DE60109386D1 - Sondenkarte zur Prüfung integrierter Schaltungen - Google Patents

Sondenkarte zur Prüfung integrierter Schaltungen

Info

Publication number
DE60109386D1
DE60109386D1 DE60109386T DE60109386T DE60109386D1 DE 60109386 D1 DE60109386 D1 DE 60109386D1 DE 60109386 T DE60109386 T DE 60109386T DE 60109386 T DE60109386 T DE 60109386T DE 60109386 D1 DE60109386 D1 DE 60109386D1
Authority
DE
Germany
Prior art keywords
integrated circuits
probe card
testing integrated
testing
probe
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
DE60109386T
Other languages
English (en)
Inventor
Masao Okubo
Kazumasa Okubo
Hiroshi Iwata
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Japan Electronic Materials Corp
Original Assignee
Japan Electronic Materials Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Japan Electronic Materials Corp filed Critical Japan Electronic Materials Corp
Application granted granted Critical
Publication of DE60109386D1 publication Critical patent/DE60109386D1/de
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07357—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with flexible bodies, e.g. buckling beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R3/00—Apparatus or processes specially adapted for the manufacture or maintenance of measuring instruments, e.g. of probe tips

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
DE60109386T 2000-08-09 2001-08-08 Sondenkarte zur Prüfung integrierter Schaltungen Expired - Lifetime DE60109386D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2000241903A JP3486841B2 (ja) 2000-08-09 2000-08-09 垂直型プローブカード

Publications (1)

Publication Number Publication Date
DE60109386D1 true DE60109386D1 (de) 2005-04-21

Family

ID=18733017

Family Applications (1)

Application Number Title Priority Date Filing Date
DE60109386T Expired - Lifetime DE60109386D1 (de) 2000-08-09 2001-08-08 Sondenkarte zur Prüfung integrierter Schaltungen

Country Status (6)

Country Link
US (1) US6853208B2 (de)
EP (1) EP1197756B1 (de)
JP (1) JP3486841B2 (de)
KR (1) KR100395064B1 (de)
DE (1) DE60109386D1 (de)
TW (1) TWI223072B (de)

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DE60312692T2 (de) * 2003-10-13 2007-12-06 Technoprobe S.P.A, Cernusco Lombardone Prüfkopf mit vertikalen Prüfnadeln für integrierte Halbleitergeräte
WO2005050706A2 (en) 2003-11-14 2005-06-02 Wentworth Laboratories, Inc. Die design with integrated assembly aid
US7759949B2 (en) * 2004-05-21 2010-07-20 Microprobe, Inc. Probes with self-cleaning blunt skates for contacting conductive pads
US9097740B2 (en) * 2004-05-21 2015-08-04 Formfactor, Inc. Layered probes with core
US7733101B2 (en) * 2004-05-21 2010-06-08 Microprobe, Inc. Knee probe having increased scrub motion
USRE43503E1 (en) 2006-06-29 2012-07-10 Microprobe, Inc. Probe skates for electrical testing of convex pad topologies
US9476911B2 (en) 2004-05-21 2016-10-25 Microprobe, Inc. Probes with high current carrying capability and laser machining methods
US7659739B2 (en) * 2006-09-14 2010-02-09 Micro Porbe, Inc. Knee probe having reduced thickness section for control of scrub motion
US8988091B2 (en) 2004-05-21 2015-03-24 Microprobe, Inc. Multiple contact probes
JP4201739B2 (ja) 2004-05-31 2008-12-24 独立行政法人物質・材料研究機構 プローブ
JP2008536141A (ja) * 2005-04-12 2008-09-04 テクノプローブ ソチエタ ペル アツィオニ 半導体集積電子デバイス用の垂直プローブを有するテストヘッド
US7279911B2 (en) * 2005-05-03 2007-10-09 Sv Probe Pte Ltd. Probe card assembly with dielectric structure
JP4743850B2 (ja) * 2005-07-07 2011-08-10 金井 宏彰 垂直型プロ−ブピン
US7511510B2 (en) * 2005-11-30 2009-03-31 International Business Machines Corporation Nanoscale fault isolation and measurement system
US7649367B2 (en) * 2005-12-07 2010-01-19 Microprobe, Inc. Low profile probe having improved mechanical scrub and reduced contact inductance
TWI271525B (en) * 2006-01-17 2007-01-21 Chipmos Technologies Inc Probe head with vertical probes, method for manufacturing the probe head, and probe card using the probe head
US7312617B2 (en) 2006-03-20 2007-12-25 Microprobe, Inc. Space transformers employing wire bonds for interconnections with fine pitch contacts
JP2007303826A (ja) * 2006-05-08 2007-11-22 Tokyo Electron Ltd プローブ
US7683645B2 (en) * 2006-07-06 2010-03-23 Mpi Corporation High-frequency probe card and transmission line for high-frequency probe card
US7368928B2 (en) * 2006-08-29 2008-05-06 Mjc Probe Incorporation Vertical type high frequency probe card
US7400156B2 (en) * 2006-09-06 2008-07-15 Mjc Probe Incorporation Vertical probe device
US7786740B2 (en) * 2006-10-11 2010-08-31 Astria Semiconductor Holdings, Inc. Probe cards employing probes having retaining portions for potting in a potting region
US8907689B2 (en) * 2006-10-11 2014-12-09 Microprobe, Inc. Probe retention arrangement
DE202007016398U1 (de) * 2006-11-27 2008-02-21 Feinmetall Gmbh Kontaktiervorrichtung zum Kontaktieren eines zu prüfenden elektrischen Prüflings
KR101306654B1 (ko) * 2006-12-11 2013-09-10 (주) 미코에스앤피 프로브 모듈 및 그 제조 방법, 상기 프로브 모듈을 갖는프로브 카드 및 그 제조 방법
KR100847507B1 (ko) * 2007-02-07 2008-07-21 윌테크놀러지(주) 니들 및 이를 구비한 프로브 카드
US7514948B2 (en) 2007-04-10 2009-04-07 Microprobe, Inc. Vertical probe array arranged to provide space transformation
US7554348B2 (en) * 2007-06-29 2009-06-30 Wentworth Laboratories, Inc. Multi-offset die head
KR101329814B1 (ko) * 2007-07-24 2013-11-15 주식회사 코리아 인스트루먼트 프로브 카드
US7671610B2 (en) * 2007-10-19 2010-03-02 Microprobe, Inc. Vertical guided probe array providing sideways scrub motion
US8723546B2 (en) * 2007-10-19 2014-05-13 Microprobe, Inc. Vertical guided layered probe
US8230593B2 (en) * 2008-05-29 2012-07-31 Microprobe, Inc. Probe bonding method having improved control of bonding material
US8073019B2 (en) * 2009-03-02 2011-12-06 Jian Liu 810 nm ultra-short pulsed fiber laser
TW201111790A (en) * 2009-09-16 2011-04-01 Probeleader Co Ltd High-frequency vertical probe card structure
TWI417549B (zh) * 2010-07-12 2013-12-01 Mpi Corp The method of making the probe head of the vertical probe card and its composite board
CN102346201B (zh) * 2010-07-26 2015-06-17 旺矽科技股份有限公司 垂直式探针卡的探针头及其复合板的制作方法
ITMI20102125A1 (it) * 2010-11-16 2012-05-17 Technoprobe Spa Sonda di contattatura per testa di misura di dispositivi elettronici
US8963567B2 (en) 2011-10-31 2015-02-24 International Business Machines Corporation Pressure sensing and control for semiconductor wafer probing
US20140139247A1 (en) * 2012-11-21 2014-05-22 Youngseok Oh Interposer apparatus and methods
ITMI20130561A1 (it) * 2013-04-09 2014-10-10 Technoprobe Spa Testa di misura di dispositivi elettronici
KR101476683B1 (ko) * 2013-05-08 2014-12-26 (주) 루켄테크놀러지스 수직형 필름 타입 프로브 카드
JP6245876B2 (ja) * 2013-07-26 2017-12-13 株式会社日本マイクロニクス プローブカード
TWI522628B (zh) * 2013-12-13 2016-02-21 Mpi Corp Electrical detection device
KR101467381B1 (ko) * 2014-01-27 2014-12-02 윌테크놀러지(주) 반도체 검사장치
KR101421051B1 (ko) 2014-01-27 2014-07-22 윌테크놀러지(주) 반도체 검사장치
TWI521212B (zh) * 2014-03-10 2016-02-11 A method and a method of assembling a vertical probe device, and a vertical probe device
TW201537181A (zh) * 2014-03-25 2015-10-01 Mpi Corp 垂直式探針裝置及使用於該垂直式探針裝置之支撐柱
TWI553316B (zh) * 2014-04-21 2016-10-11 旺矽科技股份有限公司 探針頭及探針
IT201600079679A1 (it) * 2016-07-28 2018-01-28 Technoprobe Spa Scheda di misura di dispositivi elettronici
WO2018079788A1 (ja) * 2016-10-31 2018-05-03 京セラ株式会社 プローブカード用基板、プローブカード、および検査装置
JP7511325B2 (ja) * 2018-12-10 2024-07-05 プローブイノベーション株式会社 垂直プローブと垂直プローブ用治具
CN110865295A (zh) * 2019-10-30 2020-03-06 武汉光庭信息技术股份有限公司 一种板载ic管脚信号测试治具
EP4261547A1 (de) 2022-04-12 2023-10-18 Microtest S.p.A. Prüfkopf mit vertikalen sonden für eine sondenkarte und zugehöriges montageverfahren

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4321532A (en) * 1978-03-16 1982-03-23 Luna L Jack Repairable spring probe assembly
US4931726A (en) * 1987-06-22 1990-06-05 Hitachi, Ltd. Apparatus for testing semiconductor device
US4901013A (en) * 1988-08-19 1990-02-13 American Telephone And Telegraph Company, At&T Bell Laboratories Apparatus having a buckling beam probe assembly
IT1243302B (it) * 1990-06-19 1994-05-26 St Microelectronics Srl Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.
US5128612A (en) * 1990-07-31 1992-07-07 Texas Instruments Incorporated Disposable high performance test head
US5325052A (en) * 1990-11-30 1994-06-28 Tokyo Electron Yamanashi Limited Probe apparatus
US5525911A (en) * 1993-08-04 1996-06-11 Tokyo Electron Limited Vertical probe tester card with coaxial probes
EP0740160A1 (de) * 1995-04-24 1996-10-30 Nihon Denshizairyo Kabushiki Kaisha Vertikal arbeitende Testkarte
JP2972595B2 (ja) * 1996-09-25 1999-11-08 日本電気ファクトリエンジニアリング株式会社 プローブカード
US5977787A (en) * 1997-06-16 1999-11-02 International Business Machines Corporation Large area multiple-chip probe assembly and method of making the same
US5952843A (en) * 1998-03-24 1999-09-14 Vinh; Nguyen T. Variable contact pressure probe
US6297657B1 (en) * 1999-01-11 2001-10-02 Wentworth Laboratories, Inc. Temperature compensated vertical pin probing device

Also Published As

Publication number Publication date
US6853208B2 (en) 2005-02-08
KR20020013377A (ko) 2002-02-20
EP1197756A3 (de) 2003-08-06
JP3486841B2 (ja) 2004-01-13
TWI223072B (en) 2004-11-01
EP1197756B1 (de) 2005-03-16
KR100395064B1 (ko) 2003-08-21
EP1197756A2 (de) 2002-04-17
JP2002055119A (ja) 2002-02-20
US20020041189A1 (en) 2002-04-11

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Legal Events

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