CN100409422C - 引线环及其半导体器件、引线接合方法和引线接合装置 - Google Patents

引线环及其半导体器件、引线接合方法和引线接合装置 Download PDF

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CN100409422C
CN100409422C CNB2003101248114A CN200310124811A CN100409422C CN 100409422 C CN100409422 C CN 100409422C CN B2003101248114 A CNB2003101248114 A CN B2003101248114A CN 200310124811 A CN200310124811 A CN 200310124811A CN 100409422 C CN100409422 C CN 100409422C
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lead
wire
junction point
kink
neck
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CN1516254A (zh
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藤泽洋生
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Offshore Co ltd
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Offshore Co ltd
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Abstract

一种引线环，包括通过其连接第一接合点(A)和第二接合点(Z)的引线(3)，其中，该引线(3)具有在其上形成的一压碎部分(3c)，其是通过压碎引线(3)的一部分以及用毛细管(4)接合到第一接合点(A)上的球状物(30)的顶部而形成的。通过一种引线接合方法形成了该引线环，该方法包括：将引线(3)接合到第一接合点(A)上；在执行环控制的同时水平地和垂直地移动毛细管(4)；将引线(3)接合到已接合到第一接合点(A)上的球状物(30)的顶部附近；以及其后，在释放引线(3)并执行环控制的同时，将毛细管(4)水平地和垂直地移动到第二接合点(Z)，然后，将引线(3)接合到第二接合点(Z)上。

Description

引线环及其半导体器件、引线接合方法和引线接合装置
技术领域
本发明涉及一种用于通过引线将第一接合点与第二接合点相连的引线接合方法，一种用于执行该方法的引线接合装置，一种具有一定形状的引线环，和一种具有包含在其中的这样的引线环的半导体器件。
背景技术
如图7A或7B所示，通常的，在构造半导体器件的过程中，要通过引线3执行引线接合操作，该引线接合操作将连接到引脚框1上的半导体芯片2的焊点2a或第一接合点A与引脚框1的引脚1a或第二接合点Z相连接。典型的，连接第一和第二接合点A和Z的引线3的环形状例如分别包括图7A和7B中所示的梯形形状和三角形形状，其是在美国专利No.6,036,080或日本专利申请公开(Laid-Open publication)No.2000-277558中披露的。
图7A中所示具有梯形形状的引线环是通过如图8中所示的步骤顺序形成的。首先，在图8的步骤(a)中，放下通过有引线3的毛细管4，并将已经形成在引线3末梢上的球状物30接合到芯片2的焊点2a或第一接合点A上。然后，在图8的步骤(b)中，在释放引线3的同时，垂直地将毛细管4升高到点B。其后，在图8的步骤(c)中，在与第二接合点Z相反的方向上水平地将毛细管4移动到点C。
通常，将毛细管4在与第二接合点Z相反的方向上移动的操作被称作为“反向操作”。结果，引线3上点A和C之间的部分被形成是倾斜的，并通过毛细管4的较低端在引线倾斜部分的上端形成一个结纽3a。这样被释放的引线3上点A和C之间的部分对应于颈部H的高度(或者引线3上焊点2a和结纽3a之间的部分)，并将构成颈部H。
随后，在图8的步骤(d)中，在释放引线3的同时，垂直地将毛细管4升高到点D。然后，在图8的步骤(e)中，再一次执行毛细管4的反向操作，即，在与第二接合点Z相反的方向上水平地将毛细管4移动到点E。作为这样反向操作的结果，引线3具有另一个在点C和E之间延伸的倾斜部分，并在引线3的这个倾斜部分上端形成结纽3b。
这样被释放的引线3的这个倾斜部分将构成具有图7A所示的梯形形状的引线环的上基座部分L(或者引线3上结纽3a和3b之间的部分)。其后，在图8的步骤(f)中，将毛细管4垂直地升高到点F，使得将引线3释放出对应于图7A中所示的引线环的长倾斜部分S的长度(或者引线3上结纽3b和引脚1a之间的部分)。随后，经过位置f1和f2将毛细管4放低到第二接合点Z，使得将引线3接合到第二接合点Z或引脚1a上。
图7B中所示具有三角形形状的引线环是通过如图9中所示的步骤顺序形成的。由于与上述具有梯形形状的引线环不同，具有三角形形状的引线环不具有上基座部分(L)，因此，在形成三角形形状的引线环时，就不用执行图8的步骤(d)和(e)中的第二次反向操作。因此，在这种情况下，仅在图9的步骤(d)执行对应于图8中步骤(d)、(e)和(除f1和f2以外的f)的步骤。更特别的，图9的步骤(a)、(b)和(c)与图8的步骤(a)、(b)和(c)相同，在图9的步骤(c)中的第一次反向操作之后，在释放引线3的同时在图9的步骤(d)垂直地将毛细管4升高到点F。随后，在图9的步骤(e)中，以与图8的步骤(f)相同的方式经过位置e1和e2移动毛细管4，因此将引线3接合到第二接合点Z或引脚1a上。
但是，在上述技术中，由于引线环包括的颈部H具有稍微大的高度，因此引线环变得很高，并由此使得引线环不稳定。此外，在为了使其颈部H的高度变小而在不进行任何毛细管反向操作的情况下形成引线环，使颈部H的高度被减小到一定水平或一定水平以下的情况下，由于引线3垂直地从第一接合点A延伸，而使在拖拉或移动引线3以将其设置在合适的位置时该颈部H容易被损坏。
发明内容
考虑到现有技术的上述缺点提出了本发明。
因此，本发明的一个目的是提供一种低轮廓的引线环，该引线环是稳定的，并且其颈部很难被损坏。
本发明的另一个目的是提供一种半导体器件，其具有包含在该半导体器件中的所述引线环。
本发明的又一个目的是提供一种可以形成所述引线环的引线接合方法。
本发明进一步的目的是提供一种可以执行所述引线接合方法的引线接合装置。
根据本发明的一个方面，提供了一种引线环。该引线环包括：连接第一接合点和第二接合点的引线；所述引线包括具有接合到所述第一接合点上的球状物的颈部，和从所述颈部延伸到所述第二接合点的主体部分，所述颈部包括通过对折所述颈部的一部分而形成的第一结纽；其中：所述引线的所述主体部分包括一个以基本上水平的方向上从所述颈部延伸出来的水平部分，和一个倾斜部分，所述倾斜部分从所述水平部分延伸到所述第二接合点并且具有接合到所述第二接合点的末端；所述倾斜部分通过一个第二结纽连接到所述水平部分上，所述第二结纽是在倾斜部分和水平部分之间所述引线的一部分中形成；所述引线的所述主体部分具有接近所述颈部形成的压碎部分，该压碎部分是通过与所述球状物的顶部一起压碎所述引线的该部分而形成的，其中所述压碎部分形成在邻近第一结纽的所述引线的水平部分，同时第一结纽形成引线的该部分被对折的形状，从而所述颈部在所述压碎部分处被被压碎或变形，以具有相对于第一结纽的减小的高度。
在本发明的优选实施例中，所述颈部包括至少一个像所述第一结纽一样的附加对折结纽。
根据本发明的另一个方面，提供了一种引线接合方法，用于利用毛细管在第一接合点和第二接合点之间接合引线。该引线接合方法包括以下步骤：
(a)将形成在引线末梢上的球状物接合到第一接合点上；
(b)在执行环控制的同时水平地和垂直地移动所述毛细管，由此在邻近所述球状物的引线的颈部上形成第一结纽；
(c)将引线接合到球状物的顶部或顶部的附近，所述球状物已接合到所述第一接合点上；以及
(d)其后，在将引线从所述毛细管释放并执行环控制的同时，水平地和垂直地将所述毛细管移动到第二接合点，然后将引线接合到所述第二接合点上；
其中，步骤包括形成引线的主体部分，所述主体部分包括一个以基本上水平的方向上从所述颈部延伸出来的水平部分，和一个倾斜部分，所述倾斜部分从所述水平部分延伸到所述第二接合点，并且在引线的主体部分的一部分中形成第二结纽，从而通过第二结纽将水平部分连接到所述倾斜部分；和
步骤(c)包括用所述毛细管将引线的一部分以及所述球状物的顶部压碎，以形成引线上的压碎部分，其中所述压碎部分形成在邻近第一结纽的所述引线的水平部分，同时第一结纽形成引线的该部分被对折的形状，从而所述颈部在所述压碎部分处被被压碎或变形，以具有相对于第一结纽的减小的高度。
在本发明的优选实施例中，在步骤(b)和(c)中，对折引线的所述颈部以形成结纽。
在本发明的优选实施例中，重复地执行步骤(b)和(c)多次，以在所述颈部上形成至少一个附加的对折结纽。
在本发明的优选实施例中，步骤(d)包括操作所述毛细管以在引线的一部分上形成附加的结纽，该附加的结纽位于所述压碎部分和所述第二接合点之间。
根据本发明的又一个方面，提供了一种用于执行引线接合方法的引线接合装置。该引线接合装置包括：毛细管，具有插入到该毛细管中的引线，用以从所述毛细管释放引线；接线夹，用于可释放地夹住引线；移动装置，用于水平地和垂直地移动所述毛细管；控制单元，用于控制所述毛细管的移动；和用于手动地输入所述毛细管高度，以将所述毛细管要被升高到所述控制单元，从而自动地控制所述毛细管的移动的装置。
根据本发明进一步的方面，提供了一种半导体器件。该半导体器件包括：第一接合点；第二接合点；接合到所述第一接合点和所述第二接合点上以通过其连接所述第一接合点和所述第二接合点的引线；其中，所述引线包括具有接合到所述第一接合点上的球状物的颈部，和从所述颈部延伸到所述第二接合点的主体部分，所述颈部包括通过对折所述颈部的一部分而形成的第一结纽；其特征在于：所述引线的所述主体部分包括一个以基本上水平的方向上从所述颈部延伸出来的水平部分，和一个倾斜部分，所述倾斜部分从所述水平部分延伸到所述第二接合点并且具有接合到所述第二接合点的末端；所述倾斜部分通过一个第二结纽连接到所述水平部分上，所述第二结纽是在倾斜部分和水平部分之间所述引线的一部分中形成；所述引线的所述主体部分具有接近所述颈部形成的压碎部分，该压碎部分是通过与所述球状物的顶部一起压碎所述引线的该部分而形成的，其中所述压碎部分形成在邻近第一结纽的所述引线的水平部分，同时第一结纽形成引线的该部分被对折的形状，从而所述颈部在所述压碎部分处被被压碎或变形，以具有相对于第一结纽的减小的高度。
附图说明
由于参考接下来结合附图所进行的详细描述，本发明变得更好理解，因此将更容易地理解本发明的这些和其它目的以及由此带来的许多优点；其中：
图1A是示出了在根据本发明的半导体器件中引线环的一个实施例的形状的正视图；
图1B是示出了该半导体器件的断面示意平面图；
图2是示出了用以形成具有图1中所示形状的引线环的毛细管的运动路径和该引线环连接状态的示意性正视图；
图3是用举例的方法示出了根据本发明的方法在与毛细管的运动相联系的对应步骤中引线形状的示意图；
图4是示出了在根据本发明的半导体器件中引线环的另一个实施例的形状的正视图；
图5是示出了在根据本发明的半导体器件中引线环的又一个实施例的形状的正视图；
图6是示出了根据本发明的引线接合装置的一个实施例的结构图；
图7A和7B是分别示出了传统的具有梯形形状和三角形形状的引线环的正视图；
图8是示出了在与毛细管的运动相联系的对应步骤中引线形状的示意图，该毛细管的运动是为了形成图7A中所示的梯形形状的引线环；和
图9是示出了在与毛细管的运动相联系的对应步骤中引线形状的示意图，该毛细管的运动是为了形成图7B中所示的三角形形状的引线环。
具体实施方式
现在，将在下文参考附图描述根据本发明的引线环、半导体器件、引线接合方法和引线接合装置，附图中，每个图中相同的部分都用相同的参考符号或数字进行标记。
首先参考图1A和1B，其说明了根据本发明的引线环和具有将引线环包含在其中的的半导体器件10的一个实施例。半导体器件10中，半导体芯片2被连接到引脚框1上，并在其上具有一焊点2a，该焊点2a是第一接合点A。形成引线3的引线环，以具有通常的梯形形状，并包括具有球状物30的颈部H，该球状物30接合到焊点2a或第一接合点A上，还包括含有水平上部L和倾斜部分S的主体部分，倾斜部分S的一个末端接合到引脚框1的引脚1a或第二接合点Z上。引线环的水平上部L在其相对的两个末端上具有结纽3a和3b。
上面描述的实施例中的这种结构与传统半导体器件的结构大体上相同。但是，在上述实施例中，在第一接合点A的附近在引线3上形成了一压碎部分3c。更特殊的，通过与球状物30的顶部一起压碎引线3的该部分而在邻近结纽3a的引线3的水平上部L上形成该压碎部分3c。由于该引线环具有邻近结纽3a形成的压碎部分3c，因此，结纽3a被稳定地变形，结果使该引线环低轮廓，并显示出较强的形状保持性。
现在将参考图2和3，描述根据本发明的引线接合方法的实施例，通过该方法得到了图1A和1B中所示的半导体器件10。
图2示出了毛细管4的运动路径P，和通过引线接合已连接到第一和第二接合点A和Z的引线环的完成状态。如与图8中所示的传统方法相比，引线接合方法的所述实施例进一步包括图3的步骤(e)和(f)，其是在图8的步骤(d)和(e)之间进行的。图3的剩余步骤与图8的步骤相同，即，图3的步骤(a)到(d)和步骤(g)到(k)对应于图8的步骤(a)到(d)以及步骤(e)和(f【经过位置f1和f2】)。
首先，将描述与传统方法中的步骤相同的图3的步骤(a)到(d)。图3中，用这样一种方式来说明用于夹住引线3并释放引线3的接线夹5，使得分别通过使接线夹5接触到引线3上以及通过使接线夹5从引线3上分开来表明接线夹5的闭合状态和打开状态，并使得通过附加在接线夹5上的对角线来表明接线夹5可以被保持在闭合状态或打开状态的情况。在图3的步骤(a)中，在打开接线夹5的同时放下毛细管4，使得形成在引线3末梢上的球状物30接合到第一接合点A上。然后，在图3的步骤(b)中，在释放引线3的同时，毛细管4被垂直地升高到点B。其后，在图3的步骤(c)中，进行毛细管4的反向操作，即，在与第二接合点Z相对的方向上将毛细管4水平地移到点C。结果，用与传统方法相同的方式在引线3上形成了结纽3a。
其后，在释放引线3的同时，将毛细管4垂直地升高到点D1，其中，可以随意地选择点D1的位置。然后，执行本发明实施例中重要的或特有的步骤。更特别的是，在图3的步骤(e)中，在朝向第二接合点Z的方向上将毛细管4移到点D2，该点D2几乎是正好位于第一接合点A的上方，并且可以随意地确定点D2的垂直和水平位置。随后，用这样一种方式将引线3接合到点M1上，使得引线3的一部分与接合到第一接合点A上的球状物30的顶部一起被压碎。作为这样操作的结果，压碎部分3c形成在邻近结纽3a的引线3上，同时结纽3a形成引线3的该部分被对折的形状。然后，在图3的步骤(g)中，在释放引线3的同时，将毛细管4垂直地升高到点D。在这种情况下，毛细管4可以在水平方向上朝向第二接合点Z稍微地移动一点儿，然后垂直地升高到一个稍微偏离点D的点(未示出)上。可选择地，可以将毛细管4倾斜地升高到稍微偏离的点上。由此，在图3的步骤(e)和(f)中，在引线3上形成了压碎部分3c。
然后，在图3的步骤(h)中，执行毛细管4的第二反向操作。也就是，在与第二接合点Z相对的方向上水平地将毛细管4移到点E。毛细管4从点D到点E的移动在引线3上形成了结纽3b。其后，在图3的步骤(i)中，将毛细管4垂直地升高到点F，使得将引线3释放一定长度，该长度对应于在结纽3b和引脚1a之间延伸的引线3的倾斜部分S。
随后，用与上述传统的方法中相同的方式执行图3的步骤(j)和(k)，使得将毛细管4放下以置于第二接合点Z处，结果将引线3接合到第二接合点Z处。顺便说明，毛细管4从点F到第二接合点Z的移动可以沿与上述传统方法中相同的路径来进行，或者可以从各种可能的路径中选择一条合适的。
如上所述，引线3到点M1的第二次接合是在图3的步骤(f)中进行的，而不是在如图3的步骤(b)中所示仅将毛细管4升高之后就进行，上述点M1几乎位于第一接合点A的正上方，或是在其附近。可替换的，在图3的步骤(c)中在沿从第二接合点Z相对的方向上水平地移动毛细管4之后就执行图3的步骤(f)中的第二次接合，然后通过执行图3的步骤(d)和(e)在引线3上形成结纽3a，从而在引线3上形成压碎部分3c。结果，颈部H被压碎或变形，以具有一减小的高度，该高度基本上等于在结纽3a和3b之间延伸的水平部分L的高度，因此可以形成低轮廓的引线环。例如，当将厚度为25μm的金丝进行引线接合以形成直径大约为60μm、厚度大约为12μm的接合部分时，根据本发明颈部H的高度大约为50-80μm，而根据传统的方法颈部H的高度大约为100-130μm。此外，由于引线3的压碎部分3c直接在第一接合点A的上方接合到位置M1上，因此与传统的引线环相比，从第一接合点A上形成的引线3的升高部分是很坚固的，从而可以形成可稳定定位并具有很强的形状保持性的引线环。
此外，为了控制直接在第一接合点A上方的颈部H的高度，或控制可能产生到颈部H上的伤害，相应于直接在第一接合点A上方或在其附近的点M1的图3中步骤(b)到(f)的操作可以被重复地进行两次或更多次。在图4和5中用实例示出了通过相对于第一接合点A多次执行这样的引线接合步骤而形成的引线环的实施例。
图4中示出的引线环在颈部H具有结纽3a1和3a2，其是通过改变毛细管4在图3的步骤(c)中水平移动的距离而形成的。更特别的，毛细管4用于形成结纽3a2而进行水平移动的距离比用于形成结纽3a1的距离稍微短一些。
图5中示出的引线环在颈部H具有三个结纽3a1、3a2和3a3，其是通过改变毛细管4在图3的步骤(c)中水平移动的距离以及方向而形成的。结纽3a1和3a3是通过在相同的从第二接合点Z相反的方向上以不同的距离移动毛细管4而形成的，而结纽3a2是通过在图3的步骤(c)中在朝向第二接合点Z的方向上移动毛细管4而形成的。
如上所述，在根据本发明的引线接合方法的实施例中，至少执行一次图3中步骤(b)到(f)的接合操作。
例如，通过图6中所示的引线接合装置执行本发明的接合方法。该接合装置包括基座20、安装在基座20上的X-Y工作台22、z轴移动机构24、控制单元32，和用于通过x、y、z轴电机21、23和26控制X-Y工作台22和z轴移动机构24的伺服驱动控制部分33。该装置还包括放置有引脚框1的接合台28。z轴移动机构24包括有臂27，其具有连接在其末端的毛细管4，引线3被插入并通过该毛细管4。接线夹5设置在毛细管4的上方，以夹住和释放引线3。这样的结构使得在执行环控制的同时，毛细管4可以在连接到引脚框1上的半导体芯片2的焊点2a(或者第一接合点A)和引脚框1的引脚1a(或者第二接合点Z)之间移动。z轴移动机构24由支点25支撑，使得通过z轴电机26可以垂直地移动臂27的末端。
控制单元32根据事先在其内设定的参数将一控制信号输出到伺服驱动控制部分33，使得伺服驱动控制部分33沿一预定路径将毛细管4移动到第一和第二接合点A和Z以及将毛细管4从第一和第二接合点A和Z移回来，并操作毛细管4和接线夹5。控制单元32包括有连接到其上的手动输入部分34，以输入参数，如毛细管4在控制单元32内在引线接合操作期间在水平和垂直方向的位置。由此，通过手动输入部分34将毛细管4要被升高的高度手动地输入到了控制单元32内，从而自动地控制毛细管4的移动。图6中，附图标记30、35和36分别表示形成在引线3末梢的球状物、ITV照相机和图像识别部分。
因此，参考本发明的方法实施例，被适当地构成的装置执行如上所述的引线接合操作。
如从前述内容中可看到的，在引线接合方法和引线接合装置中，连接第一接合点和第二接合点的引线环在其颈部上具有一压碎部分，该压碎部分是通过与接合到第一接合点上的球状物的顶部一起接近颈部压碎引线的一部分而形成的。这样的结构能够提供一种低轮廓的引线环，其稳定并具有很强的形状保持性。可以通过在将引线的球状物接合到第一接合点上之后，稍微地升高毛细管，执行环控制，并在其后将引线接合到球状物顶部或顶部附近，而容易地得到引线环的这种形状。
因此，不管是布线距离短的引线环还是布线距离长的引线环都可以被形成低轮廓的稳定引线环。此外，这样形成的引线环具有很强的形状保持性，其能抵挡住由外部施加到引线环上的力或压力。因此，该引线环可以表现出很好的抗冲击的冲击吸收功能，这些冲击如在将引线接合到第二接合点期间毛细管的接触或超声波的辐射而产生的冲击、引线的振动、在铸型材料的注入过程中由铸型材料的流动而产生的外力，以及类似的冲击，从而，可以有效地防止在引线环颈部上的引线的弯曲或倾斜以及破损。
尽管已经参考附图以某种特殊的角度描述了本发明优选的实施例，但根据上述提示可以有明显的修改和变型。因此，可以理解，在所附权利要求的范围内本发明可以以除已经描述的以外的方式来实施。

Claims (7)

1.一种引线环，包括：
连接第一接合点(A)和第二接合点(Z)的引线(3)；
所述引线(3)包括具有接合到所述第一接合点(A)上的球状物(30)的颈部(H)，和从所述颈部(H)延伸到所述第二接合点(Z)的主体部分(L、S)，所述颈部(H)包括通过对折所述颈部(H)的一部分而形成的第一结纽(3a，3a2)；其特征在于：
所述引线(3)的所述主体部分(L、S)包括一个以基本上水平的方向上从所述颈部(H)延伸出来的水平部分(L)，和一个倾斜部分(S)，所述倾斜部分(S)从所述水平部分(L)延伸到所述第二接合点(Z)并且具有接合到所述第二接合点(Z)的末端；
所述倾斜部分(S)通过一个第二结纽(3b)连接到所述水平部分(L)上，所述第二结纽(3b)是在倾斜部分和水平部分之间所述引线(3)的一部分中形成；
所述引线(3)的所述主体部分(L、S)具有形成在接近所述颈部(H)的压碎部分(3c)，该压碎部分是通过与所述球状物(30)的顶部一起压碎所述引线(3)的该部分而形成的，其中所述压碎部分(3c)形成在邻近第一结纽(3a，3a2，3a3)的所述引线(3)的水平部分(L)，同时第一结纽(3a，3a2，3a3)形成引线(3)的该部分被对折的形状，从而所述颈部(H)在所述压碎部分(3c)处被被压碎或变形，以具有相对于第一结纽(3a，3a2，3a3)的减小的高度。
2.如权利要求1所述的引线环，其特征在于，所述颈部(H)包括至少一个像所述第一结纽一样的附加对折结纽。
3.一种引线接合方法，用于利用毛细管(4)在第一接合点(A)和第二接合点(Z)之间接合引线(3)，其特征在于：
该方法包括以下步骤：
a)将形成在引线(3)末梢上的球状物(30)接合到所述第一接合点(A)上：
b)在执行环控制的同时水平地和垂直地移动所述毛细管(4)，从而在邻近所述球状物(30)的引线(3)的颈部(H)上形成第一结纽；
c)将引线(3)接合到所述球状物(30)的顶部或顶部的附近，所述球状物已接合到所述第一接合点(A)上；以及
d)其后，在将引线(3)从所述毛细管(4)释放并执行环控制的同时，水平地和垂直地将所述毛细管(4)移动到所述第二接合点(Z)，然后将引线(3)接合到所述第二接合点(Z)上；
其特征在于，
步骤d)包括形成引线(3)的主体部分(L、S)，所述主体部分(L、S)包括一个以基本上水平的方向上从所述颈部(H)延伸出来的水平部分(L)，和一个倾斜部分(S)，所述倾斜部分(S)从所述水平部分(L)延伸到所述第二接合点(Z)，并且在引线(3)的主体部分的一部分中形成第二结纽(3b)，从而通过第二结纽(3b)将水平部分(L)连接到所述倾斜部分(S)；和
步骤c)包括用所述毛细管(4)将引线(3)的一部分以及所述球状物(30)的顶部压碎，以在引线(3)上形成压碎部分(3c)，其中所述压碎部分(3c)形成在邻近第一结纽(3a，3a2，3a3)的所述引线(3)的水平部分(L)，同时第一结纽(3a，3a2，3a3)形成引线(3)的该部分被对折的形状，从而所述颈部(H)在所述压碎部分(3c)处被被压碎或变形，以具有相对于第一结纽(3a，3a2，3a3)的减小的高度。
4.如权利要求3所述的引线接合方法，其特征在于，重复地执行步骤b)和c)多次，以在所述颈部(H)上形成至少一个附加的对折结纽。
6.一种引线接合装置，用于执行权利要求3或4的引线接合方法，包括：
毛细管(4)，具有插入到该毛细管中的引线(3)，用以从所述毛细管(4)释放引线(3)；
接线夹(5)，用于可释放地夹住引线(3)；
移动装置(21-27、33)，用于水平地和垂直地移动所述毛细管(4)；
控制单元(32)，用于控制所述毛细管(4)的移动；和
一装置，用于手动地输入所述毛细管(4)高度，以将所述毛细管(4)升高到所述控制单元(32)，从而自动地控制所述毛细管(4)的移动。
7.一种半导体器件，包括：
第一接合点(A)；
第二接合点(Z)；和
接合到所述第一接合点(A)和所述第二接合点(Z)上以通过其连接所述第一接合点(A)和所述第二接合点(Z)的引线(3)；
其中，所述引线(3)包括具有接合到所述第一接合点(A)上的球状物(30)的颈部(H)，和从所述颈部(H)延伸到所述第二接合点(Z)的主体部分(L、S)，所述颈部(H)包括通过对折所述颈部(H)的一部分而形成的第一结纽；其特征在于：
所述引线(3)的所述主体部分(L、S)包括一个以基本上水平的方向上从所述颈部(H)延伸出来的水平部分(L)，和一个倾斜部分(S)，所述倾斜部分(S)从所述水平部分(L)延伸到所述第二接合点(Z)并且具有接合到所述第二接合点(Z)的末端；
所述倾斜部分(S)通过一个第二结纽(3b)连接到所述水平部分(L)上，所述第二结纽(3b)是在倾斜部分和水平部分之间所述引线(3)的一部分中形成；
所述引线(3)的所述主体部分(L、S)具有接近所述颈部(H)形成的压碎部分(3c)，该压碎部分是通过与所述球状物(30)的顶部一起压碎所述引线(3)的该部分而形成的，其中所述压碎部分(3c)形成在邻近第一结纽(3a，3a2，3a3)的所述引线(3)的水平部分(L)，同时第一结纽(3a，3a2，3a3)形成引线(3)的该部分被对折的形状，从而所述颈部(H)在所述压碎部分(3c)处被被压碎或变形，以具有相对于第一结纽(3a，3a2，3a3)的减小的高度。
8.如权利要求7所述的半导体器件，其特征在于，所述颈部(H)包括至少一个像所述第一结纽一样的附加对折结纽。
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