JP6150205B2 - フラックスフリーのハンダを基板に供給する方法および装置 - Google Patents

フラックスフリーのハンダを基板に供給する方法および装置 Download PDF

Info

Publication number
JP6150205B2
JP6150205B2 JP2013130895A JP2013130895A JP6150205B2 JP 6150205 B2 JP6150205 B2 JP 6150205B2 JP 2013130895 A JP2013130895 A JP 2013130895A JP 2013130895 A JP2013130895 A JP 2013130895A JP 6150205 B2 JP6150205 B2 JP 6150205B2
Authority
JP
Japan
Prior art keywords
solder
stamp
substrate
yarn
recess
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2013130895A
Other languages
English (en)
Japanese (ja)
Other versions
JP2014014868A (ja
JP2014014868A5 (https=
Inventor
ハインリヒ ベルヒトルト
ハインリヒ ベルヒトルト
レネ ベチャート
レネ ベチャート
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Besi Switzerland AG
Original Assignee
Besi Switzerland AG
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Besi Switzerland AG filed Critical Besi Switzerland AG
Publication of JP2014014868A publication Critical patent/JP2014014868A/ja
Publication of JP2014014868A5 publication Critical patent/JP2014014868A5/ja
Application granted granted Critical
Publication of JP6150205B2 publication Critical patent/JP6150205B2/ja
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0607—Solder feeding devices
    • B23K3/063—Solder feeding devices for wire feeding
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/06—Soldering, e.g. brazing, or unsoldering making use of vibrations, e.g. supersonic vibrations
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/20—Preliminary treatment of work or areas to be soldered, e.g. in respect of a galvanic coating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/02—Soldering irons; Bits
    • B23K3/025—Bits or tips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/04—Heating appliances
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor
    • B23K3/085—Cooling, heat sink or heat shielding means
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/40—Leadframes
    • H10W70/411—Chip-supporting parts, e.g. die pads
    • H10W70/417—Bonding materials between chips and die pads
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/011—Apparatus therefor
    • H10W72/0113—Apparatus for manufacturing die-attach connectors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
    • B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01323—Manufacture or treatment of die-attach connectors using local deposition in liquid form, e.g. by dispensing droplets or by screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/013—Manufacture or treatment of die-attach connectors
    • H10W72/01321—Manufacture or treatment of die-attach connectors using local deposition
    • H10W72/01325—Manufacture or treatment of die-attach connectors using local deposition in solid form
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/019—Manufacture or treatment of bond pads
    • H10W72/01971—Cleaning, e.g. oxide removal
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/073—Connecting or disconnecting of die-attach connectors
    • H10W72/07331—Connecting techniques
    • H10W72/07336—Soldering or alloying
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/30—Die-attach connectors
    • H10W72/351—Materials of die-attach connectors
    • H10W72/353—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics
    • H10W72/354—Materials of die-attach connectors not comprising solid metals or solid metalloids, e.g. ceramics comprising polymers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/50—Bond wires
    • H10W72/59—Bond pads specially adapted therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/731—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors
    • H10W90/736—Package configurations characterised by the relative positions of pads or connectors relative to package parts of die-attach connectors between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Die Bonding (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Manufacturing & Machinery (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
JP2013130895A 2012-07-05 2013-06-21 フラックスフリーのハンダを基板に供給する方法および装置 Expired - Fee Related JP6150205B2 (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01044/12A CH706712A1 (de) 2012-07-05 2012-07-05 Verfahren und Vorrichtung zum Auftragen von Lot auf ein Substrat.
CH01044/12 2012-07-05

Publications (3)

Publication Number Publication Date
JP2014014868A JP2014014868A (ja) 2014-01-30
JP2014014868A5 JP2014014868A5 (https=) 2016-07-21
JP6150205B2 true JP6150205B2 (ja) 2017-06-21

Family

ID=49578377

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2013130895A Expired - Fee Related JP6150205B2 (ja) 2012-07-05 2013-06-21 フラックスフリーのハンダを基板に供給する方法および装置

Country Status (11)

Country Link
US (2) US9339885B2 (https=)
JP (1) JP6150205B2 (https=)
KR (1) KR102136896B1 (https=)
CN (1) CN103521871B (https=)
CH (2) CH706712A1 (https=)
DE (1) DE102013105931A1 (https=)
FR (1) FR2992879B1 (https=)
IT (1) ITAN20130119A1 (https=)
MX (1) MX362114B (https=)
MY (1) MY175176A (https=)
TW (1) TWI561324B (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102014109934A1 (de) * 2014-07-15 2016-01-21 Pac Tech - Packaging Technologies Gmbh Vorrichtung zur vereinzelten Applikation von Verbindungsmaterialdepots
CN108326390B (zh) * 2017-01-17 2021-03-23 白光株式会社 熔融控制装置及计算机可读存储介质
DE102019103140A1 (de) 2019-02-08 2020-08-13 Jenoptik Optical Systems Gmbh Verfahren zum Löten eines oder mehrerer Bauteile
CN110190001B (zh) * 2019-06-05 2020-11-03 扬州扬杰电子科技股份有限公司 一种轴向二极管的加工工艺

Family Cites Families (32)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1352558A (en) * 1970-05-22 1974-05-08 Kollmorgen Corp Apparatus for making wire scribed circuit boards
JPS57188832A (en) * 1981-05-18 1982-11-19 Hitachi Ltd Soldering method
JPS6334269Y2 (https=) * 1981-05-28 1988-09-12
US4577398A (en) 1984-09-07 1986-03-25 Trilogy Computer Development Partners, Ltd. Method for mounting a semiconductor chip
US4709849A (en) 1985-11-27 1987-12-01 Fry Metals, Inc. Solder preform and methods employing the same
JPS6450595A (en) 1987-08-21 1989-02-27 Oki Electric Ind Co Ltd Connection of semiconductor device
US4898117A (en) * 1988-04-15 1990-02-06 International Business Machines Corporation Solder deposition system
CH680176A5 (https=) * 1989-11-14 1992-06-30 Esec Sa
JPH04178266A (ja) * 1990-11-08 1992-06-25 Apollo Seiko Kk はんだゴテのコテ先構造
GB9126530D0 (en) * 1991-12-13 1992-02-12 Spirig Ernest Soldering device
JPH0745646A (ja) 1993-07-28 1995-02-14 Hitachi Ltd はんだ塗布装置
EP0752294B1 (de) 1995-07-01 2000-06-21 Esec Sa Verfahren und Einrichtung zum Austragen von flüssigem Lot
DE19619771A1 (de) * 1996-02-12 1997-08-14 David Finn Verfahren und Vorrichtung zur Verlegung eines Drahtleiters auf einem Substrat sowie hiermit hergestellte Substrate
JP2844330B2 (ja) * 1996-05-09 1999-01-06 黒田電気株式会社 超音波ハンダ付方法及び装置
DE59708121D1 (de) 1997-01-08 2002-10-10 Esec Trading Sa Einrichtung zum Formen von flüssigen Lotportionen beim Weichlöten von Halbleiterchips
EP1011132A2 (en) * 1998-12-18 2000-06-21 Ford Motor Company Ultrasonic bumping of electronic components
SG91867A1 (en) * 2000-05-24 2002-10-15 Casem Asia Pte Ltd Improved apparatus and method for dispensing solder
JP3319740B2 (ja) * 2000-06-02 2002-09-03 株式会社日鉱マテリアルズ ロウ材塗布装置
US6744003B1 (en) * 2001-07-30 2004-06-01 Harry Ono Automatic soldering machine
JP4080326B2 (ja) 2002-12-27 2008-04-23 キヤノンマシナリー株式会社 ろう材供給ノズル
JP2006315043A (ja) * 2005-05-13 2006-11-24 Toko Inc リフロー溶接装置
JP2007287934A (ja) * 2006-04-17 2007-11-01 Npc:Kk 超音波はんだ付け装置
JP2008296265A (ja) * 2007-06-01 2008-12-11 Canon Inc はんだ付け装置
US7699208B2 (en) * 2007-11-30 2010-04-20 Nordson Corporation Soldering tip, soldering iron, and soldering system
US7735715B2 (en) * 2007-12-07 2010-06-15 Asm Assembly Automation Ltd Dispensing solder for mounting semiconductor chips
JP5411542B2 (ja) * 2008-10-27 2014-02-12 和仁 鬼頭 溶接装置
JP2011051007A (ja) * 2009-09-04 2011-03-17 Japan Unix Co Ltd 超音波はんだ付け装置
DE102010000520A1 (de) * 2010-02-23 2011-08-25 SCHOTT Solar AG, 55122 Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
US20110272452A1 (en) 2010-05-04 2011-11-10 Kui Kam Lam System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
DE102010016814B3 (de) * 2010-05-05 2011-10-06 Schott Solar Ag Verfahren und Vorrichtung zum Aufbringen von Lot auf ein Werkstück
JP5498879B2 (ja) * 2010-07-09 2014-05-21 本田技研工業株式会社 半田付け装置及び方法
CH705035B1 (de) * 2011-05-23 2016-03-31 Esec Ag Verfahren zum Auftragen von Lot auf ein Substrat und Verfahren für die Montage eines Halbleiterchips.

Also Published As

Publication number Publication date
TWI561324B (en) 2016-12-11
DE102013105931A1 (de) 2014-01-09
CH706738B1 (de) 2017-05-15
FR2992879A1 (fr) 2014-01-10
CN103521871A (zh) 2014-01-22
MX362114B (es) 2019-01-07
CH706712A1 (de) 2014-01-15
CN103521871B (zh) 2016-12-28
KR102136896B1 (ko) 2020-07-23
US9339885B2 (en) 2016-05-17
CH706738A2 (de) 2014-01-15
MX2013007925A (es) 2014-01-17
US20140008421A1 (en) 2014-01-09
US20160256949A1 (en) 2016-09-08
JP2014014868A (ja) 2014-01-30
MY175176A (en) 2020-06-12
ITAN20130119A1 (it) 2014-01-06
TW201408409A (zh) 2014-03-01
KR20140005784A (ko) 2014-01-15
FR2992879B1 (fr) 2016-12-16

Similar Documents

Publication Publication Date Title
JP5389856B2 (ja) はんだをワークピースに付着させるための方法および装置
JP6150205B2 (ja) フラックスフリーのハンダを基板に供給する方法および装置
KR101044565B1 (ko) 반도체 칩들을 설치하기 위한 솔더의 분배 방법 및 분배 장치
JP2009200196A (ja) スルーホール用の半田付け装置、それを用いて電子機器を製造する方法
TWI626109B (zh) 用於在基板上分配和分佈無助熔劑焊料的裝置及包含該裝置的寫頭
TW201203410A (en) System for dispensing soft solder for mounting semiconductor chips using multiple solder wires
JP2014014868A5 (https=)
WO2017077982A1 (ja) ダイボンディング装置およびダイボンディング方法
JP2017039155A (ja) リフローはんだ付け装置および加熱部材
JP3205423B2 (ja) はんだ付方法及び装置
JP5526993B2 (ja) はんだ供給装置
HK1188584B (en) Method and apparatus for dispensing flux-free solder on a substrate
HK1188584A (en) Method and apparatus for dispensing flux-free solder on a substrate
CN102800603B (zh) 在基板上分配焊料的方法和安装半导体芯片的方法
CN102184874A (zh) 芯片接合系统及芯片接合方法
HK1201230B (en) Device for dispensing and distributing flux-free solder on a substrate
JP2003305566A (ja) ハンダ付け用コテ部材及びハンダ付け装置
CN102800603A (zh) 在基板上分配焊料的方法和安装半导体芯片的方法
JP2017019064A (ja) 被加工物の放電加工方法

Legal Events

Date Code Title Description
A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20160603

A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20160617

A521 Request for written amendment filed

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20161020

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20170413

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20170425

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20170512

R150 Certificate of patent or registration of utility model

Ref document number: 6150205

Country of ref document: JP

Free format text: JAPANESE INTERMEDIATE CODE: R150

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

LAPS Cancellation because of no payment of annual fees