover member body 31 b including theheat slug 32 is changed from the open state as shown inFIG. 2 to the closed state as shown inFIG. 1 . In the middle of that process, before thelower contact part 74 provided in thetrigger member 71 of the restrictingmember 70 disposed in the firstcover member body 31 a comes into contact with thetrigger stopper 29 at the position shown inFIG. 6 , the downward movingpusher plate 38 comes into contact with theIC package 2 housed on the floatingplate 40. - In this way, since the
lower contact part 74 of thetrigger member 71 does not contact thetrigger stopper 29 as shown inFIGS. 6 and 7 , even when the firstcover member body 31 a is further closed, thetrigger member 71 does not rotate and theupper contact part 73 continues to be located directly below theconcave part 37 formed in theupper wall part 36 of theheat slug 32. - Note that when the
pusher plate 38 presses theIC package 2 downward in the process of closing the firstcover member body 31 a, the floatingplate 40 in which theIC package 2 is housed is pressed downward and moves down to a predetermined position. Thus, the distal end of thefirst contact part 65 provided in thefirst plunger 61 of thecontact pin 60 protrudes from the top surface of the floatingplate 40 and comes into contact with a solder ball (not shown) provided in theIC package 2. - After that, as shown in
FIGS. 8 and 9 , in a state in which thecover member body 31 is closed, when theheat slug 32 is pressed from above by the coolinghead 5 to move downward, theupper contact part 73 of thetrigger member 71 is inserted into theconcave part 37 located thereabove which is formed on theupper wall part 36 in theheat slug 32. This prevents the downward movement of theheat slug 32 from being locked and causes theheat slug 32 to continue to move down to a predetermined position. - As a result, when all the cooling heads 5 corresponding to the
IC sockets 10 during testing are caused to move downward, come into contact with all the heat slugs 32 and pressed downward, it is possible to cause the unlocked heat slugs 32 of theIC socket 10 to move downward, cause the heat slugs 32 to come into contact with and press the IC packages 2, and cool the IC packages 2 through the cooling heads 5 via the heat slugs 32. - Note that in the present embodiment, the plurality of disposed
IC sockets 10 are provided with their respective cooling heads 5. All the cooling heads 5 perform pressing or pressure releasing under the same control. That is, all the cooling heads 5 are configured to operate simultaneously. However, for the reason below, the coolinghead 5 can perform operation of pressing theheat slug 32 to move down to a predetermined position for only those of theIC sockets 10 in which the IC packages 2 are housed. - Next, the
IC socket 10 in which noIC package 2 is housed will be described usingFIG. 10 toFIG. 16 . When closing thecover member 30 of theIC socket 10 in which noIC package 2 is housed, in a state in which theupper contact part 73 of thetrigger member 71 is located directly below theconcave part 37 formed in theupper wall part 36 of theheat slug 32, the firstcover member body 31 a and the secondcover member body 31 b including theheat slug 32 are changed from the open state as shown inFIG. 2 to the closed state as shown inFIG. 1 . In the middle of that process, since theIC package 2 is not housed at the position shown inFIG. 13 , if the firstcover member body 31 a and the secondcover member body 31 b are further closed, thepusher plate 38 comes into contact with the floatingplate 40 in a state in which theheat slug 32 can move downward. However, before thepusher plate 38 comes into contact with the floatingplate 40 of the firstsocket member body 31 a, the left-sidefirst protrusion part 74 a of thelower contact part 74 provided in thetrigger member 71 of the restrictingmechanism 70 disposed on the firstcover member body 31 a comes into contact with thetrigger stopper 29. - Here, when the first
cover member body 31 a including theheat slug 32 is further rotated in a closing direction, thefirst protrusion part 74 a of thelower contact part 74 moves along the leftward slope of thetrigger stopper 29 against the counterclockwise urging force of the urgingmember 75, which causes thetrigger member 71 to rotate clockwise around therotation part 72. Furthermore, when the firstcover member body 31 a including theheat slug 32 is caused to rotate in a closing direction, thetrigger member 71 further rotates clockwise and the right-sidesecond protrusion part 74 b also comes into contact with thetrigger stopper 29. - When the first
cover member body 31 a including theheat slug 32 is caused to move downward in a closing direction, as shown inFIG. 14 , thefirst protrusion part 74 a and thesecond protrusion part 74 b of thelower contact part 74 move along the leftward slope of thetrigger stopper 29 against the counterclockwise urging force of the urgingmember 75, and thetrigger member 71 thereby further rotates clockwise, thefirst protrusion part 74 a separates from thetrigger stopper 29 and only thesecond protrusion part 74 b remains in contact with thetrigger stopper 29. In accordance with such a movement of thetrigger member 71, theupper contact part 73 of thetrigger member 71 rotates up to a position facing theupper wall part 36 at the peripheral edge of theconcave part 37 located thereabove which is provided in theheat slug 32 so as to be able to contact theupper wall part 36. As shown inFIG. 14 , this locks the downward movement of theheat slug 32, preventing theheat slug 32 from further moving downward. - Note that the
pusher plate 38 comes into contact with the floatingplate 40 in the middle of the process in which thelower contact part 74 of thetrigger member 71 comes into contact with thetrigger stopper 29 and rotates clockwise. Thepusher plate 38 presses the floatingplate 40 downward in the process in which the firstcover member body 31 a is closed, and the floatingplate 40 thereby moves down to a predetermined position. Accordingly, the distal end of thefirst contact part 65 in thefirst plunger 61 of thecontact pin 60 protrudes from the top surface of the floatingplate 40. - After that, as shown in
FIGS. 15 and 16 , in a state in which thecover member body 31 is closed, when the coolinghead 5 presses theheat slug 32 from above to move downward, theupper contact part 73 of thetrigger member 71 comes into contact with and locks theupper wall part 36 of theheat slug 32. Thus, theheat slug 32 does not move downward from its position and thepressing part 35 of the undersurface of theheat slug 32 stops at a position at which it does not come into contact with the distal end of thefirst contact part 65 in thefirst plunger 61 of thecontact pin 60 that protrudes upward from the floatingplate 40. - As a result, it is possible to prevent the
heat slug 32 from contacting thecontact pin 60 that protrudes from the top surface of the floatingplate 40. This makes it possible to prevent theheat slug 32 from damaging thecontact pin 60 of theIC socket 10 in a state in which noIC package 2 is housed or prevents a foreign substance from adhering to thefirst contact part 65 of thecontact pin 60. - Thus, in the configuration of the
IC socket 10 according to the present embodiment in which theIC package 2 housed on the floatingplate 40 is pressed by the coolinghead 5 via theheat slug 32, since the restrictingmechanism 70 is provided, theheat slug 32 is not locked so as to allow theheat slug 32 to move downward in a state in which theIC package 2 is housed on the floatingplate 40 in the process of closing thecover member 30, theheat slug 32 presses theIC package 2, whereas in a state in which noIC package 2 is housed on the floatingplate 40, theheat slug 32 is locked so as to prevent theheat slug 32 from moving downward and theheat slug 32 stops at a position at which it does not contact thecontact pin 60. For this reason, the floatingplate 40 on which noIC package 2 is housed can reliably prevent, using a simple mechanism, problems such that the downward movingheat slug 32 may contact thecontact pin 60, damage thecontact pin 60 or a foreign substance may adhere to thefirst contact part 65 of thecontact pin 60. As a result, it is possible to improve durability of theIC socket 10. - Note that in order to prevent the heat slug from moving downward from a predetermined position, the present embodiment uses the restricting mechanism including the rotating trigger member, the urging member that urges the rotating trigger member in one rotating direction, and the trigger stopper disposed on the floating plate, but the present embodiment is not limited to this, and a restricting mechanism in any other configuration may also be used if the heat slug is caused to move downward in the IC socket in which the
IC package 2 is housed and allowed to contact the IC package and the heat slug is prevented from moving downward so as to prevent the heat slug from contacting the contact pin in the IC socket in which noIC package 2 is housed. - Furthermore, in the present embodiment, the cover member includes a pair of cover member bodies that open/close in a so-called double-swinging door form, but the cover member is not limited to this. For example, the cover member may be constructed of a member which opens/closes through a movement other than the double-swinging door form, or the cover member may be constructed of one or three or more movable members.
- Furthermore, according to the present embodiment, substantially the entire heat slug is made of a member having high thermal conductivity, but the heat slug is not limited to this, and the heat slug may be composed appropriately, for example, of only a portion contacting the cooling head and the IC package and a portion connecting them being made of a member having high thermal conductivity and the rest of the heat slug being made of different members.
- In the present embodiment, the terminal of the IC package is made up of a solder ball, but the terminal is not limited to this, and the present invention may be applied to an IC package including a terminal of another shape such as a tabular terminal.
- The contact pin of the present invention is not limited to a contact pin having a structure similar to that of the present embodiment, but may be one having another structure such as a contact pin formed into a tabular spring shape.
- In the present embodiment, the “socket for an electric component” of the present invention is applied to an IC socket, but the present invention is not limited to this, and the present invention is also applicable to other electric components.
-
- 1 wiring circuit board
- 2 IC package (electric component)
- 5 cooling head
- 10 IC socket (socket for electric component)
- 20 socket body
- 30 cover member
- 31 cover member body
- 31 a first cover member body
- 31 b second cover member body
- 326 heat slug
- 36 upper wall part
- 40 floating plate (housing part)
- 60 contact pin
- 70 restricting mechanism
- 71 trigger member
- 73 upper contact part
- 74 lower contact part
- 74 a first protrusion part
- 74 b second protrusion part
- 75 urging member
Claims (5)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2014-177214 | 2014-09-01 | ||
JP2014177214A JP6373130B2 (en) | 2014-09-01 | 2014-09-01 | Socket for electrical parts |
PCT/JP2015/074156 WO2016035658A1 (en) | 2014-09-01 | 2015-08-27 | Socket for electric component |
Publications (2)
Publication Number | Publication Date |
---|---|
US20170295661A1 true US20170295661A1 (en) | 2017-10-12 |
US9807909B1 US9807909B1 (en) | 2017-10-31 |
Family
ID=55439723
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US15/506,540 Expired - Fee Related US9807909B1 (en) | 2014-09-01 | 2015-08-27 | Socket for electric component |
Country Status (6)
Country | Link |
---|---|
US (1) | US9807909B1 (en) |
JP (1) | JP6373130B2 (en) |
CN (1) | CN106797090B (en) |
MY (1) | MY179606A (en) |
TW (1) | TWI674713B (en) |
WO (1) | WO2016035658A1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111836498A (en) * | 2020-08-12 | 2020-10-27 | 苏州祺烁信息科技有限公司 | A prevent bubble water installation for internet big data equipment |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP7018310B2 (en) * | 2017-12-27 | 2022-02-10 | 株式会社エンプラス | Socket for electrical components |
JP7262185B2 (en) * | 2018-07-03 | 2023-04-21 | 株式会社エンプラス | Sockets for electrical components |
JP7233290B2 (en) * | 2019-04-12 | 2023-03-06 | 株式会社エンプラス | Sockets for electrical components |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE69401040T2 (en) * | 1993-07-12 | 1997-06-05 | Nec Corp | Housing structure for microwave switching |
US5911897A (en) * | 1997-01-13 | 1999-06-15 | Micro Control Company | Temperature control for high power burn-in for integrated circuits |
TW440699B (en) * | 1998-06-09 | 2001-06-16 | Advantest Corp | Test apparatus for electronic parts |
TW432752B (en) * | 1999-07-15 | 2001-05-01 | Urex Prec Inc | Modular integrated circuit socket |
JP3822005B2 (en) * | 1999-10-04 | 2006-09-13 | 株式会社エンプラス | Socket for electrical parts |
JP4152316B2 (en) * | 2001-07-12 | 2008-09-17 | 株式会社アドバンテスト | Electronic component handling apparatus and temperature control method for electronic component |
JP3812939B2 (en) * | 2002-04-09 | 2006-08-23 | 日本航空電子工業株式会社 | Card connector |
JP2006308517A (en) * | 2005-05-02 | 2006-11-09 | Nippon Eng Kk | Burn-in board, and burn-in system |
US7277291B2 (en) * | 2005-08-08 | 2007-10-02 | Verifone Holdings, Inc. | Thermal transfer device |
JP4421540B2 (en) | 2005-09-15 | 2010-02-24 | 日本エンジニアリング株式会社 | Burn-in board and semiconductor test equipment |
US7679917B2 (en) * | 2007-02-02 | 2010-03-16 | Deck Joseph F | Electronic assembly cooling |
US7495922B2 (en) * | 2007-03-29 | 2009-02-24 | Intel Corporation | Spring loaded heat sink retention mechanism |
JP4925907B2 (en) * | 2007-04-27 | 2012-05-09 | 株式会社エンプラス | Socket for electrical parts |
US20110036538A1 (en) * | 2007-09-07 | 2011-02-17 | International Business Machines Corporation | Method and device for cooling a heat generating component |
JP4942639B2 (en) * | 2007-12-27 | 2012-05-30 | 株式会社エンプラス | Socket for electrical parts |
JP2012182224A (en) * | 2011-02-28 | 2012-09-20 | Tdk Corp | Fixing spring tool of electronic component and heat radiation structure |
JP2015504240A (en) * | 2011-11-21 | 2015-02-05 | トムソン ライセンシングThomson Licensing | Fastener that holds the heat sink |
US8702052B2 (en) * | 2012-07-05 | 2014-04-22 | Globe Motors, Inc. | Retention structure for heat generating component |
US9812795B2 (en) * | 2015-11-03 | 2017-11-07 | Ironwood Electronics, Inc. | Packaged device adapter with force applied using bearing apparatus |
-
2014
- 2014-09-01 JP JP2014177214A patent/JP6373130B2/en not_active Expired - Fee Related
-
2015
- 2015-08-27 WO PCT/JP2015/074156 patent/WO2016035658A1/en active Application Filing
- 2015-08-27 MY MYPI2017700641A patent/MY179606A/en unknown
- 2015-08-27 CN CN201580046954.9A patent/CN106797090B/en not_active Expired - Fee Related
- 2015-08-27 US US15/506,540 patent/US9807909B1/en not_active Expired - Fee Related
- 2015-08-31 TW TW104128633A patent/TWI674713B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111836498A (en) * | 2020-08-12 | 2020-10-27 | 苏州祺烁信息科技有限公司 | A prevent bubble water installation for internet big data equipment |
Also Published As
Publication number | Publication date |
---|---|
CN106797090B (en) | 2019-04-16 |
JP2016051644A (en) | 2016-04-11 |
US9807909B1 (en) | 2017-10-31 |
CN106797090A (en) | 2017-05-31 |
TWI674713B (en) | 2019-10-11 |
JP6373130B2 (en) | 2018-08-15 |
TW201622257A (en) | 2016-06-16 |
WO2016035658A1 (en) | 2016-03-10 |
MY179606A (en) | 2020-11-11 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US10466273B1 (en) | Socket device for testing IC | |
US9807909B1 (en) | Socket for electric component | |
CN1847859B (en) | Burn-in board, burn-in test method | |
TWI713267B (en) | Test socket for use in testing device under test | |
JP2003059602A (en) | Socket for semiconductor device | |
US20070270014A1 (en) | Socket for electrical parts | |
KR102185035B1 (en) | Semiconductor package test apparatus | |
JP2020017455A (en) | IC socket for semiconductor | |
US9972926B2 (en) | Electric component socket | |
KR101362546B1 (en) | Insert assembly and apparatus for receiving electronic device including the same | |
KR101830284B1 (en) | Contact apparatus and equipment for testing semiconductor device using it | |
US9476936B1 (en) | Thermal management for microcircuit testing system | |
CN107889560B (en) | Socket for electronic component | |
KR102362735B1 (en) | socket for electrical components | |
KR100502052B1 (en) | Carrier Module | |
KR100570201B1 (en) | Carrier Module for Semiconductor Test Handler | |
KR102220341B1 (en) | Semiconductor package test apparatus | |
KR20030088289A (en) | Carrier Module for Semiconductor Test Handler | |
KR20150048603A (en) | Pushing assembly and Test Hander having the same | |
WO2018030196A1 (en) | Electrical component socket | |
KR20180049564A (en) | Apparatus for testing semiconductor devices |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: ENPLAS CORPORATION, JAPAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNOR:KOBAYASHI, SHIN;REEL/FRAME:041537/0527 Effective date: 20170203 |
|
STCF | Information on status: patent grant |
Free format text: PATENTED CASE |
|
CC | Certificate of correction | ||
FEPP | Fee payment procedure |
Free format text: MAINTENANCE FEE REMINDER MAILED (ORIGINAL EVENT CODE: REM.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
LAPS | Lapse for failure to pay maintenance fees |
Free format text: PATENT EXPIRED FOR FAILURE TO PAY MAINTENANCE FEES (ORIGINAL EVENT CODE: EXP.); ENTITY STATUS OF PATENT OWNER: LARGE ENTITY |
|
STCH | Information on status: patent discontinuation |
Free format text: PATENT EXPIRED DUE TO NONPAYMENT OF MAINTENANCE FEES UNDER 37 CFR 1.362 |
|
FP | Lapsed due to failure to pay maintenance fee |
Effective date: 20211031 |