JP2005162859A - 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 - Google Patents
付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 Download PDFInfo
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- JP2005162859A JP2005162859A JP2003402810A JP2003402810A JP2005162859A JP 2005162859 A JP2005162859 A JP 2005162859A JP 2003402810 A JP2003402810 A JP 2003402810A JP 2003402810 A JP2003402810 A JP 2003402810A JP 2005162859 A JP2005162859 A JP 2005162859A
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- 229920001296 polysiloxane Polymers 0.000 title claims abstract description 56
- 238000007259 addition reaction Methods 0.000 title claims abstract description 52
- 239000011342 resin composition Substances 0.000 title claims abstract description 45
- 230000003287 optical effect Effects 0.000 title claims abstract description 27
- 125000003342 alkenyl group Chemical group 0.000 claims abstract description 67
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims abstract description 59
- 229920005989 resin Polymers 0.000 claims abstract description 36
- 239000011347 resin Substances 0.000 claims abstract description 36
- 239000003054 catalyst Substances 0.000 claims abstract description 14
- 229920006136 organohydrogenpolysiloxane Polymers 0.000 claims abstract description 8
- 230000003197 catalytic effect Effects 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims description 62
- 125000004432 carbon atom Chemical group C* 0.000 claims description 15
- 238000005227 gel permeation chromatography Methods 0.000 claims description 14
- 239000004793 Polystyrene Substances 0.000 claims description 13
- 229920002223 polystyrene Polymers 0.000 claims description 13
- 125000001183 hydrocarbyl group Chemical group 0.000 claims 8
- 239000000463 material Substances 0.000 abstract description 9
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 93
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 41
- 239000000047 product Substances 0.000 description 40
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 description 36
- -1 diphenylsiloxane units Chemical group 0.000 description 35
- 239000000243 solution Substances 0.000 description 34
- 230000015572 biosynthetic process Effects 0.000 description 26
- 238000003786 synthesis reaction Methods 0.000 description 26
- 238000002834 transmittance Methods 0.000 description 19
- 229910052697 platinum Inorganic materials 0.000 description 17
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 15
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 15
- BITPLIXHRASDQB-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane Chemical compound C=C[Si](C)(C)O[Si](C)(C)C=C BITPLIXHRASDQB-UHFFFAOYSA-N 0.000 description 15
- 150000002430 hydrocarbons Chemical group 0.000 description 15
- 239000007787 solid Substances 0.000 description 14
- 238000001816 cooling Methods 0.000 description 13
- 238000010992 reflux Methods 0.000 description 13
- 238000003756 stirring Methods 0.000 description 13
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 12
- 229910052710 silicon Inorganic materials 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 11
- 238000001723 curing Methods 0.000 description 11
- 125000004435 hydrogen atom Chemical group [H]* 0.000 description 10
- 239000007788 liquid Substances 0.000 description 9
- 229910004298 SiO 2 Inorganic materials 0.000 description 8
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 8
- 238000002156 mixing Methods 0.000 description 8
- SORVFRRXWOKHGG-UHFFFAOYSA-N bis(2-methylprop-1-enylsilyloxy)-diphenylsilane Chemical compound C1(=CC=CC=C1)[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)C1=CC=CC=C1 SORVFRRXWOKHGG-UHFFFAOYSA-N 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 7
- 229920002050 silicone resin Polymers 0.000 description 7
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 6
- KFZMGEQAYNKOFK-UHFFFAOYSA-N Isopropanol Chemical compound CC(C)O KFZMGEQAYNKOFK-UHFFFAOYSA-N 0.000 description 6
- 230000007423 decrease Effects 0.000 description 6
- ZSIAUFGUXNUGDI-UHFFFAOYSA-N hexan-1-ol Chemical compound CCCCCCO ZSIAUFGUXNUGDI-UHFFFAOYSA-N 0.000 description 6
- 239000010703 silicon Substances 0.000 description 6
- ZNOCGWVLWPVKAO-UHFFFAOYSA-N trimethoxy(phenyl)silane Chemical compound CO[Si](OC)(OC)C1=CC=CC=C1 ZNOCGWVLWPVKAO-UHFFFAOYSA-N 0.000 description 6
- LIKFHECYJZWXFJ-UHFFFAOYSA-N dimethyldichlorosilane Chemical compound C[Si](C)(Cl)Cl LIKFHECYJZWXFJ-UHFFFAOYSA-N 0.000 description 5
- 238000001914 filtration Methods 0.000 description 5
- 238000006459 hydrosilylation reaction Methods 0.000 description 5
- 238000000926 separation method Methods 0.000 description 5
- ITMCEJHCFYSIIV-UHFFFAOYSA-N triflic acid Chemical compound OS(=O)(=O)C(F)(F)F ITMCEJHCFYSIIV-UHFFFAOYSA-N 0.000 description 5
- 239000002253 acid Substances 0.000 description 4
- 238000005266 casting Methods 0.000 description 4
- RCNRJBWHLARWRP-UHFFFAOYSA-N ethenyl-[ethenyl(dimethyl)silyl]oxy-dimethylsilane;platinum Chemical compound [Pt].C=C[Si](C)(C)O[Si](C)(C)C=C RCNRJBWHLARWRP-UHFFFAOYSA-N 0.000 description 4
- 229910052739 hydrogen Inorganic materials 0.000 description 4
- 239000001257 hydrogen Substances 0.000 description 4
- VTYCDJPJGNRAHU-UHFFFAOYSA-N tris(2-methylprop-1-enylsilyloxy)-phenylsilane Chemical compound C1(=CC=CC=C1)[Si](O[SiH2]C=C(C)C)(O[SiH2]C=C(C)C)O[SiH2]C=C(C)C VTYCDJPJGNRAHU-UHFFFAOYSA-N 0.000 description 4
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 125000000217 alkyl group Chemical group 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- YLJJAVFOBDSYAN-UHFFFAOYSA-N dichloro-ethenyl-methylsilane Chemical compound C[Si](Cl)(Cl)C=C YLJJAVFOBDSYAN-UHFFFAOYSA-N 0.000 description 3
- 239000011259 mixed solution Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 125000003944 tolyl group Chemical group 0.000 description 3
- KWEKXPWNFQBJAY-UHFFFAOYSA-N (dimethyl-$l^{3}-silanyl)oxy-dimethylsilicon Chemical compound C[Si](C)O[Si](C)C KWEKXPWNFQBJAY-UHFFFAOYSA-N 0.000 description 2
- XPDWGBQVDMORPB-UHFFFAOYSA-N Fluoroform Chemical compound FC(F)F XPDWGBQVDMORPB-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000006243 chemical reaction Methods 0.000 description 2
- 239000007809 chemical reaction catalyst Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 239000010453 quartz Substances 0.000 description 2
- 230000009257 reactivity Effects 0.000 description 2
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 2
- 239000005052 trichlorosilane Substances 0.000 description 2
- WZJUBBHODHNQPW-UHFFFAOYSA-N 2,4,6,8-tetramethyl-1,3,5,7,2$l^{3},4$l^{3},6$l^{3},8$l^{3}-tetraoxatetrasilocane Chemical compound C[Si]1O[Si](C)O[Si](C)O[Si](C)O1 WZJUBBHODHNQPW-UHFFFAOYSA-N 0.000 description 1
- 125000003903 2-propenyl group Chemical group [H]C([*])([H])C([H])=C([H])[H] 0.000 description 1
- QYXVDGZUXHFXTO-UHFFFAOYSA-L 3-oxobutanoate;platinum(2+) Chemical compound [Pt+2].CC(=O)CC([O-])=O.CC(=O)CC([O-])=O QYXVDGZUXHFXTO-UHFFFAOYSA-L 0.000 description 1
- LSNNMFCWUKXFEE-UHFFFAOYSA-M Bisulfite Chemical compound OS([O-])=O LSNNMFCWUKXFEE-UHFFFAOYSA-M 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 241001620634 Roger Species 0.000 description 1
- 229910004283 SiO 4 Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 125000004369 butenyl group Chemical group C(=CCC)* 0.000 description 1
- 239000006227 byproduct Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 125000003493 decenyl group Chemical group [H]C([*])=C([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 150000001993 dienes Chemical class 0.000 description 1
- 125000005388 dimethylhydrogensiloxy group Chemical group 0.000 description 1
- VDCSGNNYCFPWFK-UHFFFAOYSA-N diphenylsilane Chemical compound C=1C=CC=CC=1[SiH2]C1=CC=CC=C1 VDCSGNNYCFPWFK-UHFFFAOYSA-N 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical compound [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 239000008393 encapsulating agent Substances 0.000 description 1
- XYIBRDXRRQCHLP-UHFFFAOYSA-N ethyl acetoacetate Chemical compound CCOC(=O)CC(C)=O XYIBRDXRRQCHLP-UHFFFAOYSA-N 0.000 description 1
- 229940093858 ethyl acetoacetate Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 239000000706 filtrate Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 229910021485 fumed silica Inorganic materials 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 125000001188 haloalkyl group Chemical group 0.000 description 1
- 238000007542 hardness measurement Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- UQEAIHBTYFGYIE-UHFFFAOYSA-N hexamethyldisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)C UQEAIHBTYFGYIE-UHFFFAOYSA-N 0.000 description 1
- 125000006038 hexenyl group Chemical group 0.000 description 1
- NYMPGSQKHIOWIO-UHFFFAOYSA-N hydroxy(diphenyl)silicon Chemical class C=1C=CC=CC=1[Si](O)C1=CC=CC=C1 NYMPGSQKHIOWIO-UHFFFAOYSA-N 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- BFXIKLCIZHOAAZ-UHFFFAOYSA-N methyltrimethoxysilane Chemical compound CO[Si](C)(OC)OC BFXIKLCIZHOAAZ-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 239000005054 phenyltrichlorosilane Substances 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- CLSUSRZJUQMOHH-UHFFFAOYSA-L platinum dichloride Chemical group Cl[Pt]Cl CLSUSRZJUQMOHH-UHFFFAOYSA-L 0.000 description 1
- 229920001843 polymethylhydrosiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- 238000000411 transmission spectrum Methods 0.000 description 1
- ORVMIVQULIKXCP-UHFFFAOYSA-N trichloro(phenyl)silane Chemical compound Cl[Si](Cl)(Cl)C1=CC=CC=C1 ORVMIVQULIKXCP-UHFFFAOYSA-N 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
- 239000011787 zinc oxide Substances 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/045—Polysiloxanes containing less than 25 silicon atoms
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/12—Polysiloxanes containing silicon bound to hydrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/20—Polysiloxanes containing silicon bound to unsaturated aliphatic groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/70—Siloxanes defined by use of the MDTQ nomenclature
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Priority Applications (10)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003402810A JP2005162859A (ja) | 2003-12-02 | 2003-12-02 | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
| DE602004025379T DE602004025379D1 (de) | 2003-12-02 | 2004-11-29 | Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material |
| AT04799945T ATE456624T1 (de) | 2003-12-02 | 2004-11-29 | Additionshärtbare organopolysiloxanharzzusammensetzung und optisches material |
| US10/581,422 US7625986B2 (en) | 2003-12-02 | 2004-11-29 | Additional-curable organopolysiloxane resin composition and an optical material |
| PCT/JP2004/018093 WO2005054371A2 (en) | 2003-12-02 | 2004-11-29 | Addition-curable organopolysiloxane resin composition and an optical material |
| EP04799945A EP1699875B1 (en) | 2003-12-02 | 2004-11-29 | Addition-curable organopolysiloxane resin composition and an optical material |
| CNB2004800358196A CN100465233C (zh) | 2003-12-02 | 2004-11-29 | 可加成固化的有机聚硅氧烷树脂组合物和光学材料 |
| MYPI20044941A MY140964A (en) | 2003-12-02 | 2004-11-30 | Addition-curable organopolysiloxane resin composition and an optical material |
| TW93137211A TWI366589B (en) | 2003-12-02 | 2004-12-02 | Composition of organopolysiloxane resin |
| KR20067013243A KR101150744B1 (ko) | 2003-12-02 | 2006-06-30 | 부가반응 경화형 오가노폴리실록산 수지 조성물 및 광학 부재 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003402810A JP2005162859A (ja) | 2003-12-02 | 2003-12-02 | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JP2005162859A true JP2005162859A (ja) | 2005-06-23 |
| JP2005162859A5 JP2005162859A5 (enExample) | 2008-08-28 |
Family
ID=34650044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2003402810A Pending JP2005162859A (ja) | 2003-12-02 | 2003-12-02 | 付加反応硬化型オルガノポリシロキサン樹脂組成物および光学部材 |
Country Status (10)
| Country | Link |
|---|---|
| US (1) | US7625986B2 (enExample) |
| EP (1) | EP1699875B1 (enExample) |
| JP (1) | JP2005162859A (enExample) |
| KR (1) | KR101150744B1 (enExample) |
| CN (1) | CN100465233C (enExample) |
| AT (1) | ATE456624T1 (enExample) |
| DE (1) | DE602004025379D1 (enExample) |
| MY (1) | MY140964A (enExample) |
| TW (1) | TWI366589B (enExample) |
| WO (1) | WO2005054371A2 (enExample) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007008996A (ja) * | 2005-06-28 | 2007-01-18 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
| JP2008050494A (ja) * | 2006-08-25 | 2008-03-06 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2008101056A (ja) * | 2006-10-17 | 2008-05-01 | Momentive Performance Materials Japan Kk | シリコーンゴム組成物 |
| JP2008545553A (ja) * | 2005-05-26 | 2008-12-18 | ダウ・コーニング・コーポレイション | 小さい形状を成型していくプロセスおよびシリコーンカプセル化剤組成物 |
| JP2009527622A (ja) * | 2006-02-24 | 2009-07-30 | ダウ・コーニング・コーポレイション | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
| WO2012060322A1 (ja) * | 2010-11-04 | 2012-05-10 | 株式会社ダイセル | 硬化性樹脂組成物及び硬化物 |
| JP2014009322A (ja) * | 2012-06-29 | 2014-01-20 | Dow Corning Toray Co Ltd | 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置 |
| WO2015178475A1 (ja) * | 2014-05-23 | 2015-11-26 | 株式会社ダイセル | 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置 |
| JP2019504918A (ja) * | 2016-02-23 | 2019-02-21 | ダウ シリコーンズ コーポレーション | 高硬度の硬化性シリコーン組成物及びそれから製造した複合物品 |
Families Citing this family (21)
| Publication number | Priority date | Publication date | Assignee | Title |
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| JP4933179B2 (ja) | 2006-07-14 | 2012-05-16 | 信越化学工業株式会社 | 硬化性シリコーンゴム組成物及びその硬化物 |
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| JP2014506263A (ja) * | 2010-12-08 | 2014-03-13 | ダウ コーニング コーポレーション | 封止材を作成するのに好適なシロキサン組成物 |
| JP5992666B2 (ja) * | 2011-06-16 | 2016-09-14 | 東レ・ダウコーニング株式会社 | 架橋性シリコーン組成物及びその架橋物 |
| EP2784126B1 (en) | 2011-11-25 | 2019-03-13 | LG Chem, Ltd. | Curable composition |
| WO2013172921A1 (en) | 2012-05-14 | 2013-11-21 | Momentive Performance Materials Inc | High refractive index material |
| WO2014021419A1 (ja) * | 2012-08-03 | 2014-02-06 | 横浜ゴム株式会社 | 硬化性樹脂組成物 |
| JP6157085B2 (ja) | 2012-10-24 | 2017-07-05 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6084808B2 (ja) | 2012-10-24 | 2017-02-22 | 東レ・ダウコーニング株式会社 | オルガノポリシロキサン、硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| JP6081774B2 (ja) * | 2012-10-30 | 2017-02-15 | 東レ・ダウコーニング株式会社 | 硬化性シリコーン組成物、その硬化物、および光半導体装置 |
| CN103012456B (zh) * | 2012-12-18 | 2015-11-18 | 烟台德邦先进硅材料有限公司 | 一种大功率led封装用有机硅低聚体的制备方法 |
| US9470395B2 (en) | 2013-03-15 | 2016-10-18 | Abl Ip Holding Llc | Optic for a light source |
| CN103232707B (zh) * | 2013-04-19 | 2015-12-09 | 深圳新宙邦科技股份有限公司 | 可固化硅橡胶组合物及其固化产品与涂覆固化方法 |
| CA2911523C (en) | 2013-05-10 | 2018-10-02 | Abl Ip Holding Llc | Silicone optics |
| KR20150097947A (ko) * | 2014-02-19 | 2015-08-27 | 다우 코닝 코포레이션 | 반응성 실리콘 조성물, 이로부터 제조되는 핫멜트 재료, 및 경화성 핫멜트 조성물 |
| CN105199397B (zh) * | 2014-06-17 | 2018-05-08 | 广州慧谷化学有限公司 | 一种可固化的有机聚硅氧烷组合物及半导体器件 |
| DE102015225906A1 (de) * | 2015-12-18 | 2017-06-22 | Wacker Chemie Ag | Siloxanharzzusammensetzungen |
| KR102757326B1 (ko) | 2018-06-12 | 2025-01-20 | 모멘티브 파포만스 마테리아루즈 쟈판 고도가이샤 | 실리콘 경화물의 제조 방법, 실리콘 경화물 및 광학용 부재 |
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| JP2008545553A (ja) * | 2005-05-26 | 2008-12-18 | ダウ・コーニング・コーポレイション | 小さい形状を成型していくプロセスおよびシリコーンカプセル化剤組成物 |
| JP2007008996A (ja) * | 2005-06-28 | 2007-01-18 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン樹脂組成物および光学部材 |
| JP2009527622A (ja) * | 2006-02-24 | 2009-07-30 | ダウ・コーニング・コーポレイション | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
| JP2013100516A (ja) * | 2006-02-24 | 2013-05-23 | Dow Corning Corp | シリコーンで封入された光放出装置及び前記シリコーンを調製するための硬化性シリコーン組成物 |
| JP2008050494A (ja) * | 2006-08-25 | 2008-03-06 | Dow Corning Toray Co Ltd | 硬化性オルガノポリシロキサン組成物および半導体装置 |
| JP2008101056A (ja) * | 2006-10-17 | 2008-05-01 | Momentive Performance Materials Japan Kk | シリコーンゴム組成物 |
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| WO2012060322A1 (ja) * | 2010-11-04 | 2012-05-10 | 株式会社ダイセル | 硬化性樹脂組成物及び硬化物 |
| US8871890B2 (en) | 2010-11-04 | 2014-10-28 | Daicel Corporation | Curable resin composition and cured article |
| JP2014009322A (ja) * | 2012-06-29 | 2014-01-20 | Dow Corning Toray Co Ltd | 反応性シリコーン組成物、反応性熱可塑体、硬化物、および光半導体装置 |
| WO2015178475A1 (ja) * | 2014-05-23 | 2015-11-26 | 株式会社ダイセル | 分岐鎖状ポリオルガノシロキシシルアルキレン、その製造方法、硬化性樹脂組成物、及び半導体装置 |
| JP2019504918A (ja) * | 2016-02-23 | 2019-02-21 | ダウ シリコーンズ コーポレーション | 高硬度の硬化性シリコーン組成物及びそれから製造した複合物品 |
| US10829640B2 (en) | 2016-02-23 | 2020-11-10 | Dow Silicones Corporation | Curable high hardness silicone composition and composite articles made thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1890324A (zh) | 2007-01-03 |
| EP1699875B1 (en) | 2010-01-27 |
| CN100465233C (zh) | 2009-03-04 |
| US7625986B2 (en) | 2009-12-01 |
| DE602004025379D1 (de) | 2010-03-18 |
| KR101150744B1 (ko) | 2012-06-08 |
| KR20060135684A (ko) | 2006-12-29 |
| EP1699875A2 (en) | 2006-09-13 |
| ATE456624T1 (de) | 2010-02-15 |
| WO2005054371A2 (en) | 2005-06-16 |
| WO2005054371A3 (en) | 2005-08-11 |
| TWI366589B (en) | 2012-06-21 |
| US20080033120A1 (en) | 2008-02-07 |
| TW200528518A (en) | 2005-09-01 |
| MY140964A (en) | 2010-02-12 |
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