JP4328145B2 - 集積回路テストプローブ - Google Patents
集積回路テストプローブ Download PDFInfo
- Publication number
- JP4328145B2 JP4328145B2 JP2003198685A JP2003198685A JP4328145B2 JP 4328145 B2 JP4328145 B2 JP 4328145B2 JP 2003198685 A JP2003198685 A JP 2003198685A JP 2003198685 A JP2003198685 A JP 2003198685A JP 4328145 B2 JP4328145 B2 JP 4328145B2
- Authority
- JP
- Japan
- Prior art keywords
- spring
- contact
- test probe
- coil
- connector assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000000523 sample Substances 0.000 title claims description 49
- 238000012360 testing method Methods 0.000 title claims description 38
- 239000000758 substrate Substances 0.000 claims description 13
- 229910000679 solder Inorganic materials 0.000 claims description 12
- 230000001154 acute effect Effects 0.000 claims description 4
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 2
- 230000001427 coherent effect Effects 0.000 claims 1
- 230000002860 competitive effect Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000010301 surface-oxidation reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
- Connecting Device With Holders (AREA)
Description
12 集積回路パッケージ
14 プリント配線基板
16 不導性基板
18 電気プローブ
20 スルーホール
24 はんだボール
30、32 層
34、36 制限開口
38 縦軸
40 伸長接点
42 コイルばね
44 クラウン
46 カラー
48 端部
50 上部コイル部分
52 中間コイル部分
54 下部コイル
56 平面
60 縦軸
Claims (7)
- コネクタアセンブリのための電気テストプローブであって、
中間カラーを有する伸長接点と、
前記接点のまわりに配設された伸長螺旋状コイルばねとを含み、
ばねの一端は、ばねの平面がカラーの当該一側面と鋭角であるように前記中間カラーの一側面に接して支持し、ばねの反対端部は密着ばねコイルを備えており、それによって、動作時に電気プローブがプリント配線基板と集積回路との間で圧縮された時に、接点の縦軸が傾斜して接点とばねの密着ばねコイルとの間に直接的な電気的経路を確立することを特徴とする電気テストプローブ。 - 伸長接点は、その一端部に、BGA集積回路のはんだボールに係合するためのクラウン構成物を有し、前記伸長接点の反対端部は螺旋状コイルばねの前記密着ばねコイル内に配置されていることを特徴とする請求項1記載の電気テストプローブ。
- ばねの前記一端部は密着ばねコイルを備えることを特徴とする請求項1記載のコネクタアセンブリのための電気テストプローブ。
- 伸長螺旋状コイルばねの中間部は定ピッチであることを特徴とする請求項1記載のコネクタアセンブリのための電気テストプローブ。
- 螺旋状コイルの前記反対端部の密着ばねコイルの直径は、ばねの前記一端部のコイルの直径より小さい直径であることを特徴とする請求項1記載のコネクタアセンブリのための電気テストプローブ。
- 螺旋状コイルばねはベリリウム銅で作られていることを特徴とする請求項1記載のコネクタアセンブリのための電気テストプローブ。
- コネクタアセンブリは、反対側の上面および底面を有する不導性基板と、前記上面と底面の間に延長する複数の環状スルーホールとを備え、各前記スルーホールは前記上面および底面の中間に拡大径部分を有し、複数の電気テストプローブが前記複数のスルーホールと対応し、各テストプローブはスルーホール内に配設されていることを特徴とする請求項1記載のコネクタアセンブリのための電気テストプローブ。
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39722302P | 2002-07-18 | 2002-07-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2004251884A JP2004251884A (ja) | 2004-09-09 |
JP4328145B2 true JP4328145B2 (ja) | 2009-09-09 |
Family
ID=30000994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2003198685A Expired - Fee Related JP4328145B2 (ja) | 2002-07-18 | 2003-07-17 | 集積回路テストプローブ |
Country Status (4)
Country | Link |
---|---|
US (1) | US6844749B2 (ja) |
EP (1) | EP1385011B1 (ja) |
JP (1) | JP4328145B2 (ja) |
DE (1) | DE60303066T2 (ja) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6937045B2 (en) * | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
EP1605553A4 (en) * | 2003-03-18 | 2007-07-11 | Shinetsu Polymer Co | CONNECTOR OF PRINT CONTACT HOLD TYPE |
JP4242199B2 (ja) | 2003-04-25 | 2009-03-18 | 株式会社ヨコオ | Icソケット |
JP2004325306A (ja) * | 2003-04-25 | 2004-11-18 | Yokowo Co Ltd | 検査用同軸プローブおよびそれを用いた検査ユニット |
KR100600482B1 (ko) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | 반도체 패키지 측정용 프로브 |
US7626408B1 (en) * | 2005-02-03 | 2009-12-01 | KK Technologies, Inc. | Electrical spring probe |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
WO2007095211A2 (en) * | 2006-02-14 | 2007-08-23 | Intelifuse, Inc. | Shape memory implant heating device |
US7545159B2 (en) * | 2006-06-01 | 2009-06-09 | Rika Denshi America, Inc. | Electrical test probes with a contact element, methods of making and using the same |
US7535241B2 (en) * | 2006-10-30 | 2009-05-19 | Aries Electronics, Inc. | Test probe with hollow tubular contact with bullet-nosed configuration at one end and crimped configuration on other end |
US7656179B2 (en) * | 2006-11-10 | 2010-02-02 | Yokowo Co., Ltd. | Relay connector having a pin block and a floating guide with guide hole |
KR100769891B1 (ko) * | 2007-01-25 | 2007-10-24 | 리노공업주식회사 | 검사용 탐침 장치 및 이를 이용한 검사용 소켓 |
US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
TW200918917A (en) * | 2007-10-16 | 2009-05-01 | Compal Electronics Inc | Testing probe and electrical connection method using the same |
DE102008004162A1 (de) | 2008-01-14 | 2009-07-23 | Yamaichi Electronics Deutschland Gmbh | Anschlußkontakt, IC Testsockel und Verfahren |
JPWO2009102029A1 (ja) * | 2008-02-14 | 2011-06-16 | 日本発條株式会社 | コンタクトプローブおよびプローブユニット |
JP5166176B2 (ja) * | 2008-09-04 | 2013-03-21 | スリーエム イノベイティブ プロパティズ カンパニー | 電子デバイス用ソケット |
JP4900843B2 (ja) | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
US7874880B2 (en) * | 2009-02-26 | 2011-01-25 | Ironwood Electronics, Inc. | Adapter apparatus with sleeve spring contacts |
WO2010140184A1 (ja) * | 2009-06-01 | 2010-12-09 | 有限会社電材マート | プローブ及びプローブ装置 |
US8430676B2 (en) * | 2009-08-10 | 2013-04-30 | Sv Probe Pte. Ltd. | Modular space transformer for fine pitch vertical probing applications |
WO2011162362A1 (ja) * | 2010-06-25 | 2011-12-29 | 日本発條株式会社 | コンタクトプローブおよびプローブユニット |
FR2971892A1 (fr) * | 2011-02-22 | 2012-08-24 | Souriau | Contact electrique et ensemble connecteur a fort nombre de manoeuvres |
JP5462231B2 (ja) * | 2011-10-24 | 2014-04-02 | ヒロセ電機株式会社 | 電気コネクタ組立体 |
US9182425B2 (en) | 2012-05-21 | 2015-11-10 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Probe supporting and aligning apparatus |
TWM461790U (zh) * | 2013-04-26 | 2013-09-11 | De-Xing Xiao | 具弧狀接觸稜線之測試探針 |
US9887478B2 (en) * | 2015-04-21 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Thermally insulating electrical contact probe |
GB2539964A (en) * | 2015-07-03 | 2017-01-04 | Sevcon Ltd | Electronics assembly |
US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
US9899193B1 (en) | 2016-11-02 | 2018-02-20 | Varian Semiconductor Equipment Associates, Inc. | RF ion source with dynamic volume control |
CN109212283B (zh) * | 2018-09-26 | 2024-08-09 | 昆山鑫润利自动化科技有限公司 | Vswr测试用探针模组定位结构 |
DE102018123995A1 (de) * | 2018-09-28 | 2020-04-02 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung |
US11043484B1 (en) | 2019-03-22 | 2021-06-22 | Xilinx, Inc. | Method and apparatus of package enabled ESD protection |
CN111157884A (zh) * | 2020-01-03 | 2020-05-15 | 中广核工程有限公司 | 继电器电阻测量系统及方法 |
TW202141046A (zh) * | 2020-04-29 | 2021-11-01 | 立錡科技股份有限公司 | 探針結構以及感測治具 |
US11539167B2 (en) | 2020-09-17 | 2022-12-27 | Carlisle Interconnect Technologies, Inc. | Adjustable push on connector/adaptor |
US11502440B2 (en) * | 2020-10-23 | 2022-11-15 | Carlisle Interconnect Technologies, Inc. | Multiport connector interface system |
JP2022079959A (ja) * | 2020-11-17 | 2022-05-27 | 山一電機株式会社 | 検査用ソケット |
CN113125811B (zh) * | 2021-03-05 | 2024-03-26 | 深圳市福浪电子有限公司 | 一种晶振测试装置 |
CN115877169A (zh) * | 2021-09-27 | 2023-03-31 | 史密斯互连美洲公司 | 用于半导体集成电路的具有阶梯环的测试插座和探针 |
CN113933687B (zh) * | 2021-10-13 | 2022-08-19 | 深圳宇凡微电子有限公司 | 便捷测试座及其测试方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4508405A (en) * | 1982-04-29 | 1985-04-02 | Augat Inc. | Electronic socket having spring probe contacts |
US4783624A (en) * | 1986-04-14 | 1988-11-08 | Interconnect Devices, Inc. | Contact probe devices and method |
EP0294696A3 (de) * | 1987-06-10 | 1989-04-26 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Federkontaktstift |
US5009613A (en) * | 1990-05-01 | 1991-04-23 | Interconnect Devices, Inc. | Spring contact twister probe for testing electrical printed circuit boards |
US5204615A (en) * | 1991-10-24 | 1993-04-20 | Interconnect Devices, Inc. | Module attachment for printed circuit board test fixtures |
US5225773A (en) * | 1992-02-26 | 1993-07-06 | Interconnect Devices, Inc. | Switch probe |
US5557213A (en) * | 1994-12-01 | 1996-09-17 | Everett Charles Technologies, Inc. | Spring-loaded electrical contact probe |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
US5877554A (en) * | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
US6104205A (en) * | 1998-02-26 | 2000-08-15 | Interconnect Devices, Inc. | Probe with tab retainer |
US6020635A (en) * | 1998-07-07 | 2000-02-01 | Advanced Interconnections Corporation | Converter socket terminal |
US6275054B1 (en) * | 1998-11-25 | 2001-08-14 | Rika Electronics International, Inc. | Electrical contact system |
US6341962B1 (en) * | 1999-10-29 | 2002-01-29 | Aries Electronics, Inc. | Solderless grid array connector |
WO2001037381A1 (en) | 1999-11-17 | 2001-05-25 | Advantest Corporation | Ic socket and ic tester |
CN1177227C (zh) | 2000-06-28 | 2004-11-24 | 日本发条株式会社 | 导电性接触件 |
JP2002090386A (ja) | 2000-09-18 | 2002-03-27 | Fuji Photo Film Co Ltd | プリント基板検査用コンタクトピン |
US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
US6696850B1 (en) * | 2002-10-02 | 2004-02-24 | Interconnect Devices, Inc. | Contact probe with off-centered back-drilled aperture |
-
2003
- 2003-06-23 US US10/602,480 patent/US6844749B2/en not_active Expired - Lifetime
- 2003-07-11 DE DE60303066T patent/DE60303066T2/de not_active Expired - Lifetime
- 2003-07-11 EP EP03015572A patent/EP1385011B1/en not_active Expired - Lifetime
- 2003-07-17 JP JP2003198685A patent/JP4328145B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
EP1385011B1 (en) | 2006-01-04 |
DE60303066T2 (de) | 2006-08-31 |
EP1385011A1 (en) | 2004-01-28 |
US20040012402A1 (en) | 2004-01-22 |
DE60303066D1 (de) | 2006-03-30 |
JP2004251884A (ja) | 2004-09-09 |
US6844749B2 (en) | 2005-01-18 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP4328145B2 (ja) | 集積回路テストプローブ | |
US6937045B2 (en) | Shielded integrated circuit probe | |
JP2006004932A5 (ja) | ||
US6422879B2 (en) | IC socket for surface-mounting semiconductor device | |
KR100734296B1 (ko) | 자체 클리닝 기능이 있는 검사장치용 소켓핀 및 이를포함하는 검사장치 | |
US7393214B2 (en) | High performance electrical connector | |
US6992496B2 (en) | Apparatus for interfacing electronic packages and test equipment | |
KR100659944B1 (ko) | 플런저 및 이를 장착한 검사용 탐침장치 | |
US20100273364A1 (en) | Axially Compliant Microelectronic Contactor | |
JP2810861B2 (ja) | 電気デバイスの接触装置及び方法 | |
US7535241B2 (en) | Test probe with hollow tubular contact with bullet-nosed configuration at one end and crimped configuration on other end | |
CN107039797B (zh) | 接口结构 | |
US6942493B2 (en) | Connector structure for connecting electronic parts | |
JP3017180B1 (ja) | コンタクトピン及びソケット | |
US6674297B1 (en) | Micro compliant interconnect apparatus for integrated circuit devices | |
KR100932459B1 (ko) | 콘택터 및 콘택터를 사용한 시험 방법 | |
JP2000329790A (ja) | 導電性接触子 | |
JP2001255340A (ja) | コンタクトプローブ及び該コンタクトプローブを設けたicパッケージ検査用ソケット | |
US7063542B2 (en) | Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits | |
US7148713B1 (en) | Algoristic spring as probe | |
JP4409114B2 (ja) | 導電性接触子アセンブリ | |
JP2004309490A (ja) | 導電性接触子 | |
JP2001093634A (ja) | 半導体パッケージ用ソケット | |
JP2000065892A (ja) | 導通検査用治具 | |
KR20090073745A (ko) | 프로브 카드 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20060630 |
|
A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20090128 |
|
A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20090206 |
|
A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20090427 |
|
TRDD | Decision of grant or rejection written | ||
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20090522 |
|
A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20090612 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120619 Year of fee payment: 3 |
|
R150 | Certificate of patent or registration of utility model |
Ref document number: 4328145 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20120619 Year of fee payment: 3 |
|
FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130619 Year of fee payment: 4 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
LAPS | Cancellation because of no payment of annual fees |