IT1243302B - Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore. - Google Patents

Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.

Info

Publication number
IT1243302B
IT1243302B IT08362390A IT8362390A IT1243302B IT 1243302 B IT1243302 B IT 1243302B IT 08362390 A IT08362390 A IT 08362390A IT 8362390 A IT8362390 A IT 8362390A IT 1243302 B IT1243302 B IT 1243302B
Authority
IT
Italy
Prior art keywords
test
card
slice
semiconductor devices
universal connection
Prior art date
Application number
IT08362390A
Other languages
English (en)
Other versions
IT9083623A1 (it
IT9083623A0 (it
Inventor
Giuseppe Libretti
Original Assignee
St Microelectronics Srl
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by St Microelectronics Srl filed Critical St Microelectronics Srl
Priority to IT08362390A priority Critical patent/IT1243302B/it
Publication of IT9083623A0 publication Critical patent/IT9083623A0/it
Priority to KR1019910009578A priority patent/KR920001665A/ko
Priority to EP91830260A priority patent/EP0462944B1/en
Priority to DE69131266T priority patent/DE69131266T2/de
Priority to US07/716,704 priority patent/US5187431A/en
Priority to JP17435491A priority patent/JP3160314B2/ja
Publication of IT9083623A1 publication Critical patent/IT9083623A1/it
Application granted granted Critical
Publication of IT1243302B publication Critical patent/IT1243302B/it

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R31/00—Coupling parts supported only by co-operation with counterpart
    • H01R31/06—Intermediate parts for linking two coupling parts, e.g. adapter
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07364—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch
    • G01R1/07378—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card with provisions for altering position, number or connection of probe tips; Adapting to differences in pitch using an intermediate adapter, e.g. space transformers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/52—Fixed connections for rigid printed circuits or like structures connecting to other rigid printed circuits or like structures

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
IT08362390A 1990-06-19 1990-06-19 Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore. IT1243302B (it)

Priority Applications (6)

Application Number Priority Date Filing Date Title
IT08362390A IT1243302B (it) 1990-06-19 1990-06-19 Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.
KR1019910009578A KR920001665A (ko) 1990-06-19 1991-06-11 "웨이퍼 시험대"의 ews 탐침카드와 시험카드간의 만능다중접촉기
EP91830260A EP0462944B1 (en) 1990-06-19 1991-06-12 Universal multicontact connection between an EWS probe card and a test card of a "test-on-wafer" station
DE69131266T DE69131266T2 (de) 1990-06-19 1991-06-12 Universal Mehrfach-Kontakt-Verbindung zwischen einer EWS-Probekarte und eine Testkarte oder einer Siliciumscheiben-Teststation
US07/716,704 US5187431A (en) 1990-06-19 1991-06-18 Universal multicontact connection between an ews probe card and a test card of a "test-on-wafer" station
JP17435491A JP3160314B2 (ja) 1990-06-19 1991-06-19 ユニバーサル多接触接続装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
IT08362390A IT1243302B (it) 1990-06-19 1990-06-19 Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.

Publications (3)

Publication Number Publication Date
IT9083623A0 IT9083623A0 (it) 1990-06-19
IT9083623A1 IT9083623A1 (it) 1991-12-19
IT1243302B true IT1243302B (it) 1994-05-26

Family

ID=11323294

Family Applications (1)

Application Number Title Priority Date Filing Date
IT08362390A IT1243302B (it) 1990-06-19 1990-06-19 Connessione universale multicontatto tra scheda portasonde ews e scheda di prova per una stazione di collaudo su fetta di dispositivi a semiconduttore.

Country Status (6)

Country Link
US (1) US5187431A (it)
EP (1) EP0462944B1 (it)
JP (1) JP3160314B2 (it)
KR (1) KR920001665A (it)
DE (1) DE69131266T2 (it)
IT (1) IT1243302B (it)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5457344A (en) * 1994-03-25 1995-10-10 Bartelink; Dirk J. Test fixtures for C4 solder-bump technology
US5656942A (en) * 1995-07-21 1997-08-12 Electroglas, Inc. Prober and tester with contact interface for integrated circuits-containing wafer held docked in a vertical plane
US6281692B1 (en) * 1998-10-05 2001-08-28 International Business Machines Corporation Interposer for maintaining temporary contact between a substrate and a test bed
JP3486841B2 (ja) * 2000-08-09 2004-01-13 日本電子材料株式会社 垂直型プローブカード
US6667631B2 (en) 2001-12-27 2003-12-23 Stmicroelectronics, Inc. High temperature probe card
US7554347B2 (en) * 2002-03-19 2009-06-30 Georgia Tech Research Corporation High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use
US6812720B1 (en) * 2003-04-17 2004-11-02 Chipmos Technologies (Bermuda) Ltd. Modularized probe card with coaxial transmitters
JP5258590B2 (ja) * 2009-01-16 2013-08-07 株式会社日本マイクロニクス 集積回路の試験装置
JP5235163B2 (ja) * 2009-05-18 2013-07-10 株式会社日本マイクロニクス 検査装置

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3028573A (en) * 1959-05-01 1962-04-03 Automatic Elect Lab Cross-connecting board
US3866119A (en) * 1973-09-10 1975-02-11 Probe Rite Inc Probe head-probing machine coupling adaptor
US4357062A (en) * 1979-12-10 1982-11-02 John Fluke Mfg. Co., Inc. Universal circuit board test fixture
JPS5929151B2 (ja) * 1981-08-03 1984-07-18 日本電子材料株式会社 半導体ウエハ−試験装置
DE8500168U1 (de) * 1985-01-05 1985-05-23 Riba-Prüftechnik GmbH, 7801 Schallstadt Tastnadel für eine Leiterplatten-Prüfeinrichtung
JPS61278768A (ja) * 1985-06-04 1986-12-09 Meiko Denshi Kogyo Kk プリント配線板検査機のインタ−フエ−ス
US4667154A (en) * 1985-06-26 1987-05-19 Lehighton Electronics, Inc. Electrical contact assembly
JPS62105379A (ja) * 1985-11-01 1987-05-15 株式会社日立製作所 コネクタ装置
JPS62113069A (ja) * 1985-11-12 1987-05-23 Hitachi Electronics Eng Co Ltd 取付用部品
US4884024A (en) * 1985-11-19 1989-11-28 Teradyne, Inc. Test pin assembly for circuit board tester
DE3630548A1 (de) * 1986-09-08 1988-03-10 Mania Gmbh Vorrichtung zum elektronischen pruefen von leiterplatten mit kontaktpunkten im 1/20 zoll-raster
DE3721312A1 (de) * 1987-06-27 1989-01-05 List Ingo Verstellbarer universalfederkontaktstift zum kontaktieren von testpunkten mit beliebigen koordinaten von einem vorgegebenen rasterfeld aus
US4859806A (en) * 1988-05-17 1989-08-22 Microelectronics And Computer Technology Corporation Discretionary interconnect

Also Published As

Publication number Publication date
US5187431A (en) 1993-02-16
DE69131266D1 (de) 1999-07-01
EP0462944A1 (en) 1991-12-27
JPH0621167A (ja) 1994-01-28
DE69131266T2 (de) 1999-09-23
IT9083623A1 (it) 1991-12-19
JP3160314B2 (ja) 2001-04-25
EP0462944B1 (en) 1999-05-26
IT9083623A0 (it) 1990-06-19
KR920001665A (ko) 1992-01-30

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Legal Events

Date Code Title Description
0001 Granted
TA Fee payment date (situation as of event date), data collected since 19931001

Effective date: 19970628