JP4201739B2 - プローブ - Google Patents
プローブ Download PDFInfo
- Publication number
- JP4201739B2 JP4201739B2 JP2004161844A JP2004161844A JP4201739B2 JP 4201739 B2 JP4201739 B2 JP 4201739B2 JP 2004161844 A JP2004161844 A JP 2004161844A JP 2004161844 A JP2004161844 A JP 2004161844A JP 4201739 B2 JP4201739 B2 JP 4201739B2
- Authority
- JP
- Japan
- Prior art keywords
- probe
- contact
- base
- contact portion
- electrode
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06755—Material aspects
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
- G01R1/02—General constructional details
- G01R1/06—Measuring leads; Measuring probes
- G01R1/067—Measuring probes
- G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
- G01R1/06733—Geometry aspects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Measuring Leads Or Probes (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Description
110 接触部
111 基部
111a 膨張部
200 プローブ
210 接触部
211 基部
211a 変形部
Claims (1)
- 測定対象の電極に対して略垂直に接触可能な略直線状の接触部と、この接触部と連なる基端部とを有したプローブにおいて、
前記接触部は、基部と、前記基部の幅方向の端部に一体的に設けられた接合部とを有しており、前記接合部は80〜90℃下で前記基部の長手方向に膨張変形又は収縮変形可能な形状記憶合金で構成されており、前記接合部の変形により、前記接触部が前記基部の長手方向に対して略直角な方向に変形することを特徴とするプローブ。
Priority Applications (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161844A JP4201739B2 (ja) | 2004-05-31 | 2004-05-31 | プローブ |
PCT/JP2005/009177 WO2005116667A1 (ja) | 2004-05-31 | 2005-05-19 | プローブ |
KR1020057024714A KR101134394B1 (ko) | 2004-05-31 | 2005-05-19 | 프로브 |
US10/565,156 US7692438B2 (en) | 2004-05-31 | 2005-05-19 | Bimetallic probe with tip end |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004161844A JP4201739B2 (ja) | 2004-05-31 | 2004-05-31 | プローブ |
Publications (3)
Publication Number | Publication Date |
---|---|
JP2005345129A JP2005345129A (ja) | 2005-12-15 |
JP2005345129A5 JP2005345129A5 (ja) | 2006-02-02 |
JP4201739B2 true JP4201739B2 (ja) | 2008-12-24 |
Family
ID=35451001
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004161844A Expired - Fee Related JP4201739B2 (ja) | 2004-05-31 | 2004-05-31 | プローブ |
Country Status (4)
Country | Link |
---|---|
US (1) | US7692438B2 (ja) |
JP (1) | JP4201739B2 (ja) |
KR (1) | KR101134394B1 (ja) |
WO (1) | WO2005116667A1 (ja) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104204818B (zh) * | 2012-03-23 | 2017-05-24 | 爱德万测试公司 | 用于半导体测试的横向驱动探针 |
US9678108B1 (en) | 2014-02-06 | 2017-06-13 | Advantest America, Inc. | Methods to manufacture semiconductor probe tips |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3870978A (en) * | 1973-09-13 | 1975-03-11 | Omni Spectra Inc | Abutting electrical contact means using resilient conductive material |
JPH0254814A (ja) * | 1988-08-17 | 1990-02-23 | Sharp Corp | コンタクトピン |
US5225777A (en) * | 1992-02-04 | 1993-07-06 | International Business Machines Corporation | High density probe |
KR100471341B1 (ko) * | 1996-05-23 | 2005-07-21 | 제네시스 테크놀로지 가부시키가이샤 | 콘택트프로브및그것을구비한프로브장치 |
US6724203B1 (en) * | 1997-10-30 | 2004-04-20 | International Business Machines Corporation | Full wafer test configuration using memory metals |
JP3486841B2 (ja) | 2000-08-09 | 2004-01-13 | 日本電子材料株式会社 | 垂直型プローブカード |
JP2002231399A (ja) | 2001-02-02 | 2002-08-16 | Fujitsu Ltd | 半導体装置試験用コンタクタ及びその製造方法 |
US6507207B2 (en) * | 2001-02-20 | 2003-01-14 | Vinh T. Nguyen | Contact probe pin for wafer probing apparatus |
US6577147B2 (en) * | 2001-09-06 | 2003-06-10 | Intel Corporation | Method and apparatus for resisting probe burn using shape memory alloy probe during testing of an electronic device |
JP2005140677A (ja) * | 2003-11-07 | 2005-06-02 | Japan Electronic Materials Corp | プローブシート及びこれを用いたプローブシートユニット |
US7176703B2 (en) * | 2004-08-31 | 2007-02-13 | Hitachi Global Storage Technologies Netherlands B.V. | Test probe with thermally activated grip and release |
-
2004
- 2004-05-31 JP JP2004161844A patent/JP4201739B2/ja not_active Expired - Fee Related
-
2005
- 2005-05-19 WO PCT/JP2005/009177 patent/WO2005116667A1/ja active Application Filing
- 2005-05-19 KR KR1020057024714A patent/KR101134394B1/ko not_active IP Right Cessation
- 2005-05-19 US US10/565,156 patent/US7692438B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2005345129A (ja) | 2005-12-15 |
US7692438B2 (en) | 2010-04-06 |
WO2005116667A1 (ja) | 2005-12-08 |
KR101134394B1 (ko) | 2012-04-09 |
US20080054916A1 (en) | 2008-03-06 |
KR20070029036A (ko) | 2007-03-13 |
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