SG143060A1 - Wire loop, semiconductor device having same and wire bonding method - Google Patents

Wire loop, semiconductor device having same and wire bonding method

Info

Publication number
SG143060A1
SG143060A1 SG200502904-6A SG2005029046A SG143060A1 SG 143060 A1 SG143060 A1 SG 143060A1 SG 2005029046 A SG2005029046 A SG 2005029046A SG 143060 A1 SG143060 A1 SG 143060A1
Authority
SG
Singapore
Prior art keywords
wire
semiconductor device
same
bonding method
loop
Prior art date
Application number
SG200502904-6A
Inventor
Mizuho Shirato
Hiromi Fujisawa
Tadahisha Akita
Original Assignee
Kaijo Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kaijo Kk filed Critical Kaijo Kk
Priority to SG200502904-6A priority Critical patent/SG143060A1/en
Publication of SG143060A1 publication Critical patent/SG143060A1/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/42—Wire connectors; Manufacturing methods related thereto
    • H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01015—Phosphorus [P]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

Wire loop, semiconductor device having same and wire bonding method A wire loop includes a wire (3) connecting a first bonding point (A) and a second bonding point (Z) therethrough, wherein an additional wire loop (P) is formed after wire bonding at the second bonding point (Z) without cutting the wire (3) and the additional wire loop (P) is bonded to the second bonding point (Z) or to the vicinity thereof while part of the wire (3) is crushed. Fig. 1A
SG200502904-6A 2005-05-10 2005-05-10 Wire loop, semiconductor device having same and wire bonding method SG143060A1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
SG200502904-6A SG143060A1 (en) 2005-05-10 2005-05-10 Wire loop, semiconductor device having same and wire bonding method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
SG200502904-6A SG143060A1 (en) 2005-05-10 2005-05-10 Wire loop, semiconductor device having same and wire bonding method

Publications (1)

Publication Number Publication Date
SG143060A1 true SG143060A1 (en) 2008-06-27

Family

ID=39615553

Family Applications (1)

Application Number Title Priority Date Filing Date
SG200502904-6A SG143060A1 (en) 2005-05-10 2005-05-10 Wire loop, semiconductor device having same and wire bonding method

Country Status (1)

Country Link
SG (1) SG143060A1 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199571A1 (en) * 2020-12-23 2022-06-23 Skyworks Solutions, Inc. Apparatus and methods for tool mark free stitch bonding

Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE3621917A1 (en) * 1986-06-30 1988-01-07 Bosch Gmbh Robert Method for producing electrical connections inside semiconductor components and electrical connection for semiconductor components
JPH01276729A (en) * 1988-04-28 1989-11-07 Nec Kansai Ltd Wire bonding
JPH0215137A (en) * 1985-06-20 1990-01-18 Accmulatorenfab Sonnenschein Gmbh Lead-calcium alloy and production thereof
JPH04255237A (en) * 1991-02-07 1992-09-10 Fujitsu Ltd Manufacture of semiconductor device
TW456012B (en) * 2000-01-27 2001-09-21 Advanced Semiconductor Eng Semiconductor wire bonding method preventing wire sweeping
EP1422014A1 (en) * 2002-11-21 2004-05-26 Kaijo Corporation Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
JP2005019778A (en) * 2003-06-27 2005-01-20 Shinkawa Ltd Wire bonding method
US20050072833A1 (en) * 2003-10-02 2005-04-07 Wong Yam Mo Method of forming low wire loops and wire loops formed using the method

Patent Citations (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0215137A (en) * 1985-06-20 1990-01-18 Accmulatorenfab Sonnenschein Gmbh Lead-calcium alloy and production thereof
DE3621917A1 (en) * 1986-06-30 1988-01-07 Bosch Gmbh Robert Method for producing electrical connections inside semiconductor components and electrical connection for semiconductor components
JPH01276729A (en) * 1988-04-28 1989-11-07 Nec Kansai Ltd Wire bonding
JPH04255237A (en) * 1991-02-07 1992-09-10 Fujitsu Ltd Manufacture of semiconductor device
TW456012B (en) * 2000-01-27 2001-09-21 Advanced Semiconductor Eng Semiconductor wire bonding method preventing wire sweeping
EP1422014A1 (en) * 2002-11-21 2004-05-26 Kaijo Corporation Semiconductor device having a wire loop with a crushed part on a ball, loop wire bonding method and loop wire bonding apparatus for carrying out such method
US6815836B2 (en) * 2003-03-24 2004-11-09 Texas Instruments Incorporated Wire bonding for thin semiconductor package
JP2005019778A (en) * 2003-06-27 2005-01-20 Shinkawa Ltd Wire bonding method
US20050072833A1 (en) * 2003-10-02 2005-04-07 Wong Yam Mo Method of forming low wire loops and wire loops formed using the method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20220199571A1 (en) * 2020-12-23 2022-06-23 Skyworks Solutions, Inc. Apparatus and methods for tool mark free stitch bonding

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