GB1352558A - Apparatus for making wire scribed circuit boards - Google Patents

Apparatus for making wire scribed circuit boards

Info

Publication number
GB1352558A
GB1352558A GB3920373A GB3920373A GB1352558A GB 1352558 A GB1352558 A GB 1352558A GB 3920373 A GB3920373 A GB 3920373A GB 3920373 A GB3920373 A GB 3920373A GB 1352558 A GB1352558 A GB 1352558A
Authority
GB
United Kingdom
Prior art keywords
wire
board
head
wiring apparatus
circuit boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
GB3920373A
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kollmorgen Corp
Original Assignee
Kollmorgen Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Kollmorgen Corp filed Critical Kollmorgen Corp
Priority to GB3920373A priority Critical patent/GB1352558A/en
Publication of GB1352558A publication Critical patent/GB1352558A/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/103—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by bonding or embedding conductive wires or strips
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/06—Wiring by machine
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10287—Metal wires as connectors or conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/02—Details related to mechanical or acoustic processing, e.g. drilling, punching, cutting, using ultrasound
    • H05K2203/0285—Using ultrasound, e.g. for cleaning, soldering or wet treatment
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/11—Treatments characterised by their effect, e.g. heating, cooling, roughening
    • H05K2203/1105—Heating or thermal processing not related to soldering, firing, curing or laminating, e.g. for shaping the substrate or during finish plating
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/386—Improvement of the adhesion between the insulating substrate and the metal by the use of an organic polymeric bonding layer, e.g. adhesive

Abstract

1352558 Making circuit boards KOLLMERGEN CORP 19 April 1971 39203/73 Divided out of 1352557 Heading B3A An electrical circuit board is made by adhering conductors to an insulating board. The board 11, Fig. 2 which may be of a reinforced ceramic, a thermoplastic or a thermosetting material and has a coating 12 of B-stage thermosetting adhesive, is located under the wiring apparatus of Fig. 2. To start the wiring process feed rollers 31, 32 move against insulated wire 20 from a supply to feed wire under the tacking head 24. Head 24 is then moved downwards and the heating coil 25 is energized sufficiently to soften the adhesive 12, mold it partly round the wire and initiate curing. Rollers 31, 32 are withdrawn from the wire and the board 11 is moved in X or Y direction by drive 18 so that wire is drawn from the supply and tacked periodically by head 24 along a desired line. When it is desired to turn through a right angle, the whole of the wiring apparatus is rotated through 90 degrees and the drive is energized in the other direction. At the end of a desired wire run, the wire is severed by decent of cutter 26. The wiring apparatus, which consists essentially of a number of concentric cylinders movable relative to one another by motors under computer control is described in detail with reference to Figs. 4-7 (not shown). In a modification, Fig. 8 (not shown), heating is by an ultrasonic transducer.
GB3920373A 1970-05-22 1970-05-22 Apparatus for making wire scribed circuit boards Expired GB1352558A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
GB3920373A GB1352558A (en) 1970-05-22 1970-05-22 Apparatus for making wire scribed circuit boards

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
GB3920373A GB1352558A (en) 1970-05-22 1970-05-22 Apparatus for making wire scribed circuit boards

Publications (1)

Publication Number Publication Date
GB1352558A true GB1352558A (en) 1974-05-08

Family

ID=10408259

Family Applications (1)

Application Number Title Priority Date Filing Date
GB3920373A Expired GB1352558A (en) 1970-05-22 1970-05-22 Apparatus for making wire scribed circuit boards

Country Status (1)

Country Link
GB (1) GB1352558A (en)

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2466936A1 (en) * 1979-09-28 1981-04-10 Cii Honeywell Bull APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE
US4327486A (en) * 1979-05-25 1982-05-04 Lucas Industries Ltd. Method of making a lamp assembly
GB2188570A (en) * 1986-03-14 1987-10-07 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
EP0276669A1 (en) * 1987-01-30 1988-08-03 Siemens Aktiengesellschaft Connecting device for wires or strips by resistive welding
WO2012104054A1 (en) * 2011-01-31 2012-08-09 Hochschule Für Angewandte Wissenschaften - Fachhochschule Kempten Method for producing a circuit carrier
CH706712A1 (en) * 2012-07-05 2014-01-15 Besi Switzerland Ag Method and apparatus for dispensing solder onto a substrate.
EP3416464A1 (en) * 2017-06-14 2018-12-19 Valeo Iluminacion Method for manufacturing an electronic assembly and lighting device
WO2020148385A1 (en) * 2019-01-16 2020-07-23 Motherson Innovations Company Limited Cover for an antenna and method of producing such a cover

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4327486A (en) * 1979-05-25 1982-05-04 Lucas Industries Ltd. Method of making a lamp assembly
FR2466936A1 (en) * 1979-09-28 1981-04-10 Cii Honeywell Bull APPARATUS FOR WIRING TO THE SURFACE OF AN INTERCONNECT SUBSTRATE
GB2188570A (en) * 1986-03-14 1987-10-07 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
US4724598A (en) * 1986-03-14 1988-02-16 The Boeing Company Method of bolt hole strengthening in a fibrous composite laminate
GB2188570B (en) * 1986-03-14 1989-11-15 Boeing Co Method of bolt hole strengthening in a fibrous composite laminate
EP0276669A1 (en) * 1987-01-30 1988-08-03 Siemens Aktiengesellschaft Connecting device for wires or strips by resistive welding
WO2012104054A1 (en) * 2011-01-31 2012-08-09 Hochschule Für Angewandte Wissenschaften - Fachhochschule Kempten Method for producing a circuit carrier
CH706712A1 (en) * 2012-07-05 2014-01-15 Besi Switzerland Ag Method and apparatus for dispensing solder onto a substrate.
US9339885B2 (en) 2012-07-05 2016-05-17 Besi Switzerland Ag Method and apparatus for dispensing flux-free solder on a substrate
EP3416464A1 (en) * 2017-06-14 2018-12-19 Valeo Iluminacion Method for manufacturing an electronic assembly and lighting device
WO2020148385A1 (en) * 2019-01-16 2020-07-23 Motherson Innovations Company Limited Cover for an antenna and method of producing such a cover
US11652285B2 (en) 2019-01-16 2023-05-16 Motherson Innovations Company Limited Cover for an antenna and method of producing such a cover

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Legal Events

Date Code Title Description
PS Patent sealed
PE20 Patent expired after termination of 20 years