MY140964A - Addition-curable organopolysiloxane resin composition and an optical material - Google Patents

Addition-curable organopolysiloxane resin composition and an optical material

Info

Publication number
MY140964A
MY140964A MYPI20044941A MYPI20044941A MY140964A MY 140964 A MY140964 A MY 140964A MY PI20044941 A MYPI20044941 A MY PI20044941A MY PI20044941 A MYPI20044941 A MY PI20044941A MY 140964 A MY140964 A MY 140964A
Authority
MY
Malaysia
Prior art keywords
addition
organopolysiloxane resin
optical material
resin composition
curable organopolysiloxane
Prior art date
Application number
MYPI20044941A
Other languages
English (en)
Inventor
Makoto Yoshitake
Koji Nakanishi
Hisataka Nakashima
Hideki Kobayashi
Masashi Murakami
Kasumi Takeuchi
Original Assignee
Dow Corning Toray Co Ltd
Dow Corning
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Co Ltd, Dow Corning filed Critical Dow Corning Toray Co Ltd
Publication of MY140964A publication Critical patent/MY140964A/en

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/12—Polysiloxanes containing silicon bound to hydrogen
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/045—Polysiloxanes containing less than 25 silicon atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2201/00—Properties
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
MYPI20044941A 2003-12-02 2004-11-30 Addition-curable organopolysiloxane resin composition and an optical material MY140964A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2003402810A JP2005162859A (ja) 2003-12-02 2003-12-02 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材

Publications (1)

Publication Number Publication Date
MY140964A true MY140964A (en) 2010-02-12

Family

ID=34650044

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20044941A MY140964A (en) 2003-12-02 2004-11-30 Addition-curable organopolysiloxane resin composition and an optical material

Country Status (10)

Country Link
US (1) US7625986B2 (enExample)
EP (1) EP1699875B1 (enExample)
JP (1) JP2005162859A (enExample)
KR (1) KR101150744B1 (enExample)
CN (1) CN100465233C (enExample)
AT (1) ATE456624T1 (enExample)
DE (1) DE602004025379D1 (enExample)
MY (1) MY140964A (enExample)
TW (1) TWI366589B (enExample)
WO (1) WO2005054371A2 (enExample)

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JP4800383B2 (ja) * 2005-05-26 2011-10-26 ダウ・コーニング・コーポレイション 小さい形状を成形するための方法およびシリコーン封止剤組成物
JP5392805B2 (ja) * 2005-06-28 2014-01-22 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン樹脂組成物および光学部材
EP1987084B1 (en) * 2006-02-24 2014-11-05 Dow Corning Corporation Light emitting device encapsulated with silicones and curable silicone compositions for preparing the silicones
JP4933179B2 (ja) 2006-07-14 2012-05-16 信越化学工業株式会社 硬化性シリコーンゴム組成物及びその硬化物
JP5148088B2 (ja) * 2006-08-25 2013-02-20 東レ・ダウコーニング株式会社 硬化性オルガノポリシロキサン組成物および半導体装置
JP5085089B2 (ja) * 2006-10-17 2012-11-28 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 シリコーンゴム組成物
DE102007055485A1 (de) * 2007-11-21 2009-06-04 Evonik Goldschmidt Gmbh Verfahren zur Herstellung verzweigter SiH-funktioneller Polysiloxane und deren Verwendung zur Herstellung SiC- und SiOC-verknüpfter, verzweigter organomodifizierter Polysiloxane
WO2011125753A1 (ja) 2010-04-02 2011-10-13 株式会社カネカ 硬化性樹脂組成物、硬化性樹脂組成物タブレット、成形体、半導体のパッケージ、半導体部品及び発光ダイオード
KR101274418B1 (ko) * 2010-06-24 2013-06-17 세키스이가가쿠 고교가부시키가이샤 광 반도체 장치용 밀봉제 및 이를 이용한 광 반도체 장치
JP2012097225A (ja) * 2010-11-04 2012-05-24 Daicel Corp 硬化性樹脂組成物及び硬化物
US20140008697A1 (en) * 2010-12-08 2014-01-09 Brian R. Harkness Siloxane Compositions Including Titanium Dioxide Nanoparticles Suitable For Forming Encapsulants
JP2014506263A (ja) * 2010-12-08 2014-03-13 ダウ コーニング コーポレーション 封止材を作成するのに好適なシロキサン組成物
JP5992666B2 (ja) * 2011-06-16 2016-09-14 東レ・ダウコーニング株式会社 架橋性シリコーン組成物及びその架橋物
EP2784126B1 (en) 2011-11-25 2019-03-13 LG Chem, Ltd. Curable composition
WO2013172921A1 (en) 2012-05-14 2013-11-21 Momentive Performance Materials Inc High refractive index material
JP6046395B2 (ja) * 2012-06-29 2016-12-14 東レ・ダウコーニング株式会社 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置
WO2014021419A1 (ja) * 2012-08-03 2014-02-06 横浜ゴム株式会社 硬化性樹脂組成物
JP6157085B2 (ja) 2012-10-24 2017-07-05 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6084808B2 (ja) 2012-10-24 2017-02-22 東レ・ダウコーニング株式会社 オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置
JP6081774B2 (ja) * 2012-10-30 2017-02-15 東レ・ダウコーニング株式会社 硬化性シリコーン組成物、その硬化物、および光半導体装置
CN103012456B (zh) * 2012-12-18 2015-11-18 烟台德邦先进硅材料有限公司 一种大功率led封装用有机硅低聚体的制备方法
US9470395B2 (en) 2013-03-15 2016-10-18 Abl Ip Holding Llc Optic for a light source
CN103232707B (zh) * 2013-04-19 2015-12-09 深圳新宙邦科技股份有限公司 可固化硅橡胶组合物及其固化产品与涂覆固化方法
CA2911523C (en) 2013-05-10 2018-10-02 Abl Ip Holding Llc Silicone optics
KR20150097947A (ko) * 2014-02-19 2015-08-27 다우 코닝 코포레이션 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물
WO2015178475A1 (ja) * 2014-05-23 2015-11-26 株式会社ダイセル 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置
CN105199397B (zh) * 2014-06-17 2018-05-08 广州慧谷化学有限公司 一种可固化的有机聚硅氧烷组合物及半导体器件
DE102015225906A1 (de) * 2015-12-18 2017-06-22 Wacker Chemie Ag Siloxanharzzusammensetzungen
WO2017143508A1 (en) * 2016-02-23 2017-08-31 Dow Corning Corporation Curable high hardness silicone composition and composite articles made thereof
KR102757326B1 (ko) 2018-06-12 2025-01-20 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재

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US3948848A (en) 1975-08-04 1976-04-06 Dow Corning Corporation Low temperature solventless silicone resins
US4198131A (en) * 1978-03-23 1980-04-15 Dow Corning Corporation Silicone resin optical devices
CA1133169A (en) 1978-06-05 1982-10-05 Dow Corning Corporation Curable solventless organopolysiloxane compositions
US4234713A (en) 1979-05-29 1980-11-18 Dow Corning Corporation Curable solventless organopolysiloxane compositions
JPH07292320A (ja) * 1994-04-22 1995-11-07 Shin Etsu Chem Co Ltd プライマー組成物及びシリコーン積層体
JPH0853622A (ja) * 1994-06-07 1996-02-27 Shin Etsu Chem Co Ltd シリコーンゲル組成物
JP3489639B2 (ja) * 1994-06-17 2004-01-26 信越化学工業株式会社 無溶剤型剥離性オルガノポリシロキサン組成物
AU5689796A (en) * 1996-04-18 1997-11-12 A. Kettenbach Fabrik Chemischer Erzeugnisse Dental-Spezialitaten GmbH und Co. KG Addition cross-linking, two-component silicone materials
JPH10158400A (ja) * 1996-11-27 1998-06-16 Shin Etsu Polymer Co Ltd 光学用レンズ
JP3344286B2 (ja) * 1997-06-12 2002-11-11 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物
DE10017154A1 (de) * 2000-04-06 2001-11-22 Wacker Chemie Gmbh Niedermolekulare alkenyl-terminierte Polydiorganosiloxane enthaltende additionsvernetzbare Siliconmassen
JP4009067B2 (ja) * 2001-03-06 2007-11-14 信越化学工業株式会社 付加硬化型シリコーン樹脂組成物

Also Published As

Publication number Publication date
CN1890324A (zh) 2007-01-03
EP1699875B1 (en) 2010-01-27
CN100465233C (zh) 2009-03-04
JP2005162859A (ja) 2005-06-23
US7625986B2 (en) 2009-12-01
DE602004025379D1 (de) 2010-03-18
KR101150744B1 (ko) 2012-06-08
KR20060135684A (ko) 2006-12-29
EP1699875A2 (en) 2006-09-13
ATE456624T1 (de) 2010-02-15
WO2005054371A2 (en) 2005-06-16
WO2005054371A3 (en) 2005-08-11
TWI366589B (en) 2012-06-21
US20080033120A1 (en) 2008-02-07
TW200528518A (en) 2005-09-01

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