TW200618687A - Method for manufacturing rigid-flex printed wiring board - Google Patents

Method for manufacturing rigid-flex printed wiring board

Info

Publication number
TW200618687A
TW200618687A TW094124501A TW94124501A TW200618687A TW 200618687 A TW200618687 A TW 200618687A TW 094124501 A TW094124501 A TW 094124501A TW 94124501 A TW94124501 A TW 94124501A TW 200618687 A TW200618687 A TW 200618687A
Authority
TW
Taiwan
Prior art keywords
wiring board
layer
printed wiring
rigid
flex printed
Prior art date
Application number
TW094124501A
Other languages
Chinese (zh)
Other versions
TWI324028B (en
Inventor
Fumitaka Aizawa
Katsuhiko Takahashi
Koji Tsurusaki
Original Assignee
Fujikura Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujikura Ltd filed Critical Fujikura Ltd
Publication of TW200618687A publication Critical patent/TW200618687A/en
Application granted granted Critical
Publication of TWI324028B publication Critical patent/TWI324028B/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/381—Improvement of the adhesion between the insulating substrate and the metal by special treatment of the substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4644—Manufacturing multilayer circuits by building the multilayer layer by layer, i.e. build-up multilayer circuits
    • H05K3/4652—Adding a circuit layer by laminating a metal foil or a preformed metal foil pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
    • H05K3/4694—Partitioned multilayer circuits having adjacent regions with different properties, e.g. by adding or inserting locally circuit layers having a higher circuit density
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
    • H05K2203/0779—Treatments involving liquids, e.g. plating, rinsing characterised by the specific liquids involved
    • H05K2203/0786—Using an aqueous solution, e.g. for cleaning or during drilling of holes
    • H05K2203/0793—Aqueous alkaline solution, e.g. for cleaning or etching

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Laminated Bodies (AREA)

Abstract

A method for manufacturing a rigid-flex printed wiring board including an inner-layer flexible wiring board that is formed by laminating a cover lay on an inner-layer copper-clad lamination and has two outer-surfaces of flexible members, outer-layer rigid wiring boards each having one surface of a non-flexible member, and adhesion members, the method including a step α of subjecting the two outer-surfaces of the inner-layer flexible wiring board to an alkaline treatment, and a step β of stacking the outer-layer rigid wiring boards on each of the two outer-surfaces of the inner-layer flexible wiring board that have been subjected to the alkaline treatment via the adhesion members.
TW094124501A 2004-11-30 2005-07-20 Method for manufacturing rigid-flex printed wiring board TWI324028B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004346054A JP2006156760A (en) 2004-11-30 2004-11-30 Manufacturing method of rigid-flex printed wiring board

Publications (2)

Publication Number Publication Date
TW200618687A true TW200618687A (en) 2006-06-01
TWI324028B TWI324028B (en) 2010-04-21

Family

ID=36634651

Family Applications (1)

Application Number Title Priority Date Filing Date
TW094124501A TWI324028B (en) 2004-11-30 2005-07-20 Method for manufacturing rigid-flex printed wiring board

Country Status (4)

Country Link
JP (1) JP2006156760A (en)
KR (3) KR20060060540A (en)
CN (1) CN100521881C (en)
TW (1) TWI324028B (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101090450B1 (en) * 2009-05-13 2011-12-06 스템코 주식회사 Method of fabricating of flexible circuit board for inkjet cartridge, flexible circuit board for inkjet cartridge of thereby and method for fabricating of inkjet cartridge
JP2011119616A (en) * 2009-12-07 2011-06-16 Fujitsu Ltd Method for manufacturing printed wiring board, printed wiring board, and electronic device
CN102209442B (en) * 2010-11-16 2012-11-14 博罗县精汇电子科技有限公司 Technology of producing soft-hard combination multilayer circuit board with copper foil covering method
CN105892717A (en) * 2014-11-27 2016-08-24 崔伟 Finger fastener
CN105101625A (en) * 2015-09-02 2015-11-25 竞陆电子(昆山)有限公司 Uniform board edge gumming structure for PCB (Printed Circuit Board) inner-layer boards
CN105208773B (en) * 2015-09-10 2018-03-06 深圳崇达多层线路板有限公司 A kind of preparation method of rigid-flex combined board

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH06244561A (en) * 1993-02-19 1994-09-02 Toshiba Chem Corp Flex/rigid compound wiring board
JPH11261220A (en) * 1998-03-13 1999-09-24 Hitachi Chem Co Ltd Manufacture of multilayered printed wiring board
JP2002057457A (en) * 2000-08-11 2002-02-22 Toshiba Chem Corp Manufacturing method of multilayered printed-wiring board
JP2002124762A (en) * 2000-10-16 2002-04-26 Toshiba Chem Corp Production method for multilayered printed wiring board

Also Published As

Publication number Publication date
KR20080081142A (en) 2008-09-08
KR20060060540A (en) 2006-06-05
CN1784125A (en) 2006-06-07
KR100872524B1 (en) 2008-12-08
TWI324028B (en) 2010-04-21
CN100521881C (en) 2009-07-29
JP2006156760A (en) 2006-06-15
KR20070093938A (en) 2007-09-19

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees