KR970703046A - 랩-어라운드 플랜지 인터페이스를 위한 콘택트 프로세싱을 갖춘 반도체 제조방법 및 장치(semiconductor fabrication with contact processing for wrap-around flange interface) - Google Patents

랩-어라운드 플랜지 인터페이스를 위한 콘택트 프로세싱을 갖춘 반도체 제조방법 및 장치(semiconductor fabrication with contact processing for wrap-around flange interface)

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Publication number
KR970703046A
KR970703046A KR1019960706370A KR19960706370A KR970703046A KR 970703046 A KR970703046 A KR 970703046A KR 1019960706370 A KR1019960706370 A KR 1019960706370A KR 19960706370 A KR19960706370 A KR 19960706370A KR 970703046 A KR970703046 A KR 970703046A
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KR
South Korea
Prior art keywords
wrap
contact processing
flange interface
around flange
semiconductor
Prior art date
Application number
KR1019960706370A
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English (en)
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KR100343030B1 (ko
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
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Publication of KR970703046A publication Critical patent/KR970703046A/ko
Application granted granted Critical
Publication of KR100343030B1 publication Critical patent/KR100343030B1/ko

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    • H—ELECTRICITY
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    • H01L24/10—Bump connectors ; Manufacturing methods related thereto
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    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
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    • H01L23/522—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body
    • H01L23/532—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames including external interconnections consisting of a multilayer structure of conductive and insulating layers inseparably formed on the semiconductor body characterised by the materials
    • H01L23/53204—Conductive materials
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Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Internal Circuitry In Semiconductor Integrated Circuit Devices (AREA)
  • Drying Of Semiconductors (AREA)
  • Element Separation (AREA)
  • Weting (AREA)
  • Electrodes Of Semiconductors (AREA)
KR1019960706370A 1994-05-11 1995-04-27 랩-어라운드플랜지인터페이스를위한콘택트프로세싱을갖춘반도체제조방법및장치 KR100343030B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US08/241,602 1994-05-11
US08/241,602 US5656547A (en) 1994-05-11 1994-05-11 Method for making a leadless surface mounted device with wrap-around flange interface contacts
PCT/US1995/005189 WO1995031829A1 (en) 1994-05-11 1995-04-27 Semiconductor fabrication with contact processing for wrap-around flange interface

Publications (2)

Publication Number Publication Date
KR970703046A true KR970703046A (ko) 1997-06-10
KR100343030B1 KR100343030B1 (ko) 2002-12-05

Family

ID=22911374

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019960706370A KR100343030B1 (ko) 1994-05-11 1995-04-27 랩-어라운드플랜지인터페이스를위한콘택트프로세싱을갖춘반도체제조방법및장치

Country Status (8)

Country Link
US (2) US5656547A (ko)
JP (2) JP4159599B2 (ko)
KR (1) KR100343030B1 (ko)
AU (1) AU2366795A (ko)
DE (1) DE19580514B4 (ko)
GB (1) GB2302210B (ko)
HK (1) HK1012776A1 (ko)
WO (1) WO1995031829A1 (ko)

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DE19580514B4 (de) 2010-10-07
GB2302210A (en) 1997-01-08
DE19580514T1 (de) 1997-06-19
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GB9623266D0 (en) 1997-01-08
US5656547A (en) 1997-08-12
US5557149A (en) 1996-09-17
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AU2366795A (en) 1995-12-05
HK1012776A1 (en) 1999-08-06

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