CH706712A1 - Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. - Google Patents

Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. Download PDF

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Publication number
CH706712A1
CH706712A1 CH01044/12A CH10442012A CH706712A1 CH 706712 A1 CH706712 A1 CH 706712A1 CH 01044/12 A CH01044/12 A CH 01044/12A CH 10442012 A CH10442012 A CH 10442012A CH 706712 A1 CH706712 A1 CH 706712A1
Authority
CH
Switzerland
Prior art keywords
solder
substrate
punch
wire
solder wire
Prior art date
Application number
CH01044/12A
Other languages
German (de)
English (en)
Inventor
Heinrich Berchtold
Rene Bertschart
Original Assignee
Besi Switzerland Ag
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland Ag filed Critical Besi Switzerland Ag
Priority to CH01044/12A priority Critical patent/CH706712A1/de
Priority to CH01025/13A priority patent/CH706738B1/de
Priority to FR1355167A priority patent/FR2992879B1/fr
Priority to DE102013105931.7A priority patent/DE102013105931A1/de
Priority to US13/916,079 priority patent/US9339885B2/en
Priority to MYPI2013002241A priority patent/MY175176A/en
Priority to TW102121334A priority patent/TWI561324B/zh
Priority to JP2013130895A priority patent/JP6150205B2/ja
Priority to CN201310269081.0A priority patent/CN103521871B/zh
Priority to IT000119A priority patent/ITAN20130119A1/it
Priority to KR1020130076889A priority patent/KR102136896B1/ko
Priority to MX2013007925A priority patent/MX362114B/es
Publication of CH706712A1 publication Critical patent/CH706712A1/de
Priority to US15/156,197 priority patent/US20160256949A1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/025—Bits or tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01971—Cleaning, e.g. oxide removal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CH01044/12A 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat. CH706712A1 (de)

Priority Applications (13)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CH01025/13A CH706738B1 (de) 2012-07-05 2013-05-29 Verfahren und Vorrichtung zum Auftragen von flussmittelfreiem Lot auf ein Substrat.
FR1355167A FR2992879B1 (fr) 2012-07-05 2013-06-05 Procede et appareil de distribution de brasure sans flux sur un substrat
DE102013105931.7A DE102013105931A1 (de) 2012-07-05 2013-06-07 Verfahren und Vorrichtung zum Auftragen von flussmittelfreiem Lot auf ein Substrat
US13/916,079 US9339885B2 (en) 2012-07-05 2013-06-12 Method and apparatus for dispensing flux-free solder on a substrate
MYPI2013002241A MY175176A (en) 2012-07-05 2013-06-17 Method and apparatus for dispensing flux-free solder on a substrate
TW102121334A TWI561324B (en) 2012-07-05 2013-06-17 Method and apparatus for dispensing flux-free solder on a substrate
JP2013130895A JP6150205B2 (ja) 2012-07-05 2013-06-21 フラックスフリーのハンダを基板に供給する方法および装置
CN201310269081.0A CN103521871B (zh) 2012-07-05 2013-06-28 用于在基板上分配无焊剂焊料的方法和设备
IT000119A ITAN20130119A1 (it) 2012-07-05 2013-07-01 Procedimento e dispositivo per applicare leghe brasanti senza flussanti su un substrato
KR1020130076889A KR102136896B1 (ko) 2012-07-05 2013-07-02 무-플럭스 솔더를 기판상에 분배하기 위한 방법 및 장치
MX2013007925A MX362114B (es) 2012-07-05 2013-07-05 Método y aparato para dispensar soldadura sin fundente en un sustrato.
US15/156,197 US20160256949A1 (en) 2012-07-05 2016-05-16 Apparatus For Dispensing Flux-Free Solder On A Substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.

Publications (1)

Publication Number Publication Date
CH706712A1 true CH706712A1 (de) 2014-01-15

Family

ID=49578377

Family Applications (2)

Application Number Title Priority Date Filing Date
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CH01025/13A CH706738B1 (de) 2012-07-05 2013-05-29 Verfahren und Vorrichtung zum Auftragen von flussmittelfreiem Lot auf ein Substrat.

Family Applications After (1)

Application Number Title Priority Date Filing Date
CH01025/13A CH706738B1 (de) 2012-07-05 2013-05-29 Verfahren und Vorrichtung zum Auftragen von flussmittelfreiem Lot auf ein Substrat.

Country Status (11)

Country Link
US (2) US9339885B2 (https=)
JP (1) JP6150205B2 (https=)
KR (1) KR102136896B1 (https=)
CN (1) CN103521871B (https=)
CH (2) CH706712A1 (https=)
DE (1) DE102013105931A1 (https=)
FR (1) FR2992879B1 (https=)
IT (1) ITAN20130119A1 (https=)
MX (1) MX362114B (https=)
MY (1) MY175176A (https=)
TW (1) TWI561324B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
CN108326390B (zh) * 2017-01-17 2021-03-23 白光株式会社 熔融控制装置及计算机可读存储介质
DE102019103140A1 (de) 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
CN110190001B (zh) * 2019-06-05 2020-11-03 扬州扬杰电子科技股份有限公司 一种轴向二极管的加工工艺

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
WO2001089753A1 (en) * 2000-05-24 2001-11-29 Casem (Asia) Pte Ltd Improved apparatus and method for dispensing solder

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JPS57188832A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Soldering method
JPS6334269Y2 (https=) * 1981-05-28 1988-09-12
US4577398A (en) 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4709849A (en) 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JPS6450595A (en) 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
CH680176A5 (https=) * 1989-11-14 1992-06-30 Esec Sa
JPH04178266A (ja) * 1990-11-08 1992-06-25 Apollo Seiko Kk はんだゴテのコテ先構造
GB9126530D0 (en) * 1991-12-13 1992-02-12 Spirig Ernest Soldering device
JPH0745646A (ja) 1993-07-28 1995-02-14 Hitachi Ltd はんだ塗布装置
EP0752294B1 (de) 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
JP2844330B2 (ja) * 1996-05-09 1999-01-06 黒田電気株式会社 超音波ハンダ付方法及び装置
DE59708121D1 (de) 1997-01-08 2002-10-10 Esec Trading Sa Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
JP3319740B2 (ja) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ ロウ材塗布装置
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
JP4080326B2 (ja) 2002-12-27 2008-04-23 キヤノンマシナリー株式会社 ろう材供給ノズル
JP2006315043A (ja) * 2005-05-13 2006-11-24 Toko Inc リフロー溶接装置
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
JP2008296265A (ja) * 2007-06-01 2008-12-11 Canon Inc はんだ付け装置
US7699208B2 (en) * 2007-11-30 2010-04-20 Nordson Corporation Soldering tip, soldering iron, and soldering system
US7735715B2 (en) * 2007-12-07 2010-06-15 Asm Assembly Automation Ltd Dispensing solder for mounting semiconductor chips
JP5411542B2 (ja) * 2008-10-27 2014-02-12 和仁 鬼頭 溶接装置
JP2011051007A (ja) * 2009-09-04 2011-03-17 Japan Unix Co Ltd 超音波はんだ付け装置
DE102010000520A1 (de) * 2010-02-23 2011-08-25 SCHOTT Solar AG, 55122 Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
US20110272452A1 (en) 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
DE102010016814B3 (de) * 2010-05-05 2011-10-06 Schott Solar Ag Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
JP5498879B2 (ja) * 2010-07-09 2014-05-21 本田技研工業株式会社 半田付け装置及び方法
CH705035B1 (de) * 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
WO2001089753A1 (en) * 2000-05-24 2001-11-29 Casem (Asia) Pte Ltd Improved apparatus and method for dispensing solder

Also Published As

Publication number Publication date
TWI561324B (en) 2016-12-11
DE102013105931A1 (de) 2014-01-09
CH706738B1 (de) 2017-05-15
FR2992879A1 (fr) 2014-01-10
CN103521871A (zh) 2014-01-22
MX362114B (es) 2019-01-07
JP6150205B2 (ja) 2017-06-21
CN103521871B (zh) 2016-12-28
KR102136896B1 (ko) 2020-07-23
US9339885B2 (en) 2016-05-17
CH706738A2 (de) 2014-01-15
MX2013007925A (es) 2014-01-17
US20140008421A1 (en) 2014-01-09
US20160256949A1 (en) 2016-09-08
JP2014014868A (ja) 2014-01-30
MY175176A (en) 2020-06-12
ITAN20130119A1 (it) 2014-01-06
TW201408409A (zh) 2014-03-01
KR20140005784A (ko) 2014-01-15
FR2992879B1 (fr) 2016-12-16

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