CN100437977C - 制造固态成像器件的方法和固态成像器件及照相机 - Google Patents

制造固态成像器件的方法和固态成像器件及照相机 Download PDF

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Publication number
CN100437977C
CN100437977C CNB2006100060050A CN200610006005A CN100437977C CN 100437977 C CN100437977 C CN 100437977C CN B2006100060050 A CNB2006100060050 A CN B2006100060050A CN 200610006005 A CN200610006005 A CN 200610006005A CN 100437977 C CN100437977 C CN 100437977C
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Prior art keywords
shielding film
solid
insulating film
state imaging
imaging device
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Expired - Fee Related
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CNB2006100060050A
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English (en)
Chinese (zh)
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CN1819147A (zh
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宫本宏之
堂福忠幸
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Sony Semiconductor Solutions Corp
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Sony Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/151—Geometry or disposition of pixel elements, address lines or gate electrodes
    • H10F39/1515—Optical shielding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/10—Integrated devices
    • H10F39/12—Image sensors
    • H10F39/15—Charge-coupled device [CCD] image sensors
    • H10F39/153—Two-dimensional or three-dimensional array CCD image sensors
    • H10F39/1532—Frame-interline transfer
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/011—Manufacture or treatment of image sensors covered by group H10F39/12
    • H10F39/024—Manufacture or treatment of image sensors covered by group H10F39/12 of coatings or optical elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/805—Coatings
    • H10F39/8053—Colour filters
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F39/00—Integrated devices, or assemblies of multiple devices, comprising at least one element covered by group H10F30/00, e.g. radiation detectors comprising photodiode arrays
    • H10F39/80—Constructional details of image sensors
    • H10F39/806—Optical elements or arrangements associated with the image sensors
    • H10F39/8063—Microlenses

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  • Solid State Image Pick-Up Elements (AREA)
  • Transforming Light Signals Into Electric Signals (AREA)
CNB2006100060050A 2005-01-27 2006-01-23 制造固态成像器件的方法和固态成像器件及照相机 Expired - Fee Related CN100437977C (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2005019796A JP4843951B2 (ja) 2005-01-27 2005-01-27 固体撮像装置の製造方法、固体撮像装置およびカメラ
JP019796/05 2005-01-27

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CN1819147A CN1819147A (zh) 2006-08-16
CN100437977C true CN100437977C (zh) 2008-11-26

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US (1) US7929036B2 (enExample)
JP (1) JP4843951B2 (enExample)
KR (1) KR101133901B1 (enExample)
CN (1) CN100437977C (enExample)
TW (1) TW200711117A (enExample)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4843951B2 (ja) * 2005-01-27 2011-12-21 ソニー株式会社 固体撮像装置の製造方法、固体撮像装置およびカメラ
JP2007081137A (ja) * 2005-09-14 2007-03-29 Fujifilm Corp 光電変換素子及び固体撮像素子
JP5207777B2 (ja) * 2008-03-06 2013-06-12 パナソニック株式会社 固体撮像装置及びその製造方法
JP5446484B2 (ja) * 2008-07-10 2014-03-19 ソニー株式会社 固体撮像装置とその製造方法および撮像装置
US8772891B2 (en) * 2008-12-10 2014-07-08 Truesense Imaging, Inc. Lateral overflow drain and channel stop regions in image sensors
JP2010177599A (ja) * 2009-01-30 2010-08-12 Panasonic Corp 固体撮像装置及びその製造方法
JP2010212365A (ja) * 2009-03-09 2010-09-24 Sony Corp 固体撮像装置、および、その製造方法、電子機器
KR20130127780A (ko) * 2012-05-15 2013-11-25 삼성전기주식회사 카메라 모듈
JP5885634B2 (ja) 2012-10-02 2016-03-15 キヤノン株式会社 固体撮像装置、および撮像システム
JP7624825B2 (ja) * 2020-11-27 2025-01-31 シャープセミコンダクターイノベーション株式会社 固体撮像装置

Citations (6)

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JPH0621410A (ja) * 1992-07-06 1994-01-28 Matsushita Electron Corp 固体撮像装置およびその製造方法
JPH08162623A (ja) * 1994-12-09 1996-06-21 Sony Corp 固体撮像素子
US5593913A (en) * 1993-09-28 1997-01-14 Sharp Kabushiki Kaisha Method of manufacturing solid state imaging device having high sensitivity and exhibiting high degree of light utilization
JPH1056164A (ja) * 1996-08-12 1998-02-24 Toshiba Corp 固体撮像装置
JP2002164522A (ja) * 2000-11-24 2002-06-07 Sony Corp 固体撮像素子とその製造方法
CN1465105A (zh) * 2001-05-22 2003-12-31 索尼公司 固体成像器件的制造方法

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JPS62230269A (ja) * 1986-03-31 1987-10-08 Toshiba Corp 電子スチルカメラ
JPS63177551A (ja) * 1987-01-19 1988-07-21 Hitachi Ltd 固体撮像装置およびその製造方法
JPH05167052A (ja) * 1991-12-16 1993-07-02 Sony Corp 固体撮像装置の製造方法
JPH05183136A (ja) * 1991-12-27 1993-07-23 Fujitsu Ltd 固体撮像素子およびその製造方法
JP2833906B2 (ja) * 1992-01-31 1998-12-09 九州日本電気株式会社 固体撮像素子
JP3339249B2 (ja) * 1995-04-17 2002-10-28 ソニー株式会社 固体撮像素子の製造方法
KR100223805B1 (ko) 1997-06-13 1999-10-15 구본준 고체 촬상소자의 제조방법
JP2002158345A (ja) * 2000-11-22 2002-05-31 Shimadzu Corp 固体撮像素子
JP2002314063A (ja) * 2001-02-06 2002-10-25 Mitsubishi Electric Corp Ｃｍｏｓイメージセンサ及びその製造方法
KR101053323B1 (ko) * 2002-05-14 2011-08-01 소니 주식회사 반도체 장치와 그 제조 방법, 및 전자 기기
JP2004228425A (ja) * 2003-01-24 2004-08-12 Renesas Technology Corp Ｃｍｏｓイメージセンサの製造方法
US7232712B2 (en) * 2003-10-28 2007-06-19 Dongbu Electronics Co., Ltd. CMOS image sensor and method for fabricating the same
JP3729826B2 (ja) * 2004-01-09 2005-12-21 松下電器産業株式会社 固体撮像装置の製造方法
JP2005268609A (ja) * 2004-03-19 2005-09-29 Fuji Photo Film Co Ltd 多層積層型多画素撮像素子及びテレビカメラ
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JP2006073885A (ja) * 2004-09-03 2006-03-16 Canon Inc 固体撮像装置、その製造方法、およびデジタルカメラ
JP4843951B2 (ja) * 2005-01-27 2011-12-21 ソニー株式会社 固体撮像装置の製造方法、固体撮像装置およびカメラ

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0621410A (ja) * 1992-07-06 1994-01-28 Matsushita Electron Corp 固体撮像装置およびその製造方法
US5593913A (en) * 1993-09-28 1997-01-14 Sharp Kabushiki Kaisha Method of manufacturing solid state imaging device having high sensitivity and exhibiting high degree of light utilization
JPH08162623A (ja) * 1994-12-09 1996-06-21 Sony Corp 固体撮像素子
JPH1056164A (ja) * 1996-08-12 1998-02-24 Toshiba Corp 固体撮像装置
JP2002164522A (ja) * 2000-11-24 2002-06-07 Sony Corp 固体撮像素子とその製造方法
CN1465105A (zh) * 2001-05-22 2003-12-31 索尼公司 固体成像器件的制造方法

Also Published As

Publication number Publication date
CN1819147A (zh) 2006-08-16
US7929036B2 (en) 2011-04-19
TWI294179B (enExample) 2008-03-01
KR20060086878A (ko) 2006-08-01
TW200711117A (en) 2007-03-16
JP2006210595A (ja) 2006-08-10
JP4843951B2 (ja) 2011-12-21
KR101133901B1 (ko) 2012-04-09
US20060166389A1 (en) 2006-07-27

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