CN100454604C - 平板显示器及其制造方法 - Google Patents
平板显示器及其制造方法 Download PDFInfo
- Publication number
- CN100454604C CN100454604C CNB2005100565031A CN200510056503A CN100454604C CN 100454604 C CN100454604 C CN 100454604C CN B2005100565031 A CNB2005100565031 A CN B2005100565031A CN 200510056503 A CN200510056503 A CN 200510056503A CN 100454604 C CN100454604 C CN 100454604C
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- Prior art keywords
- electrode
- capacitors
- film transistor
- dielectric substrate
- thin film
- Prior art date
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- Expired - Lifetime
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 16
- 239000003990 capacitor Substances 0.000 claims abstract description 172
- 239000000758 substrate Substances 0.000 claims abstract description 95
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 239000010409 thin film Substances 0.000 claims abstract description 54
- 239000010410 layer Substances 0.000 claims description 150
- 229920002120 photoresistant polymer Polymers 0.000 claims description 70
- 239000010408 film Substances 0.000 claims description 51
- 239000011229 interlayer Substances 0.000 claims description 51
- 238000000034 method Methods 0.000 claims description 43
- 239000012212 insulator Substances 0.000 claims description 36
- 229910052751 metal Inorganic materials 0.000 claims description 35
- 239000002184 metal Substances 0.000 claims description 35
- 238000005530 etching Methods 0.000 claims description 28
- 230000004888 barrier function Effects 0.000 claims description 15
- 230000015572 biosynthetic process Effects 0.000 claims description 9
- 239000000203 mixture Substances 0.000 claims description 8
- 230000008021 deposition Effects 0.000 claims description 5
- 238000004380 ashing Methods 0.000 claims description 3
- 150000002739 metals Chemical class 0.000 claims description 2
- 239000000463 material Substances 0.000 description 31
- 239000011248 coating agent Substances 0.000 description 21
- 238000000576 coating method Methods 0.000 description 21
- 230000005540 biological transmission Effects 0.000 description 14
- 238000009413 insulation Methods 0.000 description 12
- 238000002161 passivation Methods 0.000 description 10
- 239000011651 chromium Substances 0.000 description 6
- MRNHPUHPBOKKQT-UHFFFAOYSA-N indium;tin;hydrate Chemical compound O.[In].[Sn] MRNHPUHPBOKKQT-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 5
- 239000011521 glass Substances 0.000 description 5
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 5
- 229920005591 polysilicon Polymers 0.000 description 5
- 238000001312 dry etching Methods 0.000 description 4
- 150000002500 ions Chemical class 0.000 description 4
- 238000007634 remodeling Methods 0.000 description 4
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 3
- 238000013459 approach Methods 0.000 description 3
- 229910052804 chromium Inorganic materials 0.000 description 3
- 238000005260 corrosion Methods 0.000 description 3
- 230000007797 corrosion Effects 0.000 description 3
- 238000001465 metallisation Methods 0.000 description 3
- YVTHLONGBIQYBO-UHFFFAOYSA-N zinc indium(3+) oxygen(2-) Chemical compound [O--].[Zn++].[In+3] YVTHLONGBIQYBO-UHFFFAOYSA-N 0.000 description 3
- 229920001621 AMOLED Polymers 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 2
- 239000012141 concentrate Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 239000012535 impurity Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000012780 transparent material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 229910001182 Mo alloy Inorganic materials 0.000 description 1
- ZOKXTWBITQBERF-UHFFFAOYSA-N Molybdenum Chemical compound [Mo] ZOKXTWBITQBERF-UHFFFAOYSA-N 0.000 description 1
- 229910001080 W alloy Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000011733 molybdenum Substances 0.000 description 1
- 239000010453 quartz Substances 0.000 description 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N silicon dioxide Inorganic materials O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/10—Apparatus or processes specially adapted to the manufacture of electroluminescent light sources
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices adapted for rectifying, amplifying, oscillating or switching, or capacitors or resistors with at least one potential-jump barrier or surface barrier, e.g. PN junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/66007—Multistep manufacturing processes
- H01L29/66075—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials
- H01L29/66227—Multistep manufacturing processes of devices having semiconductor bodies comprising group 14 or group 13/15 materials the devices being controllable only by the electric current supplied or the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched, e.g. three-terminal devices
- H01L29/66409—Unipolar field-effect transistors
- H01L29/66477—Unipolar field-effect transistors with an insulated gate, i.e. MISFET
- H01L29/66742—Thin film unipolar transistors
- H01L29/6675—Amorphous silicon or polysilicon transistors
- H01L29/66757—Lateral single gate single channel transistors with non-inverted structure, i.e. the channel layer is formed before the gate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1248—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs with a particular composition or shape of the interlayer dielectric specially adapted to the circuit arrangement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1255—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs integrated with passive devices, e.g. auxiliary capacitors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having at least one potential-jump barrier or surface barrier; including integrated passive circuit elements with at least one potential-jump barrier or surface barrier the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/1288—Multistep manufacturing methods employing particular masking sequences or specially adapted masks, e.g. half-tone mask
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/121—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements
- H10K59/1216—Active-matrix OLED [AMOLED] displays characterised by the geometry or disposition of pixel elements the pixel elements being capacitors
Abstract
Description
Claims (8)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR47334/01 | 2001-08-06 | ||
KR1020010047334A KR100699987B1 (ko) | 2001-08-06 | 2001-08-06 | 높은 캐패시턴스를 갖는 평판표시소자 및 그의 제조방법 |
KR47334/2001 | 2001-08-06 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021569568A Division CN1222043C (zh) | 2001-08-06 | 2002-08-06 | 平板显示器及其制造方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1668151A CN1668151A (zh) | 2005-09-14 |
CN100454604C true CN100454604C (zh) | 2009-01-21 |
Family
ID=19712907
Family Applications (2)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021569568A Expired - Lifetime CN1222043C (zh) | 2001-08-06 | 2002-08-06 | 平板显示器及其制造方法 |
CNB2005100565031A Expired - Lifetime CN100454604C (zh) | 2001-08-06 | 2002-08-06 | 平板显示器及其制造方法 |
Family Applications Before (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB021569568A Expired - Lifetime CN1222043C (zh) | 2001-08-06 | 2002-08-06 | 平板显示器及其制造方法 |
Country Status (3)
Country | Link |
---|---|
US (2) | US6833666B2 (zh) |
KR (1) | KR100699987B1 (zh) |
CN (2) | CN1222043C (zh) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108550708A (zh) * | 2013-01-17 | 2018-09-18 | 科迪华公司 | 高分辨率有机发光二极管器件 |
Families Citing this family (33)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100441435B1 (ko) * | 2002-05-31 | 2004-07-21 | 삼성에스디아이 주식회사 | 액티브 매트릭스 타입의 유기전계발광표시장치의 제조방법 |
KR100441436B1 (ko) * | 2002-06-17 | 2004-07-21 | 삼성에스디아이 주식회사 | 투과율이 향상된 평판표시장치 및 그의 제조방법 |
JP2004165621A (ja) * | 2002-09-20 | 2004-06-10 | Seiko Epson Corp | 半導体装置、電気光学装置、電子機器、半導体装置の製造方法 |
ATE413625T1 (de) * | 2003-06-04 | 2008-11-15 | Tpo Hong Kong Holding Ltd | Verfahren zur herstellung eines flüssigkristall- display-bauelements |
KR100551046B1 (ko) * | 2003-08-28 | 2006-02-09 | 삼성에스디아이 주식회사 | 유기 이엘 소자 |
KR100611148B1 (ko) * | 2003-11-25 | 2006-08-09 | 삼성에스디아이 주식회사 | 박막트랜지스터, 그의 제조방법 및 이를 사용하는 유기전계발광소자 |
KR100589375B1 (ko) * | 2004-05-24 | 2006-06-14 | 삼성에스디아이 주식회사 | 커패시터 및 이를 이용하는 발광 표시 장치 |
CN100459101C (zh) * | 2004-07-19 | 2009-02-04 | 友达光电股份有限公司 | 显示像素及其制造方法 |
KR101043991B1 (ko) * | 2004-07-28 | 2011-06-24 | 엘지디스플레이 주식회사 | 액정표시소자 및 그 제조방법 |
KR100712114B1 (ko) * | 2004-09-17 | 2007-04-27 | 삼성에스디아이 주식회사 | 유기전계 발광소자 및 그 제조 방법 |
JP4063266B2 (ja) * | 2004-09-30 | 2008-03-19 | セイコーエプソン株式会社 | 薄膜半導体装置の製造方法、薄膜半導体装置、電気光学装置、および電子機器 |
KR100659761B1 (ko) | 2004-10-12 | 2006-12-19 | 삼성에스디아이 주식회사 | 반도체소자 및 그 제조방법 |
CN1317596C (zh) * | 2004-11-15 | 2007-05-23 | 友达光电股份有限公司 | 像素结构及其制造方法 |
KR100669789B1 (ko) * | 2004-11-26 | 2007-01-16 | 삼성에스디아이 주식회사 | 평판 디스플레이 장치 |
TWI285059B (en) * | 2005-04-15 | 2007-08-01 | Au Optronics Corp | Fabrication method for organic electroluminescent element comprising an LTPS-TFT |
KR100624319B1 (ko) * | 2005-05-11 | 2006-09-19 | 삼성에스디아이 주식회사 | 발광표시장치의 제조방법 |
KR101216169B1 (ko) * | 2005-06-30 | 2012-12-28 | 엘지디스플레이 주식회사 | 액정 표시 장치용 박막 트랜지스터 소자 및 그의 제조 방법 |
KR100683791B1 (ko) * | 2005-07-30 | 2007-02-20 | 삼성에스디아이 주식회사 | 박막 트랜지스터 기판 및 이를 구비한 평판 디스플레이장치 |
KR100754126B1 (ko) * | 2005-11-23 | 2007-08-30 | 삼성에스디아이 주식회사 | 액정표시장치 어레이 기판 및 그 제조방법 |
KR100782461B1 (ko) * | 2006-04-05 | 2007-12-05 | 삼성에스디아이 주식회사 | Tft패널 및 이의 제조 방법, 그리고 이를 구비하는 유기전계 발광 표시 장치 |
KR100805154B1 (ko) * | 2006-09-15 | 2008-02-21 | 삼성에스디아이 주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
CN100397622C (zh) * | 2006-09-25 | 2008-06-25 | 友达光电股份有限公司 | 主动组件阵列基板的制造方法 |
KR101022652B1 (ko) * | 2009-04-02 | 2011-03-22 | 삼성모바일디스플레이주식회사 | 박막 트랜지스터 기판 제조방법 및 유기 발광 디스플레이 장치 제조방법 |
KR101084273B1 (ko) | 2010-03-03 | 2011-11-16 | 삼성모바일디스플레이주식회사 | 유기 발광 표시 장치 및 그 제조 방법 |
US9048160B2 (en) * | 2012-07-12 | 2015-06-02 | Carestream Health, Inc. | Radiographic imaging array fabrication process for metal oxide thin-film transistors with reduced mask count |
CN103383925B (zh) * | 2013-07-02 | 2015-06-03 | 京东方科技集团股份有限公司 | 显示设备、裸眼3d功能面板的信号基板及其制造方法 |
KR102257978B1 (ko) * | 2014-03-17 | 2021-05-31 | 삼성디스플레이 주식회사 | 표시 장치 및 이의 제조 방법 |
TWI550725B (zh) * | 2014-10-27 | 2016-09-21 | 業鑫科技顧問股份有限公司 | 薄膜電晶體基板製作方法 |
TWI561894B (en) * | 2015-05-29 | 2016-12-11 | Hon Hai Prec Ind Co Ltd | Manufacturing method of making electronic connection structure, tft substrate, and insulation layer |
CN105788459A (zh) * | 2015-08-19 | 2016-07-20 | 广州奥翼电子科技有限公司 | 柔性显示器及其制备方法 |
CN105931995B (zh) * | 2016-04-29 | 2018-11-23 | 京东方科技集团股份有限公司 | 阵列基板及其制作方法 |
CN112534566A (zh) * | 2018-07-04 | 2021-03-19 | 深圳市柔宇科技股份有限公司 | 阵列基板及其制造方法、显示装置 |
CN110164373B (zh) * | 2019-05-27 | 2021-01-22 | 京东方科技集团股份有限公司 | 一种像素驱动电路及其制备方法、oled显示面板 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07170458A (ja) * | 1993-12-14 | 1995-07-04 | Sony Corp | 内部増幅型固体撮像装置 |
CN1218993A (zh) * | 1997-11-27 | 1999-06-09 | 三菱电机株式会社 | 半导体器件及其制造方法 |
CN1224887A (zh) * | 1997-12-31 | 1999-08-04 | 三星电子株式会社 | 液晶显示装置及其制造方法和驱动方法 |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR19990056771A (ko) * | 1997-12-29 | 1999-07-15 | 김영환 | 액정 표시 장치 |
JP4558121B2 (ja) * | 1999-01-11 | 2010-10-06 | 株式会社半導体エネルギー研究所 | 半導体装置及びその作製方法 |
JP4860021B2 (ja) * | 1999-01-11 | 2012-01-25 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
KR100621609B1 (ko) * | 1999-04-26 | 2006-09-06 | 삼성전자주식회사 | 고개구율 박막트랜지스터 액정표시장치 형성방법 |
JP3744293B2 (ja) * | 2000-01-11 | 2006-02-08 | セイコーエプソン株式会社 | 電気光学装置の製造方法及び電気光学装置 |
JP2001272929A (ja) * | 2000-03-24 | 2001-10-05 | Toshiba Corp | 平面表示装置用アレイ基板の製造方法 |
-
2001
- 2001-08-06 KR KR1020010047334A patent/KR100699987B1/ko active IP Right Grant
-
2002
- 2002-03-12 US US10/095,111 patent/US6833666B2/en not_active Expired - Lifetime
- 2002-08-06 CN CNB021569568A patent/CN1222043C/zh not_active Expired - Lifetime
- 2002-08-06 CN CNB2005100565031A patent/CN100454604C/zh not_active Expired - Lifetime
-
2004
- 2004-06-02 US US10/857,983 patent/US6878584B2/en not_active Expired - Lifetime
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH07170458A (ja) * | 1993-12-14 | 1995-07-04 | Sony Corp | 内部増幅型固体撮像装置 |
CN1218993A (zh) * | 1997-11-27 | 1999-06-09 | 三菱电机株式会社 | 半导体器件及其制造方法 |
CN1224887A (zh) * | 1997-12-31 | 1999-08-04 | 三星电子株式会社 | 液晶显示装置及其制造方法和驱动方法 |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108550708A (zh) * | 2013-01-17 | 2018-09-18 | 科迪华公司 | 高分辨率有机发光二极管器件 |
CN108550708B (zh) * | 2013-01-17 | 2020-03-17 | 科迪华公司 | 高分辨率有机发光二极管器件 |
Also Published As
Publication number | Publication date |
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KR20030013047A (ko) | 2003-02-14 |
US6878584B2 (en) | 2005-04-12 |
US6833666B2 (en) | 2004-12-21 |
CN1417863A (zh) | 2003-05-14 |
CN1222043C (zh) | 2005-10-05 |
CN1668151A (zh) | 2005-09-14 |
US20030025444A1 (en) | 2003-02-06 |
KR100699987B1 (ko) | 2007-03-26 |
US20040219696A1 (en) | 2004-11-04 |
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