JP6706494B2 - インターフェース構造 - Google Patents
インターフェース構造 Download PDFInfo
- Publication number
- JP6706494B2 JP6706494B2 JP2015242793A JP2015242793A JP6706494B2 JP 6706494 B2 JP6706494 B2 JP 6706494B2 JP 2015242793 A JP2015242793 A JP 2015242793A JP 2015242793 A JP2015242793 A JP 2015242793A JP 6706494 B2 JP6706494 B2 JP 6706494B2
- Authority
- JP
- Japan
- Prior art keywords
- hole
- main surface
- movable contact
- socket
- interface structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 claims description 19
- 238000007747 plating Methods 0.000 claims description 16
- 239000004020 conductor Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims description 4
- 239000012777 electrically insulating material Substances 0.000 claims description 3
- 239000000523 sample Substances 0.000 description 15
- 238000004804 winding Methods 0.000 description 6
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 229920012266 Poly(ether sulfone) PES Polymers 0.000 description 1
- 230000004323 axial length Effects 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/7076—Coupling devices for connection between PCB and component, e.g. display
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2886—Features relating to contacting the IC under test, e.g. probe heads; chucks
- G01R31/2889—Interfaces, e.g. between probe and tester
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/03—Contact members characterised by the material, e.g. plating, or coating materials
- H01R13/035—Plated dielectric material
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/50—Fixed connections
- H01R12/51—Fixed connections for rigid printed circuits or like structures
- H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
- H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/716—Coupling device provided on the PCB
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/10—Sockets for co-operation with pins or blades
- H01R13/11—Resilient sockets
- H01R13/111—Resilient sockets co-operating with pins having a circular transverse section
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/15—Pins, blades or sockets having separate spring member for producing or increasing contact pressure
- H01R13/187—Pins, blades or sockets having separate spring member for producing or increasing contact pressure with spring member in the socket
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/02—Contact members
- H01R13/22—Contacts for co-operating by abutting
- H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
- H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
- H01R13/2421—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means using coil springs
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
- H01R13/62—Means for facilitating engagement or disengagement of coupling parts or for holding them in engagement
- H01R13/629—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances
- H01R13/631—Additional means for facilitating engagement or disengagement of coupling parts, e.g. aligning or guiding means, levers, gas pressure electrical locking indicators, manufacturing tolerances for engagement only
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R24/00—Two-part coupling devices, or either of their cooperating parts, characterised by their overall structure
- H01R24/58—Contacts spaced along longitudinal axis of engagement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R43/00—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors
- H01R43/20—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve
- H01R43/205—Apparatus or processes specially adapted for manufacturing, assembling, maintaining, or repairing of line connectors or current collectors or for joining electric conductors for assembling or disassembling contact members with insulating base, case or sleeve with a panel or printed circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/10—Plug-in assemblages of components, e.g. IC sockets
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0458—Details related to environmental aspects, e.g. temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
- H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
- H01R12/70—Coupling devices
- H01R12/71—Coupling devices for rigid printing circuits or like structures
- H01R12/712—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
- H01R12/714—Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
- Y10T29/49147—Assembling terminal to base
- Y10T29/49151—Assembling terminal to base by deforming or shaping
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/49002—Electrical device making
- Y10T29/49117—Conductor or circuit manufacturing
- Y10T29/49204—Contact or terminal manufacturing
- Y10T29/49208—Contact or terminal manufacturing by assembling plural parts
- Y10T29/49218—Contact or terminal manufacturing by assembling plural parts with deforming
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- General Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Connecting Device With Holders (AREA)
- Measuring Leads Or Probes (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
110:ベース部材
120:カバー部材
130:コンタクト
134:コンタクトの端部
200:ソケット用アダプタ
210:プレート
212:貫通孔
220:ベース
222:貫通孔
222A:上部貫通孔
222B:下部貫通孔
230:コイルスプリング
232:密着巻部
234:弾性部
236:可動接点部
300:回路基板
310:電極
Claims (10)
- 電子部品のインターフェース構造であって、
電気的絶縁性の材料から構成され、第1の主面および当該第1の主面に対向する第2の主面を有し、第1の主面から第2の主面に至る貫通孔が複数形成され、各貫通孔の内壁には導電性のメッキが施されている本体部と、
電気的導電性の材料から構成され、前記本体部の対応する貫通孔内に収容された複数のコイルスプリングとを有し、
前記コイルスプリングは、第1の主面側の貫通孔から挿入された電子部品の端子を受け取る受取り部と、第2の主面側において導電性領域と接触する可動接点部と、前記受取り部と前記可動接点部との間に接続された弾性部とを有し、
前記可動接点部は、前記コイルスプリングの軸方向に対して予め決められた角度で傾斜する端部を有し、当該端部は、前記本体部の第2の主面から突出しており、
前記可動接点部が前記導電性領域と接触するとき、前記可動接点部は、前記端部の傾斜により前記導電性領域上を水平方向に移動し、
前記可動接点部の水平方向の移動により前記弾性部が軸方向からオフセットする方向に移動して前記メッキに接触する、インターフェース構造。 - 前記貫通孔は、第1の主面側に開口する第1の貫通孔部と、第2の主面側に開口する第2の貫通孔部とを含み、第1の貫通孔部の径は第2の貫通孔部の径よりも大きく、前記コイルスプリングの接続部の外径は、前記弾性部の外径よりも大きく、前記受取り部が第1の貫通孔部と第1の貫通孔部の段差によって支持される、請求項1に記載のインターフェース構造。
- 前記可動接点部は、前記弾性部と同一外径の複数巻きのコイルを含み、前記可動接点部は、前記第2の貫通孔部の第2の主面側から突出する、請求項1に記載のインターフェース構造。
- 前記可動接点部が前記導電性領域に接触するとき、前記弾性部が軸方向に圧縮され、前記可動接点部が前記第2の貫通孔部内に入り込む、請求項1に記載のインターフェース構造。
- 前記受取り部は、前記電子部品の端子よりも大きい内径を有し、前記弾性部は、前記電子部品の端子よりも小さい内径を有する、請求項1ないし4いずれか1つに記載のインターフェース構造。
- インターフェース構造はさらに、前記本体部の第1の主面上にガイド部材を含み、当該ガイド部材は、前記本体部の各貫通孔と対応する位置に複数の貫通孔を含み、前記ガイド部材の貫通孔は、電子部品の端子を前記本体部にガイドする、請求項1ないし5いずれか1つに記載のインターフェース構造。
- 前記ガイド部材の貫通孔の径は、前記本体部の第1の貫通孔の径よりも小さい、請求項6に記載のインターフェース構造。
- 前記電子部品は、半導体装置を着脱自在に取付けるソケットであり、前記導電性領域は、回路基板上に形成された電極である、請求項1ないし7いずれか1つに記載のインターフェース構造。
- 半導体装置を取付け可能なソケットと、
回路基板と、
前記ソケットと前記回路基板との間のインターフェース接続をするソケット用アダプタとを有し、
前記ソケット用アダプタは、
電気的絶縁性の材料から構成され、第1の主面および当該第1の主面に対向する第2の主面を有し、第1の主面から第2の主面に至る貫通孔が複数形成され、各貫通孔の内壁には導電性のメッキが施されている本体部と、
電気的導電性の材料から構成され、前記本体部の対応する貫通孔内に収容された複数のコイルスプリングとを有し、
前記コイルスプリングは、第1の主面側の貫通孔から挿入された電子部品の端子を受け取る受取り部と、第2の主面側において導電性領域と接触する可動接点部と、前記受取り部と前記可動接点部との間に接続された弾性部とを有し、
前記可動接点部は、前記コイルスプリングの軸方向に対して予め決められた角度で傾斜する端部を有し、
前記可動接点部が前記導電性領域と接触するとき、前記可動接点部は、前記端部の傾斜により前記導電性領域上を水平方向に移動し、
前記可動接点部の水平方向の移動により前記弾性部が軸方向からオフセットする方向に移動して前記メッキに接触する、インターフェース構造。 - 前記ソケットは、ソケット用アダプタから取外しが可能である、請求項9に記載のインターフェース構造。
Priority Applications (6)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015242793A JP6706494B2 (ja) | 2015-12-14 | 2015-12-14 | インターフェース構造 |
MA042007A MA42007A (fr) | 2015-12-14 | 2016-11-21 | Structure d'interface |
EP16275168.9A EP3182521B1 (en) | 2015-12-14 | 2016-11-21 | Interface structure |
KR1020160167056A KR20170070831A (ko) | 2015-12-14 | 2016-12-08 | 인터페이스 구조 |
US15/376,286 US10714851B2 (en) | 2015-12-14 | 2016-12-12 | Interface structure |
CN201611143412.6A CN107039797B (zh) | 2015-12-14 | 2016-12-13 | 接口结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015242793A JP6706494B2 (ja) | 2015-12-14 | 2015-12-14 | インターフェース構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2017111852A JP2017111852A (ja) | 2017-06-22 |
JP6706494B2 true JP6706494B2 (ja) | 2020-06-10 |
Family
ID=57389354
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2015242793A Active JP6706494B2 (ja) | 2015-12-14 | 2015-12-14 | インターフェース構造 |
Country Status (6)
Country | Link |
---|---|
US (1) | US10714851B2 (ja) |
EP (1) | EP3182521B1 (ja) |
JP (1) | JP6706494B2 (ja) |
KR (1) | KR20170070831A (ja) |
CN (1) | CN107039797B (ja) |
MA (1) | MA42007A (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109390836B (zh) * | 2018-11-23 | 2024-02-13 | 上海雷迪埃电子有限公司 | 弯式连接器的装配工装 |
KR102213075B1 (ko) * | 2020-01-07 | 2021-02-08 | (주)마이크로컨텍솔루션 | 반도체 칩 패키지 테스트 소켓 |
CN112563228B (zh) * | 2020-11-04 | 2024-04-09 | 扬州国扬电子有限公司 | 一种具有防护缓冲结构的电极 |
KR102606908B1 (ko) * | 2020-12-23 | 2023-11-24 | (주)마이크로컨텍솔루션 | 반도체 칩 테스트 소켓 |
US11714105B2 (en) * | 2021-03-30 | 2023-08-01 | Enplas Corporation | Socket and inspection socket |
Family Cites Families (61)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4080027A (en) | 1976-07-30 | 1978-03-21 | Gte Sylvania Incorporated | Electrical contact and connector |
JP2546255Y2 (ja) | 1992-07-08 | 1997-08-27 | 矢崎総業株式会社 | 雌型端子金具 |
DE69405435T2 (de) | 1993-03-16 | 1998-01-22 | Hewlett Packard Co | Verfahren und Vorrichtung für die Herstellung von elektrisch zusammengeschalteten Schaltungen |
EP0616394A1 (en) | 1993-03-16 | 1994-09-21 | Hewlett-Packard Company | Method and system for producing electrically interconnected circuits |
US5308249A (en) | 1993-06-16 | 1994-05-03 | The Whitaker Corporation | Backplane connector utilizing flexible film circuitry |
US5443394A (en) | 1994-05-04 | 1995-08-22 | The Whitaker Corporation | Card edge connector having positive lock and extractor |
US5676559A (en) | 1995-07-06 | 1997-10-14 | The Whitaker Corporation | Zero insertion force (ZIF) electrical connector |
US5800186A (en) | 1997-03-13 | 1998-09-01 | Framatome Connectors Usa, Inc. | Printed circuit board assembly |
JP3379747B2 (ja) | 1997-05-20 | 2003-02-24 | 矢崎総業株式会社 | 低挿入力端子 |
CN1257410C (zh) * | 1997-07-14 | 2006-05-24 | 日本发条株式会社 | 导电测头 |
JP4409114B2 (ja) | 1999-03-12 | 2010-02-03 | 日本発條株式会社 | 導電性接触子アセンブリ |
JP2001093634A (ja) | 1999-09-21 | 2001-04-06 | Kato Spring Works Co Ltd | 半導体パッケージ用ソケット |
US6313523B1 (en) | 1999-10-28 | 2001-11-06 | Hewlett-Packard Company | IC die power connection using canted coil spring |
US6341962B1 (en) | 1999-10-29 | 2002-01-29 | Aries Electronics, Inc. | Solderless grid array connector |
JP3619413B2 (ja) | 2000-01-18 | 2005-02-09 | 株式会社エンプラス | 電気部品用ソケット |
JP2002170617A (ja) | 2000-12-04 | 2002-06-14 | Yokowo Co Ltd | コイルばねコネクタ |
JP3767810B2 (ja) * | 2001-04-27 | 2006-04-19 | 株式会社ヨコオ | スプリングコネクタ |
JP4721582B2 (ja) | 2001-09-14 | 2011-07-13 | 株式会社センサータ・テクノロジーズジャパン | ソケット |
JP2003100375A (ja) | 2001-09-26 | 2003-04-04 | Yokowo Co Ltd | スプリングコネクタ |
JP2003168532A (ja) | 2001-11-29 | 2003-06-13 | Texas Instr Japan Ltd | 半導体装置用ソケットおよび半導体装置のソケットへの取付け方法 |
JP4138305B2 (ja) | 2001-12-12 | 2008-08-27 | 株式会社エンプラス | 電気部品用ソケット |
JP2004029162A (ja) * | 2002-06-21 | 2004-01-29 | Sharp Corp | メカニカルロック式コネクタ |
JP3932271B2 (ja) * | 2002-06-28 | 2007-06-20 | Smk株式会社 | スライダ付きコネクタ |
US20040077225A1 (en) * | 2002-10-21 | 2004-04-22 | L & K Precision Industry Co., Ltd. | Electrical connector with movable pin |
US20040132320A1 (en) * | 2002-12-20 | 2004-07-08 | Dittmann Larry E. | Land grid array connector |
AU2003217140A1 (en) * | 2003-02-19 | 2004-09-09 | Va Innovation Pte Ltd | An interconnecting apparatus and a contact element therefor |
US6776668B1 (en) | 2003-08-01 | 2004-08-17 | Tyco Electronics Corporation | Low profile coaxial board-to-board connector |
US7021954B2 (en) | 2004-04-16 | 2006-04-04 | Hon Hai Precision Ind. Co., Ltd. | Test connector with metallic stiffener |
JP2005327628A (ja) | 2004-05-14 | 2005-11-24 | Three M Innovative Properties Co | Icソケット |
US7626408B1 (en) * | 2005-02-03 | 2009-12-01 | KK Technologies, Inc. | Electrical spring probe |
JP2006324326A (ja) | 2005-05-17 | 2006-11-30 | Elpida Memory Inc | 半導体装置 |
JP4939879B2 (ja) * | 2006-09-13 | 2012-05-30 | 株式会社エンプラス | 電気接触子、及び、電気部品用ソケット |
US9225095B2 (en) * | 2006-12-19 | 2015-12-29 | Gordon Van Ekstrom | Ball plunger-style connector assembly for electrical connections |
JP4858293B2 (ja) | 2007-05-08 | 2012-01-18 | 住友電装株式会社 | 雌端子金具 |
JP4854612B2 (ja) * | 2007-07-09 | 2012-01-18 | センサータ テクノロジーズ マサチューセッツ インコーポレーテッド | ソケット用アダプタ |
US7651366B2 (en) | 2007-07-16 | 2010-01-26 | Tyco Electronics Corporation | Electrical connector assembly with shorting contacts |
JP4868413B2 (ja) | 2007-12-04 | 2012-02-01 | センサータ テクノロジーズ インコーポレーテッド | ソケット |
US8764464B2 (en) | 2008-02-29 | 2014-07-01 | Fci Americas Technology Llc | Cross talk reduction for high speed electrical connectors |
TWM344664U (en) | 2008-04-07 | 2008-11-11 | Hon Hai Prec Ind Co Ltd | Electrical contact |
US7695285B2 (en) | 2008-05-29 | 2010-04-13 | Yokowo Co., Ltd. | Spring connector and connector |
JP5166176B2 (ja) * | 2008-09-04 | 2013-03-21 | スリーエム イノベイティブ プロパティズ カンパニー | 電子デバイス用ソケット |
JP5197297B2 (ja) | 2008-10-17 | 2013-05-15 | スリーエム イノベイティブ プロパティズ カンパニー | Icソケット |
JP5291585B2 (ja) | 2008-11-07 | 2013-09-18 | 株式会社日本マイクロニクス | 接触子及び電気的接続装置 |
JP2010118275A (ja) | 2008-11-13 | 2010-05-27 | Yamaichi Electronics Co Ltd | 半導体装置用ソケット |
JP5405582B2 (ja) | 2008-11-14 | 2014-02-05 | モレックス インコーポレイテド | 共振変更コネクタ |
JP5187188B2 (ja) | 2008-12-26 | 2013-04-24 | 富士通株式会社 | 半導体集積回路パッケージの設置方法及び電子部品の製造方法 |
US7976326B2 (en) | 2008-12-31 | 2011-07-12 | Fci Americas Technology Llc | Gender-neutral electrical connector |
US8263879B2 (en) | 2009-11-06 | 2012-09-11 | International Business Machines Corporation | Axiocentric scrubbing land grid array contacts and methods for fabrication |
KR20130014486A (ko) * | 2009-11-13 | 2013-02-07 | 테스트 툴링 솔루션즈 그룹 피티이 리미티드 | 프로브 핀 |
KR101673520B1 (ko) | 2010-03-04 | 2016-11-08 | 삼성전자 주식회사 | 반도체 모듈과 반도체 모듈용 소켓 및 이들의 결합 구조체 |
CN201667414U (zh) | 2010-04-07 | 2010-12-08 | 富士康(昆山)电脑接插件有限公司 | 电连接器 |
JP5567523B2 (ja) * | 2010-05-14 | 2014-08-06 | 日本電子材料株式会社 | 接続ピン |
US8129624B2 (en) | 2010-05-27 | 2012-03-06 | Sensata Technologies, Inc. | Pressure sensor |
US8758067B2 (en) | 2010-06-03 | 2014-06-24 | Hsio Technologies, Llc | Selective metalization of electrical connector or socket housing |
US8919656B2 (en) | 2011-06-02 | 2014-12-30 | Key Systems, Inc. | Memory button mount |
DE102011085856A1 (de) | 2011-11-07 | 2013-05-08 | Robert Bosch Gmbh | Vorrichtung zur elektrischen Kontaktierung von Elektronikeinheiten |
US8373430B1 (en) | 2012-05-06 | 2013-02-12 | Jerzy Roman Sochor | Low inductance contact probe with conductively coupled plungers |
US20130330983A1 (en) * | 2012-06-10 | 2013-12-12 | Apple Inc. | Spring-loaded contacts having sloped backside with retention guide |
JP5933728B2 (ja) | 2012-09-14 | 2016-06-15 | 日本発條株式会社 | パワーモジュール用接続端子およびパワーモジュール用接続端子群 |
US9312610B2 (en) | 2013-09-06 | 2016-04-12 | Sensata Technologies, Inc. | Stepped spring contact |
US9748678B2 (en) | 2015-03-31 | 2017-08-29 | Sensata Technologies, Inc. | Connectivity in an assembly |
-
2015
- 2015-12-14 JP JP2015242793A patent/JP6706494B2/ja active Active
-
2016
- 2016-11-21 EP EP16275168.9A patent/EP3182521B1/en active Active
- 2016-11-21 MA MA042007A patent/MA42007A/fr unknown
- 2016-12-08 KR KR1020160167056A patent/KR20170070831A/ko not_active Application Discontinuation
- 2016-12-12 US US15/376,286 patent/US10714851B2/en active Active
- 2016-12-13 CN CN201611143412.6A patent/CN107039797B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN107039797A (zh) | 2017-08-11 |
EP3182521A1 (en) | 2017-06-21 |
CN107039797B (zh) | 2020-09-15 |
MA42007A (fr) | 2017-06-21 |
JP2017111852A (ja) | 2017-06-22 |
KR20170070831A (ko) | 2017-06-22 |
US10714851B2 (en) | 2020-07-14 |
US20170171985A1 (en) | 2017-06-15 |
EP3182521B1 (en) | 2021-04-07 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6706494B2 (ja) | インターフェース構造 | |
US7501839B2 (en) | Interposer and test assembly for testing electronic devices | |
US7955088B2 (en) | Axially compliant microelectronic contactor | |
JP4328145B2 (ja) | 集積回路テストプローブ | |
JP6918518B2 (ja) | 電気特性の検査冶具 | |
JP2008180689A (ja) | 検査探針装置及びこれを用いた検査用ソケット | |
KR20010012202A (ko) | 멀티모드 유연접속기 및 그것을 사용하는 교체가능한 칩모듈 | |
US7311528B2 (en) | IC socket | |
KR101311752B1 (ko) | 반도체 테스트용 콘텍터 및 그 제조방법 | |
KR101708487B1 (ko) | 도전 실리콘 고무 안에 더블 도전 와이어를 포함하는 테스트 소켓, 및 그 제조 방법 | |
KR101369406B1 (ko) | 탐침 구조물 및 이를 갖는 전기적 검사 장치 | |
JP4085186B2 (ja) | Bgaソケット | |
KR20100069133A (ko) | 반도체소자 테스트 소켓용 스프링 컨택터 | |
JP3268749B2 (ja) | Icソケット | |
JP2904193B2 (ja) | Icソケット | |
TWI745750B (zh) | 電性連接件及電性連接裝置 | |
JP2000353579A (ja) | 半導体装置用のソケット及び半導体装置と基板との接続方法 | |
CN111293448B (zh) | 压接结构的一体型弹簧针 | |
KR100522753B1 (ko) | 모듈형 ic 소켓 | |
JP2994333B2 (ja) | Bga集積回路用ソケット | |
JP2005249499A (ja) | 電子部品用検査冶具および検査装置 | |
JP2005337994A (ja) | 電子部品検査用プローブ及び該プローブを備えた電子部品検査用接続具 | |
JP2005268090A (ja) | コンタクトピン及び電気部品用ソケット | |
JP2021012040A (ja) | 電気特性の検査冶具 | |
JP2007323925A (ja) | ソケット |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20181210 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20200109 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20200121 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20200309 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20200513 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20200518 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 6706494 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
S111 | Request for change of ownership or part of ownership |
Free format text: JAPANESE INTERMEDIATE CODE: R313113 |
|
R350 | Written notification of registration of transfer |
Free format text: JAPANESE INTERMEDIATE CODE: R350 |
|
RD02 | Notification of acceptance of power of attorney |
Free format text: JAPANESE INTERMEDIATE CODE: R3D02 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |