CN100521872C - 保持片状工件的方法和设备 - Google Patents
保持片状工件的方法和设备 Download PDFInfo
- Publication number
- CN100521872C CN100521872C CNB2005101156978A CN200510115697A CN100521872C CN 100521872 C CN100521872 C CN 100521872C CN B2005101156978 A CNB2005101156978 A CN B2005101156978A CN 200510115697 A CN200510115697 A CN 200510115697A CN 100521872 C CN100521872 C CN 100521872C
- Authority
- CN
- China
- Prior art keywords
- workpiece
- sheet
- workbench
- pressing component
- processing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000000034 method Methods 0.000 title claims abstract description 41
- 230000037303 wrinkles Effects 0.000 claims abstract description 20
- 238000012423 maintenance Methods 0.000 claims description 9
- 238000003754 machining Methods 0.000 abstract description 8
- 238000012545 processing Methods 0.000 description 44
- 230000035611 feeding Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 13
- 238000004804 winding Methods 0.000 description 12
- 238000012546 transfer Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 4
- 230000003287 optical effect Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000007665 sagging Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
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- 239000012530 fluid Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/083—Devices involving movement of the workpiece in at least one axial direction
- B23K26/0853—Devices involving movement of the workpiece in at least in two axial directions, e.g. in a plane
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/42—Printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Engineering (AREA)
- Plasma & Fusion (AREA)
- Laser Beam Processing (AREA)
- Details Of Cutting Devices (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Abstract
Description
Claims (5)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004326423A JP4388460B2 (ja) | 2004-11-10 | 2004-11-10 | シート状ワークの保持方法および保持装置 |
JP2004326423 | 2004-11-10 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1774156A CN1774156A (zh) | 2006-05-17 |
CN100521872C true CN100521872C (zh) | 2009-07-29 |
Family
ID=36315248
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005101156978A Expired - Fee Related CN100521872C (zh) | 2004-11-10 | 2005-11-09 | 保持片状工件的方法和设备 |
Country Status (6)
Country | Link |
---|---|
US (1) | US7718920B2 (zh) |
JP (1) | JP4388460B2 (zh) |
KR (1) | KR101209999B1 (zh) |
CN (1) | CN100521872C (zh) |
DE (1) | DE102005053990A1 (zh) |
TW (1) | TWI347869B (zh) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1923164A3 (en) * | 2006-11-14 | 2009-02-25 | S.M.R.E. Engineering di Mazzini S & C. S.n.c. | Apparatus for welding strips of multi-layered material to design |
CN101207973B (zh) * | 2006-12-20 | 2010-12-08 | 英华达股份有限公司 | 卷贴装置及方法 |
US20130305635A1 (en) * | 2008-05-06 | 2013-11-21 | James McCool | Stair tread overlay and manufacturing process |
JP4896274B2 (ja) * | 2010-06-14 | 2012-03-14 | 三菱電機株式会社 | レーザ加工装置、及びレーザ加工方法 |
JP5558282B2 (ja) * | 2010-09-14 | 2014-07-23 | 三菱電機株式会社 | 金属箔、金属箔の加工方法、および蓄電デバイス |
KR101432153B1 (ko) * | 2012-11-13 | 2014-08-22 | 삼성디스플레이 주식회사 | 광 투과 장치 및 이를 구비하는 어닐링 장치 |
KR102177244B1 (ko) | 2014-02-28 | 2020-11-10 | (주)테크윙 | 시트고정장치, 이를 포함하는 레이저 가공 장치 및 시트고정방법 |
EP3088095B1 (de) | 2015-04-29 | 2019-07-17 | TRUMPF Werkzeugmaschinen GmbH + Co. KG | Verfahren zum bearbeiten von plattenartigen werkstücken |
CN105704936B (zh) * | 2016-03-31 | 2019-10-29 | 广州炬森自动化设备有限公司 | 一种柔性线路板检修系统 |
CN106271134B (zh) * | 2016-09-25 | 2017-12-05 | 绍兴柯桥远达纺织有限公司 | 一种多方位固定激光钻孔用工件夹持机构 |
CN107363415A (zh) * | 2017-07-10 | 2017-11-21 | 梅塞尔切割焊接(中国)有限公司 | 激光切割机升降工作台 |
JP7041482B2 (ja) * | 2017-09-13 | 2022-03-24 | 株式会社オーク製作所 | 露光装置 |
JP6941022B2 (ja) * | 2017-10-06 | 2021-09-29 | 株式会社ディスコ | 拡張方法及び拡張装置 |
CN110320765B (zh) * | 2018-03-29 | 2023-05-16 | 株式会社Orc制作所 | 曝光装置 |
JP7037416B2 (ja) * | 2018-03-29 | 2022-03-16 | 株式会社オーク製作所 | 露光装置 |
CN108817715B (zh) * | 2018-09-10 | 2020-07-28 | 广东正业科技股份有限公司 | 一种真空吸附装置 |
JP7441076B2 (ja) * | 2020-03-03 | 2024-02-29 | 株式会社Screenホールディングス | 描画装置 |
CN112496084B (zh) * | 2020-11-25 | 2023-06-02 | 浙江泰湖科技有限公司 | 一种用于钣金加工激光切割机的钣金件压平装置 |
WO2022186975A1 (en) * | 2021-03-05 | 2022-09-09 | Electro Scientific Industries, Inc. | Laser-processing apparatus, methods of operating the same, and methods of processing workpieces using the same |
CN114012337A (zh) * | 2021-11-24 | 2022-02-08 | 镇江百永电气设备有限公司 | 一种铜软接焊接辅助工装 |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2332590A (en) * | 1942-05-25 | 1943-10-26 | Carnegie Illinois Steel Corp | Die for punch presses and the like |
US2854940A (en) * | 1955-08-16 | 1958-10-07 | Koehring Co | Diaphragm press |
US4639572A (en) * | 1985-11-25 | 1987-01-27 | Ibm Corporation | Laser cutting of composite materials |
JPH10249564A (ja) * | 1997-03-05 | 1998-09-22 | Japan Tobacco Inc | 帯状材の開孔装置 |
JP3662786B2 (ja) | 1999-09-30 | 2005-06-22 | 三菱電機株式会社 | レーザ加工装置 |
JP2002273631A (ja) | 2001-03-15 | 2002-09-25 | Matsushita Electric Ind Co Ltd | ワーク保持・位置決め方法及び装置 |
US20040040148A1 (en) * | 2002-08-29 | 2004-03-04 | Parlex Corporation | Manufacture of flexible printed circuit boards |
-
2004
- 2004-11-10 JP JP2004326423A patent/JP4388460B2/ja not_active Expired - Fee Related
-
2005
- 2005-11-01 TW TW094138239A patent/TWI347869B/zh active
- 2005-11-03 US US11/265,162 patent/US7718920B2/en not_active Expired - Fee Related
- 2005-11-09 CN CNB2005101156978A patent/CN100521872C/zh not_active Expired - Fee Related
- 2005-11-09 KR KR1020050106822A patent/KR101209999B1/ko not_active IP Right Cessation
- 2005-11-10 DE DE102005053990A patent/DE102005053990A1/de not_active Withdrawn
Also Published As
Publication number | Publication date |
---|---|
TW200628256A (en) | 2006-08-16 |
TWI347869B (en) | 2011-09-01 |
US20060096963A1 (en) | 2006-05-11 |
JP4388460B2 (ja) | 2009-12-24 |
JP2006136897A (ja) | 2006-06-01 |
CN1774156A (zh) | 2006-05-17 |
KR101209999B1 (ko) | 2012-12-07 |
US7718920B2 (en) | 2010-05-18 |
KR20060052543A (ko) | 2006-05-19 |
DE102005053990A1 (de) | 2006-07-13 |
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ASS | Succession or assignment of patent right |
Owner name: VIA MECHANICS LTD. Free format text: FORMER OWNER: HITACHI BIA MACINE CO., LTD. Effective date: 20140219 |
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TR01 | Transfer of patent right |
Effective date of registration: 20140219 Address after: Kanagawa Patentee after: Via Mechanics Ltd. Address before: Kanagawa Patentee before: Hitachi Bia Macine Co., Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090729 Termination date: 20171109 |
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