CN100465233C - 可加成固化的有机聚硅氧烷树脂组合物和光学材料 - Google Patents

可加成固化的有机聚硅氧烷树脂组合物和光学材料 Download PDF

Info

Publication number
CN100465233C
CN100465233C CNB2004800358196A CN200480035819A CN100465233C CN 100465233 C CN100465233 C CN 100465233C CN B2004800358196 A CNB2004800358196 A CN B2004800358196A CN 200480035819 A CN200480035819 A CN 200480035819A CN 100465233 C CN100465233 C CN 100465233C
Authority
CN
China
Prior art keywords
alkenyl
phenyl
sio
weight
expression
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2004800358196A
Other languages
English (en)
Chinese (zh)
Other versions
CN1890324A (zh
Inventor
吉武诚
中西康二
中岛久隆
小林秀树
村上正志
竹内香须美
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
DuPont Toray Specialty Materials KK
Dow Silicones Corp
Original Assignee
Dow Corning Toray Co Ltd
Dow Corning Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd, Dow Corning Corp filed Critical Dow Corning Toray Co Ltd
Publication of CN1890324A publication Critical patent/CN1890324A/zh
Application granted granted Critical
Publication of CN100465233C publication Critical patent/CN100465233C/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
CNB2004800358196A 2003-12-02 2004-11-29 可加成固化的有机聚硅氧烷树脂组合物和光学材料 Expired - Fee Related CN100465233C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2003402810A JP2005162859A (ja) 2003-12-02 2003-12-02 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材
JP402810/2003 2003-12-02

Publications (2)

Publication Number Publication Date
CN1890324A CN1890324A (zh) 2007-01-03
CN100465233C true CN100465233C (zh) 2009-03-04

Family

ID=34650044

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800358196A Expired - Fee Related CN100465233C (zh) 2003-12-02 2004-11-29 可加成固化的有机聚硅氧烷树脂组合物和光学材料

Country Status (10)

Country Link
US (1) US7625986B2 (enExample)
EP (1) EP1699875B1 (enExample)
JP (1) JP2005162859A (enExample)
KR (1) KR101150744B1 (enExample)
CN (1) CN100465233C (enExample)
AT (1) ATE456624T1 (enExample)
DE (1) DE602004025379D1 (enExample)
MY (1) MY140964A (enExample)
TW (1) TWI366589B (enExample)
WO (1) WO2005054371A2 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103012456A (zh) * 2012-12-18 2013-04-03 烟台德邦先进硅材料有限公司 一种大功率led封装用有机硅低聚体的制备方法

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4800383B2 (ja) * 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
EP1987084B1 (en) * 2006-02-24 2014-11-05 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP4933179B2 (ja) 2006-07-14 2012-05-16 信越化学工業株式会社 硬化性シリコーンゴム組成物及びその硬化物
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5085089B2 (ja) * 2006-10-17 2012-11-28 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 シリコーンゴム組成物
DE102007055485A1 (de) * 2007-11-21 2009-06-04 Evonik Goldschmidt Gmbh Verfahren zur Herstellung verzweigter SiH-funktioneller Polysiloxane und deren Verwendung zur Herstellung SiC- und SiOC-verknüpfter, verzweigter organomodifizierter Polysiloxane
WO2011125753A1 (ja) 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
KR101274418B1 (ko) * 2010-06-24 2013-06-17 세키스이가가쿠 고교가부시키가이샤 광 반도체 장치용 밀봉제 및 이를 이용한 광 반도체 장치
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
US20140008697A1 (en) * 2010-12-08 2014-01-09 Brian R. Harkness Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants
JP2014506263A (ja) * 2010-12-08 2014-03-13 ダウ コーニング コーポレーション 封止材を作成するのに好適なシロキサン組成物
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
EP2784126B1 (en) 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
WO2013172921A1 (en) 2012-05-14 2013-11-21 Momentive Performance Materials Inc High refractive index material
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
WO2014021419A1 (ja) * 2012-08-03 2014-02-06 横浜ゴム株式会社 硬化性樹脂組成物
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
WO2015178475A1 (ja) * 2014-05-23 2015-11-26 株式会社ダイセル 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
DE102015225906A1 (de) * 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
WO2017143508A1 (en) * 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR102757326B1 (ko) 2018-06-12 2025-01-20 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4198131A (en) * 1978-03-23 1980-04-15 Dow Corning Corporation Silicone resin optical devices
US6313190B1 (en) * 1996-04-18 2001-11-06 Kettenbach Gmbh & Co. Kg Addition cross-linking, two-component silicone material with high shore hardness and high modulus of elasticity
US20010039323A1 (en) * 2000-04-06 2001-11-08 Wacker-Chemie Gmbh Addition-crosslinkable silicone compositions comprising low-molecular weight alkenyl-terminated polydiorganosiloxanes
US20020161140A1 (en) * 2001-03-06 2002-10-31 Shin-Etsu Chemical Co., Ltd. Addition curing type silicone resin composition

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3732330A (en) 1972-03-08 1973-05-08 Dow Corning Curable compositions containing hydrogen-functional organopolysiloxanes
US3944519A (en) 1975-03-13 1976-03-16 Dow Corning Corporation Curable organopolysiloxane compositions
US3948848A (en) 1975-08-04 1976-04-06 Dow Corning Corporation Low temperature solventless silicone resins
CA1133169A (en) 1978-06-05 1982-10-05 Dow Corning Corporation Curable solventless organopolysiloxane compositions
US4234713A (en) 1979-05-29 1980-11-18 Dow Corning Corporation Curable solventless organopolysiloxane compositions
JPH07292320A (ja) * 1994-04-22 1995-11-07 Shin Etsu Chem Co Ltd プライマー組成物及びシリコーン積層体
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3489639B2 (ja) * 1994-06-17 2004-01-26 信越化学工業株式会社 無溶剤型剥離性オルガノポリシロキサン組成物
JPH10158400A (ja) * 1996-11-27 1998-06-16 Shin Etsu Polymer Co Ltd 光学用レンズ
JP3344286B2 (ja) * 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4198131A (en) * 1978-03-23 1980-04-15 Dow Corning Corporation Silicone resin optical devices
US6313190B1 (en) * 1996-04-18 2001-11-06 Kettenbach Gmbh & Co. Kg Addition cross-linking, two-component silicone material with high shore hardness and high modulus of elasticity
US20010039323A1 (en) * 2000-04-06 2001-11-08 Wacker-Chemie Gmbh Addition-crosslinkable silicone compositions comprising low-molecular weight alkenyl-terminated polydiorganosiloxanes
US20020161140A1 (en) * 2001-03-06 2002-10-31 Shin-Etsu Chemical Co., Ltd. Addition curing type silicone resin composition

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103012456A (zh) * 2012-12-18 2013-04-03 烟台德邦先进硅材料有限公司 一种大功率led封装用有机硅低聚体的制备方法
CN103012456B (zh) * 2012-12-18 2015-11-18 烟台德邦先进硅材料有限公司 一种大功率led封装用有机硅低聚体的制备方法

Also Published As

Publication number Publication date
CN1890324A (zh) 2007-01-03
EP1699875B1 (en) 2010-01-27
JP2005162859A (ja) 2005-06-23
US7625986B2 (en) 2009-12-01
DE602004025379D1 (de) 2010-03-18
KR101150744B1 (ko) 2012-06-08
KR20060135684A (ko) 2006-12-29
EP1699875A2 (en) 2006-09-13
ATE456624T1 (de) 2010-02-15
WO2005054371A2 (en) 2005-06-16
WO2005054371A3 (en) 2005-08-11
TWI366589B (en) 2012-06-21
US20080033120A1 (en) 2008-02-07
TW200528518A (en) 2005-09-01
MY140964A (en) 2010-02-12

Similar Documents

Publication Publication Date Title
CN100465233C (zh) 可加成固化的有机聚硅氧烷树脂组合物和光学材料
CN100489563C (zh) 可加成固化的有机聚硅氧烷树脂组合物
EP2271714B1 (en) Curable organopolysiloxane composition and cured product thereof
JP5956697B1 (ja) 難燃性ポリオルガノシロキサン組成物、難燃性硬化物、光学用部材、光源用レンズまたはカバー、および成形方法
JP4648146B2 (ja) 耐クラック性に優れた付加硬化型シリコーン組成物
JPWO2008047892A1 (ja) 硬化性ポリオルガノシロキサン組成物
JP2008274270A (ja) 付加硬化型シリコーン樹脂組成物及びそれを使用するシリコーン製レンズ
JP2008214512A (ja) シリコーン樹脂組成物および半導体装置
JP6301469B2 (ja) 光学半導体用のシリコーン樹脂組成物
JP5413979B2 (ja) 画像用シリコーン樹脂レンズ及びその製造方法
TWI688588B (zh) 有機聚矽氧烷、其製造方法、及硬化性聚矽氧組合物
KR102561851B1 (ko) 유기폴리실록산, 이의 제조 방법, 및 경화성 실리콘 조성물
JP2010109034A (ja) 発光ダイオード素子用シリコーン樹脂組成物及び発光ダイオード素子
JP6998905B2 (ja) 付加硬化型シリコーン組成物、硬化物及び光半導体素子
WO2009131023A1 (en) Silicon-containing polymer, method of manufacturing thereof, and curable polymer composition
CN112011187A (zh) 加成固化型有机硅树脂组合物、该组合物的制备方法及光学半导体装置
JP5913537B2 (ja) 硬化性オルガノポリシロキサン組成物の製造方法
CN115315487A (zh) 固化性液态有机硅组合物、其固化物、包含该组合物的光学填充剂、以及包含由该固化物形成的层的显示装置

Legal Events

Date Code Title Description
C41 Transfer of patent application or patent right or utility model
TA01 Transfer of patent application right

Effective date of registration: 20061110

Address after: Tokyo, Japan

Applicant after: DOW CORNING TORAY Co.,Ltd.

Co-applicant after: Dow Corning Corporation

Address before: Tokyo, Japan

Applicant before: DOW CORNING TORAY Co.,Ltd.

C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: Tokyo, Japan

Co-patentee after: Dow organosilicon company

Patentee after: DOW CORNING TORAY Co.,Ltd.

Address before: Tokyo, Japan

Co-patentee before: Dow Corning Corporation

Patentee before: DOW CORNING TORAY Co.,Ltd.

CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20090304

Termination date: 20201129