TWI324028B - Method for manufacturing rigid-flex printed wiring board - Google Patents

Description

Nine, the invention description: [Technical leadership of the sun and the moon] The field of invention is related to the manufacture of rigid flexible printed wiring boards, and the more A method for producing a rigid and flexible printed wiring board in which the adhesive layer is sandwiched between the outer layer FPC and the adhesive layer exhibits excellent adhesion strength. BACKGROUND OF THE INVENTION First, a rigid-flexible (R_f) 3-layer printed wiring board having a rough surface view is shown in FIGS. 7A to 7D and 8A and 8B, and a general sealing forming procedure is described. . However, the procedures (1) to (8) shown below are general-purposes. Even if the program is somewhat reversed, it does not limit the content. (1) The inner layer CCL110 (Fig. 7A) of the conductive member 112 is provided on one surface of the electrically insulating flexible substrate lu to process the conductive member 112 to form the circuit i12'. Thereby, the inner layer CCL 110 provided with the circuit 112 is obtained (Fig. 7B). Here, CCL refers to a copper-clad laminate (Copper-Clad Laminate). (2) A circuit 112 is provided on the inner layer CCL110', and a cover film (hereinafter also referred to as CL) is bonded on the surface (the CL is bonded to the CCL forming the circuit by hot pressing) to obtain an inner layer FPC (hereinafter also referred to as an inner layer). Substrate) (Fig. 7C). Here, the cover film 120 is one in which the adhesive layer 122 is provided on one surface of the electrically insulating flexible substrate 121. Here, FPC refers to a flexible printed circuit (Flexible Printed Circuit). (3) The joint member 140 is bonded to the rigid base material 1 51 of the outer layer RPC (hereinafter also referred to as the outer layer substrate) 150 (Fig. 8B). Here, the outer substrate 150 is provided with a conductive member 152 on one surface of the electrically insulating rigid substrate 151 (Fig. 8A). The other 'RPC' refers to a rigid wiring board (Rigid Printed Circuit). (4) The outer layer substrates 150A and 150B are laminated on the lower surface of the inner substrate 130 by the bonding members and i4〇B (hereinafter also referred to as laminate hardening p), thereby obtaining two RPC-containing outer substrate 15 by the bonding member 140.结构The structure of the inner substrate 130 including the Fpc is sandwiched (Fig. 7D). (5) Opening the substrate (hereinafter also referred to as NC drilling process, not shown). The outer substrate 150A, 150B is sandwiched. The structure of the inner substrate 13A is subjected to a mechanical processing for opening the holes for interlayer conduction. (6) A plated through hole (not shown) is formed, and an electric clock is applied to the inner side of the hole for conducting the interlayer. A through hole is formed, whereby the inner layer of the inner plate 130 and the outer substrate 150A, 150B can be turned on. (7) The outermost circuit (not shown) is formed. For example, in the structure & The conductive member 152A of the outer layer of the layer substrate 150A is subjected to a remnant process to open a circuit. (8) A resist (not shown) is formed on the outer substrate 150A, 150B. The protection is formed by the above (7). The outermost layer circuit is provided with an insulating layer made of a resist to cover the outer substrate 150A, The outermost surface of 150B, that is, the surface of the outermost circuit. In the general printed wiring board (Fig. 9) made by the above steps, a plurality of members made of different materials are used to make the combinations or layers. Therefore, when the adhesion between the specific members is low, there is an environmental test or a time change due to thermal cycling, etc., and finally a peeling occurs between the specific members 1324028. For example, When the copper ruthenium and the polyimine (peg) are peeled off, the insulation is poor, and it is not easy to use as a printed wiring board. Therefore, in the multilayer printed wiring board, it is required to bond the members with an appropriate adhesive force. 5 In the conventional method, for example, when the inner substrate 130 and the outer substrate 150B are bonded together, the adhesion strength of the bonding member 14B corresponding to the bonding portion is weak. At this time, as shown in FIG. As shown, it is easy to cause peeling between the inner substrate 130 and the outer substrate 150B. In the step after the bonding step, there is a possibility that the drug is infiltrated during etching or development, and the yield is greatly lowered. Out The reliability of the printed wiring board (hereinafter also referred to as the completed substrate) is reduced. The method for solving the above problems is (a) after the polyimine is subjected to discharge treatment, and the treatment is performed to improve the surface. (Japanese Patent Laid-Open Publication No. Hei 5-279497), (b) a method of modifying a polyimine surface with an alkaline agent 15 after low-temperature plasma treatment (Japanese Patent Laid-Open Publication No. Hei 6-32) No. 926), (c) a method of treating a polyimine film with an alkaline solution, and treating it with an acidic solution (Japanese Patent Laid-Open Publication No. Hei 7-03055), (d) on the surface of the polyimide film After the plasma treatment in an inert gas atmosphere, the plasma treatment is performed on the same side (Japanese Patent Laid-Open Publication No. Hei 8-20 3338)' (e) in the presence of the first oxidant, irradiated with ultraviolet rays. After the surface of the yttrium imide resin is etched by the second oxidizing agent, the surface is modified (Japanese Patent Laid-Open Publication No. Hei 9-157417). Further, the polyimine of each document corresponds to the electrically insulating flexible substrate 11 constituting the inner substrate 130. 7 1324028 The above-mentioned conventional documents (a) to (e) are only described as improving the adhesion, and the so-called alkali is performed. The surface treatment of the treatment or the plasma treatment does not clearly disclose the detailed treatment conditions such as "agent concentration", "treatment temperature", and "treatment time". That is, there is no record of the surface treatment for most appropriate processing conditions. (1) A multilayer wiring board suitable for a flip chip package which is resistant to thermal shock and a method for producing the same, and an appropriate range of the elastic modulus or coefficient of linear expansion of the adhesive layer and the material of the adhesive are disclosed (Japanese Patent Laid-Open Publication No. 9-- (No. 29, 8369) 10 (g) A multilayer printed wiring board in which the through-hole is not easily peeled off from the conductor circuit of the lower layer, and the appropriate range is disclosed for the particle diameter or weight distribution of the epoxy resin as the adhesive layer (Japanese Patent Laid-Open Publication) (1) A multilayer printed wiring board having excellent bonding strength between a conductor layer and an insulating layer, and only a method of performing a roughening treatment is disclosed (Japanese Patent Laid-Open Publication No. Hei 10-70367) (1) A binder for a flexible printed wiring board is disclosed as a material for a binder (Japanese Patent Laid-Open Publication No. 2001-164226). The above-mentioned conventional documents (f) to (i) do not describe the type or formulation of the adhesive in the adhesive used in the printed wiring board of the prior art, and perform the surface treatment of 20, but have not found the most appropriate condition. The improvement of the adhesion. In recent years, in the field of the technical field of printed wiring boards, the invention has been gradually progressed to a multilayer, and development of a multilayer substrate exceeding 50 layers has been carried out. In particular, with the lightness and thinness of electronic equipment, it is required to connect a rigid wiring board by a flexible printed wiring board or a rigid-flexible printing formed by partially or completely overlapping one of the flexible wiring boards with a rigid 8-wire board. Wiring board. Therefore, in the case of a multi-layered printed wiring board, the treatment of the surface of the component to which the dispensing agent is disposed is expected to be established. SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and an object thereof is to provide a structure having a structure in which an inner layer substrate and an outer layer substrate are laminated by an adhesive member, and it is possible to suppress generation between an adhesive member and an inner layer substrate. A method of manufacturing a rigid-flexible printed wiring board. A method of manufacturing a rigid-flexible printed wiring board according to a first aspect of the present invention is characterized in that the rigid-flexible printed wiring board has an inner layer of a copper-clad laminate laminated film and an outer layer of a flexible member. The flexible wiring board and the outer layer rigid wiring board and the bonding member which are formed of a non-flexible member, the manufacturing method of the rigid-flexible printed wiring board has a step α and a step 厶: the inner layer is scratched The above-mentioned two outer surfaces of the flexible wiring board are subjected to an inspective treatment; and the step/3 is performed by laminating the outer layer rigid wiring boards by the bonding members, respectively, on the outer surfaces of the inner layer winding wiring sheets subjected to the above-mentioned inspective treatment. According to a second aspect of the present invention, in a method of manufacturing a rigid-twisted printed wiring board, in the above-described red state, there is a step & 于 between the step kicking α and the step, and the step/system makes the money, The two outer surfaces of the inner flexible wiring board subjected to the aforementioned secret treatment are subjected to water washing treatment. A method for manufacturing a rigid-twisted printed wiring board according to a third aspect of the present invention is characterized in that, in the first aspect, the inspection process of the step kick α is 0 13240 28 % or more and less than 10 wt. %. According to a fourth aspect of the present invention, in the first aspect, the alkaline treatment time of the step α is 30 seconds or more and 120 seconds or shorter. 5

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In the first aspect of the invention, in the first aspect, the alkaline treatment liquid temperature in the step (α) is 25 ° C or more and lower than 55 ° C. A method of producing a rigid-flexible printed wiring board according to a sixth aspect of the present invention is characterized in that in the second aspect, the calcium concentration in the step 7 is 20 ppm or more. The manufacturing method of the rigid-flexible printed wiring board of the present invention firstly performs the physical inspection of the outer surfaces of the inner layer FPC (for example, the poly layer) by the outer surface of the inner layer FPC (the inner layer substrate) in the step α. The surface layer of the quinone imine is modified. Next, in the step, the outer layers of the inner layer FPC which have been modified by the alkaline treatment are laminated with the outer layer RPC by the bonding members to join the non-flexible members (e.g., epoxy glass). As a result, the bonding member has an excellent adhesion to both outer surfaces of the modified inner layer FPC (inner substrate). In other words, since the manufacturing method of the present invention performs the alkaline treatment only on the flexible inner layer FPC, the bonding member can greatly improve the adhesion between the inner layer FPC and the outer layer RPC, thereby contributing to providing excellent reliability and stability. A method of manufacturing a rigid-flexible printed wiring board with an adhesive force. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1A to Fig. 1D are schematic cross-sectional views showing an example of a method of manufacturing a rigid-flexible printed wiring board of the present invention. Fig. 2A and Fig. 2B are schematic cross-sectional views showing an example of a manufacturing method for the outer layer RPC of the printed wiring 10 1324028 for the first to eighth drawings. Fig. 3 is a graph showing the peel strength of the sample A. Fig. 4 is a graph showing the peel strength of the sample B. Fig. 5 is a graph showing the peel strength of the sample C. 5 Fig. 6 is a graph showing the peel strength of the sample D. 7A to 7D are schematic cross-sectional views showing an example of a method of manufacturing a rigid-flexible printed wiring board. 8A and 8B are schematic cross-sectional views showing an example of a manufacturing method for the outer layer RP C of the 7th to 7th drawings. 10 Fig. 9 is a schematic cross-sectional view showing a conventional method of manufacturing a rigid-flexible printed wiring board. Fig. 10 is a schematic cross-sectional view showing a state in which peeling occurs between the inner layer FPC constituting the printed wiring board and the bonding member. C. Embodiment 3 15 DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment of a rigid-flexible printed wiring board according to the present invention will be described with reference to the drawings. 1A to 1D are schematic cross-sectional views showing an example of a method for producing a rigid-flexible printed wiring board according to the present invention, and the components are appropriately emphasized, and the components are appropriately emphasized. Further, Fig. 2A and Fig. 2B are schematic cross-sectional views showing an example of a method of manufacturing the outer layer RPC of the printed wiring board of Figs. 1A to 1D. As shown in Fig. 1D, the rigid-flexible printed wiring board to which the manufacturing method of the present invention is applied has at least the inner layer FCL30 and the outer layer CCL10' laminated cover film 20, and 11 1324028 The outer layers RPC 50A, 50B and the bonding layer 40 are composed of epoxy glass. Further, CCL, FPC, and RP C are abbreviations of a copper-clad laminate, a flexible printed wiring (F1 exible printed circuit), and a rigid printed wiring (Rigid Printed Circuit) 5, respectively. Here, the rigid-flexible printed wiring board is described by taking a three-layer printed wiring board as an example. The manufacturing method will be described in detail as long as the effects and effects of the alkaline treatment of the present invention are not impaired, and (1) below is shown. (8) The procedure can be reversed without rumors. Φ (1) The circuit 12' is formed in the inner layer CCL10. The copper foil 12 (FIG. 1A) provided on one surface of the flexible substrate 11 made of polyimide polyimide is used as an inner layer (: (:: 10), and the copper foil 12 is subjected to a process to form a circuit 12 The inner layer CCL10' (Fig. 1B) provided with the circuit is obtained. (2) The circuit 12 is provided on the inner layer CCL10, and the cover film 2 is adhered on the surface (the CL is bonded to the CCL forming the circuit by hot pressing) Here, as the cover film 20, the adhesive layer 22 is provided on one surface of the flexible substrate 21 made of polyfluorene 15 amine, and the inner substrate 10' and the cover film 2 are bonded by the adhesive layer 22. In this way, the inner layer FPC (hereinafter also referred to as the inner layer substrate) 3 is obtained (first (: figure). (3) The outer surfaces of the inner layer substrate 30 are subjected to an annulous treatment (hereinafter referred to as step α). In the device for managing the line speed, the two outer layers of the inner layer Fpc3〇2〇 are treated with a certain alkaline aqueous solution and sprayed onto the substrate by rain, thereby performing the inner layer FPC 30. The alkaline treatment is performed, whereby the inner layer substrate 30 which is subjected to the alkaline treatment is obtained. (4) Separate from the inner substrate 30 and additionally prepared Rpc (hereinafter also referred to as outer layer substrate) 50 is bonded to an adhesive member 4A made of an adhesive sheet. It is used in 12 1324028, which is provided with a copper foil 52 on one side of a rigid substrate 51 made of epoxy glass (Fig. 2A). The outer substrate 5' is obtained by bonding the adhesive member 4A (Fig. 2B) to the rigid substrate 51 of the outer substrate 50. (5) The inner substrate 3 which has been subjected to alkaline treatment in the above (3) The outer surfaces of the above-mentioned (4) outer layer substrates (hereinafter referred to as step /3 (layer hardening)) are laminated on the outer surfaces 5 by the adhesive members 40. The preparation is as shown in Fig. 2B, and the joint members 4 are respectively attached. Two outer layers 5A and 50B of A and 40B. When laminated, the adhesive members 40A and 40B which are laminated on the both surfaces of the inner layer substrate 30 and joined to the two outer substrates 5A and 50B are bonded to each other (Fig. 1D). When this lamination is performed, 10 may be appropriately pressed or heated from the outer side of the outer layer substrates 5A, 50B to the inner side. By the above steps (1) to (5), the article shown in the id chart can be produced. Rigid-flexible 3-layer printed wiring board. In addition, although not shown in the figure, it can be applied to the 3-layer printed wiring board of the id diagram. The following steps (6) to (9) are performed locally. 15 (6) Opening the substrate (hereinafter also referred to as NC drilling processing, not shown). The inner substrate 30 is sandwiched between the outer substrates 50A and 50B. The structure is provided with a mechanical processing (not shown) for opening the holes between the layers. (7) Forming a plated through hole, and performing an electric clock treatment on the inner side of the hole for conducting the layers to form a pass Therefore, the inner layer and the outer layer can be electrically connected (not shown in Fig. 20). (8) The outermost circuit is formed (not shown in the figure, the copper foil 52A constituting the outer layer of the outer substrate 50A is engraved. Processed to form a circuit. (9) An anti-money agent (not shown) is formed on the outer substrate 50A, 50B. To protect 13 丄 to 4028

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20 The outermost circuit formed by the above (7) is provided with an insulating layer made of a resist to cover the outermost surface of the outer substrate, that is, the surface of the outermost circuit. The manufacturing method of the rigid-flexible printed wiring board of the present invention has at least the steps "and the steps" in the above steps (1) to (9). By the step α and the step cooling, the adhesive layer is modified. The outer layer of the inner layer FPC can have excellent adhesion. Therefore, since the manufacturing method of the present invention can improve the adhesion between the inner layer FP C and the outer layer RPd, it is possible to manufacture a rigid flexible printing which is excellent in reliability and has a stable adhesive force. The effect of the adhesion force obtained by the inspection process of the wiring board β by the step α can be improved if the alkalinity is specified. For example, the test treatment indifference ~ t%) is known: the good range is 0 25 or more and lower 〇〇 〇〇 , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , It is 25 or more and less than ", more preferably 0.25 or more, and 4" or less. - In addition, in addition to the step r, the (4) / the above step α and the step point have more y-type use of calcium-added water, The above-mentioned alkaline treatment of the intrinsic treatment / face into the financial processing processor. _ plus 7, can be expanded Test: The condition of Silk®. This is to improve the degree of freedom of the drug in mass production or to ease the control of the program, and to build an inexpensive and stable manufacturing line. If the concentration is specified, the concentration can be further increased. The preferred range of the calcium concentration (ppm) is 2 Å or more, preferably 25 Å or more. In addition, step α (initial treatment) and step r (washing with water of butterfly water) It is preferable to use a water washing treatment such as r〇14 water or ion-recording water between the steps or steps and the step W hardening. The agent used in the inspection process is lifted in the embodiment to be described later.

The water is ♦ liquid, but the variety and composition are not particularly limited. Further, in the embodiment described later, an example in which a vaporized aqueous solution is used is used, but the product: 5 is not particularly limited. In the following, the conditions of the treatment of the test 11 and the addition of the water are carried out from the viewpoint of performing the alkaline treatment by the inner layer substrate and modifying the surface of the inner layer substrate to improve the adhesion between the inner layer substrate and the adhesive layer. The results of the concentration evaluation are described in detail. (First Embodiment) In this example, the amount of the alkaline treatment was changed in the range of 〇丨~1〇〇wt% using a sodium hydroxide aqueous solution (NaOH (aq)) in the chemical treatment used in the alkaline treatment. By the above steps (1) to (5), a rigid-flexible three-layer printed wiring board having the structure 15 shown in Fig. 1) is produced. At this time, the production conditions other than the concentration of the test treatment are the same. The production conditions are summarized in Table 1. In addition, the printed wiring board produced in this example is called sample A. Table 1 ♦ Composition of printed wiring board [Inner layer CCL] Two-sided copper foil 18ym, polynitrene 25ym, adhesive 1〇〆 [cover film (CL)] Polyimine 25 // m, adhesive 25 # m [Outer layer RPC] - Foil copper foil 18ym, Epoxy glass lOOym [Adhesive sheet] 25 'Processing conditions of sample A [絵性处理] Concentration: 0.1~10.0 [wt%] 'Liquid temperature: 35[°c] , time: 6 〇 [seconds] [RO water wash] liquid temperature · room temperature, time: 3 〇 [seconds] [force σ mom water wash] concentration: 5 〇〇 [ppm], liquid temperature: room temperature, time :45 [sec] [RO water washing] Liquid temperature: room temperature, time: 3 sec. 1_ 15 1324028 The sample A prepared by changing the concentration of the alkaline treatment was subjected to a peel strength test based on JIS c 6 471. . At this time, the technical stretching speed was 5 〇mm/min, and the temperature was normal temperature (room temperature). Then, the peel strength (N/cm) was calculated in accordance with JIS C 5016 8.1.6. 5 Fig. 3 shows the peeling strength of sample A prepared by changing the concentration of the anatizing treatment. However, the results of the samples which were not subjected to the alkaline treatment for comparison (expressed as no treatment) are also disclosed in Fig. 3. Further, the peel strength is not particularly limited to the average value of the values obtained by 10 samples. 9 The following points can be understood from Figure 3. 10 (la) Since the concentration (wt%) of the test treatment is less than 0.1, the peel strength is low, so it is considered that the test treatment is insufficient. (lb) Conversely, when the concentration (wt%) of the alkaline treatment is higher than that of ι〇·〇, the peel strength is still low, and it is considered to be excessively alkaline. (lc) It is suggested that when the concentration (wt%) of the alkaline treatment is in the range of 0 25 or more and less than 1 〇 15 0, the alkaline treatment is performed to obtain an improvement in the peel strength. In particular, when the concentration of the test treatment is in the range of 〇 25 or more and 4 〇 or less, it is preferable to obtain a peel strength of about 3 times or more stably without the treatment. Therefore, it is known that the printed wiring board has a more stable peel strength, and the concentration of the alkaline treatment needs to be in an appropriate range. 2〇 (Second Embodiment) In this example, 'the agent used in the alkaline treatment uses an aqueous solution of sodium hydroxide (NaOH (aq))' to change the time of alkaline treatment in the range of 1 〇 to 6 〇〇 seconds. By the above steps (1) to (5), a rigid-flexible three-layer printed wiring board having the structure shown in Fig. 1 is produced. At this time, the other conditions except the alkaline treatment were the same as those of 16 1324028. The production conditions are summarized in Table 2. The printed wiring board produced in this example is referred to as sample B. __Table 2 ♦Composition of printed wiring board -- [Inner layer CCL] Two-sided copper foil 18/zm, Polyimide 25//111, bonded, 1〇#m [Cover film (CL)] Polyimine 25 / / m, adhesive 25 / / m [outer RPC] - copper foil 18 / / m, epoxy glass 1 〇〇 [adhesive sheet] 25 # m _ ♦ sample B treatment conditions ~ ^- [alkali Sexual treatment] concentration: 1.0 [wt%], liquid temperature: 31 2 3 [〇c], time: 1 〇 ~ 6 〇〇 [seconds] [RO water wash] liquid temperature: room temperature, time: 3 〇 [seconds ], [加妈水洗洗] Concentration: 500 [ppm], liquid temperature: room temperature, time: 45 [seconds] 17 1 [RO water wash] liquid temperature: room temperature, time: 3〇丨耖1 2 change The sample B prepared by the alkaline treatment was subjected to the same peel strength test as in the third example, and the peel strength (N/cm) was calculated. Fig. 4 shows the residual strength of the sample B prepared by changing the time of the alkaline treatment. However, the results of the samples which were not subjected to the alkaline treatment (expressed as untreated) were also disclosed in Fig. 4. Further, the peel strength was not particularly limited and was an average value of the values obtained by 10 samples. • 10 The following points can be understood from Figure 4. (2a) Since the peeling is low when the time (seconds) of the alkaline treatment is less than 3 Å, it is considered that the testability is insufficient. (2b) Conversely, when the time (seconds) of the alkaline treatment is higher than 12 Å, the peel strength is still low, and it is considered to be excessively alkaline. 15 (2c) When the time (seconds) of alkaline treatment is 30 or more, and the dry circumference of 12 〇 or less + ~ 卜, the peel strength of about 8 times or more is stably obtained without treatment, so it is known that Printed wiring boards have a more stable peeling strength. The time required for alkaline treatment is within an appropriate range. 1324028 (Third embodiment) In this example, the temperature used for the alkaline treatment (liquid temperature) was 15 to 55 using a sodium hydroxide aqueous solution (NaOH (aq)). The range of 〇 varies, and by the above steps (1) to (5), a rigid-flexible three-layer printed wiring board having the structure shown in Fig. iD is formed. At this time, the production conditions other than the temperature (liquid temperature) of the qualitative treatment were the same. The production conditions are summarized and shown in Table 3. The printed wiring board produced in this example is called a sample ^. Table 3, ♦ Composition of printed wiring board [Inner layer CCL] Two-sided copper foil 18//m 'Polyimide 25#m, adhesive 10; im [Cover film (CL)] Polyimine 25 m, bonded Agent 25 ym [outer layer RPC] - copper foil 18 / / m 'epoxy glass iQOym [adhesive sheet] 25m ♦ sample C treatment conditions ' -- [alkaline treatment] concentration: l. 〇 [wt%], Liquid temperature: 15~55[t], time: 60[seconds] [RO water washing] liquid temperature: room temperature 'time: 30 [seconds] [calcium water washing] concentration: 500 [ppm], liquid temperature·· Room temperature, time: 45 [sec] [RO water washing] Liquid temperature: room temperature, time: 30 [sec] The sample c prepared by changing the temperature (liquid temperature) of the alkaline treatment was carried out with the first implementation of the call 10 In the same peel strength test, the peel strength (N/cm) was calculated. Fig. 5 shows the strength of the sample C prepared by changing the temperature (liquid temperature) of the alkaline treatment. However, the results of the samples which were not subjected to the alkali treatment (compared as no treatment) were also disclosed in Fig. 5. Further, the peel strength is not particularly limited to the average value of the values obtained by 10 samples. 15 The following points can be understood from Figure 5. (3a) Since the peeling strength is low when the temperature (liquid temperature) of the test treatment is lower than 25, it is considered that the alkaline treatment is insufficient. (3b) Conversely, when the temperature of the alkaline treatment (liquid temperature) is higher than 55. At the same time, the peel strength of the sample is still low as in the case of 18 1324028, so it is regarded as excessive treatment. (3c) When the temperature of the alkaline treatment (liquid temperature) is in the range of 25 or more and 55 or less, it is preferable that the peeling strength of about 8 times or more is stably obtained without treatment. Therefore, it can be seen that in order to provide a more stable peeling strength of the printed wiring board, it is necessary to set the temperature (liquid temperature) of the inspection process to an appropriate range. (Fourth embodiment)

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In this example, after the alkaline treatment (step α), the calcium concentration of the step 7 in which the outer surface of the alkali-treated inner layer FPC is subjected to a water washing treatment is changed in the range of 〇~lOOppm using calcium-added water. By the above steps (1) to (5), a rigid-flexible three-layer printed wiring board having the structure shown in Fig. 1D is formed. At this time, the agent used in the alkaline treatment uses an aqueous sodium hydroxide solution (N aOH (aq)), and the temperature of the alkaline treatment is changed (the liquid temperature is changed in the range of the ^^ point. Other points are not changed, except for the alkali The production conditions other than the concentration of the treatment and the calcium concentration of the calcium-added water are the same. The production conditions are shown in Table 4. In addition, the printed wiring board produced in this example is referred to as sample d. Table 4 ♦ Printed wiring board The constituent material ' '~~~' [inner layer CCL] two-sided copper foil 18; zm, polyimine 25 from m, binder i〇ym [cover film (CL)] polyimine 25 / m, bonding Agent 25 // m [outer layer RPC] - copper foil 18ym, epoxy glass lOOyrn [bonding sheet] 25//m ♦ sample D treatment conditions [inspective treatment] concentration: ο·ι~i〇.〇[ Wt%], liquid temperature: 35pc], time: 6〇 [seconds] [RO water wash] liquid temperature: room temperature, time: 30 [seconds] [force πί bow water wash] concentration: 〇~l〇〇〇[ Ppm], liquid temperature: room temperature [RO water washing] liquid temperature: room temperature, time: 3 〇丨 seconds 1 time: 45 [seconds] 19 1324028 Adding water calcium concentration to change the concentration of alkaline treatment and calcium concentration The prepared S material D is carried out together with the first embodiment The same peel strength test was used to calculate the strength (N/cm). Fig. 6 is a graph showing the intensity of the sample D prepared by changing the concentration of the alkaline treatment and the calcium concentration of the calcium added to the calcium concentration. Figure 6 also shows the results of the samples that were not subjected to the experimental treatment (expressed as no treatment). In addition, the peel strength is not particularly limited, and is the average value of the values obtained from one sample. The following points can be understood from Fig. 6. ίο (4 a) Tian Wei ~ 仃 When using 35 water washing treatment (note the word concentration is 条PPm bar), only in the concentration of the test treatment (Wt% The narrowness of L0 or more and less than 4.0 shows that the peel strength tends to increase, and the peel strength of about 8 times or more less than the treatment is obtained. Relative to the area of '0.5 wt% or less or 4.0 wt% The peeling strength of the above area is almost the same as the result of the non-indicative treatment 15 (described as no treatment). (4b) When Tian Zhiji uses the washing treatment with calcium water (note that the concentration is about 2〇lOOppm bar chart) The concentration in the test treatment ~(9) is 〇μ~1〇 When the range is less than 0, the peel strength is increased. For example, the separation strength is about 8 times higher than that of no treatment, and the range of the concentration of the test treatment is greatly expanded to 0.25 to 2. 〇wt%. 4C) As a result of the concentration of the test treatment of 4.0% by weight, it can be seen that when the calcium/length is 20 ppm or more, the peel strength of about 3 times or more is stably obtained without treatment. Therefore, it is known that printing is performed. The wiring board has a more stable peel strength, and 20 1324028 is effective after the alkaline treatment, and the water washing treatment using the calcium-added water is performed. Further, it is understood that the water washing treatment using calcium-added water can achieve the effect of expanding the optimum range of the alkaline treatment. At this time, the calcium concentration (ppm) is preferably 20 or more, more preferably 250 ppm or more. According to the present invention, the inner layer substrate constituting the printed wiring board is subjected to alkaline treatment (step α), and the surface of the inner layer substrate is modified, and then the inner layer substrate and the outer layer substrate are laminated by the adhesive layer (step stone). A printed wiring board having excellent reliability and stable adhesion is produced. This manufacturing method is particularly effective for a printed wiring board in which a plurality of different materials are combined, that is, a rigid-flexible printed wiring board in which an inner layer substrate is a flexible wiring 10 board and an outer layer substrate is a rigid wiring board. Further, it is needless to say that the manufacturing method of the present invention is effective for a printed wiring board having various shapes such as a single-sided or double-sided single-layer type or a multi-layer type. The preferred embodiments of the present invention have been described above, and the present invention is not limited to the embodiments. Additions, omissions, substitutions, and other modifications can be made in the structure without departing from the scope of the invention. The invention is not limited by the foregoing description, but only by the scope of the appended claims. I. BRIEF DESCRIPTION OF THE DRAWINGS Fig. 1 to Fig. 1D are schematic cross-sectional views showing an example of a method of manufacturing the rigid-flexible printed wiring board 20 of the present invention. Figs. 2A and 2B are schematic cross-sectional views showing an example of a manufacturing method of the printed wiring board outer layer RPC for the first to eighth drawings. Fig. 3 is a graph showing the peel strength of the sample A. Fig. 4 is a graph showing the peel strength of the sample B. 21 1324028 Figure 5 is a graph showing the peel strength of sample c. Figure 6 is a graph showing the strength of the sample. 7A to 7D are a schematic view of an example of a method for producing a rigid-flexible printed wiring board. Figure 8A, Figure 8B system 翱_

颂, 颂 is not used in the manufacturing method of the outer layer RP C of the 7A to 7D drawings - an overview of the example. Fig. 9 is a cross-sectional view showing an example of a conventional method for manufacturing a flexible printed wiring board.

The first drawing shows a schematic plan view showing a state in which peeling is not caused between the inner layer FPC and the bonding member 10 constituting the printed wiring board. [Main component symbol says sun and moon] 10... inner layer CCL

10'···CCL with circuit 11.. Flexible substrate 12.. Copper foil 12' circuit 20.. Cover film 21. Flexible substrate 22.. Adhesive layer 30.. Inner layer FPC (inner substrate) 40..Adhesive member 40A...Adhesive member 40B...Adhesive member 50·.·Outer RPC (outer substrate) 50A...Outer RPC 50B...Outer RPC 51...Rigid substrate 51A...Rigid substrate 51B...Rigid substrate 52.. Copper foil 52A... Copper foil 52B··. Copper foil 110··. Inner layer CCL 110'...CCL with circuit 111.··Flexible substrate 112... Conductive member 112'... Circuit 120.. Cover film 121···Flexible substrate 122.. Adhesive layer 130···Inner layer FPC (inner substrate) 140A...Adhesive member 140B...Adhesive Member 150.. Outer layer RPC (outer substrate) 150A... Outer substrate 150B... Outer substrate 151.. Rigid substrate 152.. Conductive member 152A... Conductive member 22

Claims (1)

1324028 Application No. 94124501 Application for Patent Scope Revision 98.10 Dance p: X. Patent Application Range: 1. A method for manufacturing a rigid-flexible printed wiring board having a copper layer on the inner layer Manufacture of a rigid-flexible printed wiring board in which a cover film is laminated on a laminate, and an inner layer of a flexible wiring member and an outer layer of a flexible wiring board and an adhesive member are formed of a non-flexible member. The method has the following steps: Step a, performing alkaline treatment on the two outer surfaces of the inner flexible wiring board; and 10 15 The step β is performed on the outer surfaces of the inner flexible wiring boards subjected to the above-mentioned qualitative treatment, and the outer layer rigid wiring boards are respectively laminated by the bonding members, and the step γ and the step β are further step γ. In the step γ, the two outer surfaces of the inner flexible wiring board in the alkaline treatment are subjected to water washing treatment using calcium-added water. 2. The method of manufacturing a rigid-flexible printed wiring board according to the first aspect of the invention, wherein the alkali treatment concentration in the aforementioned step α is 0.25 wt% or more and less than 10 wt%. 3. The method of manufacturing a rigid-flexible printed wiring board according to the first aspect of the invention, wherein the alkaline treatment time in the aforementioned step α is 30 seconds to 20 seconds or less. 4. The method of producing a rigid-flexible printed wiring board according to the first aspect of the invention, wherein the alkaline treatment liquid temperature in the step (a) is 25 ° C or higher and lower than 55 ° C. 5. The method of manufacturing a rigid-flexible printed wiring board according to the first aspect of the invention, wherein the concentration of #5 in the aforementioned step γ is 20 ppm or more. twenty four