DE60303066D1 - Prüfspitze für integrierte Schaltungen - Google Patents
Prüfspitze für integrierte SchaltungenInfo
- Publication number
- DE60303066D1 DE60303066D1 DE60303066T DE60303066T DE60303066D1 DE 60303066 D1 DE60303066 D1 DE 60303066D1 DE 60303066 T DE60303066 T DE 60303066T DE 60303066 T DE60303066 T DE 60303066T DE 60303066 D1 DE60303066 D1 DE 60303066D1
- Authority
- DE
- Germany
- Prior art keywords
- probe
- integrated circuits
- circuits
- integrated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/073—Multiple probes
- G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
- G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
- G01R1/07371—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate card or back card with apertures through which the probes pass
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0441—Details
- G01R1/0466—Details concerning contact pieces or mechanical details, e.g. hinges or cams; Shielding
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/04—Housings; Supporting members; Arrangements of terminals
- G01R1/0408—Test fixtures or contact fields; Connectors or connecting adaptors; Test clips; Test sockets
- G01R1/0433—Sockets for IC's or transistors
- G01R1/0483—Sockets for un-leaded IC's having matrix type contact fields, e.g. BGA or PGA devices; Sockets for unpackaged, naked chips
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06716—Elastic
- G01R1/06722—Spring-loaded
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US39722302P | 2002-07-18 | 2002-07-18 | |
US397223P | 2002-07-18 |
Publications (2)
Publication Number | Publication Date |
---|---|
DE60303066D1 true DE60303066D1 (de) | 2006-03-30 |
DE60303066T2 DE60303066T2 (de) | 2006-08-31 |
Family
ID=30000994
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
DE60303066T Expired - Lifetime DE60303066T2 (de) | 2002-07-18 | 2003-07-11 | Prüfspitze für integrierte Schaltungen |
Country Status (4)
Country | Link |
---|---|
US (1) | US6844749B2 (de) |
EP (1) | EP1385011B1 (de) |
JP (1) | JP4328145B2 (de) |
DE (1) | DE60303066T2 (de) |
Families Citing this family (41)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6937045B2 (en) * | 2002-07-18 | 2005-08-30 | Aries Electronics, Inc. | Shielded integrated circuit probe |
WO2004084356A1 (ja) * | 2003-03-18 | 2004-09-30 | Shin-Etsu Polymer Co. Ltd. | 圧接挟持型コネクタ |
JP2004325306A (ja) * | 2003-04-25 | 2004-11-18 | Yokowo Co Ltd | 検査用同軸プローブおよびそれを用いた検査ユニット |
JP4242199B2 (ja) | 2003-04-25 | 2009-03-18 | 株式会社ヨコオ | Icソケット |
KR100600482B1 (ko) * | 2004-06-22 | 2006-07-13 | 삼성전자주식회사 | 반도체 패키지 측정용 프로브 |
US7626408B1 (en) * | 2005-02-03 | 2009-12-01 | KK Technologies, Inc. | Electrical spring probe |
US7154286B1 (en) * | 2005-06-30 | 2006-12-26 | Interconnect Devices, Inc. | Dual tapered spring probe |
WO2007095211A2 (en) * | 2006-02-14 | 2007-08-23 | Intelifuse, Inc. | Shape memory implant heating device |
US7545159B2 (en) * | 2006-06-01 | 2009-06-09 | Rika Denshi America, Inc. | Electrical test probes with a contact element, methods of making and using the same |
US7535241B2 (en) * | 2006-10-30 | 2009-05-19 | Aries Electronics, Inc. | Test probe with hollow tubular contact with bullet-nosed configuration at one end and crimped configuration on other end |
US7656179B2 (en) * | 2006-11-10 | 2010-02-02 | Yokowo Co., Ltd. | Relay connector having a pin block and a floating guide with guide hole |
KR100769891B1 (ko) * | 2007-01-25 | 2007-10-24 | 리노공업주식회사 | 검사용 탐침 장치 및 이를 이용한 검사용 소켓 |
US7479794B2 (en) * | 2007-02-28 | 2009-01-20 | Sv Probe Pte Ltd | Spring loaded probe pin assembly |
TW200918917A (en) * | 2007-10-16 | 2009-05-01 | Compal Electronics Inc | Testing probe and electrical connection method using the same |
DE102008004162A1 (de) | 2008-01-14 | 2009-07-23 | Yamaichi Electronics Deutschland Gmbh | Anschlußkontakt, IC Testsockel und Verfahren |
JPWO2009102029A1 (ja) * | 2008-02-14 | 2011-06-16 | 日本発條株式会社 | コンタクトプローブおよびプローブユニット |
JP5166176B2 (ja) * | 2008-09-04 | 2013-03-21 | スリーエム イノベイティブ プロパティズ カンパニー | 電子デバイス用ソケット |
JP4900843B2 (ja) | 2008-12-26 | 2012-03-21 | 山一電機株式会社 | 半導体装置用電気接続装置及びそれに使用されるコンタクト |
US7874880B2 (en) * | 2009-02-26 | 2011-01-25 | Ironwood Electronics, Inc. | Adapter apparatus with sleeve spring contacts |
WO2010140184A1 (ja) * | 2009-06-01 | 2010-12-09 | 有限会社電材マート | プローブ及びプローブ装置 |
US8430676B2 (en) * | 2009-08-10 | 2013-04-30 | Sv Probe Pte. Ltd. | Modular space transformer for fine pitch vertical probing applications |
SG186433A1 (en) * | 2010-06-25 | 2013-01-30 | Nhk Spring Co Ltd | Contact probe and probe unit |
FR2971892A1 (fr) * | 2011-02-22 | 2012-08-24 | Souriau | Contact electrique et ensemble connecteur a fort nombre de manoeuvres |
JP5462231B2 (ja) * | 2011-10-24 | 2014-04-02 | ヒロセ電機株式会社 | 電気コネクタ組立体 |
US9182425B2 (en) * | 2012-05-21 | 2015-11-10 | Lenovo Enterprise Solutions (Singapore) Pte. Ltd. | Probe supporting and aligning apparatus |
TWM461790U (zh) * | 2013-04-26 | 2013-09-11 | De-Xing Xiao | 具弧狀接觸稜線之測試探針 |
US9887478B2 (en) * | 2015-04-21 | 2018-02-06 | Varian Semiconductor Equipment Associates, Inc. | Thermally insulating electrical contact probe |
GB2539964A (en) * | 2015-07-03 | 2017-01-04 | Sevcon Ltd | Electronics assembly |
US10274515B1 (en) * | 2015-08-07 | 2019-04-30 | Johnstech International Corporation | Waveguide integrated testing |
US9899193B1 (en) | 2016-11-02 | 2018-02-20 | Varian Semiconductor Equipment Associates, Inc. | RF ion source with dynamic volume control |
CN109212283A (zh) * | 2018-09-26 | 2019-01-15 | 昆山鑫润利自动化科技有限公司 | Vswr测试用探针模组定位结构 |
DE102018123995A1 (de) * | 2018-09-28 | 2020-04-02 | Knorr-Bremse Systeme für Nutzfahrzeuge GmbH | Kontaktiereinrichtung zum elektrischen Kontaktieren einer Leiterplatte mit einem Spulenkörper für ein Magnetventil für eine Bremseinrichtung für ein Fahrzeug, Magnetventil mit einer Kontaktiereinrichtung und Verfahren zum Herstellen einer Kontaktiereinrichtung |
US11043484B1 (en) | 2019-03-22 | 2021-06-22 | Xilinx, Inc. | Method and apparatus of package enabled ESD protection |
CN111157884A (zh) * | 2020-01-03 | 2020-05-15 | 中广核工程有限公司 | 继电器电阻测量系统及方法 |
TW202141046A (zh) * | 2020-04-29 | 2021-11-01 | 立錡科技股份有限公司 | 探針結構以及感測治具 |
US11539167B2 (en) | 2020-09-17 | 2022-12-27 | Carlisle Interconnect Technologies, Inc. | Adjustable push on connector/adaptor |
US11502440B2 (en) * | 2020-10-23 | 2022-11-15 | Carlisle Interconnect Technologies, Inc. | Multiport connector interface system |
JP2022079959A (ja) * | 2020-11-17 | 2022-05-27 | 山一電機株式会社 | 検査用ソケット |
CN113125811B (zh) * | 2021-03-05 | 2024-03-26 | 深圳市福浪电子有限公司 | 一种晶振测试装置 |
CN115877169A (zh) * | 2021-09-27 | 2023-03-31 | 史密斯互连美洲公司 | 用于半导体集成电路的具有阶梯环的测试插座和探针 |
CN113933687B (zh) * | 2021-10-13 | 2022-08-19 | 深圳宇凡微电子有限公司 | 便捷测试座及其测试方法 |
Family Cites Families (19)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4508405A (en) * | 1982-04-29 | 1985-04-02 | Augat Inc. | Electronic socket having spring probe contacts |
US4783624A (en) | 1986-04-14 | 1988-11-08 | Interconnect Devices, Inc. | Contact probe devices and method |
EP0294696A3 (de) | 1987-06-10 | 1989-04-26 | Feinmetall Gesellschaft mit beschrÀ¤nkter Haftung | Federkontaktstift |
US5009613A (en) | 1990-05-01 | 1991-04-23 | Interconnect Devices, Inc. | Spring contact twister probe for testing electrical printed circuit boards |
US5204615A (en) | 1991-10-24 | 1993-04-20 | Interconnect Devices, Inc. | Module attachment for printed circuit board test fixtures |
US5225773A (en) | 1992-02-26 | 1993-07-06 | Interconnect Devices, Inc. | Switch probe |
US5557213A (en) | 1994-12-01 | 1996-09-17 | Everett Charles Technologies, Inc. | Spring-loaded electrical contact probe |
US6046597A (en) * | 1995-10-04 | 2000-04-04 | Oz Technologies, Inc. | Test socket for an IC device |
JP3634074B2 (ja) * | 1996-06-28 | 2005-03-30 | 日本発条株式会社 | 導電性接触子 |
US5877554A (en) | 1997-11-03 | 1999-03-02 | Advanced Interconnections Corp. | Converter socket terminal |
US6104205A (en) | 1998-02-26 | 2000-08-15 | Interconnect Devices, Inc. | Probe with tab retainer |
US6020635A (en) | 1998-07-07 | 2000-02-01 | Advanced Interconnections Corporation | Converter socket terminal |
DE19983760T1 (de) * | 1998-11-25 | 2001-11-08 | Rika Electronics Internat Inc | Elektrisches Kontaktsystem |
US6341962B1 (en) | 1999-10-29 | 2002-01-29 | Aries Electronics, Inc. | Solderless grid array connector |
US6464511B1 (en) | 1999-11-17 | 2002-10-15 | Advantest Corporation | IC socket and IC tester |
EP1296145B1 (de) | 2000-06-28 | 2007-04-11 | NHK Spring Co., Ltd. | Leitender kontakt |
JP2002090386A (ja) | 2000-09-18 | 2002-03-27 | Fuji Photo Film Co Ltd | プリント基板検査用コンタクトピン |
US6685492B2 (en) * | 2001-12-27 | 2004-02-03 | Rika Electronics International, Inc. | Sockets for testing electronic packages having contact probes with contact tips easily maintainable in optimum operational condition |
US6696850B1 (en) * | 2002-10-02 | 2004-02-24 | Interconnect Devices, Inc. | Contact probe with off-centered back-drilled aperture |
-
2003
- 2003-06-23 US US10/602,480 patent/US6844749B2/en not_active Expired - Lifetime
- 2003-07-11 DE DE60303066T patent/DE60303066T2/de not_active Expired - Lifetime
- 2003-07-11 EP EP03015572A patent/EP1385011B1/de not_active Expired - Lifetime
- 2003-07-17 JP JP2003198685A patent/JP4328145B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20040012402A1 (en) | 2004-01-22 |
EP1385011A1 (de) | 2004-01-28 |
DE60303066T2 (de) | 2006-08-31 |
JP2004251884A (ja) | 2004-09-09 |
EP1385011B1 (de) | 2006-01-04 |
US6844749B2 (en) | 2005-01-18 |
JP4328145B2 (ja) | 2009-09-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
8364 | No opposition during term of opposition |