CN100513485C - 电极电路保护用硅橡胶组合物、电极电路保护材料和电气、电子零件 - Google Patents

电极电路保护用硅橡胶组合物、电极电路保护材料和电气、电子零件 Download PDF

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Publication number
CN100513485C
CN100513485C CNB2004100852991A CN200410085299A CN100513485C CN 100513485 C CN100513485 C CN 100513485C CN B2004100852991 A CNB2004100852991 A CN B2004100852991A CN 200410085299 A CN200410085299 A CN 200410085299A CN 100513485 C CN100513485 C CN 100513485C
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CN
China
Prior art keywords
silicone rubber
rubber composition
groups
electrode circuit
circuit protection
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004100852991A
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English (en)
Chinese (zh)
Other versions
CN1621448A (zh
Inventor
柏木努
盐原利夫
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Shin-Etsu Chemical Co Ltd
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Shin-Etsu Chemical Co Ltd
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Publication of CN1621448A publication Critical patent/CN1621448A/zh
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
    • B01J—CHEMICAL OR PHYSICAL PROCESSES, e.g. CATALYSIS OR COLLOID CHEMISTRY; THEIR RELEVANT APPARATUS
    • B01J23/00—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00
    • B01J23/38—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals
    • B01J23/40—Catalysts comprising metals or metal oxides or hydroxides, not provided for in group B01J21/00 of noble metals of the platinum group metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/06—Preparatory processes
    • C08G77/08—Preparatory processes characterised by the catalysts used
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D183/00—Coating compositions based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Coating compositions based on derivatives of such polymers
    • C09D183/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23F—NON-MECHANICAL REMOVAL OF METALLIC MATERIAL FROM SURFACE; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL; MULTI-STEP PROCESSES FOR SURFACE TREATMENT OF METALLIC MATERIAL INVOLVING AT LEAST ONE PROCESS PROVIDED FOR IN CLASS C23 AND AT LEAST ONE PROCESS COVERED BY SUBCLASS C21D OR C22F OR CLASS C25
    • C23F11/00—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent
    • C23F11/08—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids
    • C23F11/10—Inhibiting corrosion of metallic material by applying inhibitors to the surface in danger of corrosion or adding them to the corrosive agent in other liquids using organic inhibitors
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Polymers & Plastics (AREA)
  • Medicinal Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Paints Or Removers (AREA)
CNB2004100852991A 2003-10-14 2004-10-14 电极电路保护用硅橡胶组合物、电极电路保护材料和电气、电子零件 Expired - Fee Related CN100513485C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003354122 2003-10-14
JP2003354122A JP4645793B2 (ja) 2003-10-14 2003-10-14 電極回路保護用シリコーンゴム組成物、電極回路保護材及び電気・電子部品

Publications (2)

Publication Number Publication Date
CN1621448A CN1621448A (zh) 2005-06-01
CN100513485C true CN100513485C (zh) 2009-07-15

Family

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Family Applications (1)

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CNB2004100852991A Expired - Fee Related CN100513485C (zh) 2003-10-14 2004-10-14 电极电路保护用硅橡胶组合物、电极电路保护材料和电气、电子零件

Country Status (4)

Country Link
JP (1) JP4645793B2 (enExample)
KR (1) KR101092092B1 (enExample)
CN (1) CN100513485C (enExample)
TW (1) TW200513498A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106232747A (zh) * 2014-01-14 2016-12-14 罗伯特·博世有限公司 具有硅聚合物涂层的电路载体

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JP4647321B2 (ja) * 2005-01-31 2011-03-09 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP2006206816A (ja) * 2005-01-31 2006-08-10 Ge Toshiba Silicones Co Ltd 室温硬化性ポリオルガノシロキサン組成物
JP2006330277A (ja) * 2005-05-25 2006-12-07 Fuji Xerox Co Ltd 静電潜像現像剤用キャリア及びその製造方法、静電潜像現像剤、画像形成装置
JP2007161999A (ja) * 2005-11-17 2007-06-28 Shin Etsu Chem Co Ltd 圧縮永久歪特性に優れた硬化物を与えるｃｉｐｇ用付加硬化型シリコーン組成物及び該組成物の硬化物の圧縮永久歪低減方法
JP5015476B2 (ja) * 2006-03-01 2012-08-29 東レ・ダウコーニング株式会社 電極・電気回路の保護剤組成物
CN101939360B (zh) * 2008-02-07 2014-06-25 新日铁住金化学株式会社 有机硅树脂及其制造方法以及含有该有机硅树脂的固化型树脂组合物
WO2011132419A1 (ja) * 2010-04-22 2011-10-27 日本化薬株式会社 銀変色防止剤、銀変色防止樹脂組成物、銀変色防止方法、及びこれを使用した発光ダイオード
JP5676785B2 (ja) * 2012-02-10 2015-02-25 三菱樹脂株式会社 カバーレイフィルム、発光素子搭載用基板、及び光源装置
US20160230044A1 (en) * 2015-02-10 2016-08-11 International Business Machines Corporation Modified Conformal Coatings With Decreased Sulfur Solubility
JP6637674B2 (ja) * 2015-04-30 2020-01-29 信越化学工業株式会社 プリント配線板、プリント配線板の製造方法、及び半導体装置
CN105489418B (zh) * 2015-12-31 2017-09-01 宝鸡市晨光真空电器有限责任公司 用于户外高压真空断路器的固封式极柱模块的固封工艺
EP4186953A4 (en) * 2020-07-22 2024-08-14 Shin-Etsu Chemical Co., Ltd. ANTI-SULFURIZATION COATING MATERIAL, CURED PRODUCT THEREOF, AND ELECTRONIC DEVICE
JP2022034356A (ja) * 2020-08-18 2022-03-03 信越化学工業株式会社 ゼオライト含有シリコーンゴム組成物及びその製造方法
EP4271757A4 (en) * 2020-12-31 2024-10-09 Elkem Silicones Shanghai Co., Ltd. METHOD FOR POST-TREATING AN OBJECT MANUFACTURED BY ADDITIVE MANUFACTURING
AT525377B1 (de) * 2021-08-30 2025-02-15 Hraschan Jakob Überzug für Oberflächen von Gegenständen aus Holz

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EP0299641A2 (en) * 1987-07-17 1989-01-18 Dow Corning Corporation A curable composition
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
CN1255515A (zh) * 1998-12-03 2000-06-07 瓦克化学有限公司 用于制备电缆或型材的聚硅氧烷橡胶组合物
CN1282354A (zh) * 1997-09-16 2001-01-31 Ge拜尔硅股份有限公司 加成交联的硅橡胶混合物、其制备方法和其用途
CN1358800A (zh) * 2000-12-14 2002-07-17 瓦克化学有限公司 可固化的有机聚硅氧烷调制剂

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0299641A2 (en) * 1987-07-17 1989-01-18 Dow Corning Corporation A curable composition
US5276414A (en) * 1991-12-10 1994-01-04 Mitsubishi Denki Kabushiki Kaisha Moistureproof structure for module circuits
CN1282354A (zh) * 1997-09-16 2001-01-31 Ge拜尔硅股份有限公司 加成交联的硅橡胶混合物、其制备方法和其用途
CN1255515A (zh) * 1998-12-03 2000-06-07 瓦克化学有限公司 用于制备电缆或型材的聚硅氧烷橡胶组合物
CN1358800A (zh) * 2000-12-14 2002-07-17 瓦克化学有限公司 可固化的有机聚硅氧烷调制剂

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN106232747A (zh) * 2014-01-14 2016-12-14 罗伯特·博世有限公司 具有硅聚合物涂层的电路载体
CN106232747B (zh) * 2014-01-14 2019-01-15 罗伯特·博世有限公司 具有硅聚合物涂层的电路载体

Also Published As

Publication number Publication date
KR101092092B1 (ko) 2011-12-12
CN1621448A (zh) 2005-06-01
TW200513498A (en) 2005-04-16
JP4645793B2 (ja) 2011-03-09
KR20050036749A (ko) 2005-04-20
TWI335348B (enExample) 2011-01-01
JP2005120155A (ja) 2005-05-12

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Granted publication date: 20090715