DE3763534D1 - Uebergabevorrichtung und uebergabeverfahren fuer halbleiterkassetten. - Google Patents

Uebergabevorrichtung und uebergabeverfahren fuer halbleiterkassetten.

Info

Publication number
DE3763534D1
DE3763534D1 DE8787106308T DE3763534T DE3763534D1 DE 3763534 D1 DE3763534 D1 DE 3763534D1 DE 8787106308 T DE8787106308 T DE 8787106308T DE 3763534 T DE3763534 T DE 3763534T DE 3763534 D1 DE3763534 D1 DE 3763534D1
Authority
DE
Germany
Prior art keywords
delivery
delivery device
cassettes
semiconductor
semiconductor cassettes
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
DE8787106308T
Other languages
English (en)
Inventor
Peter Kochersperger
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SVG Lithography Systems Inc
Original Assignee
Perkin Elmer Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Perkin Elmer Corp filed Critical Perkin Elmer Corp
Application granted granted Critical
Publication of DE3763534D1 publication Critical patent/DE3763534D1/de
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
    • H01L21/67781—Batch transfer of wafers
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/139—Associated with semiconductor wafer handling including wafer charging or discharging means for vacuum chamber
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S414/00—Material or article handling
    • Y10S414/135—Associated with semiconductor wafer handling
    • Y10S414/14—Wafer cassette transporting

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Intermediate Stations On Conveyors (AREA)
DE8787106308T 1986-05-05 1987-04-30 Uebergabevorrichtung und uebergabeverfahren fuer halbleiterkassetten. Expired - Fee Related DE3763534D1 (de)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/859,586 US4750857A (en) 1986-05-05 1986-05-05 Wafer cassette transfer mechanism

Publications (1)

Publication Number Publication Date
DE3763534D1 true DE3763534D1 (de) 1990-08-09

Family

ID=25331278

Family Applications (1)

Application Number Title Priority Date Filing Date
DE8787106308T Expired - Fee Related DE3763534D1 (de) 1986-05-05 1987-04-30 Uebergabevorrichtung und uebergabeverfahren fuer halbleiterkassetten.

Country Status (6)

Country Link
US (1) US4750857A (de)
EP (1) EP0244772B1 (de)
JP (1) JPS6323333A (de)
KR (1) KR870011671A (de)
CA (1) CA1268265C (de)
DE (1) DE3763534D1 (de)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2905857B2 (ja) * 1989-08-11 1999-06-14 東京エレクトロン株式会社 縦型処理装置
US5162047A (en) * 1989-08-28 1992-11-10 Tokyo Electron Sagami Limited Vertical heat treatment apparatus having wafer transfer mechanism and method for transferring wafers
US5199843A (en) * 1991-10-04 1993-04-06 Carl Sferra Overhead storage system
US5246218A (en) * 1992-09-25 1993-09-21 Intel Corporation Apparatus for securing an automatically loaded wafer cassette on a wafer processing equipment
DE4425208C2 (de) * 1994-07-16 1996-05-09 Jenoptik Technologie Gmbh Einrichtung zur Kopplung von Be- und Entladegeräten mit Halbleiterbearbeitungsmaschinen
US5779203A (en) * 1996-06-28 1998-07-14 Edlinger; Erich Adjustable wafer cassette stand

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3782563A (en) * 1971-09-13 1974-01-01 Security Fire Door Co Dumbwaiter loading and unloading apparatus
US3964623A (en) * 1975-02-12 1976-06-22 Verhein Gene D Pallet-palletizer assembly
US4203696A (en) * 1975-08-18 1980-05-20 Lindberg Gunnar Vilhelm Tray unloading device
US4124132A (en) * 1977-05-18 1978-11-07 Sola Basic Industries, Inc. Magazine apparatus for semiconductor processing device
SU823143A1 (ru) * 1979-05-31 1981-04-23 Специализированная Проектно-Конструк-Торская Технологическая Организация"Pocabtomatctpom" Мпсм Рсфср Устройство дл укладки рамок с кир-пичОМ HA пОлОчНыЕ ВАгОНЕТКи
US4573851A (en) * 1983-05-18 1986-03-04 Microglass, Inc. Semiconductor wafer transfer apparatus and method
DE3418243A1 (de) * 1983-05-20 1984-11-22 Varian Associates, Inc., Palo Alto, Calif. Automatisierte kassettenfoerderanlage
US4588341A (en) * 1983-07-08 1986-05-13 Motoda Denshi Kogyo Kabushiki Kaisha Article delivery apparatus
US4536122A (en) * 1983-08-22 1985-08-20 Trilogy Computer Development Partners, Ltd. Wafer transfer device
AU578621B2 (en) * 1983-08-31 1988-11-03 Sony Corporation Device for exchanging disks

Also Published As

Publication number Publication date
CA1268265A (en) 1990-04-24
EP0244772A1 (de) 1987-11-11
US4750857A (en) 1988-06-14
CA1268265C (en) 1990-04-24
KR870011671A (ko) 1987-12-26
JPS6323333A (ja) 1988-01-30
EP0244772B1 (de) 1990-07-04

Similar Documents

Publication Publication Date Title
DE3773761D1 (de) Umladevorrichtung fuer wafer.
DE3689735T2 (de) Verfahren und Gerät zur Herstellung von Halbleitervorrichtungen.
DE3687795D1 (de) Halbleiterbehandlungsvorrichtung.
KR870011686A (ko) 반도체장치 및 그 제조방법
DE3650012D1 (de) Halbleitervorrichtung.
KR920003833A (ko) 반도체 장치 제조 방법 및 시스템
DE3850855D1 (de) Halbleitervorrichtung.
KR900013620A (ko) 세라믹팩형 반도체 장치 및 그의 조립방법
DE3773624D1 (de) Geraet sowie anschlussteil dafuer.
KR890700922A (ko) 반도체 장치와 그 제조방법
KR880013254A (ko) 반도체장치 및 그 제조방법
NL189326C (nl) Halfgeleiderinrichting.
KR870009477A (ko) 반도체장치와 그 제조방법
KR880002274A (ko) 바이폴라형 반도체장치의 제조방법
DE3688064D1 (de) Halbleitervorrichtung.
DE245712T1 (de) Halbleiterlaser und detektorvorrichtung.
FR2625043B1 (fr) Dispositif semi-conducteur
KR890004403A (ko) 반도체 장치 및 제조방법
DE3773957D1 (de) Halbleitervorrichtung.
IT8720296A0 (it) Procedimento e dispositivo per cordonare.
KR890004398A (ko) 반도체장치 및 그의 제조방법
DE3889354D1 (de) Halbleiteranordnung.
KR870008394A (ko) 반도체장치 및 그 제조방법
NL193883B (nl) Geïntegreerde halfgeleiderinrichting.
KR880701968A (ko) 반도체장치 및 그 제조방법

Legal Events

Date Code Title Description
8364 No opposition during term of opposition
8327 Change in the person/name/address of the patent owner

Owner name: SVG LITHOGRAPHY SYSTEMS, INC., WILTON, CONN., US

8328 Change in the person/name/address of the agent

Free format text: GRUENECKER, A., DIPL.-ING. KINKELDEY, H., DIPL.-ING. DR.-ING. STOCKMAIR, W., DIPL.-ING. DR.-ING. AE.E. CAL TECH SCHUMANN, K., DIPL.-PHYS. DR.RER.NAT. JAKOB, P., DIPL.-ING. BEZOLD, G., DIPL.-CHEM. DR.RER.NAT. MEISTER, W., DIPL.-ING. HILGERS, H., DIPL.-ING. MEYER-PLATH, H., DIPL.-ING. DR.-ING. EHNOLD, A., DIPL.-ING. SCHUSTER, T., DIPL.-PHYS. GOLDBACH, K., DIPL.-ING.DR.-ING. AUFENANGER, M., DIPL.-ING. KLITZSCH, G., DIPL.-ING., PAT.-ANWAELTE, 8000 MUENCHEN

8339 Ceased/non-payment of the annual fee