CN100521881C - 可挠刚性印刷线路板的制造方法 - Google Patents

可挠刚性印刷线路板的制造方法 Download PDF

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Publication number
CN100521881C
CN100521881C CNB2005100877974A CN200510087797A CN100521881C CN 100521881 C CN100521881 C CN 100521881C CN B2005100877974 A CNB2005100877974 A CN B2005100877974A CN 200510087797 A CN200510087797 A CN 200510087797A CN 100521881 C CN100521881 C CN 100521881C
Authority
CN
China
Prior art keywords
aforementioned
alkali treatment
flexible
printed substrate
substrate
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2005100877974A
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English (en)
Chinese (zh)
Other versions
CN1784125A (zh
Inventor
相泽文隆
高桥克彦
鹤崎幸司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujikura Ltd
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of CN1784125A publication Critical patent/CN1784125A/zh
Application granted granted Critical
Publication of CN100521881C publication Critical patent/CN100521881C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)
CNB2005100877974A 2004-11-30 2005-08-08 可挠刚性印刷线路板的制造方法 Expired - Fee Related CN100521881C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2004346054 2004-11-30
JP2004364054 2004-11-30
JP2004346054A JP2006156760A (ja) 2004-11-30 2004-11-30 リジッド・フレックスプリント配線板の製造方法

Publications (2)

Publication Number Publication Date
CN1784125A CN1784125A (zh) 2006-06-07
CN100521881C true CN100521881C (zh) 2009-07-29

Family

ID=36634651

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2005100877974A Expired - Fee Related CN100521881C (zh) 2004-11-30 2005-08-08 可挠刚性印刷线路板的制造方法

Country Status (4)

Country Link
JP (1) JP2006156760A (ko)
KR (3) KR20060060540A (ko)
CN (1) CN100521881C (ko)
TW (1) TWI324028B (ko)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105892717A (zh) * 2014-11-27 2016-08-24 崔伟 一种指扣

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090450B1 (ko) * 2009-05-13 2011-12-06 스템코 주식회사 잉크젯 카트리지용 연성 회로 기판의 제조 방법, 그에 의해 제조된 잉크젯 카트리지용 연성 회로 기판 및 잉크젯 카트리지의 제조 방법
JP2011119616A (ja) * 2009-12-07 2011-06-16 Fujitsu Ltd プリント配線基板の製造方法、プリント配線基板、および電子装置
CN102209442B (zh) * 2010-11-16 2012-11-14 博罗县精汇电子科技有限公司 铜箔覆盖法生产软硬结合多层电路板的工艺
CN105101625A (zh) * 2015-09-02 2015-11-25 竞陆电子(昆山)有限公司 Pcb内层板边均匀流胶结构
CN105208773B (zh) * 2015-09-10 2018-03-06 深圳崇达多层线路板有限公司 一种刚挠结合板的制作方法

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244561A (ja) * 1993-02-19 1994-09-02 Toshiba Chem Corp フレックス／リジット複合配線板
JPH11261220A (ja) * 1998-03-13 1999-09-24 Hitachi Chem Co Ltd 多層プリント配線板の製造方法
JP2002057457A (ja) * 2000-08-11 2002-02-22 Toshiba Chem Corp 多層プリント配線板の製造方法
JP2002124762A (ja) * 2000-10-16 2002-04-26 Toshiba Chem Corp 多層プリント配線板の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN105892717A (zh) * 2014-11-27 2016-08-24 崔伟 一种指扣

Also Published As

Publication number Publication date
KR20070093938A (ko) 2007-09-19
CN1784125A (zh) 2006-06-07
KR100872524B1 (ko) 2008-12-08
KR20060060540A (ko) 2006-06-05
KR20080081142A (ko) 2008-09-08
TW200618687A (en) 2006-06-01
JP2006156760A (ja) 2006-06-15
TWI324028B (en) 2010-04-21

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Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
CI01 Correction of invention patent gazette

Correction item: Priority

Correct: 2004.11.30 JP 2004-346054

False: 2004.11.30 JP 2004-364054

Number: 23

Volume: 22

CI02 Correction of invention patent application

Correction item: Priority

Correct: 2004.11.30 JP 2004-346054

False: 2004.11.30 JP 2004-364054

Number: 23

Page: The title page

Volume: 22

COR Change of bibliographic data

Free format text: CORRECT: PRIORITY; FROM: 2004.11.30 JP 2004-364054 TO: 2004.11.30 JP 2004-346054

ERR Gazette correction

Free format text: CORRECT: PRIORITY; FROM: 2004.11.30 JP 2004-364054 TO: 2004.11.30 JP 2004-346054

C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090729

Termination date: 20120808